Combined sensor and electronic equipment

Abstract

The utility model provides a combined sensor and an electronic device, the combined sensor comprises a packaging structure formed by assembling a PCB and a metal shell, and the PCB in the packaging structure is provided with an inertia device unit and a microphone device unit. The inertial device unit comprises a first MEMS chip arranged on a PCB in the packaging structure, the microphone device unit comprises a second MEMS chip arranged on the PCB in the packaging structure, a sound hole communicated with the outside is formed in the PCB corresponding to the second MEMS chip, and the first MEMS chip and the second MEMS chip are arranged in the packaging structure. The microphone device unit picks up air conduction sound through the sound hole. According to the utility model, the problem of poor user experience caused by the fact that better information cannot be captured due to the design structure of the size and the number of devices in the existing combined sensor can be solved.

Description

Technical Field

[0001] This utility model relates to the field of VCC and MIC combined sensor technology, and particularly to a VCC and MIC combined sensor and electronic device. Background Technology

[0002] The VACC (Voice Accelerometer) sensor is a type of inertial sensor commonly used in TWS, OWS, AR, and Glasses devices to pick up bone conduction vibration signals when the wearer speaks, which are then used for ENC uplink noise reduction. Because the vibration signal bandwidth is relatively narrow (generally less than 2kHz), using only an inertial sensor will result in the loss of many high-frequency components, making the sound distorted and muffled. Therefore, it is usually used in conjunction with a MIC (microphone) at the device level. The high-frequency components are fused using the air conduction signals picked up by the MIC, thus ensuring noise reduction while also improving sound fidelity and making the sound more natural.

[0003] Currently, consumer electronics products generally pursue miniaturization and high integration, which places high demands on device size. When using both microphone sensors and inertial sensors simultaneously, stacking design presents a challenge. Due to the size and quantity of devices, some locations with good signal capture cannot be placed, resulting in a poor user experience. To solve this problem, there is an urgent need for a new type of combined sensor structure. Utility Model Content

[0004] In view of the above problems, the purpose of this utility model is to provide a combined sensor and electronic device to solve the problem that the design structure of existing combined sensors, due to the size and number of device components, cannot capture good information, resulting in a poor user experience.

[0005] This utility model provides a combined sensor, comprising: a package structure formed by assembling a PCB board and a metal shell; an inertial device unit and a microphone device unit respectively disposed on the PCB board inside the package structure; the inertial device unit including a first MEMS chip disposed on the PCB board inside the package structure; and the microphone device unit including a second MEMS chip disposed on the PCB board inside the package structure.

[0006] A sound hole connected to the outside is provided on the PCB board corresponding to the second MEMS chip, and the microphone device unit picks up air-conducted sound through the sound hole.

[0007] Preferably, the inertial device unit further includes a first ASIC chip, and the microphone device unit further includes a second ASIC chip.

[0008] Preferably, the first MEMS chip and the second ASIC chip are respectively disposed on a PCB board inside the package structure, wherein,

[0009] The first ASIC chip is mounted on the first MEMS chip, and the second ASIC chip and the second MEMS chip are electrically connected by gold wire.

[0010] Preferably, a protective layer is wrapped around the second ASIC chip, wherein,

[0011] The protective layer is used to prevent the second ASIC chip from becoming photosensitized.

[0012] Preferably, chip pads are respectively provided on the bottom of the first MEMS chip, the second ASIC chip, and the second MEMS chip, wherein,

[0013] The first MEMS chip, the second ASIC chip, and the second MEMS chip are electrically connected to the PCB board through the chip pads.

[0014] Preferably, the first ASIC chip and the second ASIC chip are respectively embedded inside the PCB board, and the first MEMS chip is disposed on the PCB board inside the packaging structure.

[0015] Preferably, a first circuit and a second circuit are pre-embedded inside the PCB board; wherein,

[0016] The first ASIC chip is electrically connected to the first MEMS chip through the first line, and the second ASIC chip is electrically connected to the second MEMS chip through the second line.

[0017] Preferably, the metal casing is fixed to the PCB board by an adhesive, wherein the adhesive is silver paste, solder paste, silicone, or epoxy.

[0018] Preferably, an external pad is provided on a PCB board outside the packaging structure, and the PCB board is electrically connected to external devices through the external pad.

[0019] This utility model also provides an electronic device, including the above-mentioned combined sensor, wherein...

[0020] The inertial device unit of the combined sensor is used to pick up bone conduction vibration signals, and the microphone device unit of the combined sensor is used to pick up air conduction sound.

