Micro differential pressure sensor packaging structure, micro differential pressure test assembly and electronic equipment
By designing multiple pad modules and a housing in the micro differential pressure sensor packaging structure, the problem of limited pad quantity is solved, enabling flexible configuration and efficient testing, thereby improving product quality and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEMSENSING MICROSYST SUZHOU CHINA
- Filing Date
- 2025-05-30
- Publication Date
- 2026-04-28
AI Technical Summary
The existing micro differential pressure sensor packaging structure has a limited number of pads that cannot be easily changed, which cannot meet the needs of different application scenarios.
A micro differential pressure sensor packaging structure was designed. Multiple pad modules, including a first pad, a second pad, and a third pad, were set on the substrate. These modules were used to transmit different electrical signals or were shorted together and used as a single pad. Combined with the housing and protective device, the pads could be flexibly configured.
It meets the needs of different testing and usage scenarios, improves testing efficiency and pad stability, reduces the risk of electrostatic damage, and achieves grounding function through pad shorting, thereby improving product quality and reliability.
Smart Images
Figure CN224175997U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of differential pressure sensor technology, and in particular to a differential pressure sensor packaging structure, a differential pressure testing component, and an electronic device. Background Technology
[0002] By connecting the pads of the differential pressure sensor package structure to the pads of the circuit board one by one, the requirements for factory testing of the differential pressure sensor package structure can be met by utilizing the local wiring design of the circuit board, thereby ensuring the product quality of the differential pressure sensor package structure.
[0003] In existing technologies, the number of pads in the micro differential pressure sensor packaging structure is limited and cannot be changed at will, which cannot meet the usage requirements of different scenarios. Utility Model Content
[0004] This application provides a micro differential pressure sensor packaging structure, a micro differential pressure testing component, and an electronic device, which can meet diverse testing needs.
[0005] In a first aspect, embodiments of this application propose a micro differential pressure sensor packaging structure, comprising:
[0006] A substrate includes a first surface and a second surface disposed opposite to each other. The first surface has a terminal module, which includes a first terminal and a second terminal. The second surface has a first pad module, which includes a first pad and a second pad disposed at a distance from each other. The first pad is electrically connected to the first terminal, and the second pad is electrically connected to the second terminal. In a first scenario, the first pad and the second pad are used to transmit different electrical signals. In a second scenario, the first pad and the second pad are shorted together and used as a single pad.
[0007] A housing is located on one side of the first surface, and the housing and the substrate surround to form a cavity;
[0008] A differential pressure sensor is located inside the cavity and is electrically connected to the terminal module.
[0009] In some embodiments, the housing has at least one first through-hole through the housing, and the cavity communicates with the external space through the first through-hole.
[0010] In some embodiments, there are two first through holes, which are symmetrically arranged along a first central axis and a second central axis. The first central axis and the second central axis are both central axes of the housing, and both the first central axis and the second central axis are parallel to the surface of the housing away from the substrate.
[0011] In some embodiments, the differential pressure sensor packaging structure further includes a protective device connected to the housing and covering the first through hole.
[0012] In some embodiments, the substrate has a third central axis parallel to the second surface; the substrate has a second through-hole penetrating the substrate, the center of the second through-hole coinciding with the third central axis, and the differential pressure sensor blocks the second through-hole.
[0013] In some embodiments, the first pad and the second pad are arranged around the second through hole, and the first pad is symmetrically arranged along the third central axis, and the second pad is symmetrically arranged along the third central axis.
[0014] In some embodiments, the first pad module further includes a third pad and a fourth pad, the fourth pad being annular and surrounding the second through hole, the third pad being located on one side of the third central axis, and the first pad and the second pad being located on the other side of the third central axis; the first pad and the second pad are separated by an isolation strip.
[0015] In some embodiments, the width of the isolation strip ranges from 0.05 mm to 0.075 mm.
