Electronic device

Abstract

The utility model discloses an electronic device. The electronic device comprises a device shell, a camera decoration ring and a heat dissipation module. The camera decoration ring is connected with the equipment shell, an equipment inner cavity is defined by the camera decoration ring and the equipment shell, a first ventilation hole is formed in the camera decoration ring, and a second ventilation hole is formed in the equipment shell; the heat dissipation module is arranged in the equipment inner cavity, the heat dissipation module comprises a module shell and a heat dissipation fan, an air passing channel is defined by the module shell, the air passing channel is communicated with the first ventilation hole and the second ventilation hole, and the heat dissipation fan is located in the air passing channel. Under the condition that the cooling fan rotates, airflow can be driven to enter the air passing channel from one of the first ventilation hole and the second ventilation hole, and is discharged through the other one of the first ventilation hole and the second ventilation hole, so that heat in the equipment shell can be taken away in an active cooling mode, and rapid cooling is achieved.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and more particularly to an electronic device. Background Technology

[0002] As the performance of electronic devices (such as smartphones and tablets) continues to improve, the heat generated inside them increases significantly. Existing heat dissipation solutions (such as metal heat sinks and graphite heat sinks) suffer from low heat dissipation efficiency and are no longer sufficient to meet the heat dissipation requirements under high-load scenarios. Therefore, a more efficient heat dissipation solution is urgently needed. Utility Model Content

[0003] This application discloses an electronic device to solve the problem of low heat dissipation efficiency in related technologies.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] This application discloses an electronic device, which includes a device housing, a camera decorative ring, and a heat dissipation module;

[0006] The camera decorative ring is connected to the device housing and together with the device housing, they form the inner cavity of the device. The camera decorative ring is provided with a first ventilation hole, and the device housing is provided with a second ventilation hole.

[0007] The heat dissipation module is disposed in the inner cavity of the device. The heat dissipation module includes a module housing and a cooling fan. The module housing forms an air passage, which connects the first ventilation hole and the second ventilation hole. The cooling fan is located in the air passage.

[0008] The technical solution adopted in this application can achieve the following technical effects:

[0009] The electronic device disclosed in this application improves upon related technologies by incorporating a heat dissipation module within its internal cavity. This module includes a housing and a cooling fan. The housing forms an airflow channel connecting a first ventilation hole and a second ventilation hole. The cooling fan is located within this channel. When the cooling fan rotates, it draws airflow from one of the first and second ventilation holes into the airflow channel and exhausts it through the other, thus actively dissipating heat from the housing and achieving rapid cooling. Furthermore, the integrated design of the camera decorative ring and the heat dissipation module optimizes the layout of the heat dissipation channel, improving the space utilization of the electronic device. Attached Figure Description

[0010] Figure 1This is one of the structural schematic diagrams of the electronic device disclosed in the embodiments of this application;

[0011] Figure 2 This is a second schematic diagram of the structure of the electronic device disclosed in the embodiments of this application;

[0012] Figure 3 This is the third schematic diagram of the structure of the electronic device disclosed in the embodiments of this application;

[0013] Figure 4 for Figure 3 Cross-sectional view along the AA direction;

[0014] Figure 5 for Figure 3 Cross-sectional view along the BB direction;

[0015] Figure 6 for Figure 5 Enlarged view of point a in the middle;

[0016] Figure 7 This is the fourth schematic diagram of the structure of the electronic device disclosed in the embodiments of this application;

[0017] Figure 8 This is an exploded view of the heat dissipation module disclosed in the embodiments of this application;

[0018] Figure 9 This is one of the structural schematic diagrams of the heat dissipation module disclosed in the embodiments of this application;

[0019] Figure 10 for Figure 9 Cross-sectional view along the CC direction;

[0020] Figure 11 This is a second schematic diagram of the structure of the heat dissipation module disclosed in the embodiments of this application;

[0021] Figure 12 for Figure 11 Cross-sectional view along the DD direction;

[0022] Figure 13 This is one of the structural schematic diagrams of the elastic sealing ring disclosed in the embodiments of this application;

