Wafer cooling device
By designing multiple cooling layers and venting channels in the wafer cooling device, and combining them with an air extraction device, the corrosion problem of the cooling station caused by condensate was solved, achieving efficient cooling and preventing wafer scratches.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
- Filing Date
- 2025-06-11
- Publication Date
- 2026-04-28
AI Technical Summary
When the wafers are brought in after high-temperature processing, the hot air trapped on the wafer surface in the existing cooling station condenses to form condensate. Impurities and corrosive gases in the condensate react chemically with the metal surface of the cooling station, causing corrosion on the cooling station surface and resulting in scratches on the wafers during transport.
Design a wafer cooling device comprising multiple vertically arranged cooling layers and vertically spaced exhaust channels, combined with an exhaust device, to actively extract the gas generated during the cooling process through exhaust channels, exhaust ports and the exhaust device, to prevent gas accumulation, reduce condensate production and prevent corrosion of the cooling layers.
It effectively prevents corrosion on the surface of the cooling station, reduces scratches on the wafers during transport, and improves cooling efficiency and device stability.
Smart Images
Figure CN224178569U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to wafer cooling devices. Background Technology
[0002] In the semiconductor manufacturing process, after the wafer completes high-temperature processes (such as etching, deposition, photolithography, etc.), it needs to be cooled in a cooling station to ensure that the wafer temperature is reduced to a level suitable for subsequent processes.
[0003] However, in existing cooling stations, when the high-temperature processed wafers enter, the hot air trapped on the wafer surface condenses on the station surface, forming condensate. This condensate contains impurities and corrosive gases (such as fluorine-containing gases) brought in from the wafer surface or the process environment. These impurities and corrosive gases react chemically with the metal surface of the cooling station, causing corrosion. This corrosion transforms the originally smooth surface of the cooling station into an uneven surface, leading to scratches on the wafers during transport. Utility Model Content
[0004] This application primarily provides a wafer cooling device to address the technical problem mentioned in the background art: impurities and corrosive gases in the condensate can chemically react with the metal surface of the cooling station, leading to surface corrosion. This corrosion can cause the originally smooth surface of the cooling station to become uneven, resulting in scratches on the wafer during transport.
[0005] The technical solution adopted by this application to solve the above-mentioned technical problems is as follows:
[0006] This application provides a wafer cooling apparatus comprising: a cooling box having a wafer feed port at one end, wherein the cooling box contains a plurality of vertically arranged cooling layers for storing and cooling wafers; a plurality of vertically spaced venting grooves are provided on the side wall of the cooling box corresponding to the wafer feed port, the plurality of venting grooves corresponding one-to-one with the plurality of cooling layers; an venting channel is also provided in the cooling box connecting the cooling layers and the venting grooves, the venting channel being located near the inner side wall of the cooling box corresponding to the wafer feed port; an venting port corresponding to the venting channel is provided on the bottom wall of the cooling box, the venting port being connected to the venting channel; and a suction device, covering the venting grooves and the venting port, for extracting gas from the cooling box.
[0007] Optionally, the cooling box is also provided with a seal, which is located on the exhaust port and is used to seal the connection between the exhaust port and the suction device.
[0008] Optionally, the air extraction device includes: an air extraction box connected to the cooling box and covering the exhaust groove and the exhaust port; and an air extraction pipe, one end of which extends into the air extraction box through a connection hole on the air extraction box, and the other end of which is connected to a negative pressure device, for extracting gas from the air extraction box and extracting gas from the cooling box.
[0009] Optionally, a pressure regulating valve is connected to the suction pipe. The pressure regulating valve is located outside the suction box and is used to detect the air pressure inside the suction box and adjust the opening and closing of the suction pipe.
[0010] Optionally, the bottom of the vacuum box is provided with a liquid storage component for storing condensate during the vacuuming process.
