Feeding and discharging device adaptive to die bonder

Abstract

The utility model discloses a loading and unloading device adaptive to a die bonder, the loading and unloading device comprises a loading mechanism, a grabbing mechanism, a transmission mechanism and a processing platform, the loading mechanism is used for placing a tray with a chip; the grabbing mechanism is used for grabbing the tray placed on the feeding mechanism; the transmission mechanism is connected with the grabbing mechanism and drives the grabbing mechanism to move. The processing platform is used for bearing the tray transferred by the grabbing mechanism; the grabbing mechanism comprises a suction cup and a fixing assembly, the suction cup is used for adsorbing a tray, the fixing assembly comprises at least two limiting pieces, and the at least two limiting pieces are oppositely arranged and used for clamping the tray adsorbed to the suction cup. Therefore, the transmission mechanism drives the grabbing mechanism to move and place the tray on the processing platform, the grabbing mechanism comprises the suction cup and the fixing assembly, the fixing assembly comprises the at least two limiting assemblies, the suction cup clamps the tray adsorbed to the suction cup through the at least two limiting assemblies after adsorbing the tray, and then the risk of chip damage caused by falling of the tray can be reduced.

Description

Technical Field

[0001] This application relates to the field of chip packaging equipment technology, and in particular to a loading and unloading device adapted to a die bonder. Background Technology

[0002] Currently, in the chip manufacturing process, the die bonder is a key piece of equipment in the semiconductor packaging process. The die bonder is used to precisely pick up the chip and bond it to the substrate. At present, the packaging process requires manual transfer of the tray containing the chip to the die bonder's processing table, and then the die bonder performs the packaging process on the chip. However, the above operation is inefficient and has significant safety risks.

[0003] While existing automation solutions can partially replace manual labor, they still suffer from low efficiency and accuracy during chip transfer, as well as the risk of damaging the chips. Utility Model Content

[0004] The main objective of this application is to provide a loading and unloading device adapted to a die bonder, aiming to solve the aforementioned technical problems existing in the prior art.

[0005] To address the aforementioned issues, this application provides a loading / unloading device adapted to a die bonder. The device includes a loading mechanism, a gripping mechanism, a transmission mechanism, and a processing platform. The loading mechanism is used to place a tray containing chips; the gripping mechanism is used to grip the tray placed on the loading mechanism; the transmission mechanism is connected to the gripping mechanism and drives the gripping mechanism to move; the processing platform is used to support the tray transferred by the gripping mechanism. The gripping mechanism includes a suction cup and a fixing component. The suction cup is used to absorb the tray, and the fixing component includes at least two limiting members arranged opposite to each other, which clamp the tray absorbed by the suction cup.

[0006] In some embodiments, the limiting member has a limiting groove at one end near the tray, the opening of the limiting groove faces the tray, and the inner sidewall of the limiting groove on one side in the height direction receives the side of the tray away from the gripping mechanism.

[0007] In some embodiments, two limiting members are divided into a limiting member group, and the number of limiting member groups is at least two, with at least two limiting member groups spaced apart in a direction perpendicular to the two opposing limiting members.

[0008] In some embodiments, the processing platform includes a carrying groove and a clearance groove. The gripping mechanism approaches the processing platform in the height direction to place the pallet in the carrying groove. The clearance groove is correspondingly provided with the limiting member and is disposed on the bottom wall of the carrying groove.

[0009] In some embodiments, the radial dimension of the support groove is larger than the radial dimension of the pallet, and the processing platform further includes a pushing mechanism located on one side of the processing platform, which pushes the pallet toward the pallet.

[0010] In some embodiments, the pushing mechanism includes a wedge, and the gripping mechanism includes an inclined block. The wedge is disposed corresponding to the inclined block in the height direction. In the height direction, the distance between the inclined block and the wedge is less than the distance between the pallet and the bearing groove. As the gripping mechanism moves toward the processing platform in the height direction, the inclined block pushes the wedge to move away from the pallet.