[0023] Figure 14 This is a second schematic diagram of the structure of the elastic sealing ring disclosed in the embodiments of this application;

[0024] Figure 15 This is a schematic diagram of the finned heat dissipation structure disclosed in the embodiments of this application;

[0025] Figure 16 for Figure 15 Enlarged view of point b in the middle;

[0026] Figure 17This is a schematic diagram of the structure of the first subshell disclosed in an embodiment of this application;

[0027] Figure 18 This is a schematic diagram of the structure of the second subshell disclosed in an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 110 - Equipment housing, 111 - Second ventilation hole, 112 - Reinforcing rib, 120 - Camera decorative ring, 121 - First ventilation hole, 1211 - Sub-ventilation hole, 122 - Panel, 123 - Skirt, 130 - Heat dissipation module, 131 - Module housing, 1311 - First sub-shell, 1312 - Second sub-shell, 1313 - Mounting slot, 132 - Cooling fan, 133 - Air passage, 1331 - First opening, 1332 - Second opening, 134 - Dustproof mesh, 135 - First sealing part, 136 - Second sealing part, 137 - Sealing adhesive layer, 138 - Elastic sealing ring, 1381 - Gasket, 1382 - Elastic flared structure, 139 - Fin noise reduction structure, 1391 - Fin. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0032] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0033] Please refer to Figures 1 to 18 This application discloses an electronic device, which may be a mobile phone, tablet computer, e-book reader, game console, wearable device, etc. This application does not limit the specific type of electronic device.

[0034] The aforementioned electronic device may include a device housing 110, a camera decorative ring 120, and a heat dissipation module 130. The device housing 110 serves as the main frame of the electronic device. The camera decorative ring 120 is connected to the device housing 110 and together with the device housing 110, forms an inner cavity. Various components, such as the camera module and circuit boards, are housed within this inner cavity. It should be noted that the device housing 110 has mounting holes, in which the camera module is mounted. The camera decorative ring 120 covers these mounting holes and is positioned opposite the camera module to provide light transmission and protection for the camera module. The connection between the camera decorative ring 120 and the device housing 110 can be achieved through adhesive bonding, snap-fitting, or other methods.

[0035] The camera decorative ring 120 has a first ventilation hole 121, which can be located on the top surface or the side surface of the camera decorative ring 120. The side surface of the camera decorative ring 120 extends from its top surface. The device housing 110 has a second ventilation hole 111. The device housing 110 can be the mid-frame or back cover of an electronic device. The second ventilation hole 111 can be located on the mid-frame or the back cover of the electronic device.

[0036] A heat dissipation module 130 is disposed within the internal cavity of an electronic device. The heat dissipation module 130 may include a module housing 131 and a cooling fan 132. The module housing 131 forms an air passage 133, which connects to a first ventilation hole 121 and a second ventilation hole 111. The cooling fan 132 is located within the air passage 133. The air passage 133 can be connected to the first ventilation hole 121 and the second ventilation hole 111 in two ways: First, the module housing 131 has two open ends, which are interconnected through the air passage 133, and the two open ends extend into the first ventilation hole 121 and the second ventilation hole 111 respectively, forming a nested structure; second, the two open ends of the module housing 131 are respectively connected to the first ventilation hole 121 and the second ventilation hole 111, and a sealing gasket or sealant can be used at the connection point to achieve a seal.

[0037] When the cooling fan 132 is powered on and rotating, it drives the airflow within the air passage 133. The air enters the air passage 133 through one of the first ventilation holes 121 and the second ventilation hole 111, and then exits through the other of the first ventilation hole 121 and the second ventilation hole 111. The airflow within the air passage 133 carries away heat from the inside of the electronic device, thus achieving rapid heat dissipation. The power required for the cooling fan 132 to operate can be provided by the battery of the electronic device. Additionally, the device housing 110 of the electronic device also contains heat-generating components, such as the motherboard, sub-board, and battery. The heat dissipation module 130 is positioned close to these heat-generating components.

