Device for preparing protective film

Abstract

The utility model relates to a device for preparing a protective film. The device comprises a chamber, wafer glass, a rotating disc, a fixing assembly, a feeding pipe and a lifting mechanism. The chamber is used for providing a place for preparing the protective film; the wafer glass is a carrier for preparing the protective film, and the wafer glass is arranged in the cavity; the rotating disc is used for driving the wafer glass to rotate; the fixing assembly provides a fixing boundary for the protective film, and the fixing assembly is arranged on the wafer glass; the feeding pipe is used for conveying feed liquid required for manufacturing the protective film into the chamber, and the feeding pipe is communicated with the chamber; and the lifting mechanism is used for taking out the prepared protective film from the chamber. After the protective film is prepared, the protective film can be taken down more quickly, more conveniently and relatively more completely, the step of traditional adhesive tape can be omitted, and compared with other shapes, the square wafer glass has the advantages that the utilization rate of the produced protective film is higher, and the material loss is reduced.

Description

An apparatus for preparing a protective film Technical Field

[0001] This utility model relates to the field of pellicle protective film preparation technology, and to an apparatus for preparing a protective film, specifically an apparatus for preparing a small-sized pellicle protective film. Background Technology

[0002] In many fields such as electronics and optics, protective films play a crucial role, effectively protecting the surfaces of various products from scratches, contamination, and other damage, thereby ensuring product performance and quality. In the fabrication process of protective films, release molding is a common method, and the fabrication equipment directly affects the quality and production efficiency of the protective film. Currently, taking the fabrication of protective films on wafer glass as an example, the mainstream pellicle protective film on the market requires first uniformly rotating and coating a liquid onto the wafer glass, followed by drying, and then applying adhesive tape to a frame to remove the pellicle protective film from the glass. This process is relatively cumbersome, leading to low production efficiency, increased time costs, and potential damage to the protective film due to operational errors. Patent CN110176412B discloses a protective film forming apparatus. The main technical problem this apparatus addresses is the efficient removal of resin adhering to the upper surface of a ring-shaped frame when forming a protective film on the upper surface of a wafer supported by a ring frame. However, it does not address the issue of convenient and quick removal of the protective film. Summary of the Invention

[0003] To address at least some of the problems mentioned above in the prior art, this invention provides an apparatus for preparing a protective film, specifically an apparatus for preparing a small-sized pellicle protective film.

[0004] This utility model provides an apparatus for preparing a protective film, the apparatus comprising:

[0005] A chamber, which provides a space for the preparation of a protective film;

[0006] A wafer glass, which serves as a carrier for the preparation of a protective film, is placed within the cavity;

[0007] A rotating disk is used to drive the wafer glass to rotate, and the wafer glass is placed on the rotating disk;

[0008] A fixing component that provides a fixing boundary for the protective film, the fixing component being placed on the wafer glass;

[0009] A feed pipe is used to transport the liquid material required for making the protective film into the chamber, and the feed pipe is connected to the chamber.

[0010] A lifting mechanism is used to remove the prepared protective film from the cavity.

[0011] Furthermore, the fixing component includes a frame and a fixing buckle, the fixing buckle being fixedly connected to the wafer glass and detachably connected to the frame. The fixing buckle prevents the frame from being thrown out due to centrifugal force during rotation.

[0012] Furthermore, the bottom of the frame is provided with a first groove, and the fixing buckle is provided with a first protrusion. The first protrusion is conforming to the first groove so as to limit the frame and prevent the frame from being thrown out due to centrifugal force when rotating. At the same time, it also facilitates the lifting of the protective film along with the frame when the lifting platform is raised and lowered.

[0013] Furthermore, the frame is a rigid material frame. The frame includes a titanium alloy frame or an aluminum alloy frame.

[0014] Furthermore, the lifting mechanism includes a lifting platform and a connecting rod disposed within the lifting platform. The frame has mounting holes. When the lifting platform is in operation, the connecting rod extends from the lifting platform and passes through the mounting holes. The lifting platform and the connecting rod cooperate to enable operations such as lifting and removing the frame and / or protective film.

[0015] Furthermore, the connecting rod is an electric push rod.

[0016] Furthermore, the lifting mechanism also includes a gear, and the connecting rod includes a connecting rod body and a rack segment disposed at one end of the connecting rod body, the rack segment matching the gear. The rack segment can convert the rotational motion of the gear into linear motion to realize the extension and retraction function of the connecting rod.