[0011] In some embodiments, the pushing mechanism further includes an elastic element that is elastically supported between the pushing mechanism and the sidewall of the bearing groove.

[0012] In some embodiments, the wedge includes a rotating shaft, which is cylindrical and its axis is perpendicular to the height direction and the direction of movement of the pushing mechanism. The rotating shaft rotates about its own axis.

[0013] In some embodiments, the loading mechanism includes a lifting mechanism and a first sensor. The lifting mechanism is located below the pallet in the height direction, and the first sensor is located at the end of the loading mechanism away from the lifting mechanism. The pallet is located between the lifting mechanism and the first sensor in the height direction.

[0014] In some embodiments, the feeding mechanism includes a basket and a base. The basket is fixed to the base, and the base is provided with two sets of second sensors at intervals. The basket is provided with a horizontal groove in the light path of the light emitted by the two second sensors, allowing the light emitted by the two second sensors to pass through respectively.

[0015] Compared with existing technologies, the loading and unloading device for a die bonder provided in this application includes a loading mechanism, a gripping mechanism, a transmission mechanism, and a processing platform. The loading mechanism is used to place a tray containing chips; the gripping mechanism is used to grip the tray placed on the loading mechanism; the transmission mechanism is connected to the gripping mechanism and drives the gripping mechanism to move; the processing platform is used to support the tray transferred by the gripping mechanism. The gripping mechanism includes a suction cup and a fixing component. The suction cup is used to adsorb the tray in the height direction, and the fixing component includes at least two limiting members, which are arranged opposite to each other and used to clamp the tray adsorbed on the suction cup. Through the above implementation, the transmission mechanism drives the gripping mechanism to grip the tray and place it on the processing platform. The gripping mechanism includes a suction cup and a fixing component, and the fixing component includes at least two limiting components. After the suction cup adsorbs the tray, the at least two limiting members clamp the tray adsorbed on the suction cup, thereby reducing the risk of chip damage due to the tray falling. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a structure of an embodiment of the loading and unloading device for a die bonder provided in this application;

[0018] Figure 2 yes Figure 1 A schematic diagram of one embodiment of the gripping mechanism shown;

[0019] Figure 3 yes Figure 1 A schematic diagram of one embodiment of the processing platform shown;

[0020] Figure 4 yes Figure 3 The diagram shows the structure of the pushing mechanism.

[0021] Figure 5 yes Figure 1 A schematic diagram of one embodiment of the feeding mechanism is shown.

[0022] Reference numerals: 1. Loading / unloading device; 10. Loading mechanism; 111. First sensor; 120. Basket; 121. Horizontal groove; 130. Second sensor; 140. Gripping mechanism; 20. Suction cup; 210. Fixing assembly; 220. Limiting component; 222. Limiting groove; 2221. Inclined block; 230. Transmission mechanism; 30. Processing platform; 40. Bearing groove; 410. Clearance groove; 420. Pushing mechanism; 430. Push block; 431. Wedge block; 432. Rotating shaft; 4321. Elastic component; 433. Lateral direction X; Vertical direction Y; Height direction Z. Detailed Implementation

[0023] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0025] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0028] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0029] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0030] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0031] Currently, in the chip manufacturing process, the die bonder is a key piece of equipment in the semiconductor packaging process, used to precisely pick up and bond chips to the substrate. Currently, the packaging process requires manual transfer of the tray containing the chips to the die bonder's worktable, where the die bonder then performs the packaging process. However, this operation is inefficient and carries significant safety risks. While existing automation solutions can partially replace manual labor, issues with efficiency and accuracy during chip transfer and the risk of chip damage remain.

[0032] To address the technical problems existing in related technologies, this application provides a loading and unloading device adapted to a die bonder. For details, please refer to [link to relevant documentation]. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of an embodiment of the loading and unloading device for a die bonder provided in this application. Figure 2 yes Figure 1 The diagram shows a structural schematic of one embodiment of the gripping mechanism.