[0016] In some embodiments, the second surface has a center point; the first pad module further includes a third pad; the substrate has a second through hole penetrating the substrate, the center of the second through hole coincides with the center point, and the differential pressure sensor blocks the second through hole; the third pad is arranged around the second through hole; the first pad and the second pad are located on both sides of the third pad, and the first pad and the second pad form a centrally symmetrical structure around the center point.
[0017] In some embodiments, the third pad is a continuous ring, and the third pad forms a centrally symmetrical structure around the center point.
[0018] In some embodiments, the second surface has a center point; the first pad module further includes a third pad; the substrate has a second through-hole penetrating the substrate, the center of the second through-hole coinciding with the center point, and the differential pressure sensor shielding the second through-hole; the first pad and the second pad are arranged around the second through-hole, and the first pad and the second pad form a centrally symmetrical structure around the center point; the third pad includes a first part and a second part, the first part and the second part are located on both sides of the second through-hole, and the first part and the second part form a centrally symmetrical structure around the center point.
[0019] Secondly, embodiments of this application propose a differential pressure testing component, comprising:
[0020] The differential pressure sensor packaging structure as described in any of the above embodiments;
[0021] The circuit board includes a second pad module, which is electrically connected to the first pad module.
[0022] Thirdly, this application proposes an electronic device including a differential pressure sensor packaging structure as described in any of the above embodiments.
[0023] This application can achieve the following technical effects: Based on the micro differential pressure sensor packaging structure provided in the embodiments of this application, in the first scenario, the first pad and the second pad are used as different polarities to transmit different electrical signals, and in the second scenario, the first pad and the second pad are shorted together and used as one polarity, thus meeting the usage requirements of different scenarios. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.
[0026] Figure 1 A side cross-sectional view of a micro differential pressure sensor packaging structure provided for an embodiment of this application;
[0027] Figure 2 A schematic diagram of the structure of a first pad module provided for an embodiment of this application;
[0028] Figure 3 A schematic diagram of the structure of a first pad module provided for an embodiment of this application;
[0029] Figure 4 A schematic diagram of the structure of a first pad module provided for an embodiment of this application;
[0030] Figure 5 A schematic diagram of the structure of a first pad module provided for an embodiment of this application;
[0031] Figure 6 A top view of a housing structure provided for an embodiment of this application;
[0032] Figure 7 A top view of a housing structure provided for an embodiment of this application;
[0033] Figure 8 A top view of a housing structure provided for an embodiment of this application;
[0034] Figure 9 A schematic diagram of the structure of a differential pressure testing component provided for an embodiment of this application;
[0035] Figure 10 A schematic diagram of a circuit board structure provided for an embodiment of this application;
[0036] Figure 11 This is a schematic diagram of a circuit board structure provided for an embodiment of this application.
[0037] Explanation of reference numerals in the attached figures:
[0038] 100 - Micro differential pressure sensor package structure; 1 - Substrate; 11 - First surface; 12 - Second surface; 13 - Terminal module; 14 - First pad module; 141 - First pad; 142 - Second pad; 143 - Third pad; 145 - First part; 146 - Second part; 144 - Fourth pad; 121 - Isolation strip; 15 - Second through hole; 2 - Housing; 21 - Cavity; 22 - First through hole; 221 - Baffle; 3 - Micro differential pressure sensor; 4 - Connecting wire; 5 - Protective device; 6 - ASIC chip; 200 - Circuit board; 7 - Second pad module; 71 - Fifth pad; 72 - Sixth pad; 73 - Seventh pad; a - First central axis; b - Second central axis; c - Third central axis; d - Center point. Detailed Implementation
[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.
[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.
[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0042] By connecting the pads of the differential pressure sensor package structure to the pads of the circuit board one-to-one, the requirements for factory testing of the differential pressure sensor package structure can be met through the local wiring design of the circuit board, thus ensuring the product quality of the differential pressure sensor package structure. In the prior art, the number of pads in the differential pressure sensor package structure is limited and cannot be changed arbitrarily, while users have different requirements for the number of pads in testing and usage scenarios.
