Easily-brazed lug boss soldering lug for plate type cooler

Abstract

The utility model discloses a plate type cooler boss soldering lug easy to braze, which comprises soldering lugs correspondingly placed on each chip boss, the soldering lugs are strip-shaped, the upper side and the lower side of each soldering lug are slotted to form thin edges for connecting two adjacent soldering lugs, and the connecting positions of the side edges of the thin edges are sequentially provided with second extension edges and first extension edges. According to the plate type cooler boss soldering lug easy to braze, the hollowed-out grooves which are inwards formed at intervals are formed between the second extension edge and the first extension edge, so that the second extension edge and the first extension edge can be partially disconnected according to the bending angle, and then the position of a local position of the soldering lug can be changed; therefore, the position distribution of bosses in a chip with a special function can be adapted, and the applicability is better. And the thin edge is formed by the slot on the soldering lug, so that consumables can be reduced to a certain extent.

Description

Technical Field

[0001] This utility model relates to the technical field of cooler components, specifically to an easily brazed plate cooler boss welding piece. Background Technology

[0002] Easy-to-solder boards typically refer to boards that have undergone surface treatment or material optimization to facilitate better connections during brazing. Cooler bosses are welding components used in the cooler manufacturing process. A boss is a raised structure welded to a cooler component (such as a core board) and is typically used as a solder support and positioning element during brazing. In some special-function chips, the placement of bosses is designed according to functional requirements. For example, in cooler chips, bosses are elliptical and convex upwards, distributed along the coolant flow path to reduce dead zones and improve heat transfer efficiency. Secondly, certain areas are more sensitive to stress or electrical interference from bosses. Therefore, bosses need to avoid these sensitive areas to prevent negative impacts on the performance of sensitive circuits.

[0003] This case arose in order to resolve the aforementioned issues. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides an easily brazable plate cooler boss welding piece, which solves the problems mentioned in the background art.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: an easy-to-solder plate cooler boss pad, including a pad corresponding to each chip boss, the pad being elongated, the upper and lower sides of the pad being slotted to form a thin edge connecting two adjacent pads, and the connecting position of the thin edge being provided with an extension edge two and an extension edge one in sequence.

[0008] Preferably, an inwardly spaced perforated groove is formed between the second extension edge and the first extension edge to facilitate partial disconnection at the connection point as needed.

[0009] Preferably, the boss welding piece is made of a strip-shaped metal material that matches the material of the cooler body, and can be either copper or aluminum alloy.

[0010] (III) Beneficial Effects

[0011] After adopting the above technical solution, this utility model has the following advantages compared with the prior art: The easy-to-solder plate cooler boss solder pad of this utility model has an extension edge two and an extension edge one sequentially arranged at the connection point on any side of the thin edge. An inwardly spaced perforated groove is formed between the extension edge two and the extension edge one, allowing the extension edge two and the extension edge one to be partially disconnected according to the bending angle. This enables the local position of the solder pad to be changed to adapt to the positional distribution of the bosses in chips with special functions, resulting in better applicability. Furthermore, the narrow edge is formed by slots on the solder pad, which can reduce material consumption to a certain extent. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the present invention;

[0013] Figure 2 This is a schematic diagram of the deformation of the boss welding piece of this utility model.

[0014] In the diagram: 1. Chip; 2. Solder pad; 3. Thin edge; 4. Extension edge one; 5. Extension edge two; 6. Hollowed-out groove. Detailed Implementation

[0015] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0016] like Figure 1 As shown: A solderable plate cooler boss pad includes a pad 2 corresponding to each chip 1 boss. The pad 2 is elongated and has slots on its upper and lower sides to form thin edges 3 connecting two adjacent pads 2. The slots on the pad 2 can reduce material consumption to a certain extent.

[0017] like Figure 2 As shown, an extension edge 2 5 and an extension edge 1 4 are sequentially arranged at the connection position on the side of the thin edge 3. An inwardly spaced hollow groove 6 is formed between the extension edge 2 5 and the extension edge 1 4, so that the extension edge 2 5 and the extension edge 1 4 can be partially disconnected according to the bending angle, thereby changing the position of the solder pad 2 in a localized manner to adapt to the position distribution of the protrusions in the chip 1 with special functions, thus improving applicability.

[0018] When using solder pads 2, they simply need to be placed one-to-one on the bumps of chip 1. During the subsequent soldering process, capillary action occurs, causing the solder, originally spread out on the bumps of chip 1, to contract onto the bumps under the influence of surface tension, thus achieving soldering. During the soldering process, the bump solder pads 2 ensure uniform solder distribution and fill the gaps between components, thereby preventing coolant leakage and ensuring the cooler's sealing performance.

[0019] The boss welding piece 2 serves as a positioning component to ensure the accurate positioning of each component during welding and to avoid welding deviations.

[0020] The boss welding piece 2 is made of a strip of metal material that matches the material of the cooler body, such as aluminum alloy. Of course, copper can also be used to ensure welding compatibility and performance.

[0021] The above-described embodiments are for illustrative purposes. Based on the above description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this utility model is not limited to the contents of the specification; its protection scope must be determined according to the claims.

Claims

1. A solderable plate cooler boss pad, comprising a pad corresponding to each chip boss, the pad being elongated, characterized in that: The upper and lower sides of the welding sheet are slotted to form a thin edge connecting two adjacent welding sheets. The connecting position of the thin edge is provided with an extension edge two and an extension edge one in sequence.

2. The easily solderable plate cooler boss welding piece according to claim 1, characterized in that: An inwardly spaced perforated groove is formed between the second extension edge and the first extension edge, which facilitates partial disconnection at the connection point as needed.

3. The easily solderable plate cooler boss welding piece according to claim 1, characterized in that: The boss welding strip is made of a strip-shaped metal material that matches the material of the cooler body, and can be made of either copper or aluminum alloy.

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