Display module

Abstract

A display module comprises a housing member, a backlight module, a display screen, an adhesive tape layer, a driving circuit board, a soaking-thermal insulation material layer and a light-transmitting cover plate. The backlight module is located in the housing member. The display screen is located in the shell piece and located on the backlight module. The adhesive tape layer surrounds the display screen. The driving circuit board is located on the display screen. The soaking-heat insulation material layer is located on the adhesive tape layer and the driving circuit board. And the light-transmitting cover plate is positioned on the soaking-heat insulating material layer. As the soaking-heat-insulating material layer is additionally arranged between the driving circuit board and the adhesive tape layer, a large amount of heat energy emitted by the driving circuit board can be quickly conducted to the adhesive tape layer through the soaking-heat-insulating material layer and then conducted to the shell piece, and heat exchange with outside air is carried out through the shell piece with a larger surface area; the heat energy generated by the driving circuit board can be effectively conducted out, the temperature of the light-transmitting cover plate is reduced, and the reliability of the display module and the touch feeling of a human body are better.

Description

Technical Field

[0001] This disclosure relates to a display module. Background Technology

[0002] In the field of automotive displays, a common manufacturing process is chip-on-glass (COG) packaging, which involves encapsulating one or more driver chips on a glass substrate. However, driver chips generate a lot of heat and consume a lot of power. After the screen is turned on, the driver chips, which are difficult to dissipate heat due to being buried under the glass cover, become the culprit for the temperature rise of the glass cover, which can easily affect the operation of the display and the tactile experience of the user. Utility Model Content

[0003] The technical specification disclosed herein is a display module.

[0004] According to one embodiment of this disclosure, a display module includes a housing, a backlight module, a display screen, an adhesive tape layer, a driving circuit board, a heat-spreading and heat-insulating material layer, and a light-transmitting cover. The backlight module is located within the housing. The display screen is located within the housing and on top of the backlight module. The adhesive tape layer surrounds the display screen. The driving circuit board is located on the display screen. The heat-spreading and heat-insulating material layer is located on the adhesive tape layer and the driving circuit board. The light-transmitting cover is located on the heat-spreading and heat-insulating material layer.

[0005] In one embodiment of this disclosure, there is a gap between the housing and the display screen, and a heat-insulating material layer spans the gap.

[0006] In one embodiment of this disclosure, the display module further includes a system board. The system board is located below the backlight module and within the housing, and is electrically connected to the backlight module.

[0007] In one embodiment of this disclosure, the system board is suspended below the backlight module without contacting the housing.

[0008] In one embodiment of this disclosure, the display module further includes an optical adhesive layer. The optical adhesive layer is located between the light-transmitting cover and the display screen.

[0009] In one embodiment disclosed herein, the two opposing surfaces of the heat-spreading and heat-insulating material layer directly contact the drive circuit board and the light-transmitting cover plate, respectively.

[0010] In one embodiment of this disclosure, the heat-spreading and heat-insulating material layer includes a first adhesive layer, a heat-spreading material layer, a second adhesive layer, and a heat-insulating material layer. The first adhesive layer contacts the drive circuit board. The heat-spreading material layer is located on the first adhesive layer. The second adhesive layer is located on the heat-spreading material layer. The heat-insulating material layer is located on the second adhesive layer.

[0011] In one embodiment of this disclosure, the heat-spreading / insulating material layer comprises a first adhesive layer, an insulating material layer, a second adhesive layer, and a heat-spreading material layer. The insulating material layer is located on the first adhesive layer. The second adhesive layer is located on the insulating material layer. The heat-spreading material layer is located on the second adhesive layer and contacts the light-transmitting cover plate.

[0012] In one embodiment of this disclosure, a portion of the tape layer overlaps with the housing component.

[0013] In one embodiment of this disclosure, a portion of the heat-spreading and heat-insulating material layer protrudes beyond the boundary of the drive circuit board.