[0043] Furthermore, before connecting the pads of the differential pressure sensor package structure to the pads of the circuit board, it is necessary to distinguish the polarity of the differential pressure sensor package structure by the position of the pads, which adds an extra step.
[0044] The following description, in conjunction with the accompanying drawings, introduces the micro differential pressure sensor packaging structure, micro differential pressure testing components, and electronic equipment provided in the embodiments of this application.
[0045] See Figure 1As shown in the figure, this application provides a micro differential pressure sensor packaging structure 100, including: a substrate 1, a housing 2, and a micro differential pressure sensor 3. The substrate 1 includes a first surface 11 and a second surface 12 disposed opposite to each other, the first surface 11 and the second surface 12 being arranged along the thickness direction of the micro differential pressure sensor packaging structure 100. The first surface 11 has a terminal module 13, the terminal module 13 including a first terminal and a second terminal, the first terminal and the second terminal being different terminals. The second surface 12 has a first pad module 14. The first pad module 14 includes a first pad 141 (not shown) and a second pad 142 (not shown) disposed at intervals from each other. The first pad 141 is electrically connected to the first terminal, and the second pad 142 is electrically connected to the second terminal. In a first scenario, the first pad 141 and the second pad 142 are used to transmit different electrical signals; in a second scenario, the first pad 141 and the second pad 142 are short-circuited and used as a single pad. The housing 2 is located on one side of the first surface 11, and the housing 2 and the substrate 1 enclose a cavity 21. The differential pressure sensor 3 is located inside the cavity 21 and is electrically connected to the terminal module 13.
[0046] Specifically, the first scenario includes a test scenario for performance testing of the differential pressure sensor 3 (hereinafter referred to as the test scenario); the second scenario includes a usage scenario after the second pad module 7 (not shown) in the circuit board 200 (not shown) and the substrate 1 in the differential pressure sensor package structure 100 are surface-mounted (SMT) together (hereinafter referred to as the usage scenario).
[0047] Specifically, the differential pressure sensor package structure 100 also includes a connecting line 4 and an ASIC chip 6. The ASIC chip 6 (ASIC, Application Specific Integrated Circuit) is an integrated circuit designed for a specific application. The differential pressure sensor 3 and the ASIC chip 6 are electrically connected via the connecting line 4, and the differential pressure sensor 3 and the terminal module 13 are electrically connected via the connecting line 4.
[0048] In some embodiments, the median dimensions of the differential pressure sensor package structure 100 are 2.0 mm × 1.25 mm × 1.0 mm.
[0049] In some embodiments, see Figure 1 As shown, the housing 2 has at least one through hole 22 on the side away from the substrate 1. The first through hole 22 serves as a vent. The cavity 21 communicates with the external space through the first through hole 22.
[0050] In some embodiments, see Figure 6As shown, there are two first through holes 22, each circular. The two first through holes 22 are symmetrically arranged along a first central axis a and a second central axis b. Both the first central axis a and the second central axis b are central axes of the housing 2, and both are parallel to the surface of the housing 2 away from the substrate 1, and are perpendicular to each other. Based on this embodiment, the appearance of the housing 2 remains unchanged after the differential pressure sensor packaging structure 100 is rotated 180 degrees.
[0051] In some embodiments, see Figure 7 As shown, there are two first through holes 22. Each first through hole 22 is block-shaped and has two right angles and two rounded corners. The two first through holes 22 are symmetrically arranged along the first central axis a and the second central axis b. The edge of the first through hole 22 is connected to a baffle 221, which is recessed into the first surface 11 to prevent foreign objects from entering the first through hole 22. Based on this embodiment, the appearance of the housing 2 remains unchanged after the differential pressure sensor packaging structure 100 is rotated 180 degrees.
[0052] In some embodiments, see Figure 8 As shown, there is one first through hole 22, which is rectangular and symmetrically arranged along the first central axis a. The edge of the first through hole 22 is connected to two baffles 221, which are recessed into the first surface 11 to prevent foreign objects from entering the first through hole 22. The micro differential pressure sensor packaging structure 100 also includes a protective device 5, which is connected to the housing 2 and covers the first through hole 22.