[0038] It should be added that the module housing 131 and the device housing 110 can be independent of each other. The module housing 131 can be installed in the device housing 110. The module housing 131, the device housing 110 and the camera decorative ring 120 can be connected by means of bonding, welding or other methods. Alternatively, the device housing 110 can include the module housing 131. That is to say, the module housing 131 is actually a part of the device housing 110. The module housing 131 and the air passage 133 can be formed on the device housing 110 by integral molding.

[0039] As described above, the electronic device disclosed in this application improves upon related technologies by incorporating a heat dissipation module 130 within its internal cavity. The heat dissipation module 130 includes a module housing 131 and a cooling fan 132. The module housing 131 forms an airflow channel 133, which connects to a first ventilation hole 121 and a second ventilation hole 111. The cooling fan 132 is located within the airflow channel 133. When the cooling fan 132 rotates, it drives airflow from one of the first ventilation hole 121 and the second ventilation hole 111 into the airflow channel 133, and then exhausts it through the other of the first ventilation hole 121 and the second ventilation hole 111. This active cooling method removes heat from the device housing 110, achieving rapid heat dissipation. Furthermore, the integrated design of the camera decorative ring 120 and the heat dissipation module 130 optimizes the layout of the heat dissipation channel, improving the space utilization of the electronic device.

[0040] like Figures 1 to 6As shown, the camera decorative ring 120 may include a panel 122 and a skirt 123. The skirt 123 is connected to the periphery of the panel 122 and extends from the panel 122 in a direction away from the panel 122. The panel 122 and the skirt 123 may be an integral structure or made separately and then assembled together by welding, bonding, or other methods. When the camera decorative ring 120 is assembled with the device housing 110, the skirt 123 can be supported between the panel 122 and the device housing 110. That is, at least a portion of the skirt 123 will protrude from the outside of the device housing 110, so the first ventilation hole 121 can be formed in the skirt 123. Since the skirt 123 is located between the panel 122 and the device housing 110, and its position is relatively concealed, opening the first ventilation hole 121 on the skirt 123 can better hide the first ventilation hole 121 and avoid affecting the overall integrity and aesthetics of the electronic device. In addition, since the camera module also generates a lot of heat when it is working, opening the first ventilation hole 121 on the skirt 123 is also conducive to improving the heat dissipation efficiency of the camera module.

[0041] like Figure 1 As shown, the first ventilation hole 121 may include at least two sub-ventilation holes 1211. The at least two sub-ventilation holes 1211 are arranged at intervals along the circumference of the skirt edge 123. The number of sub-ventilation holes 1211 can be two, three, four, etc. The specific number can be flexibly selected according to the actual size of the camera decorative ring 120. This application embodiment does not limit this.

[0042] like Figure 5 and Figure 6 As shown, in order to prevent debris from entering the air passage 133 and causing damage to the cooling fan 132, a dustproof net 134 can be installed in the heat dissipation channel formed by the first ventilation hole 121, the air passage 133, and the second ventilation hole 111. That is to say, the dustproof net 134 can be installed in the first ventilation hole 121, the second ventilation hole 111, or the air passage 133.

[0043] like Figures 7 to 12As shown, the air passage 133 has a first opening 1331 and a second opening 1332. The first opening 1331 of the air passage 133 communicates with the first ventilation hole 121, and the second opening 1332 of the air passage 133 communicates with the second ventilation hole 111. The first opening 1331 can be the air inlet of the air passage 133, and the second opening 1332 can be the air outlet of the air passage 133; alternatively, the second opening 1332 can be the air inlet of the air passage 133, and the first opening 1331 can be the air outlet of the air passage 133. A dustproof net 134 can be installed at the connection between the first ventilation hole 121 and the first opening 1331 of the air passage 133, and / or, the dustproof net 134 can be installed at the connection between the second ventilation hole 111 and the second opening 1332 of the air passage 133, as long as it can prevent debris from entering the cooling fan 132. The embodiment of this application does not limit the installation position of the dustproof net 134.