[0033] The loading and unloading device 1 includes a loading mechanism 10, a gripping mechanism 20, a transmission mechanism 30, and a processing platform 40. The loading mechanism 10 is used to place a tray containing chips; the gripping mechanism 20 is used to grip the tray placed on the loading mechanism 10; the transmission mechanism 30 is connected to the gripping mechanism 20 and drives the gripping mechanism 20 to move; the processing platform 40 is used to support the tray transferred by the gripping mechanism 20; wherein, the gripping mechanism 20 includes a suction cup 210 and a fixing component 220. The suction cup 210 is used to adsorb the tray, and the fixing component 220 includes at least two limiting members 222, which are arranged opposite to each other and are used to clamp the tray adsorbed on the suction cup 210.

[0034] The loading mechanism 10 is used to place a tray containing chips for the gripping mechanism 20 to grasp. The unloading mechanism may include a transfer mechanism for transferring the tray. The transfer mechanism may include a loading end and a picking end, located on the same side of the transfer mechanism and spaced apart. The loading end is the area where the tray is placed in the loading mechanism 10, and the picking end is the area where the gripping mechanism 20 grasps the tray. After the tray is placed at the loading end, the transfer mechanism transfers the tray from the loading end to the picking end, ready for the gripping mechanism 20 to grasp.

[0035] The gripping mechanism 20 is connected to the transmission mechanism 30. After the transmission mechanism 30 drives the gripping mechanism 20 to the position corresponding to the pallet, the gripping mechanism 20 can grip the pallet. When the gripping mechanism 20 is in the initial position, it is located above the picking end in the height direction Z. The transmission mechanism 30 drives the gripping mechanism 20 to move towards the loading mechanism 10 in the height direction Z to grip the pallet. The processing platform 40 can be located at the end of the transmission mechanism 30 away from the loading mechanism 10 in the vertical direction Y. After the gripping mechanism 20 grips the pallet at the picking end, the transmission mechanism 30 can transmit the gripping mechanism 20 to the top of the processing platform 40 in the vertical direction Y. Then, after the gripping mechanism 20 moves towards the processing platform 40, it can place the pallet on the processing platform 40.

[0036] Further, the gripping mechanism 20 includes a suction cup 210 and a fixing component 220. The suction cup 210 corresponds to the peripheral edge of the tray and is positioned facing the tray to adhere the tray to the suction cup 210. The fixing component 220 is used to fix the tray adhered to the suction cup 210. The fixing component 220 includes at least two limiting members 222, which are respectively located on both sides of the tray to clamp the tray between the at least two limiting members 222. In some embodiments, the fixing component 220 may also include a driving member. The number of driving members may be the same as the number of limiting members 222, or there may be only one. When the number of driving members is the same as the number of limiting members 222, each driving member can drive one limiting member 222 away from or towards the tray. When there is one actuator, the actuator can be positioned between the two limiting members 222 in the vertical Y direction. The actuator can simultaneously engage with both limiting members 222 at an angle to drive both limiting members 222 away from the tray in the vertical Y direction. The fixing assembly 220 may also include an elastic connector for elastically connecting the two opposing limiting members 222, so that the actuator returns to its original position after the limiting members 222 have moved away from the tray. The elastic connector can elastically drive the limiting members 222 on both sides closer to the tray, thereby clamping the tray. The fixing assembly 220 may also include a guide groove that extends in the vertical Y direction. The end of the limiting member 222 away from the tray is located in the guide groove to make the movement of the limiting member 222 in the vertical Y direction more stable. In addition, there may be multiple suction cups 210, which are circumferentially spaced to improve the stability of the suction cups 210 adsorbing the tray.

[0037] Through the above implementation method, the transmission mechanism 30 drives the gripping mechanism 20 to grip the tray and place the tray on the processing platform 40. The gripping mechanism 20 includes a suction cup 210 and a fixing component 220. The fixing component 220 includes at least two limiting components. After the suction cup 210 adsorbs the tray, the tray adsorbed to the suction cup 210 is clamped by at least two limiting components 222, thereby reducing the risk of chip damage caused by the tray falling.