[0053] In some embodiments, see Figure 1 As shown, the protective device 5 is connected to the housing 2 and covers the first through hole 22. The protective device 5 can be an oil-proof and acid-proof mesh, which is used to prevent oily and acidic substances from entering the cavity 21 through the first through hole 22.
[0054] In some embodiments, see Figure 1 and Figure 2 As shown, the substrate 1 has a third central axis c, which is parallel to the second surface 12 and is the central axis of the substrate 1; the substrate 1 has a second through hole 15 that penetrates the substrate 1, the center of the second through hole 15 coincides with the third central axis c, the projection of the micro differential pressure sensor 3 on the substrate 1 overlaps with the second through hole 15, and the second through hole 15 serves as a vent.
[0055] In some embodiments, see Figure 2As shown, the first pad module 14 also includes a third pad 143. The first pad 141 and the second pad 142 are arranged around the second through-hole 15, with the first pad 141 symmetrically arranged along the third central axis c, and the second pad 142 symmetrically arranged along the third central axis c. There are two second pads 142, one semi-circular and the other rectangular. There are multiple third pads 143, all of which are rectangular.
[0056] In the first scenario (test scenario), the first pad 141 and the second pad 142 are used to transmit different electrical signals. For example, the first pad 141 is used to transmit a test signal, and the second pad 142 is used to transmit a ground signal. In the second scenario (use scenario), the first pad 141 and the second pad 142 are electrically connected to the second pad module 7 on the circuit board 200, realizing a short circuit between the first pad 141 and the second pad 142. After the short circuit, the first pad 141 and the second pad 142 form a single pad structure for grounding and transmitting a ground signal.
[0057] Terminal module 13 also includes a third terminal, which is electrically connected to a third pad 143 and also electrically connected to the electrodes in the differential pressure sensor 3. In a first scenario (test scenario), the third pad 143 is used to transmit the polarity signal of the differential pressure sensor 3. In a second scenario (use scenario), the third pad 143 is used to transmit the polarity signal of the differential pressure sensor 3.
[0058] Furthermore, the first pad 141, the second pad 142, and the third pad 143 are all copper pads.
[0059] Furthermore, in the second scenario (use scenario), the first pad 141 and the second pad 142 can be shorted by solder paste. After shorting, the first pad 141 and the second pad 142 are used as a single polarity.
[0060] Furthermore, the area of the first pad 141 ranges from 0.09 mm. 2 Up to 2mm 2 .
[0061] Furthermore, the area of the second pad 142 ranges from 0.09 mm. 2 Up to 4mm 2 .
[0062] Based on the above embodiments, increasing the total area of the first pad 141 and the second pad 142 facilitates heat dissipation in the differential pressure sensor package structure 100. Furthermore, since the areas of the first pad 141 and the second pad 142 are relatively large, their stability is high after electrical connection with the second pad module 7, making it less likely for the differential pressure sensor package structure 100 to detach from the circuit board 200.
[0063] In some embodiments, see Figure 3 As shown, the first pad module 14 also includes a third pad 143 and a fourth pad 144. The fourth pad 144 is annular and surrounds the second through hole 15. The third pad 143 is located on one side of the third central axis c, and the first pad 141 and the second pad 142 are located on the other side of the third central axis c. The first pad 141 and the second pad 142 are separated by an isolation strip 121. The width of the isolation strip 121 ranges from 0.05 mm to 0.075 mm.
[0064] In the first scenario (test scenario), the first pad 141 and the second pad 142 are used to transmit different electrical signals. For example, the first pad 141 is used to transmit the grounding signal of the differential pressure sensor 3. The second pad 142 is electrically connected to the housing 2 to ground the housing 2 and is used to transmit the grounding signal of the housing 2. By grounding the housing 2, static electricity is quickly discharged to the ground through the grounding path formed by the housing 2 and the second pad 142, thereby avoiding the accumulation of static electricity on the surface of the differential pressure sensor package structure 100, reducing the risk of damage to the internal circuitry of the differential pressure sensor package structure 100 by static electricity, and achieving electrostatic discharge protection.
