Chip selection mechanism for integrated circuit packaging

Abstract

The utility model discloses a chip selection mechanism for integrated circuit packaging, which relates to the technical field of integrated circuit packaging and comprises a rack, a detection mechanism is arranged above the rack, and the detection mechanism is used for quickly identifying defective integrated circuits; the movable plate is arranged above the rack, and the top of the movable plate is fixedly connected with a push plate; the rotation driving mechanism is arranged on the moving plate; and the positioning mechanism is arranged above the rack, and the positioning mechanism is used for positioning the circuit board. According to the utility model, the rotary driving mechanism is utilized to drive the moving plate to rotate circularly, the moving plate drives the push plates to rotate, and the plurality of push plates push the chip circuit boards towards the conveying direction when the moving plate rotates in each circle, so that the chip circuit boards are fixed at intervals and are driven to enter a detection area in sequence; a plurality of chips are prevented from entering the detection area at the same time, and the chip circuit board is positioned to the center of the detection area by using the positioning mechanism, so that the chip circuit board is prevented from deviating.

Description

An integrated circuit packaging chip selection mechanism Technical Field

[0001] This utility model relates to the field of integrated circuit packaging technology, and in particular to an integrated circuit packaging chip selection mechanism. Background Technology

[0002] An integrated circuit packaging chip sorting mechanism is a device used to screen and classify chips during the integrated circuit packaging process. Its main function is to continuously inspect the incoming integrated circuits, identify and reject unqualified chips, and ensure that only qualified chips proceed to the next process.

[0003] Integrated circuit packaging chip selection mechanisms use a conveyor to move chip circuit boards through an inspection mechanism for inspection. However, during this process, multiple chips may be stacked disorderly on the conveyor, causing multiple chips to enter the inspection area at the same time, making it impossible for the inspection device to accurately identify defects in individual chips. Summary of the Invention

[0004] The purpose of this invention is to provide an integrated circuit packaging chip selection mechanism to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit packaging chip selection mechanism, comprising:

[0006] A rack, with a detection mechanism mounted on top of the rack, the detection mechanism being used to identify defective integrated circuits;

[0007] A movable plate is disposed above the frame, and a push plate is fixedly connected to the top of the movable plate;

[0008] A rotary drive mechanism is disposed on a movable plate and is used to drive the movable plate to rotate.

[0009] A positioning mechanism is disposed above the frame and is used to position the circuit board.

[0010] Preferably, the rotary drive mechanism includes a first connecting rod, a first fixed plate and a third fixed plate are fixedly connected to the top of the frame, the first connecting rod and the third fixed plate are spaced apart, the first connecting rod is rotatably connected to the outer wall of the first fixed plate, the outer wall of the third fixed plate is rotatably connected to a third connecting rod, and a second connecting rod is rotatably connected between the third connecting rod and the first connecting rod.

[0011] Preferably, a second fixed plate is fixedly connected to the bottom of the movable plate, the top end of the second connecting rod is rotatably connected to the second fixed plate, multiple push plates are arranged horizontally at intervals, and a first driving member is fixedly connected to the outer wall of the first fixed plate, the first driving member being used to drive the second connecting rod to rotate.

[0012] Preferably, a support rod is fixedly connected to the top of the frame, a square plate is fixedly connected to the top of the support rod, a fixed frame is fixedly connected to the top of the square plate, the detection mechanism is disposed inside the fixed frame, and there are two square plates disposed on both sides of the movable plate.

[0013] Preferably, the positioning mechanism includes a sliding plate, a threaded rod is rotatably connected to the inner wall of the fixed frame, a second driving member is fixedly connected to the outer wall of the fixed frame, the second driving member is used to drive the threaded rod to rotate, the sliding plate is slidably connected to the inner wall of the fixed frame, and the sliding plate is threadedly sleeved on the outer wall of the threaded rod.

[0014] Preferably, a circular rod is slidably connected to the outer wall of the skateboard, and a positioning plate is fixedly connected to the side of the circular rod away from the skateboard. A spring is fixedly connected between the positioning plate and the skateboard.

[0015] Compared with the prior art, the technical effects of this utility model are as follows:

[0016] This invention utilizes a rotary drive mechanism to drive a moving plate to rotate cyclically. The moving plate drives a pusher plate to rotate. Each rotation of the moving plate pushes multiple pushers one step forward in the transport direction, ensuring a fixed spacing between each chip circuit board. This allows each chip circuit board to enter the detection area sequentially, preventing multiple chips from entering the detection area simultaneously. At the same time, a positioning mechanism is used to position the chip circuit board to the center of the detection area, preventing the chip circuit board from shifting. Attached Figure Description

[0017] Figure 1 is a front three-dimensional structural diagram of this utility model.