[0038] In some embodiments, the limiting member 222 has a limiting groove 2221 at one end near the tray, with the opening of the limiting groove 2221 facing the tray. The inner sidewall of the limiting groove 2221 on the side in the height direction Z receives the side of the tray away from the gripping mechanism 20. The limiting member 222 includes the limiting groove 2221, which is located at one end of the limiting member 222 near the tray and is on the same horizontal plane as the tray. The opening of the limiting groove 2221 faces the tray, so that when the limiting member 222 clamps the tray, both sides of the tray can be respectively located in the limiting grooves 2221 of the two limiting members 222, so that the lower surface of the tray in the height direction Z receives the inner sidewall of the limiting groove 2221 on the side in the height direction Z. In addition, the limiting member 222 can also apply a force to the tray in the vertical direction Y for clamping the tray, thereby further reducing the risk of the tray falling due to the decrease in air pressure of the suction cup 210.

[0039] In some embodiments, two limiting members 222 are divided into a limiting member group, and the number of limiting member groups is at least two. The at least two limiting member groups are spaced apart in a direction perpendicular to the two opposing limiting members 222. At least two corresponding limiting members 222 can be divided into a limiting member group, and the at least two limiting member groups can be spaced apart in a direction perpendicular to the two opposing limiting members 222. The direction in which the two limiting member groups are spaced apart can be understood as a lateral direction X perpendicular to the vertical direction Y, so that multiple limiting members 222 are provided on both sides of the pallet, and the multiple limiting members 222 on the same side are spaced apart, thereby improving the stability of the fixing component 220 in fixing the pallet. In this embodiment, the fixing component 220 may further include a fixing plate and a sliding block. The limiting members 222 on both sides of the tray may be fixed to a fixing plate respectively. The end of the fixing plate away from the limiting member 222 may be fixedly connected to the upper end of the sliding block in the height direction Z. The sliding block has a sliding groove that extends in the vertical direction Y. The cross-section of the sliding groove may be I-shaped, and the lower end of the sliding groove in the height direction Z passes through the sliding block. The fixing component 220 may further include a fixing block and a base plate. The upper part of the fixing block is located in the sliding groove, and the lower part of the fixing block is fixed to the base plate. The sliding block is slidably connected to the fixing block through the sliding groove, so that the fixing block causes the sliding block to move only in the vertical direction Y. The sliding block and the driving member are wedge-shaped, thereby improving the stability of the limiting member 222 in the vertical direction Y.

[0040] In another embodiment, the multiple suction cups 210 are divided into a suction cup group. The gripping mechanism 20 has at least two suction cup groups. The suction cups 210 of each suction cup group are arranged at intervals along the circumference of the tray. The position corresponding to one suction cup 210 of one suction cup group is corresponding to one suction cup 210 of another suction cup group. That is to say, different suction cup groups have a suction cup 210 at the corresponding position, and the suction cups 210 at the corresponding position are arranged adjacent to each other. In addition, each suction cup group is connected to an air channel, so that when the air pressure of one suction cup group is insufficient to adsorb the tray, the other suction cup group can still adsorb the tray. Thus, when adsorbing the tray, the risk of the tray falling due to the failure of a group of suction cup groups can be reduced.

[0041] See Figure 3 and Figure 4 , Figure 3 yes Figure 1 The diagram shows a structural schematic of one embodiment of the processing platform. Figure 4 yes Figure 3 The diagram shows the structure of the pushing mechanism.