[0065] In the second scenario (use scenario), the first pad 141 and the second pad 142 are electrically connected to the second pad module 7 on the circuit board 200, realizing the short circuit between the first pad 141 and the second pad 142. After the short circuit, the first pad 141 and the second pad 142 form a pad structure for grounding and transmitting grounding signals.
[0066] In the second scenario (use scenario), the first pad 141, the second pad 142, and the fourth pad 144 can also be electrically connected to the second pad module 7 on the circuit board 200 to achieve shorting of the first pad 141, the second pad 142, and the fourth pad 144. After shorting, the first pad 141, the second pad 142, and the fourth pad 144 are used as a single pad structure.
[0067] Terminal module 13 also includes a third terminal and a fourth terminal. The third terminal is electrically connected to a third pad 143 and is also electrically connected to the positive electrode in the differential pressure sensor 3. The fourth terminal is electrically connected to a fourth pad 144 and is also electrically connected to the negative electrode in the differential pressure sensor 3. In the first scenario (test scenario) and the second scenario (use scenario), the third pad 143 is used to transmit a positive polarity signal, and the fourth pad 144 can also be used to transmit a negative polarity signal.
[0068] Through the above embodiments, the isolation strip 121 is used to divide a complete pad structure into a first pad 141 and a second pad 142, which increases the number of pads. The first pad 141 and the second pad 142 can be used independently in the first scenario, or they can be used as a pad structure after shorting in the second scenario, thus meeting the usage requirements of different scenarios.
[0069] In some embodiments, see Figure 4 As shown, the second surface 12 has a center point d, which is the geometric center of the second surface 12; the first pad module 14 also includes a third pad 143; the substrate 1 has a second through hole 15 penetrating the substrate 1, the center of the second through hole 15 coincides with the center point d, and a differential pressure sensor 3 (not shown) blocks the second through hole 15; the third pad 143 is arranged around the second through hole 15; the first pad 141 and the second pad 142 are located on both sides of the third pad 143, and the first pad 141 and the second pad 142 form a centrally symmetrical structure around the center point d. The third pad 143 is a continuous ring, and the third pad 143 forms a centrally symmetrical structure around the center point d.
[0070] In the first scenario (test scenario), the first pad 141 is used to transmit test signals; the second pad 142 is electrically connected to the negative electrode in the differential pressure sensor 3 via the second terminal, and the second pad 142 is used to transmit negative polarity signals. In the second scenario (use scenario), the first pad 141 and the second pad 142 are electrically connected to the second pad module 7 on the circuit board 200, realizing a short circuit between the first pad 141 and the second pad 142. After the short circuit, the first pad 141 and the second pad 142 form a single pad structure for grounding and transmitting ground signals.
[0071] The third terminal is electrically connected to the third pad 143, and is also electrically connected to the positive electrode in the differential pressure sensor 3. In the first scenario (test scenario) and the second scenario (use scenario), the third pad 143 is used to transmit a positive polarity signal.
[0072] In some embodiments, see Figure 5 As shown, the second surface 12 has a center point d; the first pad module 14 also includes a third pad 143; the substrate 1 has a second through hole 15 penetrating the substrate 1, the center of the second through hole 15 coincides with the center point d, and the micro differential pressure sensor 3 (not shown) blocks the second through hole 15; the first pad 141 and the second pad 142 are arranged around the second through hole 15, and the first pad 141 and the second pad 142 form a centrally symmetrical structure around the center point d; the third pad 143 includes a first part 145 and a second part 146 that are isolated from each other, the first part 145 and the second part 146 are located on both sides of the second through hole 15, and the first part 145 and the second part 146 form a centrally symmetrical structure around the center point d.