[0011] Optionally, the liquid storage assembly further includes: a receiving groove, which is formed on the bottom side of the vacuum box; and a liquid storage box, which is disposed in the receiving groove and slidably connected to the receiving groove. When the liquid storage box is full of coolant, the liquid storage box is pulled out to clean the coolant.
[0012] Optionally, downwardly inclined guide plates are provided on both sides of the air extraction box, and the guide plates are located above the receiving groove.
[0013] Optionally, the liquid storage box is provided with absorbent cotton to absorb the condensate in the liquid storage box.
[0014] The wafer cooling device provided in this application stores wafers in layers through multiple cooling layers, avoiding contact between wafers, reducing heat transfer, and improving cooling efficiency. Furthermore, multiple vertically spaced exhaust grooves are provided on the side walls of the cooling box corresponding to the wafer feed port, with one exhaust groove for each cooling layer. This allows hot air and condensed gas generated during the cooling process to be discharged in a timely manner, preventing gas accumulation in the cooling box and the generation of condensate. This also prevents corrosion of the cooling layer inside the cooling box, thereby preventing wafer scratches. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the cooling device of this application;
[0017] Figure 2 This is one of the structural schematic diagrams of the cooling box in this application;
[0018] Figure 3This is the second structural schematic diagram of the cooling box in this application;
[0019] Figure 4 This is a schematic diagram of the air extraction device of this application;
[0020] Figure 5 This is an exploded view of the extraction device of this application;
[0021] Figure 6 This is a cross-sectional view of the air extraction device of this application.
[0022] Icons: 100-Cooling box; 110-Exhaust trough; 120-Exhaust channel; 130-Seal; 140-Panel feed port; 150-Cooling layer; 200-Evacuation device; 210-Evacuation box; 211-Containing tank; 212-Liquid storage box; 212a-Absorbent cotton; 213-Guide plate; 220-Evacuation pipe; 221-Pressure regulating valve.
[0023] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indications will also change accordingly.
[0026] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0027] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0028] In existing cooling stations, when a high-temperature processed wafer enters, the hot air trapped on the wafer surface condenses on the station surface, forming condensate. This condensate contains impurities and corrosive gases (such as fluorine-containing gases) from the wafer surface or the process environment. These impurities and corrosive gases react chemically with the metal surface of the cooling station, causing corrosion. This corrosion makes the originally smooth surface of the cooling station uneven, leading to scratches on the wafer during transport. To address these problems, the embodiments of this application refer to... Figures 1 to 6 The following technical solutions are provided to overcome the above problems.
[0029] Please refer to Figures 1 to 6 This application provides a wafer cooling device comprising: a cooling box 100 having a wafer feed port 140 at one end; a plurality of vertically arranged cooling layers 150 disposed within the cooling box 100 for storing and cooling wafers; a plurality of vertically spaced exhaust grooves 110 formed on the sidewall of the cooling box 100 corresponding to the wafer feed port 140, the plurality of exhaust grooves 110 corresponding one-to-one with the plurality of cooling layers 150; an exhaust channel 120 connected to the cooling layers 150 and the exhaust grooves 110 disposed within the cooling box 100; the exhaust channel 120 being disposed near the inner sidewall of the cooling box 100 corresponding to the wafer feed port 140; an exhaust port corresponding to the exhaust channel 120 being formed on the bottom wall of the cooling box 100, the exhaust port being connected to the exhaust channel 120; and a vacuum device 200, covering the exhaust grooves 110 and the exhaust port, for extracting gas from the cooling box 100.
[0030] Specifically, the wafer is placed into the cooling box 100 through the wafer feed port 140. The cooling box 100 has multiple vertically arranged cooling layers 150 inside, each capable of holding one or more wafers. The cooling layers 150 can be made of metal, utilizing their excellent thermal conductivity to accelerate wafer cooling. Furthermore, multiple vertically spaced exhaust channels 110 are formed on the sidewalls of the cooling box 100 corresponding to the wafer feed port 140. Each exhaust channel 110 corresponds to a cooling layer 150 and is used to expel hot air and condensed gas generated during the cooling process.