[0021] As can be seen from the above technical solution, the combined sensor and electronic device provided by this utility model sets up an inertial device unit and a microphone device unit inside the package structure. A sound hole connected to the outside is set on the PCB board corresponding to the MEMS chip of the microphone device unit. The microphone device unit picks up air conduction sound through the sound hole, and the inertial device unit is used to pick up bone conduction vibration signals when the wearer speaks. This structural design reduces the overall size of the product, makes it more convenient for users to stack the design, and meets the requirements of high integration. That is, it improves the application experience while ensuring the noise reduction effect and improving the sound reproduction, making the sound more natural, thereby better meeting the user experience.

[0022] To achieve the foregoing and related objectives, one or more aspects of the present invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the present invention. However, these aspects indicate only a few of the various ways in which the principles of the present invention can be used. Furthermore, the present invention is intended to include all such aspects and their equivalents. Attached Figure Description

[0023] Other objects and results of this utility model will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention. In the drawings:

[0024] Figure 1 This is a schematic diagram of the combined sensor structure according to an embodiment of the present invention.

[0025] The reference numerals in the accompanying drawings include: 1. Metal casing, 2. PCB board, 3. First ASIC chip, 4. First MEMS chip, 5. Second ASIC chip, 6. Second MEMS chip, 7. Sound hole.

[0026] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0027] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0028] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] To address the aforementioned problem of poor user experience caused by the inability to capture good information due to the design structure of existing combined sensors with limited device size and quantity, this invention proposes a combined sensor and electronic device.

[0030] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0031] To illustrate the structure of the combined sensor provided by this utility model, Figure 1 A combined sensor structure according to an embodiment of the present invention is shown.

[0032] like Figure 1 As shown, the combined sensor provided by this utility model includes: a package structure formed by assembling a PCB board 2 and a metal shell 1. An inertial device unit and a microphone device unit are respectively disposed on the PCB board 2 inside the package structure. The inertial device unit includes a first MEMS chip 4 disposed on the PCB board inside the package structure, and the microphone device unit includes a second MEMS chip 6 disposed on the PCB board 2 inside the package structure. A sound hole 7 communicating with the outside is provided on the PCB board 2 corresponding to the second MEMS chip 6. The microphone device unit picks up air-conducted sound through the sound hole 7.

[0033] In an embodiment of this invention, the microphone unit picks up air-conducted sound through a sound hole, and the inertial device unit picks up bone conduction vibration signals when the wearer speaks. The inertial device unit includes a first ASIC chip 3 and a first MEMS chip 4, and the microphone unit includes a second ASIC chip and a second MEMS chip 6.

[0034] In the embodiments of this utility model, in order to reduce the overall size of the product, facilitate user stacking design, and meet the requirements of high integration, the structural design forms of the inertial device unit and the microphone device unit include at least two types. One specific embodiment is as follows: the first MEMS chip 4, the second ASIC chip 5, and the second MEMS chip 6 are respectively disposed on the PCB board 2 inside the package structure, wherein the first ASIC chip 3 is disposed on the first MEMS chip 4, and the second ASIC chip 5 and the second MEMS chip 6 are electrically connected by gold wire.

[0035] In this embodiment, a protective layer is wrapped around the second ASIC chip 5 to prevent photosensitization. Chip pads are respectively provided on the bottom of the first MEMS chip 4, the second ASIC chip 5, and the second MEMS chip 6, and the first MEMS chip 4, the second ASIC chip 5, and the second MEMS chip 6 are electrically connected to the PCB board 2 through these chip pads.

[0036] In this embodiment, since the inertial device unit itself is not sensitive to air-conducted sound, no additional protective design is required to enable the two systems to operate independently, resulting in a simpler structure and manufacturing process. The overall size is reduced by approximately 40% compared to the original separate microphone sensor and inertial sensor.

[0037] To further reduce the overall size, the inertial device unit and microphone device unit can also be designed with other structures. Another specific embodiment of the inertial device unit and microphone device unit is as follows: the first ASIC chip 3 and the second ASIC chip 5 are respectively embedded inside the PCB 2 board, and the first MEMS chip 4 and the second MEMS chip 6 are disposed on the PCB 2 inside the package structure. A first circuit and a second circuit are pre-embedded inside the PCB 2; the first ASIC chip 3 is electrically connected to the first MEMS chip 4 through the first circuit, and the second ASIC chip 5 is electrically connected to the second MEMS chip 6 through the second circuit. The first MEMS chip 4 and the second MEMS chip 6 are electrically connected to the PCB 2 through chip pads. In this embodiment, because the first ASIC chip 3 and the second ASIC chip 5 are respectively embedded inside the PCB 2 board, the overall size of the product is reduced, satisfying both the requirement for reduced overall product size and the requirement for high integration.