[0073] In the first scenario (test scenario), the first pad 141 is used to transmit test signals; the second pad 142 is electrically connected to the negative electrode in the differential pressure sensor 3 via the second terminal, and the second pad 142 is used to transmit negative polarity signals. In the second scenario (use scenario), the first pad 141 and the second pad 142 are electrically connected to the second pad module 7 on the circuit board 200, realizing a short circuit between the first pad 141 and the second pad 142. After the short circuit, the first pad 141 and the second pad 142 form a single pad structure for grounding and transmitting ground signals.
[0074] The third terminal is electrically connected to the third pad 143, and is also electrically connected to the positive electrode in the differential pressure sensor 3. In the first scenario (test scenario) and the second scenario (use scenario), the third pad 143 is used to transmit a positive polarity signal.
[0075] Furthermore, the area of the first pad 141 ranges from 0.2 mm. 2 Up to 2mm 2 The area of the second pad 142 ranges from 0.2 mm. 2 Up to 2mm 2 .
[0076] Based on the above embodiments, since the first pad module 14 forms a centrally symmetrical structure around the center point d, and the center of the second through hole 15 coincides with the center point d, the appearance of the second surface 12 does not change after the second surface 12 is rotated 180 degrees, and the polarity of the first pad 141 and the second pad 142 does not change after rotation. Before performing tape and reel testing, it is not necessary to distinguish the polarity of the differential pressure sensor package structure 100, reducing the steps of distinguishing polarity, thus improving testing efficiency and preventing tape and reel reversal and circuit board 200SMT failure caused by incorrect polarity distinction in the prior art.
[0077] This application proposes a differential pressure testing component, see reference. Figure 9 As shown, the differential pressure testing component includes: a differential pressure sensor packaging structure 100 as described in any of the above embodiments and a circuit board 200. The circuit board 200 includes a second pad module 7, which is electrically connected to the first pad module 14.
[0078] In some embodiments, see Figure 10As shown, the second pad module 7 includes a fifth pad 71 and a sixth pad 72. The fifth pad 71 is correspondingly disposed to the first pad 141 and the second pad 142, and is electrically connected to both the first pad 141 and the second pad 142 to short-circuit them. The sixth pad 72 is correspondingly disposed to the third pad 143, and is electrically connected to the third pad 143. In this embodiment, the fifth pad 71 and... Figure 2 The first pad 141 and the second pad 142 are set accordingly, and the sixth pad 72 is set with... Figure 2 The third pad 143 in the middle is set accordingly.
[0079] In some embodiments, see Figure 11 As shown, the second pad module 7 also includes a seventh pad 73. In this embodiment, the fifth pad 71 and... Figure 3 The first pad 141 and the second pad 142 are correspondingly arranged, and the fifth pad 71 is electrically connected to the first pad 141 and the second pad 142 respectively, so as to short-circuit the first pad 141 and the second pad 142. The sixth pad 72 and Figure 3 The third pad 143 is correspondingly provided, and the sixth pad 72 is electrically connected to the third pad 143. The seventh pad 73 is... Figure 3 The fourth pad 144 is correspondingly provided, and the seventh pad 73 is electrically connected to the fourth pad 144.
[0080] This application proposes an electronic device including a differential pressure sensor packaging structure 100 as described in any of the above embodiments.
[0081] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0082] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.
[0083] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. A micro differential pressure sensor packaging structure, characterized in that, include: The substrate (1) includes a first surface (11) and a second surface (12) disposed opposite to each other. The first surface (11) has a terminal module (13), which includes a first terminal and a second terminal. The second surface (12) has a first pad module (14), which includes a first pad (141) and a second pad (142) disposed at intervals from each other. The first pad (141) is electrically connected to the first terminal, and the second pad (142) is electrically connected to the second terminal. In a first scenario, the first pad (141) and the second pad (142) are used to transmit different electrical signals. In a second scenario, the first pad (141) and the second pad (142) are short-circuited and used as a single pad. The housing (2) is located on one side of the first surface (11), and the housing (2) and the substrate (1) surround to form a cavity (21); The differential pressure sensor (3) is located inside the cavity (21) and is electrically connected to the terminal module (13).