[0042] In some embodiments, the processing platform 40 includes a carrying groove 410 and a clearance groove 420. The gripping mechanism 20 approaches the processing platform 40 in the height direction Z to place the pallet in the carrying groove 410. The clearance groove 420 is correspondingly provided with the limiting member 222 and is disposed on the bottom wall of the carrying groove 410. The processing platform 40 is provided with a support groove 410 for holding a pallet. A clearance groove 420 is provided on the bottom wall of the support groove 410. Specifically, the clearance groove 420 is located on both sides of the support groove 410 in the vertical direction Y. The clearance groove 420 is recessed in the height direction Z away from the support groove 410 on the basis of the bottom wall of the support groove 410 to form the clearance groove 420. This allows the clearance groove 420 to avoid the limiting member 222 when the lower surface of the pallet contacts the bottom surface of the support groove 410 during the process of the gripping mechanism 20 approaching the processing platform 40. As a result, when the gripping mechanism 20 releases the fixation of the pallet, there is no falling gap between the pallet and the support groove 410, which reduces the risk of damage or displacement of the chips in the pallet due to the gap between the pallet and the support groove 410 when the gripping mechanism 20 releases the fixation of the pallet. In this embodiment, the clearance groove 420 has a dimension greater than that of the limiting member 222 in the vertical direction Y, so as to provide space for displacement when the limiting member 222 releases its fixation on the tray.

[0043] In some embodiments, the radial dimension of the support groove 410 is larger than the radial dimension of the pallet. The processing platform 40 also includes a pushing mechanism 430, which is located on one side of the processing platform 40 and pushes the pallet towards it. The larger radial dimension of the support groove 410 allows the pallet to be easily placed into the support groove 410. The pushing mechanism 430 is located on one side of the support platform in the vertical direction Y. After the pallet is placed into the support groove 410, the pushing mechanism 430 moves towards the pallet in the vertical direction Y to secure the pallet in the support groove 410. No additional sensing devices are required to accurately secure the pallet in the support groove 410. Therefore, the structure is simpler and more efficient, as the radial dimension of the support groove 410 is larger than the radial dimension of the pallet, and the pushing mechanism 430 is used to secure the pallet in the support groove 410. In this embodiment, the pushing mechanism 430 may further include a pushing block 431, which is located at the end of the pushing mechanism 430 near the pallet. The pushing block 431 can abut against the pallet to fix it. The end of the pushing block 431 near the pallet may also be provided with a buffer pad so that the pallet and the pushing block 431 can make soft contact, which can reduce the risk of pallet damage. The carrying groove 410 can accommodate two pallets in the transverse direction X, and the dimension of the carrying groove 410 in the transverse direction X is larger than the dimension of two pallets, thereby improving the working efficiency of the loading and unloading device 1.

[0044] In some embodiments, the pushing mechanism 430 includes a wedge 432, and the gripping mechanism 20 includes a wedge 230. The wedge 432 is correspondingly disposed to the wedge 230 in the height direction Z. In the height direction Z, the distance between the wedge 432 and the wedge 230 is less than the distance between the pallet and the bearing groove 410. As the gripping mechanism 20 moves toward the processing platform 40 in the height direction Z, the wedge 230 pushes the wedge 432 to move away from the pallet. The pushing mechanism 430 also includes a wedge 432, and the gripping mechanism 20 also includes a wedge 230. The wedge 230 and the wedge 432 are correspondingly disposed to each other in the height direction Z. During the process of the gripping mechanism 20 approaching the processing table, the pushing mechanism 430 is in its first state, that is, the pushing mechanism 430 is partially located in the bearing groove 410. The inclined block 230 approaches and abuts against the wedge block 432. The inclined block 230 can push the wedge block 432 to move away from the pallet. After the limiting member 222 releases the fixation of the pallet, as the gripping mechanism 20 moves away from the processing platform 40, the inclined block 230 gradually releases its abutment against the wedge block 432, allowing the pushing mechanism 430 to approach the pallet and fix it. This reduces the risk that the pushing mechanism 430 may approach the pallet prematurely due to a malfunction, causing the pallet to fail to be fixed in the bearing groove 410. In addition, in the height direction Z, the distance between the inclined block 230 and the wedge block 432 is less than the distance between the pallet and the bearing groove 410, so that the inclined block 230 abuts against the wedge block 432 first, thereby allowing the pallet to be smoothly placed in the bearing groove 410.