[0014] In the above-disclosed embodiment, since a heat-spreading and heat-insulating material layer is added between the driving circuit board and the tape layer, a large amount of heat energy generated by the driving circuit board can be quickly conducted to the tape layer through the heat-spreading and heat-insulating material layer, and then to the outer casing. Through the heat exchange between the outer casing with a large surface area and the outside air, the heat energy generated by the driving circuit board can be effectively conducted away, reducing the temperature of the light-transmitting cover, and improving the reliability of the display module and the human touch. Attached Figure Description

[0015] The nature of this disclosure can be best understood by reading it in conjunction with the accompanying illustrations and by the embodiments described below. Note that, according to standard practice in the industry, the various features are not drawn to scale. In fact, the dimensions of the various features may be increased or decreased arbitrarily for clarity of explanation.

[0016] Figure 1 An exploded view of a display module according to one embodiment of this disclosure is shown;

[0017] Figure 2 Draw Figure 1 A cross-sectional view of the display module;

[0018] Figure 3 Draw Figure 2 A magnified view of a portion of area A of the display module;

[0019] Figure 4 Draw Figure 3 Cross-sectional view of the heat-spreading and heat-insulating material layer;

[0020] Figure 5 A cross-sectional view of a heat-equalizing-insulating material layer according to another embodiment of this disclosure is shown.

[0021] [Symbol Explanation]

[0022] 100: Display Module

[0023] 110: Housing components

[0024] 112: Gap

[0025] 114: Groove

[0026] 116: Upper surface

[0027] 120: Backlight Module

[0028] 130: Display screen

[0029] 140: Tape layer

[0030] 150: Driver circuit board

[0031] 160, 160a: Heat dissipation-insulation material layer

[0032] 162: First adhesive layer

[0033] 164: Heat dissipation material layer

[0034] 166: Second adhesive layer

[0035] 168: Thermal insulation material layer

[0036] 170: Translucent Cover Plate

[0037] 172: Upper surface

[0038] 180: System Board

[0039] 190: Optical adhesive layer

[0040] A: Area Detailed Implementation

[0041] The following description of embodiments provides many different implementations, or examples, for carrying out various features of the provided object. Specific examples of elements and arrangements are described below to simplify the subject matter. Of course, these examples are merely illustrative and are not intended to be limiting. Furthermore, element symbols and / or letters may be repeated in various examples. This repetition is for simplicity and clarity and does not in itself specify the relationship between the various embodiments and / or configurations discussed.

[0042] Spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for descriptive purposes to describe the relationship between one element or feature and another, as shown in the accompanying drawings. Spatial relative terms are intended to cover different orientations of the apparatus in use or operation other than those shown in the accompanying drawings. The apparatus may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein shall be interpreted accordingly.

[0043] Figure 1 An exploded view of a display module 100 according to one embodiment of the present disclosure is shown. Figure 2 Draw Figure 1 A cross-sectional view of the display module 100. Figure 3 Draw Figure 2 A magnified view of a portion of area A of the display module 100. (Refer to...) Figures 1 to 3 The display module 100 includes a housing 110, a backlight module 120, a display screen 130, an adhesive tape layer 140, a driver circuit board 150, a heat-spreading and heat-insulating material layer 160, and a light-transmitting cover 170. The light-transmitting cover 170 is, for example, a glass cover. The backlight module 120 is located within the housing 110. The display screen 130 is located within the housing 110 and on top of the backlight module 120. The adhesive tape layer 140 surrounds the display screen 130. The driver circuit board 150 is located on the display screen 130. The heat-spreading and heat-insulating material layer 160 is located on the adhesive tape layer 140 and the driver circuit board 150. The light-transmitting cover 170 is located on the heat-spreading and heat-insulating material layer 160. In some embodiments, the heat-spreading and heat-insulating material layer 160 may be bonded to the light-transmitting cover 170. In some embodiments, the heat-spreading and heat-insulating material layer 160 may be bonded to the driver circuit board 150. A gap 112 exists between the housing 110 and the display screen 130, and the heat-spreading / insulating material layer 160 and the upper light-transmitting cover plate 170 span the gap 112. In some embodiments, the drive circuit board 150 includes chip-on-glass (COG) directly packaged on the display screen 130. The two opposing surfaces of the heat-spreading / insulating material layer 160 directly contact the drive circuit board 150 and the light-transmitting cover plate 170, respectively.