2. The micro differential pressure sensor packaging structure according to claim 1, characterized in that, The housing (2) has at least one first through hole (22) penetrating the housing, and the cavity (21) communicates with the external space through the first through hole (22).
3. The micro differential pressure sensor packaging structure according to claim 2, characterized in that, There are two first through holes (22). The two first through holes (22) are symmetrically arranged along the first central axis (a) and the second central axis (b). The first central axis (a) and the second central axis (b) are both the central axes of the housing (2). The first central axis (a) and the second central axis (b) are both parallel to the surface of the housing (2) away from the substrate (1).
4. The micro differential pressure sensor packaging structure according to claim 2 or 3, characterized in that, It also includes a protective device (5), which is connected to the housing (2) and covers the first through hole (22).
5. The micro differential pressure sensor packaging structure according to claim 1, characterized in that, The substrate (1) has a third central axis (c) that is parallel to the second surface (12); The substrate (1) has a second through hole (15) that passes through the substrate (1), the center of the second through hole (15) coincides with the third central axis (c), and the differential pressure sensor (3) blocks the second through hole (15).
6. The micro differential pressure sensor packaging structure according to claim 5, characterized in that, The first pad (141) and the second pad (142) are arranged around the second through hole (15), and the first pad (141) is symmetrically arranged along the third central axis (c), and the second pad (142) is symmetrically arranged along the third central axis (c).
7. The micro differential pressure sensor packaging structure according to claim 5, characterized in that, The first pad module (14) further includes a third pad (143) and a fourth pad (144). The fourth pad (144) is annular and surrounds the second through hole (15). The third pad (143) is located on one side of the third central axis (c), and the first pad (141) and the second pad (142) are located on the other side of the third central axis (c). The first pad (141) and the second pad (142) are separated by an isolation strip (121).
8. The micro differential pressure sensor packaging structure according to claim 7, characterized in that, The width of the isolation strip (121) ranges from 0.05 mm to 0.075 mm.
9. The micro differential pressure sensor packaging structure according to claim 1, characterized in that, The second surface (12) has a center point (d); The first pad module (14) also includes a third pad (143); The substrate (1) has a second through hole (15) that passes through the substrate (1), the center of the second through hole (15) coincides with the center point (d), and the differential pressure sensor (3) blocks the second through hole (15). The third pad (143) is disposed around the second through hole (15); The first pad (141) and the second pad (142) are located on both sides of the third pad (143), and the first pad (141) and the second pad (142) form a centrally symmetrical structure around the center point (d).
10. The micro differential pressure sensor packaging structure according to claim 9, characterized in that, The third pad (143) is a continuous ring, and the third pad (143) forms a centrally symmetrical structure around the center point (d).
11. The micro differential pressure sensor packaging structure according to claim 1, characterized in that, The second surface (12) has a center point (d); The first pad module (14) also includes a third pad (143); The substrate (1) has a second through hole (15) that passes through the substrate (1), the center of the second through hole (15) coincides with the center point (d), and the differential pressure sensor (3) blocks the second through hole (15). The first pad (141) and the second pad (142) are arranged around the second through hole (15), and the first pad (141) and the second pad (142) form a centrally symmetrical structure around the center point (d); The third pad (143) includes a first part (145) and a second part (146), the first part (145) and the second part (146) are located on both sides of the second through hole (15), and the first part (145) and the second part (146) form a centrally symmetrical structure around the center point (d).
12. A differential pressure testing component, characterized in that, include: The micro differential pressure sensor packaging structure (100) as described in any one of claims 1 to 11; The circuit board (200) includes a second pad module (7) which is electrically connected to the first pad module (14).
13. The differential pressure testing assembly according to claim 12, characterized in that, The second pad module (7) includes a fifth pad (71), which is provided in correspondence with the first pad (141) and the second pad (142), and is electrically connected to the first pad (141) and the second pad (142) respectively.
14. An electronic device, characterized in that, Includes the micro differential pressure sensor packaging structure (100) as described in any one of claims 1 to 11.