[0045] In some embodiments, the pushing mechanism 430 further includes an elastic element 433, which is elastically supported between the pushing mechanism 430 and the sidewall of the bearing groove 410. The pushing mechanism 430 also includes an elastic element 433, which, when supported between the pushing mechanism 430 and the sidewall of the bearing groove 410, allows the pushing mechanism 430 to automatically rebound and fix the pallet with the pushing block 431 when the inclined block 230 pushes the wedge block 432 away from the pallet. In this embodiment, the pushing mechanism 430 also includes a connecting body. The processing platform 40 is provided with a receiving groove for accommodating the pushing mechanism 430. The receiving groove can extend in the vertical direction Y, and the connecting body is located in the receiving groove to allow the pushing mechanism 430 to move stably in the vertical direction Y. The elastic element 433 is supported between the connecting body and the inner wall of the receiving groove. The connecting main plate also has a limiting groove at one end in the vertical Y direction near the elastic element 433, with part of the elastic element 433 located in the limiting groove to restrict its movement and make it more stable. This simplifies the structure of the pushing mechanism 430 and eliminates the need for an additional drive device to fix the tray. The pushing mechanism 430 may also include a baffle, which can be fixed to the side of the pushing mechanism 430 away from the receiving groove to further improve the stability of the elastic element 433.

[0046] In some embodiments, the wedge 432 includes a rotating shaft 4321, which is cylindrical. The axis of the rotating shaft 4321 is perpendicular to the height direction Z and the vertical direction Y, that is, the axis of the rotating shaft 4321 is parallel to the horizontal direction X. The rotating shaft 4321 rotates around its own axis. The wedge 432 includes the rotating shaft 4321, which can be cylindrical. As the wedge 230 approaches the pushing mechanism 430, the wedge 230 abuts against the wall of the rotating shaft 4321, thereby reducing the friction between the wedge 230 and the rotating shaft 4321 and improving the service life of the rotating shaft 4321.

[0047] See Figure 5 , Figure 5 yes Figure 1 A schematic diagram of one embodiment of the feeding mechanism is shown.

[0048] In some embodiments, the feeding mechanism 10 includes a basket 120 and a base 130. The basket 120 is fixed to the base 130. The base 130 is provided with two sets of second sensors 140 spaced apart. The basket 120 is provided with a horizontal groove 121 in the optical path of the light emitted by the two second sensors 140, allowing the light emitted by the two second sensors 140 to pass through respectively. The feeding mechanism 10 includes a basket 120 and a base 130. A transmission mechanism is connected to the base 130. The basket 120 can be fixed to the base 130. The transmission mechanism drives the base 130 to move between the loading end and the unloading end. The base 130 is provided with two sets of second sensors 140 spaced apart. The second sensors 140 can be electronic inclinometers or laser levels. The two sets of second sensors 140 can detect whether the basket 120 is level, which can reduce the risk that the gripping mechanism 20 will fail to grip the tray due to the tray being tilted when the basket 120 is not level. Optionally, the second sensor 140 can be a laser level. The basket 120 can also be provided with horizontal grooves 121 that allow light emitted by the two second sensors 140 to pass through. The two horizontal grooves 121 are correspondingly arranged with their respective second sensors 140, and are horizontally positioned. Therefore, whether the basket 120 is horizontal can be determined by whether the light emitted by the two second sensors 140 passes through their respective horizontal grooves 121. Furthermore, the basket 120 can also be provided with positioning holes, and the base 130 has corresponding positioning pins, allowing the basket 120 to be quickly positioned and installed on the base 130. The basket 120 is used to hold a tray. The basket 120 has circumferentially spaced limiting posts on the periphery of the tray. These limiting posts restrict the position of the tray, making its position more precise. Further, the positioning posts can be cylindrical, thereby reducing the contact area between the positioning posts and the tray and increasing the service life of the tray.

