Ceramic substrate limiting structure

Abstract

The utility model relates to the technical field of semiconductor production, and discloses a ceramic substrate limiting structure which comprises a frame, at least one loading area used for placing a ceramic substrate is arranged in the frame, the surface of the ceramic substrate is provided with a copper-clad layer, and the copper-clad layer exposes a partial area of the edge of the ceramic substrate; the limiting pieces are used for limiting and fixing the periphery of the ceramic substrate, the first ends of the limiting pieces are installed on the frame in an up-and-down sliding mode and can freely move downwards under the action of the gravity of the limiting pieces, and the second ends of the limiting pieces are used for abutting against the side face of the edge of a copper-clad layer on the upper surface of the ceramic substrate. The limiting piece in the structure can move downwards along with the ceramic substrate, the risk that ceramics on the ceramic substrate are broken can be reduced, and the yield is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a ceramic substrate limiting structure. Background Technology

[0002] In traditional power modules, the ceramic substrate is a crucial carrier for the chip. A ceramic substrate is a special board made by directly bonding copper foil to the surface (single-sided or double-sided) of an alumina or aluminum nitride ceramic substrate at high temperatures. During power module production, the ceramic substrate and copper substrate are first reflow soldered, and then the chip is mounted on the ceramic substrate. During the reflow process, the ceramic substrate may rotate or shift due to solder melting, necessitating a positioning fixture to control its position. Traditional positioning fixtures typically use locating protrusions to limit and fix the ceramic substrate around its perimeter. This concentrates stress at the contact point between the ceramic substrate and the fixture, making the ceramic substrate prone to cracking as the solder melts, thus reducing product yield. Utility Model Content

[0003] The purpose of this invention is to solve at least one problem of the prior art and to propose a ceramic substrate limiting structure.

[0004] To achieve the above objectives, this utility model proposes a ceramic substrate limiting structure, comprising:

[0005] A frame having at least one loading area for placing a ceramic substrate, the ceramic substrate including a ceramic layer and copper-clad layers disposed on the upper and lower surfaces of the ceramic layer, wherein the copper-clad layers expose a portion of the edge of the ceramic layer.

[0006] Multiple limiting components are used to limit and fix the ceramic substrate around its perimeter. The first end of each limiting component is slidably mounted on the frame and can move freely downward under its own weight. The second end of each limiting component is used to abut against the side of the edge of the copper-clad layer on the upper surface of the ceramic layer.

[0007] As an optional implementation, a protrusion is provided between two adjacent loading areas, and the protrusion has an opening in the middle to give it a certain elasticity, thus serving as an elastic protrusion.

[0008] As an optional implementation, the protrusions, elastic protrusions and the frame are connected by welding, screws, integral molding or riveting.

[0009] As an optional implementation, each loading area is provided with four slide grooves along the height direction of the frame, with one slide groove on each side, and the first end of the limiting member is connected to the slide groove in a one-to-one correspondence.

[0010] As an optional implementation, each loading area is provided with eight slide grooves along the height direction of the frame, and two slide grooves are provided on each side, with the first end of the limiting member corresponding to and cooperating with the slide grooves one by one.

[0011] As an optional implementation, each loading area is provided with twelve slides along the height of the frame, and three slides are provided on each side, with the first end of the limiting member corresponding to and cooperating with each slide.

[0012] As an optional implementation, the height of the groove does not exceed the height of the ceramic substrate.

[0013] As an optional implementation, the cross-section of the groove is cross-shaped, T-shaped, E-shaped, or L-shaped.

[0014] As an optional implementation, the top opening of the chute is covered with a cap, and a spring is provided between the cap and the limiting member.

[0015] As an optional implementation, a gasket layer is provided at the second end of the limiting member.

[0016] As an optional implementation, the first surface of the gasket layer away from the copper-clad layer on the upper surface of the ceramic layer is connected to the limiting member by adhesive bonding, welding, riveting, or integral molding, and the second surface of the gasket layer near the copper-clad layer on the upper surface of the ceramic layer is provided with a knurled structure.