[0031] Furthermore, an exhaust channel 120 is provided inside the cooling box 100, which connects the cooling layer 150 and the exhaust groove 110 to ensure that the gas generated during the cooling process can be smoothly discharged from the cooling layer 150. The exhaust channel 120 is located near the inner side wall of the cooling box 100 corresponding to the feeding port 140 to facilitate gas discharge and reduce the residence time of gas in the cooling box 100. An exhaust port is opened on the bottom wall of the cooling box 100, which is connected to the exhaust channel 120 to further optimize the gas discharge path and ensure that the gas can be smoothly discharged from the cooling box 100. An air extraction device 200 is provided on the surface of the exhaust groove 110 and the exhaust port of the cooling box 100 to actively extract the gas inside the cooling box 100.
[0032] Understandably, the design of the exhaust channel 120 and exhaust port provides a clear exhaust path for the gas generated during the cooling process, reducing the accumulation of gas in the cooling box 100 and thus reducing the generation of condensate. The low-temperature surface of the cooling layer 150 and the high-temperature surface of the wafer form a temperature difference, accelerating heat conduction. At the same time, the generated hot air is discharged through the exhaust channel 120, and the negative pressure of the suction device 200 accelerates the discharge of the gas generated during the cooling process (such as hot air and condensate) from the exhaust groove 110 and exhaust port, reducing the residence time of gas in the cooling box 100 and further improving cooling efficiency. By optimizing the gas exhaust path, the accumulation of condensate in the cooling box 100 is reduced, and the risk of corrosion on the surface of the cooling box 100 is reduced.
[0033] This application provides a wafer cooling device that stores wafers in layers using multiple cooling layers 150 to avoid contact between wafers, reduce heat transfer, and improve cooling efficiency. Multiple vertically spaced exhaust channels 110 are provided on the sidewalls of the cooling box 100 corresponding to the wafer feed port 140, with one exhaust channel 110 for each cooling layer 150. The negative pressure of the extraction device 200 allows hot air and condensed gas generated during cooling to be discharged promptly. The design of the exhaust channel 120 and exhaust port optimizes the gas discharge path, preventing gas accumulation within the cooling box 100 and the generation of condensate, thus preventing corrosion of the cooling layers 150 inside the cooling box 100 and consequently preventing wafer scratches.
[0034] In some embodiments, the cooling box 100 is further provided with a sealing element 130, which is located on the exhaust port and is used to seal the connection between the exhaust port and the suction device 200.
[0035] Specifically, a seal 130 is installed at the exhaust port of the cooling box 100. The seal 130 is located at the connection between the exhaust port and the suction device 200 to prevent gas leakage from the connection between the exhaust port and the suction device 200, ensuring that the suction device 200 can effectively extract the gas from the cooling box 100. Through the sealing effect of the seal 130, gas leakage is reduced, suction efficiency is improved, and the stability and reliability of the cooling process are ensured.
[0036] In some embodiments, the air extraction device 200 includes: an air extraction box 210 connected to the cooling box 100 and covering the exhaust groove 110 and the exhaust port; and an air extraction pipe 220, one end of which extends into the air extraction box 210 through a connection hole on the air extraction box 210, and the other end of which is connected to a negative pressure device, for extracting gas from the air extraction box 210 and the cooling box 100.
[0037] Specifically, the air extraction pipe 220 is connected to the cooling box 100 and covers the exhaust groove 110 and the exhaust port. One end of the air extraction pipe 220 extends into the air extraction box 210 through the connection hole on the air extraction box 210, and the other end is connected to the negative pressure device for extracting the gas in the air extraction box 210 and the gas in the cooling box 100.