[0044] In one optional embodiment of this application, the first opening 1331 of the air passage 133 can be an air inlet, and correspondingly, the second opening 1332 of the air passage 133 is an air outlet. Therefore, a dustproof net 134 can be placed between the first ventilation hole 121 and the first opening 1331 of the air passage 133. To prevent the dustproof net 134 from shaking or shifting, the opposite sides of the dustproof net 134 are connected to the camera decorative ring 120 and the module housing 131, respectively. Specific connection methods can include bonding, interference fit, etc.

[0045] Based on the above, during the process of airflow entering the air passage 133 through the first ventilation hole 121 and the first opening 1331, the connection between the first ventilation hole 121 and the first opening 1331 is relatively complex, and the airflow will inevitably generate considerable noise when passing through this point. Therefore, the heat dissipation module may also include a fin noise reduction structure 139. The fin noise reduction structure 139 can be disposed inside the first opening 1331. Considering that the compact size of the first opening 1331 is not conducive to the placement of the fin noise reduction structure 139, it can also be disposed on the inner wall of the air passage 133 and close to the first opening 1331. The connection method between the fin noise reduction structure 139 and the inner wall of the air passage 133 can be adhesive bonding, snap-fitting, bolt connection, etc.

[0046] When the airflow in the ventilation duct 133 is discharged through the second opening 1332 of the ventilation duct 133, it inevitably generates considerable noise. In one optional embodiment of this application, such as... Figure 15 As shown, the fin noise reduction structure 139 can also be placed on the inner wall of the air passage 133 and close to the second opening 1332, which can also achieve the corresponding noise reduction effect.

[0047] like Figure 15 and Figure 16 As shown, the fin noise reduction structure 139 can have multiple fins 1391 arranged sequentially and at intervals along the airflow direction. Adjacent fins 1391 and the inner wall of the airflow channel 133 form a sound-receiving cavity. The noise generated by the airflow is essentially a form of energy. When the noise is conducted to the fin noise reduction structure 139, the fins 1391 guide it further into the sound-receiving cavity. The noise energy rubs and collides with the fins 1391 and the inner wall of the airflow channel 133, thus converting it into heat energy, thereby achieving the noise reduction effect of the heat dissipation module. Furthermore, after the noise energy is converted into heat energy, it can be discharged through the airflow channel 133 without affecting the heat dissipation performance of the electronic device.

[0048] like Figure 2 As shown, to improve the durability of electronic devices, reinforcing ribs 112 can be provided inside the second ventilation hole 111 to prevent deformation of the second ventilation hole 111. In addition, the reinforcing ribs 112 can also divide the second ventilation hole 111 into multiple smaller ventilation holes, thereby preventing debris from entering the air passage 133 through the second ventilation hole 111. The number of reinforcing ribs 112 can be one, two, or more. In this embodiment, there are two reinforcing ribs 112, which extend in two mutually perpendicular directions and are arranged in a cross shape.

[0049] As described above, to improve the dustproof and waterproof performance of electronic devices, the air passage 133 needs to be independent and sealed from the device's internal cavity. Sealing structures can be provided between the first opening 1331 and the first ventilation hole 121 of the air passage 133, and between the second opening 1332 and the second ventilation hole 111 of the air passage 133, to ensure that the air passage 133 is independent and sealed from the device's internal cavity, thus avoiding adverse effects on the dustproof and waterproof performance of the electronic devices. Specifically, such as... Figures 4 to 6 As shown, a first sealing part 135 can be provided between the first ventilation hole 121 and the first opening 1331. The first sealing part 135 is connected to the camera decorative ring 120 and the module housing 131 respectively. The specific connection method can be bonding, snap-fitting, interference fit, etc. The first sealing part 135 can be a dispensing sealing structure, double-sided adhesive, sealing ring, etc.

[0050] A second sealing part 136 is provided between the second ventilation hole 111 and the second opening 1332. The second sealing part 136 is connected to the equipment housing 110 and the module housing 131 respectively. The specific connection method can be adhesive bonding, snap-fit, interference fit, etc. Similarly, the second sealing part 136 can also be a dispensing sealing structure, double-sided adhesive, sealing ring, etc.