[0017] Furthermore, the telescopic function of the connecting rod is not limited to the gear-rack structure described above, but also includes other implementation methods, such as hydraulic or pneumatic methods.

[0018] Furthermore, the device also includes

[0019] A heating element for heating the chamber, the heating element comprising a heating wire. The heating wire may be a molybdenum heating wire or a nickel-chromium alloy heating wire.

[0020] Furthermore, the device also includes

[0021] The control buttons are used to control the operation of the device. The control buttons include a first button, a second button, and a third button. The first button is electrically connected to the rotating disk, the second button is electrically connected to the heating component, and the third button is electrically connected to the lifting platform to control the lifting or extending of the connecting rod.

[0022] Furthermore, the device also includes a controller. The controller is electrically connected to the control buttons.

[0023] Furthermore, the controller is a PCL controller.

[0024] Furthermore, the chamber includes a chamber body with an internal cavity, a cover plate on top of the chamber body, a stage within the cavity, and a switch latch on the outer wall of the chamber body. The stage is located at the bottom of the rotating disk, and the rotating disk is rotatably connected to the stage. The switch latch is located on one or at least one side of the outer wall of the chamber body to open and close the chamber body. The chamber body (the side with the switch latch) is detachably connected to the other sides of the chamber body so that when the switch latch is opened, the corresponding chamber body can be removed, at which point the chamber is in an open state, facilitating the insertion or removal of frames, etc. The rotating disk drives the wafer glass to rotate at a constant speed around the center point, so that the liquid material is evenly coated on the wafer glass. The cover plate covers the top of the chamber body, protecting the internal components and also maintaining the stability of the internal processing environment to a certain extent.

[0025] Furthermore, the switch buckle includes a first connecting body and a second connecting body connected to the first connecting body. The first connecting body is fixedly connected to the chamber body, and the first connecting body is movably connected to the second connecting body.

[0026] Furthermore, the first connector includes a first connector body and a second groove on the first connector body; the second connector is L-shaped, including a second connector body and a second protrusion on the second connector body, the second protrusion conforming to the second groove. When it is necessary to insert or remove the frame, the switch is opened, that is, the second connector is pulled out from the second groove. At this time, the chamber body fixed by the switch is released, and the chamber body can be removed.

[0027] Furthermore, the heating wire is arranged on the stage to heat the chamber. The stage is a ceramic stage or the like.

[0028] Furthermore, the switch buckle is not limited to the aforementioned switch buckle, but also includes other conventional latches. The switch buckle is used to open or close the chamber (chamber body) to facilitate the insertion and removal of the frame, etc.

[0029] Furthermore, the chamber body is a glass chamber body to form a glass door.

[0030] Furthermore, the device also includes a base platform, on which the control buttons are located, and on which the chamber is placed. The base platform supports the entire device.

[0031] Furthermore, a valve is provided on the feed pipe.

[0032] Furthermore, the wafer glass is a square wafer glass.

[0033] Furthermore, the wafer glass includes a wafer glass body and a coating disposed on the wafer glass body.

[0034] Furthermore, the coating is applied to the surface of the wafer glass by physical adsorption, and the coating includes surface-modified coatings such as fluorocarbon layers.

[0035] The usage process of this utility model is as follows:

[0036] Activate the switch latch to open the chamber body;

[0037] The frame is removed using a lifting platform, and a surface modifier (fluorocarbon compound) is applied to the wafer glass to reduce the adhesion of the protective film to the wafer glass.

[0038] After the surface modification is completed, the frame is placed in the lifting platform, the frame is placed on the wafer glass, and the switch buckle is closed to close the chamber body.

[0039] After opening the valve, the first button is turned on to make the rotating disk drive the wafer glass to rotate at a constant speed around the center point until the liquid material for preparing the protective film is evenly coated on the wafer glass;

[0040] After spin coating is completed, the rotation speed of the rotating disk is reduced and the second button is turned on. The heating component starts to work, heating the chamber and drying the liquid on the upper surface of the wafer glass to form a protective film.

[0041] When the third button is pressed, the lifting platform starts to operate. The connecting rod extends from the lifting platform and passes through the mounting hole, raising the frame (including the protective film) to a suitable height. (Because the protective film has different adhesion to the frame and the wafer glass, the protective film has lower adhesion to the wafer glass, so the frame can be easily removed.)