[0038] Understandably, the extraction box 210 is connected to the cooling box 100 and covers the exhaust groove 110 and exhaust port, serving to seal and concentrate gas discharge. One end of the extraction pipe 220 extends into the extraction box 210 through the connection hole on the extraction box 210, and the other end is connected to the negative pressure device. The negative pressure device extracts the gas from the extraction box 210 through the extraction pipe 220, thereby driving the gas in the cooling box 100 out. The gas in the cooling box 100 enters the extraction box 210 through the exhaust groove 110 and exhaust port, and is then extracted by the negative pressure device through the extraction pipe 220, ensuring smooth gas discharge and reducing condensate production.
[0039] In some embodiments, a pressure regulating valve 221 is connected to the suction pipe 220. The pressure regulating valve 221 is located outside the suction box 210 and is used to detect the air pressure inside the suction box 210 and adjust the opening and closing of the suction pipe 220.
[0040] Specifically, a pressure regulating valve 221 is installed on the suction pipe 220. Located outside the suction box 210 for easy operation and maintenance, the valve 221 detects the air pressure inside the suction box 210 and automatically adjusts the opening and closing of the suction pipe 220 based on the detected pressure. When the air pressure is too high, the valve 221 automatically opens the suction pipe 220 to accelerate gas discharge; when the air pressure is too low, the valve 221 automatically closes the suction pipe 220 to prevent over-extraction. Through the automatic adjustment function of the valve 221, the air pressure inside the suction box 210 is maintained within a set range, optimizing the gas discharge path and reducing condensate production.
[0041] Understandably, the negative pressure device creates negative pressure in the suction box 210 through the suction pipe 220. The gas in the cooling box 100 enters the suction box 210 through the exhaust port and the exhaust grooves 110 of each layer, and is then extracted by the negative pressure device through the suction pipe 220. The pressure regulating valve 221 detects the gas pressure in the suction box 210 in real time. When the gas pressure exceeds the set value, the pressure regulating valve 221 automatically opens to accelerate the gas discharge; when the gas pressure is lower than the set value, the pressure regulating valve 221 automatically closes to prevent excessive gas extraction.
[0042] In some embodiments, the bottom of the vacuum box 210 is provided with a liquid storage component for storing condensate during the vacuuming process.
[0043] Specifically, a liquid storage component is installed at the bottom of the suction box 210 to collect and store the condensate generated during the suction process. The liquid storage component can effectively collect the condensate discharged from the suction box 210, preventing the condensate from accumulating inside the suction box 210 or overflowing into the cooling box 100. The design of the liquid storage component facilitates regular cleaning and replacement, ensuring the normal operation of the suction device 200.
[0044] In some embodiments, the liquid storage assembly further includes: a receiving groove 211, which is formed on the bottom side of the vacuum box 210; and a liquid storage box 212, which is disposed in the receiving groove 211 and slidably connected to the receiving groove 211. When the liquid storage box 212 is full of coolant, the liquid storage box 212 is pulled out to clean the coolant.
[0045] Specifically, a receiving groove 211 is formed on the bottom side of the vacuum box 210 to accommodate the liquid storage box 212. The liquid storage box 212 is placed in the receiving groove 211 and is slidably connected to the receiving groove 211. This design allows the liquid storage box 212 to be easily pulled out and pushed back in, facilitating cleaning and replacement. When the liquid storage box 212 is full of condensate, the operator can easily pull out the liquid storage box 212, clean out the condensate, and then put it back into the receiving groove 211.
[0046] Understandably, the liquid collection box 212 can collect condensate in a concentrated manner, preventing condensate from overflowing into the vacuum box 210 or the cooling box 100, reducing interference with the cooling process. The sliding connection design allows the liquid collection box 212 to be easily pulled out and pushed back, facilitating operators to clean the condensate regularly and ensuring the normal operation of the vacuum device 200.
[0047] In some embodiments, downwardly inclined guide plates 213 are disposed on the two side walls of the air extraction box 210, and the guide plates 213 are located above the receiving groove 211.