[0017] As an optional implementation, the dimensions of each edge of the copper-clad layer and each edge of the ceramic layer differ by 0.3mm-0.7mm, and the limiting member that partially protrudes outside the frame rests on the upper surface of the ceramic layer.

[0018] As an optional implementation, the limiting member is a metal component, and the second end of the limiting member has rounded corners on both sides.

[0019] The beneficial effects of this utility model are as follows: By setting multiple limiting components in the frame that can move downward with the ceramic substrate, this utility model adopts a floating limiting structure. It can move downward synchronously with the natural settling of the ceramic substrate after printing reflow. The limiting components are always in contact with the copper-clad layer on the ceramic substrate, which can better limit and fix the ceramic substrate. Moreover, the limiting components always maintain contact with the copper-clad layer, and the ceramic layer is kept out of the air, thereby avoiding the risk of ceramic layer breakage and helping to improve the product yield.

[0020] The features and advantages of this utility model will be described in detail through embodiments and accompanying drawings. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the state after the ceramic substrate is loaded according to an embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the state when the ceramic substrate is not loaded in an embodiment of this utility model.

[0023] Figure 3 This is an embodiment of the present utility model. Figure 2 Enlarged schematic diagram of part A in the middle.

[0024] Figure 4 This is a schematic diagram of the ceramic substrate according to an embodiment of the present invention.

[0025] Figure 5 This is a schematic diagram of the limiting component according to an embodiment of the present utility model.

[0026] Figure 6 This is a schematic diagram of the state when the ceramic substrate is not loaded in an embodiment of this utility model.

[0027] Figure 7 This is a schematic diagram of the state when the ceramic substrate is not loaded in an embodiment of this utility model.

[0028] Figure 8 This is an embodiment of the present utility model. Figure 1 Enlarged schematic diagram of section B in the middle.

[0029] In the diagram: 1. Frame; 2. Loading area; 3. Limiting component; 4. Protrusion; 5. Slide groove; 6. Ceramic substrate; 61. Ceramic layer; 62. Copper cladding layer. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] It should be understood that terms such as “first” and “second” used herein to describe various elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. For example, the use of terms such as “first” and “second” herein does not imply order or sequence unless the context clearly indicates otherwise. For ease of description, spatially relative terms such as “horizontal” and “vertical” may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include not only the orientations shown in the accompanying drawings but also different orientations of the device in use or operation.

[0032] In this application, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. It should be noted that the terms "comprising" and "having," and their variations, used in this application are intended to cover non-exclusive inclusion. The present invention will now be described in detail with reference to the accompanying drawings.

[0034] Example 1

[0035] See Figures 1 to 5 , Figure 8 This embodiment provides a ceramic substrate limiting structure, including:

[0036] The frame 1 has at least one loading area 2 for placing a ceramic substrate 6. The ceramic substrate 6 includes a ceramic layer 61 and copper clad layers 62 disposed on the upper and lower surfaces of the ceramic layer 61, and the copper clad layers 62 expose a portion of the edge of the ceramic layer 61.

[0037] Multiple limiting members 3 are used to limit and fix the ceramic substrate 6 around the loading area 2. The first end of the limiting member 3 is slidably mounted on the frame 1 and can move downward under its own weight. During the downward movement, the second end of the limiting member 3 always abuts against the side of the copper-clad layer 62 on the upper surface of the ceramic layer 61.

[0038] The upper surface of the ceramic layer 61 is its top plane in the height direction, which is perpendicular to the horizontal plane of the frame.

[0039] In actual production, the number of loading zones 2 can be set according to process requirements, including but not limited to 1, 2, 3, 4, or 6. When multiple loading zones 2 are set, they can be arranged in an array. Multiple loading zones 2 can be interconnected or separated by partitions. To improve the overall strength of the frame 1, the frame can be a metal frame, such as an aluminum alloy frame or an iron frame. The number of limiting members 3 is set according to the number, size, and shape of the ceramic substrates 6 that need to be limited and fixed. The more sides, the larger the size, and the more numerous the ceramic substrates 6, the more limiting members 3 are required. In use, each ceramic substrate 6 should be limited and fixed with at least one limiting member on each side. To improve the limiting and fixing effect, multiple evenly arranged limiting members 3 can be used to limit and fix each ceramic substrate 6 placed on each side.

