Novel DFN0603-3L lead frame

Abstract

The utility model discloses a DFN0603-3L novel lead frame in the technical field of semiconductor packaging, which comprises a frame main body, a lead connecting structure and a plurality of pin structures, a plurality of chip mounting areas are uniformly distributed on the frame main body, the plurality of pin structures are connected to the back surface of the frame main body, lead grooves exist between the adjacent chip mounting areas and pin structures, and the lead grooves are connected with the lead connecting structure. The lead groove is arranged at the edge of the frame main body, the lead connecting structure is a lead pin, and the lead pin is arranged on the frame main body. The novel lead frame is reasonable in structural design, good in heat dissipation performance, stable in lead connection, high in production efficiency and wide in market application prospect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a novel lead frame DFN0603-3L. Background Technology

[0002] In the field of semiconductor packaging, the leadframe, as a key component connecting the chip to external circuits, directly affects the reliability, stability, and production efficiency of the entire electronic product. Traditional leadframes are mostly made of metal materials, which, while meeting basic packaging requirements to some extent, have gradually revealed many limitations in practical applications.

[0003] First, traditional leadframes have poor heat dissipation performance. With the rapid development of semiconductor technology, chip integration is constantly increasing, and power consumption is also increasing, leading to increasingly serious heat accumulation problems during the packaging process. Due to limitations in materials and structural design, traditional leadframes are unable to effectively dissipate this heat, thus affecting the chip's performance and lifespan.

[0004] Secondly, traditional leadframes have limited pin count and wafer area. With the increasing demands for high integration and miniaturization in current technologies, the requirements for pin count and wafer area in chips are constantly growing. However, the pin layout and structural design of traditional leadframes cannot meet these requirements, limiting chip performance and application range.

[0005] Furthermore, the production efficiency of traditional leadframes needs improvement. In the semiconductor packaging industry, production efficiency is directly related to a company's competitiveness and market share. However, due to the relatively complex manufacturing process and low level of automation of traditional leadframes, production efficiency is low, making it difficult to meet the rapidly changing market demands. Utility Model Content

[0006] The present invention aims to provide a novel lead frame DFN0603-3L to solve the problems of insufficient pin count and insufficient wafer area in existing lead frames.

[0007] To solve the above technical problems, this utility model provides the following technical solution: a novel lead frame DFN0603-3L, comprising a frame body, a lead connection structure and multiple pin structures. Multiple chip mounting areas are evenly distributed on the frame body, and multiple pin structures are connected to the back of the frame body. There are lead grooves between adjacent chip mounting areas and pin structures. The lead grooves are set at the edge of the frame body. The lead connection structure is a lead pin, and the lead pin is set on the frame body.

[0008] The working principle of this utility model is as follows: In the production process, the frame material (copper strip) EFTEC64T frame body is first processed and shaped, and then the pin structure, lead groove and fixing protrusion are etched on the frame body to complete the production of the lead frame.

[0009] The beneficial effects of this utility model are: 1. By setting the pin structure, the chip's performance in terms of the number of lead frame pin outputs is improved, which enables the chip to be packaged.

[0010] 2. The fixing groove in the lead connection structure can effectively fix the lead, enhance the stability of the lead connection, and improve the reliability of semiconductor packaging.

[0011] 3. The lead frame structure of this utility model is reasonably designed, which facilitates production and processing and improves production efficiency.

[0012] Furthermore, the main frame is made of high-temperature resistant metal material EFTEC64T, which has good mechanical strength and electrical conductivity.

[0013] Furthermore, the pin structure is rectangular with a thickness of 0.102 mm.

[0014] Furthermore, the lead wire groove extends through the main frame body, and is elongated, with a width of 0.08 mm and a depth of 0.05 mm. The shape of the lead wire groove facilitates the routing of the lead wires.

[0015] Furthermore, multiple fixing protrusions are evenly connected to the outer side of the lead groove, and these fixing protrusions are arranged in a crisscross pattern. The fixing protrusions distributed on both sides of the lead groove can firmly fix the lead wire, improving the stability of the lead wire connection.

[0016] Furthermore, the height of the fixing groove is 0.102 mm and the width is 0.038 mm. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a novel lead frame DFN0603-3L according to this utility model;

[0018] Figure 2 This is a magnified view of a portion of the lead wire connection structure. Detailed Implementation

[0019] The following detailed description illustrates the specific implementation method:

[0020] The reference numerals in the accompanying drawings include: frame body 1, pin structure 2, lead groove 3, chip mounting area 4, and fixing protrusion 5.

[0021] The basic implementation examples are as follows: Figure 1 - Appendix Figure 2As shown: A novel lead frame, DFN0603-3L, includes a frame body 1, a lead connection structure, and twelve pin structures 2. The frame body 1 is made of high-temperature resistant metal material EFTEC64T, which has good mechanical strength and conductivity. Chip mounting areas 4 are evenly distributed on the frame body 1. The twelve pin structures 2 are fixedly connected to the back of the frame body 1. The pin structures 2 are rectangular with a thickness of 0.102mm. There are lead grooves 3 between adjacent chip mounting areas 4 and pin structures 2. The lead grooves 3 are located at the edge of the frame body 1 and penetrate the frame body 1. The lead grooves 3 are elongated, with a width of 0.08mm and a depth of 0.05mm. Fixing protrusions 5 are evenly arranged on the outer side of the lead grooves 3. The fixing protrusions 5 are arranged in a crisscross pattern. The height of the fixing protrusions 5 is 0.102mm and the width is 0.038mm. The lead connection structure is a lead pin, which is set on the frame body 1.

[0022] The specific implementation process is as follows: In the production process, the frame material (copper strip) EFTEC64T frame body 1 is first processed and shaped, and then the pin structure 2, lead groove 3 and fixing protrusion 5 are etched on the frame body 1 to complete the production of the lead frame.

[0023] The above descriptions are merely embodiments of this utility model, and common knowledge regarding specific structures and characteristics is not elaborated upon here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of this utility model, and these should also be considered within the scope of protection of this utility model. These modifications will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A novel lead frame DFN0603-3L, characterized in that: The device includes a frame body, a lead wire connection structure, and multiple pin structures. Multiple chip mounting areas are evenly distributed on the frame body, and multiple pin structures are connected to the back of the frame body. There are lead wire grooves between adjacent chip mounting areas and pin structures. The lead wire grooves are located at the edge of the frame body. The lead wire connection structure is a lead wire pin, and the lead wire pin is located on the frame body. Multiple fixed protrusions are evenly connected to the outside of the lead wire grooves, and the multiple fixed protrusions are arranged in a crisscross pattern.

2. The novel lead frame DFN0603-3L according to claim 1, characterized in that: The main frame is made of high-temperature resistant metal material EFTEC64T, which has good mechanical strength and electrical conductivity.

3. The novel lead frame DFN0603-3L according to claim 2, characterized in that: The pin structure is rectangular and has a thickness of 0.102 mm.

4. The novel lead frame DFN0603-3L according to claim 3, characterized in that: The lead wire groove runs through the main frame body. The lead wire groove is long and narrow, with a width of 0.08 mm and a depth of 0.05 mm.

5. The novel lead frame DFN0603-3L according to claim 4, characterized in that: The height of the fixing groove is 0.102 mm and the width is 0.038 mm.

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