[0051] Based on the specific installation location of the dustproof net 134, a targeted sealing design is required. Specifically, for example... Figure 5 and Figure 6 As shown, the dustproof mesh 134 has a first surface facing the camera decorative ring 120 and a second surface facing away from the camera decorative ring 120. The first sealing part 135 may include two parts: a first sub-sealing part disposed between the camera decorative ring 120 and the dustproof mesh 134, and a second sub-sealing part disposed between the dustproof mesh 134 and the module housing 131. The first sub-sealing part is connected to the first surface of the dustproof mesh 134 and the camera decorative ring 120, respectively, and the second sub-sealing part is connected to the second surface of the dustproof mesh 134 and the device housing 110, respectively. The specific connection method can be selected according to the specific form of the first and second sub-sealing parts. For example, both the first sub-seal and the second sub-seal can be sealing adhesive layers 137. In this case, the first sub-seal is bonded to the first surface of the dustproof mesh 134 and the camera decorative ring 120, respectively, and the second sub-seal is bonded to the second surface of the dustproof mesh 134 and the device housing 110, respectively. Alternatively, both the first and second sub-seal can be elastic sealing rings 138. In this case, the first sub-seal is interference-fitted to the first surface of the dustproof mesh 134 and the camera decorative ring 120, respectively, and the second sub-seal is interference-fitted to the second surface of the dustproof mesh 134 and the device housing 110, respectively. Of course, the first sub-sealing part and the second sub-sealing part can also be a combination of a sealing layer 137 and an elastic sealing ring 138. For example, the first sub-sealing part is a sealing layer 137 and the second sub-sealing part is an elastic sealing ring 138, or the second sub-sealing part is a sealing layer 137 and the first sub-sealing part is an elastic sealing ring 138. As long as a sealed connection between the first opening 1331 of the air passage 133 and the first ventilation hole 121 can be achieved, this application embodiment does not limit this.

[0052] It should be added that the second sealing part 136 can also be a sealing adhesive layer 137 or an elastic sealing ring 138. Correspondingly, the second sealing part 136 can be bonded or interference-fitted to the equipment housing 110 and the module housing 131 respectively.

[0053] like Figure 13 and Figure 14 As shown, the aforementioned elastic sealing ring 138 may include a gasket 1381 and an elastic flared structure 1382. The elastic flared structure 1382 is connected to the end face of the gasket 1381. The elastic flared structure 1382 and the gasket 1381 can be an integral structure or manufactured separately and then assembled together by means of bonding, heat fusion, etc. The elastic flared structure 1382 extends in a flared shape from the gasket 1381 in a direction away from the gasket 1381. When the elastic sealing ring 138 is compressed, the elastic flared structure 1382 can deform and fill the assembly gap, thereby improving the sealing performance of the air passage 133.

[0054] like Figures 8 to 12 As shown, to facilitate the installation of the cooling fan 132, the module housing 131 may include a first sub-housing 1311 and a second sub-housing 1312. The first sub-housing 1311 covers the second sub-housing 1312, and the first sub-housing 1311 and the second sub-housing 1312 form the aforementioned air passage 133. The first sub-housing 1311 and the second sub-housing 1312 can be assembled by means of bonding, snap-fitting, bolting, etc. In this embodiment, the first sub-housing 1311 and the second sub-housing 1312 can be bonded to each other by a sealant layer 137. The first opening 1331 of the air passage 133 may be located in the first sub-housing 1311, and the second opening 1332 of the air passage 133 may be located in the second sub-housing 1312.

[0055] It should be added that the fin noise reduction structure 139 is located on the inner wall of the air passage 133, such as... Figure 17 and Figure 18 As shown, the fin noise reduction structure 139 can be specifically disposed on the first sub-shell 1311 or the second sub-shell 1312. Of course, the fin noise reduction structure 139 can also be disposed on both the first sub-shell 1311 and the second sub-shell 1312. In this case, there is a gap between the fin noise reduction structure 139 disposed on the first sub-shell 1311 and the fin noise reduction structure 139 disposed on the second sub-shell 1312, so that the airflow in the air passage 133 can pass smoothly through the two fin noise reduction structures 139.