[0042] Turn on the switch, open the chamber body, and remove the frame (with protective film);

[0043] Apply UV-curing adhesive to the frame of the required size, place it in the film area, irradiate with ultraviolet light, and then cut it.

[0044] After completion, the frame is cleaned and inserted into the connecting rod. The third button is then pressed, causing the connecting rod to descend and place the frame on the circular crystal glass. The connecting rod then retracts into the lifting platform.

[0045] This invention has at least the following beneficial effects: 1) After the protective film is prepared by this invention, it can be removed faster, more conveniently, and more completely; 2) This invention eliminates the traditional adhesive tape step, and the square wafer glass has a higher utilization rate for producing protective film compared to other shapes, reducing material waste; 3) This invention avoids operation in confined spaces, reduces tape waste, increases economy, and is environmentally friendly. Attached Figure Description

[0046] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the various embodiments of the present invention will be presented with reference to the accompanying drawings. It is understood that these drawings depict only typical embodiments of the present invention and are therefore not intended to limit its scope. In the drawings, for clarity, the same or corresponding parts will be indicated by the same or similar reference numerals.

[0047] Figure 1 shows a schematic diagram of the apparatus for preparing a protective film in some embodiments of the present invention;

[0048] Figure 2 shows a schematic diagram of the switch buckle structure in some embodiments of the present invention;

[0049] Figure 3 shows a schematic diagram of the telescopic structure of the connecting rod in some embodiments of this utility model;

[0050] Figure label:

[0051] 1-Cavity, 2-Wafer Glass, 3-Rotating Disk, 4-Frame, 5-Fixing Buckle, 6-Feed Pipe, 7-Lifting Platform, 8-Connecting Rod, 81-Connecting Rod Body, 82-Rack Segment, 9-Control Button, 10-Cover Plate, 11-Platform, 12-Switch Buckle, 121-First Connector, 1211-First Connector Body, 1212-Second Groove, 122-Second Connector, 1221-Second Connector Body, 1222-Second Protrusion, 13-Base Platform, 14-Gear. Detailed Implementation

[0052] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0053] In this utility model, the various embodiments are merely intended to illustrate the solution of this utility model and should not be construed as limiting.

[0054] In this utility model, unless otherwise specified, the quantifiers “one” and “one” do not exclude scenarios involving multiple elements.

[0055] It should also be noted that in the embodiments of this utility model, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of this utility model, the required parts or components can be added according to the specific scenario.

[0056] It should also be noted that within the scope of this utility model, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0057] It should also be noted that in the description of this utility model, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0058] Furthermore, the embodiments of this utility model describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of this utility model, the order of each step can be adjusted according to the process.

[0059] In the following embodiments, the frame 4 is a titanium alloy frame or an aluminum alloy frame; the heating element is a molybdenum heating wire or a nickel-chromium alloy heating wire; the chamber body is a glass chamber body; the wafer glass 2 is a square wafer glass; the connecting rod 8 is an electric push rod; and the stage 11 is a ceramic stage.