[0040] During use, as the solder melts during the printing reflow process, the ceramic substrate 6 moves downward, and the limiting member 3 falls freely under the action of gravity. The downward movement of the limiting member 3 is used to cooperate with the natural settling of the ceramic substrate 6 after printing reflow, so that the limiting member 3 can always abut against and contact the side of the copper-clad layer 62 on the upper surface of the ceramic layer 61, ensuring the accuracy of the fixed position of the ceramic substrate 6. The limiting member 3 always keeps in contact with the side of the copper-clad layer 62, rather than directly abutting against the ceramic layer 61, thus avoiding the risk of ceramic breakage and improving yield.

[0041] The limiting member 3 and the frame 1 are connected by a guide rail and a slider to achieve a sliding connection. That is, a guide rail is set along the height direction of the frame 1, and a slider is set at the first end of the limiting member 3. The slider and the guide rail are connected to enable the limiting member to slide up and down along the guide rail.

[0042] Of course, the limiting member 3 and the frame 1 can also be connected by a snap-fit ​​part and a sliding groove to achieve a sliding connection. That is, a sliding groove 5 is provided in the frame 1 along the height direction, the first end of the limiting member 3 is provided with a snap-fit ​​part to connect with the sliding groove 5, and the second end of the limiting member 3 extends out of the sliding groove 5. The limiting member 3 can slide up and down inside the sliding groove 5 through the snap-fit ​​part to achieve the up and down movement of the limiting member 3.

[0043] The edges of the copper-clad layer 62 on the upper surface of the ceramic layer 61 and the edges of the copper-clad layer 62 have a certain gap, generally 0.3mm-0.7mm apart, which forms a step between the upper surface of the ceramic layer 61 and the side of the copper-clad layer 62. The limiting member 3, which extends out of the frame 1, rests on the step formed by the upper surface of the ceramic layer 61 and the side of the copper-clad layer 62. The ceramic layer 61 provides a certain support for the limiting member 3, making it less likely for the limiting member 3 to shift or tilt. This further ensures that the second end of the limiting member 3 can always be in contact with the side of the copper-clad layer 62 during the up and down movement.

[0044] Optionally, the dimensions of each edge of the copper-clad layer 62 on the upper surface of the ceramic layer 61 and each edge of the ceramic layer 61 differ by 0.3mm, 0.4mm, 0.5mm, 0.6mm, or 0.7mm. By adjusting the length of the limiting member 3, the second end of the limiting member 3 can always be in contact with the side of the copper-clad layer 62 during the up-and-down movement.

[0045] Example 2

[0046] Based on embodiment 1, the frame 1 is provided with a protrusion, and a groove 5 is provided along the height direction on the side of the protrusion near the loading area 2. The first end of the limiting member 3 is slidably installed in the groove 5 and can move freely downward under its own weight. During the downward movement, the second end of the limiting member always abuts against the side of the edge of the copper-clad layer 62 on the upper surface of the ceramic layer 61.

[0047] For details, please refer to Figures 1 to 3 In this embodiment, based on embodiment 1, a protrusion 4 is provided between two adjacent loading areas 2. The protrusion 4 is a long and thin strip structure and has an opening in the middle to give it a certain degree of elasticity.

[0048] In actual use, a groove 5 is provided on the side of the end of the protrusion 4 along the height direction. The first end of the limiting member 3 is slidably installed in the groove 5 and can move downward under its own weight. During the downward movement, the second end of the limiting member 3 always abuts against the side of the copper-clad layer 62 on the upper surface of the ceramic layer 61.