[0044] Because a heat-spreading and heat-insulating material layer 160 is added between the driving circuit board 150 and the tape layer 140, a large amount of heat energy generated by the driving circuit board 150 can be quickly conducted to the tape layer 140 through the heat-spreading and heat-insulating material layer 160, and then to the housing 110. Through the heat exchange between the housing 110 with the outside air and the larger surface area, the heat energy generated by the driving circuit board 150 can be effectively conducted away, reducing the temperature of the light-transmitting cover 170. Compared with the traditional display module without the heat-spreading and heat-insulating material layer, the temperature is reduced by about 7°C, making the reliability of the aforementioned display module 100 and the human touch feel better.

[0045] In addition, the display module 100 also includes a system board 180. The system board 180 is located below the backlight module 120 and inside the housing 110, and is electrically connected to the backlight module 120. Furthermore, the display module 100 also includes an optical adhesive layer 190. The optical adhesive layer 190 is located below the light-transmitting cover plate 170 and between the light-transmitting cover plate 170 and the display screen 130. The two opposing surfaces of the heat-spreading / insulating material layer 160 directly contact the optical adhesive layer 190 and the light-transmitting cover plate 170, respectively. In this embodiment, a portion of the tape layer 140 overlaps with the housing 110. Furthermore, in this embodiment, a portion of the heat-spreading / insulating material layer 160 protrudes beyond the boundary of the drive circuit board 150. The material of the heat-spreading / insulating material layer 160 may include copper foil, graphite, nano-carbon copper, combinations thereof, or similar materials. The material of the tape layer 140 may include thermally conductive foam with thermal conductivity, VHB, combinations thereof, or similar materials.

[0046] Furthermore, in this embodiment, the system board 180 is suspended within the housing 110 without contacting it. Additionally, the housing 110 has a recess 114 on its inner side to accommodate the adhesive tape layer 140. In some embodiments, the upper surface 172 of the light-transmitting cover 170 is higher than the upper surface 116 of the housing 110, but this disclosure is not limited to this. In some embodiments, the thickness of the adhesive tape layer 140 may be greater than the thickness of the heat-spreading / insulating material layer 160, but this disclosure is not limited to this; for example, the thickness relationship between the two can be adjusted according to process requirements. In some embodiments, the display module 100 may include touch functionality, but this disclosure is not limited to this. In some embodiments, the heat-spreading / insulating material layer 160 is located in the black matrix (BM) area of ​​the light-transmitting cover 170, thus not affecting the overall viewing experience of the display module 100.

[0047] In some embodiments, the manufacturing process of the display module 100 involves first bonding an optical adhesive layer 190 to a light-transmitting cover plate 170, then bonding it to a heat-dissipating and heat-insulating material layer 160, followed by bonding an adhesive tape layer 140; then bonding the display screen 130, which already has the driver circuit board 150 encapsulated, to the cover plate. Next, the backlight module 120 is bonded; then, the system board 180 is assembled, and finally, the entire module is combined with the housing 110. This process ensures that the heat-dissipating and heat-insulating material layer 160 can effectively bridge the gap between the driver circuit board 150 and the housing 110, maximizing the heat conduction effect of the heat-dissipating and heat-insulating material layer 160.