[0049] In some embodiments, the loading mechanism 10 includes a lifting mechanism (not shown) and a first sensor 111. The lifting mechanism is located below the pallet in the height direction Z, and the first sensor 111 is located at the end of the loading mechanism 10 away from the lifting mechanism. The pallet is located between the lifting mechanism and the first sensor 111 in the height direction Z. The loading mechanism 10 may further include a lifting mechanism located below the pallet in the height direction Z to lift the pallet in the height direction Z. The loading mechanism 10 also includes a first sensor 111 located at the end of the loading mechanism 10 away from the lifting mechanism, and the pallet is located between the lifting mechanism and the first sensor 111. The number of first sensors 111 is at least two, and the two first sensors 111 are horizontally spaced apart to detect whether the pallet is parallel. After the tray is loaded into the basket 120, the tray is located below the second sensor 140 in the height direction Z. Then, the lifting mechanism lifts the tray to the same height as the second sensor 140. During this process, the two second sensors 140 can detect whether the tray is level. The gripping mechanism 20 then descends to a fixed height to grip the tray. This reduces the risk of the lifting mechanism lifting the tray above the first sensor 111, causing the gripping mechanism 20 to apply excessive pressure to the tray and the lifting mechanism, which could lead to chip damage or damage to the lifting mechanism.

[0050] The loading and unloading device 1 may further include a unloading mechanism, which may also include a base 130 and a basket 120, and may have the same configuration as the loading mechanism 10. The unloading mechanism is connected to the transmission mechanism, which may further include a feeding end and a receiving end. The feeding end and the receiving end may be located on the side of the transmission mechanism away from the receiving end and the loading end, respectively, and the feeding end and the receiving end correspond to the positions of the receiving end and the loading end, respectively. That is to say, after the gripping mechanism 20 grips the pallet located on the processing platform 40 and places the pallet on the unloading mechanism at the feeding end, the transmission mechanism can transmit the unloading mechanism from the feeding end to the receiving end so that the pallet can be removed as a whole by taking out the basket 120 of the unloading mechanism. The transmission mechanism is equipped with third sensors at the loading end, the waiting-to-receive end, the receiving end, and the discharging end, corresponding to the loading mechanism 10 and the unloading mechanism. The loading mechanism 10 and the unloading mechanism may also each include a sensing block. One third sensor senses whether the loading mechanism 10 has reached the loading end and the receiving end through the sensing block, and another third sensor senses whether the unloading mechanism has reached the waiting-to-receive end and the discharging end through the sensing block, thereby ensuring accurate alignment between the gripping mechanism 20 and the pallet. This reduces the risk of collisions or pallet drops caused by the loading / unloading device 1 continuing to operate when the loading mechanism 10 or the unloading mechanism is not in position. In this embodiment, the basket 120 and the base 130 are both provided with through slots in the height direction Z at positions corresponding to the lifting mechanism, allowing the lifting mechanism to lift the pallet from the through slots in the base 130 and the basket 120.

[0051] In some embodiments, a push-top fixing member may also be provided on the base 130. The push-top fixing member may be located on one side or opposite sides of the basket 120 to fix the basket 120 by the push-top fixing member, thereby reducing the risk that the basket 120 may move during the operation of the loading and unloading device 1 and causing the gripping mechanism 20 to fail to accurately grip the pallet, and improving the accuracy of the pallet position.

[0052] It is understood that the above and below operations of the loading / unloading device 1 are controlled by the control system. In some embodiments, the loading / unloading device 1 further includes a transfer station, which is located in the vertical direction Y between the unloading end of the unloading mechanism and the processing platform 40. After the transmission mechanism 30 drives the gripping mechanism 20 to place the tray on the processing platform 40 at the picking end of the loading mechanism 10, the transmission mechanism 30 transfers the gripping mechanism 20 to the transfer station. After the chip is processed, the transmission mechanism 30 can be directly driven from the transfer station to the corresponding position on the processing platform 40, thereby reducing the travel path of the gripping mechanism 20 and improving the efficiency of the loading / unloading device 1 in transferring trays. The specific stroke of the gripping mechanism 20 is as follows: the gripping mechanism 20 grips the tray at the picking end; the gripping mechanism 20 grips the tray to the processing platform 40; the gripping mechanism 20 is driven to the transfer station; after the chip is processed, the gripping mechanism 20 is driven from the transfer station to the processing station to grip the tray; the gripping mechanism 20 is then driven from the processing platform 40 to the unloading end to place the tray on the unloading mechanism.