[0060] The following embodiment provides an apparatus for preparing a protective film. Figure 1 shows a schematic diagram of the apparatus. The apparatus includes: a chamber 1, a wafer glass 2, a rotating disk 3, a fixing assembly, a feed tube 6, a lifting mechanism, a heating component, a control button 9, and a base 13. The chamber 1 provides a space for preparing the protective film. The chamber 1 includes a chamber body with an internal cavity, a cover plate 10 on the top of the chamber body, a stage 11 inside the cavity, and a switch 12 on the outer wall of the chamber body. The stage 11 is located at the bottom of the rotating disk 3, and the rotating disk 3 is rotatably connected to the stage 11. The switch 12 is located on one side of the outer wall of the chamber body to open and close the chamber body (i.e., the glass door). The chamber body (the side with the switch 12) is detachably connected to the other sides of the chamber body so that when the switch 12 is opened, the corresponding chamber body can be removed. At this time, the chamber 1 is in an open state, which facilitates the insertion or removal of the frame 4, etc. Figure 2 shows a schematic diagram of the switch buckle 12. The switch buckle 12 includes a first connecting body 121 and a second connecting body 122 connected to the first connecting body 121. The first connecting body 121 is fixedly connected to the chamber body, and the first connecting body 121 and the second connecting body 122 are movably connected. The first connecting body 121 includes a first connecting body body 1211 and a second groove 1212 provided on the first connecting body body 1211; the second connecting body 122 is L-shaped, and includes a second connecting body body 1221 and a second protrusion 1222 provided on the second connecting body body 1221. The second protrusion 1222 conforms to the shape of the second groove 1212. When it is necessary to insert or remove the frame 4, the switch buckle 12 is opened, that is, the second connecting body 122 is pulled out from the second groove 1212. At this time, the chamber body fixed by the switch buckle 12 is released, and the chamber body can be removed. The heating component is arranged on the stage 11 to heat the chamber 1. The rotating disk 3 drives the wafer glass 2 to rotate at a constant speed around the center point, so that the liquid material is evenly coated on the wafer glass 2. The cover plate 10 covers the top of the chamber body, protecting the internal components of the chamber 1, and can also maintain the stability of the internal processing environment of the chamber 1 to a certain extent. The wafer glass 2 is the carrier for the preparation of the protective film. The wafer glass 2 is placed in the chamber 1. The rotating disk 3 is used to drive the wafer glass 2 to rotate. The wafer glass 2 is placed on the rotating disk 3. The fixing component is placed on the wafer glass 2 to provide a fixed boundary for the protective film. The fixing component includes a frame 4 and a fixing buckle 5. The fixing buckle 5 is fixedly connected to the wafer glass 2. The fixing buckle 2 is detachably connected to the frame 4. Specifically, the bottom of the frame 4 is provided with a first groove, and the fixing buckle 2 is provided with a first protrusion. The first protrusion is conforming to the first groove to limit the frame 4, preventing the frame 4 from being thrown out due to centrifugal force during rotation. At the same time, it also facilitates the lifting of the protective film along with the frame 4 when the lifting platform 7 is raised and lowered. The fixing buckle 5 prevents the frame 4 from being thrown out due to centrifugal force during rotation.Frame 4 is placed on wafer glass 2. Feed pipe 6 is connected to chamber 1. Feed pipe 6 is equipped with a valve to transport the liquid material required for making the protective film into chamber 1. Lifting mechanism is used to remove the prepared protective film from chamber 1. Lifting mechanism includes lifting platform 7 and connecting rod 8 located in lifting platform 7. Frame 4 has mounting holes. When lifting platform 7 is running, connecting rod 8 extends from lifting platform 7 and passes through the mounting holes. Lifting platform 7 and connecting rod 8 cooperate to realize the lifting and removal of frame 4 and / or protective film. Heating component is used to heat chamber 1. Control button 9 is used to control the operation of the device. Control button 9 includes a first button, a second button and a third button. The first button is electrically connected to rotating disk 3, the second button is electrically connected to heating component, and the third button is electrically connected to lifting platform 7 to control the lifting or extension of connecting rod 8. Base 13 is used to support the entire device. Control button 9 is located on base 13. Chamber 1 is placed on base 13.

[0061] The usage process of this utility model is as follows:

[0062] Turn on switch 12 to open the chamber body;

[0063] The frame is removed using a lifting platform, and a surface modifier (fluorocarbon compound) is applied to the wafer glass 2 to reduce the adhesion of the protective film to the wafer glass 2.

[0064] After the surface modification is completed, the frame is placed in the lifting platform, the frame 4 is placed on the wafer glass 2, and the switch buckle 12 is closed to close the chamber body.

[0065] After opening the valve, press the first button to make the rotating disk 3 drive the wafer glass 2 to rotate at a constant speed around the center point until the liquid material for preparing the protective film is evenly coated on the wafer glass 2.

[0066] After spin coating is completed, reduce the speed of the rotating disk 3 and turn on the second button. The heating component starts to work, heating the chamber 1 and drying the liquid on the upper surface of the wafer glass 2 to form a protective film.

[0067] Press the third button, and the lifting platform 7 will start running. The connecting rod 8 will extend from the lifting platform 7 and pass through the mounting hole, raising the frame 4 (with the protective film) to a suitable height. (Because the protective film has different adhesion to the frame 4 and the wafer glass 2, the protective film has lower adhesion to the wafer glass 2, so the frame 4 can be easily removed.)

[0068] Turn on switch 12 to open the chamber body and remove frame 4 (with protective film);

[0069] Apply UV-curing adhesive to the frame of the required size, place it in the film area, irradiate with ultraviolet light, and then cut it.