[0018] Figure 2 is a three-dimensional structural diagram of the movable plate of this utility model.

[0019] Figure 3 is a three-dimensional structural diagram of the fixing frame of this utility model.

[0020] In the diagram: 1. Frame; 2. Support rod; 3. Square plate; 4. Moving plate; 5. Push plate; 6. Fixed frame; 7. First fixed plate; 8. First driving component; 9. First connecting rod; 10. Second connecting rod; 11. Second fixed plate; 12. Third fixed plate; 13. Positioning plate; 14. Spring; 15. Round rod; 16. Detection mechanism; 17. Threaded rod; 18. Second driving component; 19. Slide plate; 20. Third connecting rod. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] This utility model provides an integrated circuit packaging chip selection mechanism as shown in Figures 1-3, including a frame 1, a moving plate 4, a rotation drive mechanism, and a positioning mechanism. A detection mechanism 16 is disposed above the frame 1. The detection mechanism 16 is used to identify defective integrated circuits. The detection mechanism 16 includes several test probes and probe fixing blocks. The fixing blocks adjust the probe height through a retaining ring or pressure ring design to ensure that the probes remain vertical or at a predetermined angle during testing. The probes screen out chips with design or manufacturing defects through continuity testing. The moving plate 4 is disposed above the frame 1, and a push plate 5 is fixedly connected to the top of the moving plate 4. The moving mechanism is set on the moving plate 4, and the rotary drive mechanism is used to drive the moving plate 4 to rotate. The positioning mechanism is set above the frame 1 and is used to position the circuit board. In specific use: the rotary drive mechanism drives the moving plate 4 to rotate cyclically, and the moving plate 4 drives the push plate 5 to rotate. Each rotation of the moving plate 4 pushes multiple push plates 5 one step in the transport direction, so that the spacing between each chip circuit board is fixed, and each chip circuit board enters the detection area in sequence, avoiding multiple chips from entering the detection area at the same time. At the same time, the positioning mechanism is used to position the chip circuit board to the center of the detection area to prevent the chip circuit board from shifting.

[0023] In one aspect, the rotary drive mechanism includes a first connecting rod 9. A first fixed plate 7 and a third fixed plate 12 are fixedly connected to the top of the frame 1. The first connecting rod 9 and the third fixed plate 12 are spaced apart. The first connecting rod 9 is rotatably connected to the outer wall of the first fixed plate 7. A third connecting rod 20 is rotatably connected to the outer wall of the third fixed plate 12. A second connecting rod 10 is rotatably connected between the third connecting rod 20 and the first connecting rod 9. A second fixed plate 11 is fixedly connected to the bottom of the moving plate 4. The top end of the second connecting rod 10 is rotatably connected to the second fixed plate 11. There are multiple push plates 5. Furthermore, the components are arranged at horizontal intervals. The outer wall of the first fixed plate 7 is fixedly connected to the first driving component 8, which is used to drive the second connecting rod 10 to rotate. The first driving component 8 is a motor. In actual use, under the limiting action of the third connecting rod 20, the second connecting rod 10 rotates and moves around an elliptical trajectory. The second connecting rod 10 drives the moving plate 4 and the push plate 5 to move synchronously. Multiple push plates 5 push the chip forward to the working area of ​​the next push plate 5 in sequence. This process is repeated to achieve the purpose of each chip circuit board entering the detection area in sequence.

[0024] On the other hand, a support rod 2 is fixedly connected to the top of the frame 1, a square plate 3 is fixedly connected to the top of the support rod 2, and a fixed frame 6 is fixedly connected to the top of the square plate 3. The detection mechanism 16 is set inside the fixed frame 6. There are two square plates 3, which are set on both sides of the movable plate 4. The square plates 3 are used to support the chip. In specific use: the worker places the chip on the top of the square plate 3. When the push plate 5 rotates downward, the square plate 3 supports the chip. When the push plate 5 rotates upward, it pushes the chip forward.