[0049] The protrusion 4 can be an aluminum alloy component. During the printing reflow process, as the solder melts and the ceramic substrate 6 moves downward, the copper cladding layer 62 can squeeze the side of the protrusion 4. Since the protrusion 4 has an opening in the middle, it can have a certain range of deformation ability after being squeezed in a horizontal position, which can release the stress generated during the squeezing of the ceramic substrate 6.

[0050] Example 3

[0051] This embodiment is based on Embodiment 1, see also... Figure 2 The frame 1 has a protrusion 4 on its edge. The protrusion 4 has a groove 5 along the height direction on the side near the loading area. The first end of the limiting member 3 is slidably installed in the groove 5 and can move downward under its own weight. During the downward movement, the second end of the limiting member 3 always abuts against the copper-clad layer 62 on the upper surface of the ceramic layer 61.

[0052] The protrusion 4 can be located on the side of the frame 1 of the loading area 2 or at the corner of the loading area 2, and the length of the protrusion 4 shall not exceed the length of each side of the loading area 2.

[0053] Optionally, the protrusion 4 can be set vertically or at an angle on the frame 1.

[0054] In other embodiments, the protrusion 4 is connected to the frame 1 by welding, screws, integral molding, or rivets, so that the protrusion 4 can be fixedly or detachably installed on the frame 1.

[0055] Example 4

[0056] In this embodiment, based on embodiment 1, each loading area 2 is provided with four sliding grooves 5 along the height direction of the frame 1, with one sliding groove 5 on each side. The number of limiting members 3 is the same as the number of sliding grooves 5, and the first end of the limiting member 3 is connected to the sliding groove 5 in a one-to-one correspondence. In order to improve the limiting and fixing stability and force uniformity of the ceramic substrate 6, the four sliding grooves in each loading area 2 are symmetrically distributed.

[0057] Example 5

[0058] See Figure 6 and Figure 7 In this embodiment, based on embodiment 1, each loading area 2 is provided with eight sliding grooves 5 along the height direction of the frame 1, with two sliding grooves 5 on each side. The number of limiting members 3 is the same as the number of sliding grooves 5, and the first end of the limiting member 3 is connected to the sliding groove 5 in a one-to-one correspondence. In order to improve the limiting and fixing stability and force uniformity of the ceramic substrate 6, the eight sliding grooves in each loading area 2 are symmetrically distributed.

[0059] In other embodiments, each loading area 2 is provided with twelve sliding grooves 5 along the height direction of the frame, with three sliding grooves 5 on each side. The number of limiting members 3 is the same as the number of sliding grooves 5, and the first end of the limiting member 3 is connected to the sliding groove 5 in a one-to-one correspondence. In order to improve the limiting and fixing stability and force uniformity of the ceramic substrate 6, the 12 sliding grooves in each loading area 2 are symmetrically distributed.

[0060] In this embodiment, the height of the groove 5 does not exceed the height of the ceramic substrate 6.

[0061] In other embodiments, the height of the chute 5 does not exceed the height of the ceramic substrate settling.

[0062] In this embodiment, the cross-section of the slide 5 is cross-shaped, T-shaped, E-shaped, or L-shaped, and the cross-section of the slide 5 is a slide section parallel to the horizontal direction of the frame 1.

[0063] Correspondingly, the first end of the limiting member 3 has a snap-fit ​​portion that is adapted to the cross-section of the slide groove 5.

[0064] In other embodiments, the top opening of the slide 5 is covered by a cap. The cap and the slide 5 can be connected by a snap-fit, screw, threaded connection or welding, so that the cap can be detached or fixedly installed on the slide 5. A spring is provided between the cap and the limiting member 3, and the spring can play an elastic restoring role.

[0065] Example 6

[0066] In this embodiment, the limiting member 3 is a metal component, and a gasket layer is provided at the second end of the limiting member 3. The second end of the limiting member 3 has rounded corners on both sides. The gasket layer can be a rubber pad or a plastic pad. The gasket layer can provide a certain buffer protection for the copper clad layer 62.