[0070] After completion, clean the frame 4 and insert the frame 4 into the connecting rod 8. Press the third button, and the connecting rod 8 will descend and place the frame 4 on the circular crystal glass. Then, the connecting rod 8 will retract into the lifting platform 7.

[0071] In some embodiments, the wafer glass 2 includes a wafer glass body and a coating disposed on the wafer glass body. The coating is disposed on the surface of the wafer glass 2 by physical adsorption, and the coating includes a surface-modified coating such as a fluorocarbon layer.

[0072] In some embodiments, the apparatus for preparing the protective film further includes a controller. The controller is electrically connected to control buttons.

[0073] In some embodiments, Figure 3 shows a schematic diagram of the telescopic structure of the connecting rod 8. The lifting mechanism further includes a gear 14. The connecting rod 8 includes a connecting rod body 81 and a rack segment 82 disposed at one end of the connecting rod body 81. The rack segment 82 matches the gear 14. The rack segment 82 can convert the rotational motion of the gear 14 into linear motion to realize the telescopic function of the connecting rod 8. By operating the third button, the gear 14 in the lifting platform 7 is controlled to drive the connecting rod 8 to move back and forth, inserting the connecting rod 8 into the corresponding mounting hole in the frame 4. After operating the third button again to raise the frame 4, the glass door is opened and the frame 4 is taken out.

[0074] In the above embodiments, the telescopic function of the connecting rod 8 is not limited to the gear 14-rack structure mentioned above, but also includes other implementation methods, such as hydraulic or pneumatic methods; the frame 4 is a rigid frame, and is not limited to titanium alloy or aluminum alloy frames; the switch buckle 12 is not limited to the switch buckle mentioned above, but also includes other conventional buckles.

[0075] The apparatus for preparing the protective film in this embodiment allows for faster, more convenient, and more complete removal of the protective film, eliminating the need for the traditional adhesive tape step. Furthermore, the square wafer glass has a higher utilization rate for the produced protective film compared to other shapes, reducing material waste.

[0076] While some embodiments of this invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of this invention and thereby cover the methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. An apparatus for preparing a protective film, characterized in that, The device includes: a chamber for providing a site for preparing a protective film; A wafer glass, serving as a carrier for the preparation of the protective film, is placed within the chamber; a rotating disk, used to rotate the wafer glass, is placed on the rotating disk; a fixing assembly, providing a fixed boundary for the protective film, is placed on the wafer glass; a feed pipe, used to transport the liquid required for making the protective film into the chamber, the feed pipe being connected to the chamber; and a lifting mechanism, used to remove the prepared protective film from the chamber.

2. The apparatus for preparing a protective film according to claim 1, characterized in that, The fixing component includes a frame and a fixing buckle. The fixing buckle is fixedly connected to the wafer glass, and the fixing buckle is detachably connected to the frame.

3. The apparatus for preparing a protective film according to claim 2, characterized in that, The lifting mechanism includes a lifting platform and a connecting rod disposed within the lifting platform. The frame has mounting holes. When the lifting platform is in operation, the connecting rod extends from the lifting platform and passes through the mounting holes.

4. The apparatus for preparing a protective film according to claim 3, characterized in that, The device also includes a heating element for heating the chamber, the heating element comprising a heating wire.

5. The apparatus for preparing a protective film according to claim 4, characterized in that, The device also includes control buttons for controlling the operation of the device. The control buttons include a first button, a second button, and a third button. The first button is electrically connected to the rotating disk, the second button is electrically connected to the heating component, and the third button is electrically connected to the lifting platform.

6. The apparatus for preparing a protective film according to claim 1, characterized in that, The chamber includes a chamber body with an internal cavity, a cover plate on top of the chamber body, a platform inside the cavity, and a switch buckle on the outer wall of the chamber body. The platform is located at the bottom of the rotating disk, and the rotating disk is rotatably connected to the platform. The switch buckle is located on at least one side of the outer wall of the chamber body so that when the switch buckle is opened, the corresponding chamber body opens.

7. The apparatus for preparing a protective film according to claim 6, characterized in that, The chamber body is a glass chamber body.

8. The apparatus for preparing a protective film according to claim 5, characterized in that, The device also includes a base platform, the control buttons are located on the base platform, and the chamber is placed on the base platform.

9. The apparatus for preparing a protective film according to claim 1, characterized in that, The feed pipe is equipped with a valve.

10. The apparatus for preparing a protective film according to claim 1, characterized in that, The wafer glass is a square wafer glass.

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