[0056] like Figure 8 As shown, to facilitate the installation and fixation of the cooling fan 132, a mounting groove 1313 can be provided in the second sub-shell 1312. The cooling fan 132 is placed in the mounting groove 1313, and the limiting and fixing effect of the mounting groove 1313 is used to achieve stable installation of the cooling fan 132. In addition, to further improve the stability of the installation, the cooling fan 132 can also be bonded and fixed to the mounting groove 1313 by applying adhesive.

[0057] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0058] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, This includes the device housing, camera decorative ring, and heat dissipation module; The camera decorative ring is connected to the device housing and forms an inner cavity with the device housing. The camera decorative ring is provided with a first ventilation hole, and the device housing is provided with a second ventilation hole. The heat dissipation module is disposed in the inner cavity of the device. The heat dissipation module includes a module housing and a cooling fan. The module housing forms an air passage, which connects the first ventilation hole and the second ventilation hole. The cooling fan is located in the air passage.

2. The electronic device according to claim 1, characterized in that, The camera decorative ring includes a panel and a skirt. The skirt is connected to the periphery of the panel and extends from the panel in a direction away from the panel. The skirt is supported between the panel and the device housing. The first ventilation hole is opened in the skirt.

3. The electronic device according to claim 2, characterized in that, The first ventilation hole includes at least two sub-ventilation holes, which are arranged at circumferential intervals along the skirt.

4. The electronic device according to claim 1, characterized in that, A dustproof screen is provided in the heat dissipation channel formed by the first ventilation hole, the air passage and the second ventilation hole.

5. The electronic device according to claim 4, characterized in that, The air passage has a first opening and a second opening, the first opening being connected to the first ventilation hole, and the second opening being connected to the second ventilation hole; The first opening is an air inlet, the second opening is an air outlet, and the dustproof net is provided between the first ventilation hole and the first opening. The opposite sides of the dustproof net are respectively connected to the camera decorative ring and the module housing.

6. The electronic device according to claim 5, characterized in that, The heat dissipation module further includes a fin noise reduction structure, which is disposed in the air passage and close to the first opening, and / or, the fin noise reduction structure is disposed in the air passage and close to the second opening.

7. The electronic device according to claim 6, characterized in that, The fin noise reduction structure includes multiple fins arranged at intervals along the airflow direction. The multiple fins are respectively connected to the inner wall of the air passage, and adjacent fins and the inner wall of the air passage form a sound receiving cavity.

8. The electronic device according to any one of claims 1-5, characterized in that, The second ventilation hole is equipped with reinforcing ribs.

9. The electronic device according to claim 5, characterized in that, A first sealing part is provided between the first ventilation hole and the first opening, and the first sealing part is connected to the camera decorative ring and the module housing respectively; A second sealing part is provided between the second ventilation hole and the second opening, and the second sealing part is connected to the equipment housing and the module housing respectively.

10. The electronic device according to claim 9, characterized in that, The dustproof net has a first surface facing the camera decorative ring and a second surface facing away from the camera decorative ring. The first sealing part includes a first sub-sealing part disposed between the camera decorative ring and the dustproof net, and a second sub-sealing part disposed between the dustproof net and the module housing. The first sub-sealing part is connected to the first surface of the dustproof net and the camera decorative ring, respectively. The second sub-sealing part is connected to the second surface of the dustproof net and the device housing, respectively. The first sub-seal portion, the second sub-seal portion, and the second seal portion are respectively a sealing adhesive layer or an elastic sealing ring.

11. The electronic device according to claim 10, characterized in that, The elastic sealing ring includes a gasket and an elastic flared structure. The elastic flared structure is connected to the end face of the gasket and extends in a flared shape from the gasket in a direction away from the gasket.

12. The electronic device according to claim 1, characterized in that, The module housing includes a first sub-shell and a second sub-shell, the first sub-shell covering the second sub-shell and forming the air passage together with the second sub-shell; The second sub-shell has a mounting slot, and the cooling fan is disposed in the mounting slot.

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