[0038] Furthermore, in embodiments of this invention, the metal casing 1 is fixed to the PCB board 2 by an adhesive, wherein the adhesive is silver paste, solder paste, silicone, or epoxy resin. The specific adhesive is selected according to the actual situation in specific applications and is not limited to any one type. External pads are provided on the PCB board 2 outside the packaging structure, and the PCB board 2 is electrically connected to external devices through these external pads.

[0039] In addition, this utility model also provides an electronic device, including the above-mentioned combined sensor, wherein the inertial device unit of the combined sensor is used to pick up bone conduction vibration signals when the wearer speaks, and the microphone device unit of the combined sensor is used to pick up air conduction sound.

[0040] The specific structure of the combined sensor is as described in the foregoing embodiments. Since this electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be described in detail here.

[0041] In this embodiment, the combined sensor is connected via a flexible printed circuit board (FPCB). One end of the FPCB is electrically connected to the combined sensor, and the other end is used to connect to an external power source. It can be understood that the flexible printed circuit board is used to connect and conduct external circuitry to the combined sensor.

[0042] In this embodiment, the electronic device can be TWS, OWS, AR, Glasses, etc., and is not limited thereto. In the electronic device, the unidirectional MEMS microphone can be assembled into the housing of the electronic device as a module, or it can be assembled into the housing of the electronic device as a single unit.

[0043] Specifically, when the combined sensor is applied to terminal devices such as TWS and OWS, it is mounted on the motherboard via SMT to replace the Talk MIC (Microphone) or FF MIC (Feedforward Microphone). While retaining the beamforming function, it uses VCC (Voice Accelerometer) to pick up bone conduction vibration signals, further improving the ENC noise reduction effect. Alternatively, it can be mounted on the FPC via SMT and placed inside the earphone cavity to replace the FB MIC (Feedback Microphone). It can also be combined with Talk MIC + FF MIC to achieve a design scheme that combines microphone device unit with inertial device unit.

[0044] When the combined sensor is applied to terminal devices such as AR and Glasses, the combined sensor can be placed in the nose pad or crossbeam. Without affecting the original call quality, inertial devices can be used for noise reduction design, realizing a design scheme that combines microphone device unit with inertial device unit.

[0045] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.

Claims

1. A combined sensor, comprising: A package structure formed by assembling a PCB board and a metal casing, wherein an inertial device unit and a microphone device unit are respectively disposed on the PCB board inside the package structure, characterized in that the inertial device unit includes a first MEMS chip disposed on the PCB board inside the package structure, and the microphone device unit includes a second MEMS chip disposed on the PCB board inside the package structure, wherein... A sound hole connected to the outside is provided on the PCB board corresponding to the second MEMS chip, and the microphone device unit picks up air-conducted sound through the sound hole.

2. The combined sensor according to claim 1, characterized in that, The inertial device unit further includes a first ASIC chip, and the microphone device unit further includes a second ASIC chip.

3. The combined sensor according to claim 2, characterized in that, The first MEMS chip and the second ASIC chip are respectively disposed on a PCB board inside the package structure, wherein, The first ASIC chip is mounted on the first MEMS chip, and the second ASIC chip and the second MEMS chip are electrically connected by gold wire.

4. The combined sensor according to claim 3, characterized in that, A protective layer is wrapped around the second ASIC chip, wherein, The protective layer is used to prevent the second ASIC chip from becoming photosensitized.

5. The combined sensor according to claim 4, characterized in that, Chip pads are respectively provided on the bottom of the first MEMS chip, the second ASIC chip, and the second MEMS chip. The first MEMS chip, the second ASIC chip, and the second MEMS chip are electrically connected to the PCB board through the chip pads.

6. The combined sensor according to claim 2, characterized in that, The first ASIC chip and the second ASIC chip are respectively embedded inside the PCB board, and the first MEMS chip is disposed on the PCB board inside the package structure.

7. The combined sensor according to claim 6, characterized in that, The PCB board has a first circuit and a second circuit pre-embedded inside; wherein, The first ASIC chip is electrically connected to the first MEMS chip through the first line, and the second ASIC chip is electrically connected to the second MEMS chip through the second line.

8. The combined sensor according to claim 1, characterized in that, The metal casing is fixed to the PCB board by an adhesive, wherein the adhesive is silver paste, solder paste, silicone, or epoxy.

9. The combined sensor according to claim 1, characterized in that, An external pad is provided on the PCB board outside the packaging structure, and the PCB board is electrically connected to external devices through the external pad.

10. An electronic device, characterized in that, Including the combined sensor as described in any one of claims 1-9, wherein, The inertial device unit of the combined sensor is used to pick up bone conduction vibration signals, and the microphone device unit of the combined sensor is used to pick up air conduction sound.

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