[0048] Specifically, downward-sloping guide plates 213 are arranged opposite each other on the two side walls of the vacuum box 210. The tilt angle and position of the guide plates 213 are designed according to the structural and functional requirements of the vacuum box 210. The guide plates 213 are located above the receiving groove 211 to ensure that the condensate can flow smoothly into the liquid storage box 212. Understandably, downward-sloping guide plates 213 are arranged opposite each other on the two side walls of the vacuum box 210, and the guide plates 213 are located above the receiving groove 211. The tilt angle of the guide plates 213 is designed to be 30°-45° to ensure that the condensate can flow smoothly into the liquid storage box 212.
[0049] In some embodiments, the liquid storage box 212 is provided with absorbent cotton 212a for absorbing the condensate in the liquid storage box 212.
[0050] Specifically, absorbent cotton 212a is placed inside the liquid storage box 212. The absorbent cotton 212a absorbs the condensate inside the liquid storage box 212, preventing condensate buildup. Through its porous structure and absorbency, the absorbent cotton 212a effectively absorbs the condensate inside the liquid storage box 212, reducing condensate buildup. The absorbent cotton 212a can be replaced or cleaned periodically to ensure continuous absorption of condensate inside the liquid storage box 212. By absorbing condensate, the absorbent cotton 212a prevents condensate from overflowing outside the liquid storage box 212, reducing corrosion and contamination to the equipment. The periodic replacement or cleaning of the absorbent cotton 212a ensures continuous absorption of condensate inside the liquid storage box 212, facilitating maintenance and cleaning.
[0051] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.
Claims
1. A wafer cooling apparatus, characterized in that, include: A cooling box with a wafer feed port at one end, wherein multiple vertically arranged cooling layers are provided inside the cooling box for storing and cooling wafers; The cooling box has multiple vertically spaced exhaust grooves on the side wall corresponding to the feeding port. Each of the multiple exhaust grooves corresponds to a different cooling layer. The cooling box also has an exhaust channel that connects the cooling layers and the exhaust grooves. The exhaust channel is located near the inner side wall of the cooling box corresponding to the feeding port. The bottom wall of the cooling box has an exhaust port that corresponds to the exhaust channel and is connected to the exhaust channel. An air extraction device is installed over the exhaust trough and the exhaust port to extract gas from the cooling box.
2. The wafer cooling apparatus according to claim 1, characterized in that, The cooling box is also provided with a sealing element, which is located on the exhaust port and is used to seal the connection between the exhaust port and the air extraction device.
3. The wafer cooling apparatus according to claim 1, characterized in that, The air extraction device includes: An air extraction box is connected to the cooling box and covers the exhaust groove and the exhaust port; The suction pipe extends into the suction box through a connection hole on the suction box at one end, and is connected to a negative pressure device at the other end. It is used to extract gas from the suction box and to extract gas from the cooling box.
4. The wafer cooling apparatus according to claim 3, characterized in that, A pressure regulating valve is connected to the suction pipe. The pressure regulating valve is located outside the suction box and is used to detect the air pressure inside the suction box and adjust the opening and closing of the suction pipe.
5. The wafer cooling apparatus according to claim 4, characterized in that, The bottom of the vacuum box is equipped with a liquid storage component for storing condensate during the vacuuming process.
6. The wafer cooling apparatus according to claim 5, characterized in that, The liquid storage component also includes: A receiving groove is formed on the bottom side of the vacuum box; A coolant storage box is disposed in the receiving tank and is slidably connected to the receiving tank. When the coolant storage box is full of coolant, the coolant storage box is pulled out to clean the coolant.
7. The wafer cooling apparatus according to claim 6, characterized in that, The air extraction box has downwardly inclined guide plates on its two side walls, which are located above the receiving groove.
8. The wafer cooling apparatus according to claim 6, characterized in that, The liquid storage box is equipped with absorbent cotton to absorb the condensate inside.