[0067] As an optional embodiment, the first surface of the gasket layer away from the copper clad layer 62 is connected to the limiting member 3 by adhesive bonding, welding, riveting, or integral molding. The second surface of the gasket layer near the copper clad layer 62 is provided with a knurled structure, so that the gasket layer and the copper clad layer 62 are not easy to loosen when they come into contact.

[0068] The above embodiments are illustrative of the present invention and are not intended to limit the present invention. Any simple modifications to the present invention are within the protection scope of the present invention.

Claims

1. A ceramic substrate limiting structure, characterized in that, include: A frame having at least one loading area for placing a ceramic substrate, the ceramic substrate including a ceramic layer and copper-clad layers disposed on the upper and lower surfaces of the ceramic layer, wherein the copper-clad layers expose a portion of the edge of the ceramic layer. Multiple limiting components are used to limit and fix the ceramic substrate around its perimeter. The first end of each limiting component is slidably mounted on the frame and can move freely downwards under its own weight. The second end of each limiting component is used to abut against the side of the edge of the copper-clad layer on the upper surface of the ceramic layer.

2. The ceramic substrate limiting structure as described in claim 1, characterized in that... The frame is provided with a protrusion, and a groove is provided along the height direction on the side of the protrusion near the loading area. The first end of the limiting member is slidably installed in the groove and can move freely downward under its own weight. During the downward movement, the second end of the limiting member always abuts against the side of the edge of the copper-clad layer on the upper surface of the ceramic layer.

3. The ceramic substrate limiting structure as described in claim 2, characterized in that... A protrusion is provided between two adjacent loading areas, and the protrusion has an opening in the middle to give it a certain elasticity, thus serving as an elastic protrusion.

4. The ceramic substrate limiting structure as described in claim 3, characterized in that... The protrusions and elastic protrusions are connected to the frame by welding, screws, integral molding, or rivets.

5. The ceramic substrate limiting structure as described in claim 1, characterized in that: Each loading area is provided with four slide grooves along the height of the frame, with one slide groove on each side, and the first end of the limiting member is connected to the slide groove in a one-to-one correspondence.

6. The ceramic substrate limiting structure as described in claim 1, characterized in that: Each loading area is provided with eight slide grooves along the height of the frame, and two slide grooves are provided on each side. The first end of the limiting member is connected to the slide groove in a one-to-one correspondence.

7. The ceramic substrate limiting structure as described in claim 1, characterized in that: Each loading area is provided with twelve slide grooves along the height of the frame, and three slide grooves are provided on each side. The first end of the limiting member is connected to the slide groove in a one-to-one correspondence.

8. The ceramic substrate limiting structure as described in claim 2 or 4, characterized in that: The height of the chute does not exceed the height of the ceramic substrate, or the height of the chute does not exceed the height of the ceramic substrate when it settles.

9. The ceramic substrate limiting structure as described in claim 2 or 4, characterized in that: The cross-section of the groove is cross-shaped, T-shaped, E-shaped, or L-shaped.

10. The ceramic substrate limiting structure as described in claim 2 or 4, characterized in that: The top opening of the chute is covered by a cap, and a spring is provided between the cap and the limiting member.

11. The ceramic substrate limiting structure as described in claim 1, characterized in that: A gasket layer is provided at the second end of the limiting member.

12. The ceramic substrate limiting structure as described in claim 11, characterized in that: The first surface of the gasket layer away from the copper-clad layer is connected to the limiting component by adhesive bonding, welding, riveting, or integral molding. The second surface of the gasket layer near the copper-clad layer is provided with a knurled structure.

13. The ceramic substrate limiting structure as described in claim 1, characterized in that: The dimensions of each edge of the copper-clad layer and each edge of the ceramic layer differ by 0.3mm-0.7mm, and the limiting member that partially protrudes outside the frame rests on the upper surface of the ceramic layer.

14. The ceramic substrate limiting structure as described in claim 1, characterized in that: The limiting member is a metal component, and the second end of the limiting member has rounded corners on both sides.

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