[0048] Figure 4 Draw Figure 3 A cross-sectional view of the heat-spreading and insulation material layer 160. (Refer to...) Figure 4In some embodiments, the heat-spreading and heat-insulating material layer 160 includes a first adhesive layer 162, a heat-spreading material layer 164, a second adhesive layer 166, and a heat-insulating material layer 168. The first adhesive layer 162 contacts the drive circuit board 150. The heat-spreading material layer 164 is located on the first adhesive layer 162. The second adhesive layer 166 is located on the heat-spreading material layer 164. The heat-insulating material layer 168 is located on the second adhesive layer 166. The heat-spreading material layer 164 is configured to uniformly diffuse heat from one side (i.e., the side closest to the drive circuit board 150) throughout the entire heat-spreading material layer 164, while the heat-insulating material layer 168 is configured to isolate heat conduction in other directions, accelerating heat transfer in the heat-spreading material layer 164. The material of the heat-spreading material layer 164 may include copper foil, graphite, nano-carbon copper, combinations thereof, or similar materials. The material of the heat-insulating material layer 168 may include heat-insulating foam. This design directly contacts the drive circuit board 150 below, and its main function is to help the drive circuit board 150 conduct heat away.

[0049] Figure 5 A cross-sectional view of a heat-monotropic and heat-insulating material layer 160a according to another embodiment of this disclosure is shown. (Refer to...) Figure 5 In some embodiments, the heat-spreading / insulating material layer 160a includes a first adhesive layer 162, an insulating material layer 168, a second adhesive layer 166, and a heat-spreading material layer 164. The insulating material layer 168 is located on the first adhesive layer 162. The second adhesive layer 166 is located on the insulating material layer 168. The heat-spreading material layer 164 is located on the second adhesive layer 166 and contacts the light-transmitting cover plate 170. The heat-spreading material layer 164 is configured to uniformly diffuse heat from one side throughout the entire heat-spreading material layer 164, while the insulating material layer 168 is configured to isolate heat conduction in other directions, accelerating heat transfer in the heat-spreading material layer 164. The material of the heat-spreading material layer 164 may include copper foil, graphite, nano-carbon copper, combinations thereof, or similar materials. The material of the insulating material layer 168 may include insulating foam.

[0050] The foregoing outlines the features of several embodiments to enable those skilled in the art to better understand the nature of this disclosure. Those skilled in the art should understand that they can readily use this disclosure as the basis for designing or modifying other processes and structures to achieve the same purposes and / or advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and alterations can be made to them without departing from the spirit and scope of this disclosure.

Claims

1. A display module, characterized in that, Include: One outer casing; A backlight module is located inside the housing. A display screen is located inside the housing and on the backlight module; A layer of tape surrounds the display screen; A driver circuit board is located on the display screen; A heat-equalizing and heat-insulating material layer is located on the tape layer and the drive circuit board; as well as A light-transmitting cover is located on the heat-equalizing and heat-insulating material layer.

2. The display module as described in claim 1, characterized in that, There is a gap between the housing and the display screen, and the heat-absorbing and heat-insulating material layer spans the gap.

3. The display module as described in claim 1, characterized in that, Also includes: A system board is located below the backlight module and inside the housing, and is electrically connected to the backlight module.

4. The display module as described in claim 3, characterized in that, The system board is suspended below the backlight module without contacting the housing.

5. The display module as described in claim 1, characterized in that, Also includes: An optical adhesive layer is located between the light-transmitting cover and the display screen.

6. The display module as described in claim 5, characterized in that, The two opposing surfaces of the heat-absorbing and heat-insulating material layer are in direct contact with the drive circuit board and the light-transmitting cover, respectively.

7. The display module as described in claim 1, characterized in that, The heat-absorbing / insulating material layer includes: A first adhesive layer contacts the drive circuit board; A heat-equalizing material layer is located on the first adhesive layer; A second adhesive layer is located on the heat-dampening material layer; and An insulating material layer is located on the second adhesive layer.

8. The display module as described in claim 1, characterized in that, The heat-absorbing / insulating material layer includes: First adhesive layer; An insulating material layer is located on the first adhesive layer; A second adhesive layer, located on the insulation material layer; and A heat-equalizing material layer is located on the second adhesive layer and in contact with the light-transmitting cover plate.

9. The display module as described in claim 1, characterized in that, A portion of the tape layer overlaps with the housing component.

10. The display module as described in claim 1, characterized in that, A portion of the heat-absorbing and heat-insulating material layer protrudes beyond one boundary of the drive circuit board.

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