[0025] Preferably, the positioning mechanism includes a slide plate 19, a threaded rod 17 rotatably connected to the inner wall of the fixing frame 6, and a second driving member 18 fixedly connected to the outer wall of the fixing frame 6. The second driving member 18 uses a motor and is used to drive the threaded rod 17 to rotate. The slide plate 19 is slidably connected to the inner wall of the fixing frame 6 and threadedly sleeved on the outer wall of the threaded rod 17. The threaded rod 17 is a bidirectional screw. A circular rod 15 is slidably connected to the outer wall of the slide plate 19. A positioning plate 13 is fixedly connected to the side of the circular rod 15 away from the slide plate 19. There are two positioning plates 13 arranged horizontally and symmetrically. A spring 14 is fixedly connected between the positioning plate 13 and the slide plate 19. The spring 14 is used to prevent the positioning plate 13 from being damaged by excessive stress and to make the positioning plate 13 suitable for chips of various sizes. In specific use: the second driving member 18 drives the threaded rod 17 to rotate, and the threaded rod 17 drives the positioning plate 13 to move through the slide plate 19. After clamping the chip, the positioning plate 13 squeezes the spring 14 to achieve the centering positioning of the chip.

[0026] In practice: the worker places the chip on top of the square plate 3, activates the first driving component 8, and under the limiting action of the third connecting rod 20, the second connecting rod 10 rotates and moves around an elliptical trajectory. The second connecting rod 10 drives the moving plate 4 and the push plate 5 to move synchronously. Multiple push plates 5 push the chip forward to the working area of ​​the next push plate 5 in sequence. This process is repeated to achieve the purpose of each chip circuit board entering the detection area in sequence. The second driving component 18 drives the threaded rod 17 to rotate, and the threaded rod 17 drives the positioning plate 13 to move through the sliding plate 19. After clamping the chip, the positioning plate 13 squeezes the spring 14 to achieve the centering positioning of the chip.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit packaging chip selection mechanism, characterized in that, include: A frame (1) is provided above the frame (1) and the detection mechanism (16) is used to identify defective integrated circuits; a moving plate (4) is provided above the frame (1) and a push plate (5) is fixedly connected to the top of the moving plate (4); a rotation drive mechanism is provided on the moving plate (4) and the rotation drive mechanism is used to drive the moving plate (4) to rotate; a positioning mechanism is provided above the frame (1) and the positioning mechanism is used to position the circuit board.

2. The integrated circuit packaging chip selection mechanism according to claim 1, characterized in that, The rotary drive mechanism includes a first connecting rod (9), a first fixing plate (7) and a third fixing plate (12) are fixedly connected to the top of the frame (1), the first connecting rod (9) and the third fixing plate (12) are spaced apart, the first connecting rod (9) is rotatably connected to the outer wall of the first fixing plate (7), the outer wall of the third fixing plate (12) is rotatably connected to a third connecting rod (20), and a second connecting rod (10) is rotatably connected between the third connecting rod (20) and the first connecting rod (9).

3. The integrated circuit packaging chip selection mechanism according to claim 2, characterized in that, The bottom of the movable plate (4) is fixedly connected to a second fixed plate (11), and the top of the second connecting rod (10) is rotatably connected to the second fixed plate (11). There are multiple push plates (5) arranged horizontally at intervals. The outer wall of the first fixed plate (7) is fixedly connected to a first driving member (8), which is used to drive the second connecting rod (10) to rotate.

4. The integrated circuit packaging chip selection mechanism according to claim 3, characterized in that, The top of the frame (1) is fixedly connected to a support rod (2), the top of the support rod (2) is fixedly connected to a square plate (3), the top of the square plate (3) is fixedly connected to a fixing frame (6), the detection mechanism (16) is located inside the fixing frame (6), and there are two square plates (3) located on both sides of the movable plate (4).

5. The integrated circuit packaging chip selection mechanism according to claim 4, characterized in that, The positioning mechanism includes a sliding plate (19), a threaded rod (17) is rotatably connected to the inner wall of the fixing frame (6), and a second driving member (18) is fixedly connected to the outer wall of the fixing frame (6). The second driving member (18) is used to drive the threaded rod (17) to rotate. The sliding plate (19) is slidably connected to the inner wall of the fixing frame (6), and the sliding plate (19) is threadedly sleeved on the outer wall of the threaded rod (17).

6. The integrated circuit packaging chip selection mechanism according to claim 5, characterized in that, A circular rod (15) is slidably connected to the outer wall of the slide plate (19). A positioning plate (13) is fixedly connected to the side of the circular rod (15) away from the slide plate (19). A spring (14) is fixedly connected between the positioning plate (13) and the slide plate (19).

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