[0053] In summary, the transmission mechanism 30 drives the gripping mechanism 20 to grip the tray and place it on the processing platform 40. The gripping mechanism 20 includes a suction cup 210 and a fixing component 220. The fixing component 220 includes at least two limiting components. After the suction cup 210 adsorbs the tray, the tray adsorbed by the suction cup 210 is clamped by at least two limiting components 222, thereby reducing the risk of chip damage caused by the tray falling.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A loading and unloading device adapted to a die bonder, characterized in that, The loading and unloading device for the die bonder includes: The feeding mechanism is used to place the tray containing the chips; A gripping mechanism for gripping the pallet placed on the feeding mechanism; A transmission mechanism is connected to the gripping mechanism, and the transmission mechanism drives the gripping mechanism to move; A processing platform for holding the pallet transferred by the gripping mechanism; The gripping mechanism includes a suction cup and a fixing component. The suction cup is used to adsorb the tray, and the fixing component includes at least two limiting members, which are arranged opposite to each other and are used to clamp the tray adsorbed on the suction cup.

2. The loading and unloading device for a die bonder according to claim 1, characterized in that, The limiting member has a limiting groove at one end near the tray, the opening of the limiting groove faces the tray, and the inner sidewall of the limiting groove on one side in the height direction supports the side of the tray away from the gripping mechanism.

3. The loading and unloading device for a die bonder according to claim 1, characterized in that, The two limiting members are divided into a limiting member group, and the number of the limiting member groups is at least two. The at least two limiting member groups are spaced apart in a direction perpendicular to the two opposing limiting members.

4. The loading and unloading device for a die bonder according to claim 1, characterized in that, The processing platform includes a bearing groove and a clearance groove. The gripping mechanism approaches the processing platform in the height direction to place the pallet in the bearing groove. The clearance groove is correspondingly provided with the limiting member and is located on the bottom wall of the bearing groove.

5. The loading and unloading device for a die bonder according to claim 4, characterized in that, The radial dimension of the bearing groove is larger than the radial dimension of the pallet. The processing platform also includes a pushing mechanism located on one side of the processing platform. The pushing mechanism pushes the pallet toward the pallet.

6. The loading and unloading device for a die bonder according to claim 5, characterized in that, The pushing mechanism includes a wedge, and the gripping mechanism includes an inclined block. The wedge is disposed corresponding to the inclined block in the height direction. In the height direction, the distance between the inclined block and the wedge is less than the distance between the pallet and the bearing groove. As the gripping mechanism moves toward the processing platform in the height direction, the inclined block pushes the wedge to move away from the pallet.

7. The loading and unloading device for a die bonder according to claim 6, characterized in that, The pushing mechanism also includes an elastic element, which is elastically supported between the pushing mechanism and the side wall of the bearing groove.

8. The loading and unloading device for a die bonder according to claim 6, characterized in that, The wedge includes a rotating shaft, which is cylindrical. The axis of the rotating shaft is perpendicular to the height direction and the direction of movement of the pushing mechanism. The rotating shaft rotates around its own axis.

9. The loading and unloading device for a die bonder according to claim 1, characterized in that, The loading mechanism includes a lifting mechanism and a first sensor. The lifting mechanism is located below the pallet in the height direction, and the first sensor is located at the end of the loading mechanism away from the lifting mechanism. The pallet is located between the lifting mechanism and the first sensor in the height direction.

10. The loading and unloading device for a die bonder according to claim 1, characterized in that, The feeding mechanism includes a basket and a base. The basket is fixed on the base. The base is provided with two sets of second sensors at intervals. The basket is provided with a horizontal groove in the light path of the two second sensors, allowing the light emitted by the two second sensors to pass through respectively.

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