Uniformly-coated semiconductor metal surface electroplating automation equipment

Abstract

The utility model discloses uniform coating semiconductor metal surface electroplating automation equipment which comprises a device body, an electroplating pool and a workbench are arranged in the device body, first electric sliding rails are installed on the outer wall of the workbench and the outer wall of the electroplating pool, a U-shaped frame is arranged in the first electric sliding rails in a sliding mode, a second electric sliding rail is arranged in the U-shaped frame, and the second electric sliding rail is connected with the workbench. A sliding frame is slidably arranged in the second electric sliding rail, an air cylinder is installed in the sliding frame, an electric clamping jaw is connected to the lower portion of the air cylinder, a draining pool is arranged above the workbench, a drying box is arranged on the side edge of the draining pool, a draining plate is installed in the draining pool, a fan is installed on the drying box, and one end of the drying box is connected with an air outlet pipe; and one end of the air outlet pipe is connected with an air outlet head, so that an electroplated element can be dried and fed, a user can conveniently dry the element, the practicability and the convenience of the device are improved, the flexibility of the device is improved, and the uniformity and the quality of element coating are ensured.

Description

An automated equipment for uniformly depositing semiconductor metal surfaces Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and specifically relates to an automated equipment for uniformly depositing electroplating on semiconductor metal surfaces. Background Technology

[0002] Electroplating equipment is used to perform necessary surface finishing processes on parts, giving them a smooth and clean surface, which is a crucial step in obtaining a high-quality plating layer. Electroplating is a major process in the entire production process. Depending on the requirements of the parts, one or more single-metal or alloy electroplating processes are selected to perform electroplating or immersion plating on the parts. The purpose of immersion is to achieve corrosion resistance, wear resistance, and aesthetic appeal for the parts.

[0003] After the existing semiconductor metal is coated, it is inconvenient to dry it. It is usually directly air-dried, which is inefficient, affects the quality of the finished product, and affects the progress of subsequent processing. At the same time, it is inconvenient to collect and treat the electroplating solution, resulting in waste of the electroplating solution and increased cost. Therefore, we need to upgrade and transform the existing technology. Summary of the Invention

[0004] The purpose of this invention is to provide an automated equipment for electroplating semiconductor metal surfaces with uniform coating, so as to solve the problems mentioned in the background art.

[0005] To solve the above problems, the following technical solutions are provided:

[0006] Design an automated electroplating device for uniformly deposited semiconductor metal surfaces, comprising a device body containing an electroplating tank and a worktable. An electric slide rail is mounted on the outer wall of the worktable and the electroplating tank. A U-shaped frame slides within the electric slide rail, and a second electric slide rail is opened within the U-shaped frame. A sliding frame slides within the second electric slide rail, and a cylinder is installed within the sliding frame. An electric gripper is connected below the cylinder. A drain tank is located above the worktable, and a drying box is located on the side of the drain tank, with a drain plate installed inside the drain tank. A fan is mounted on the drying box, and one end of the drying box is connected to an air outlet pipe, with the other end of the air outlet pipe connected to an air outlet head.

[0007] Furthermore, one end of the electroplating tank is connected to a drain pipe, and two sets of drain pipes are provided, with valves installed on both sets of drain pipes.

[0008] Furthermore, an L-shaped buckle is fixedly connected above the drain plate, and the L-shaped buckle is movably engaged with the drain pool.

[0009] Furthermore, the workbench is provided with a placement slot, and a water collection tank is slidably disposed in the placement slot, the water collection tank being located below the drain pool.

[0010] Furthermore, the water collection tank is provided with finger grooves, which are long rectangular openings.

[0011] Furthermore, a support frame is provided below the drying oven, and one end of the support frame is welded and fixed to the workbench.

[0012] Furthermore, a retaining ring is fixedly connected above the support frame, and an air outlet pipe is movably engaged within the retaining ring. The air outlet pipe is made of an elastic and stretchable material.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model, by setting up an electric slide rail one, a U-shaped frame, an electric slide rail two, a sliding frame, a cylinder, an electric gripper, a drying box, a fan, an air outlet pipe, an air outlet head, and a retaining ring, can dry and load components that have been electroplated, making it convenient for users to dry the components, increasing the practicality and convenience of the device, improving the flexibility of the device, and ensuring the uniformity and quality of the component coating.

[0015] 2. This utility model, by setting up a drain pool, drain board, L-shaped buckle, placement groove, water collection tank and finger groove, can centrally collect and treat the waste liquid generated by electroplating, reduce pollution diffusion, save investment expenses, and facilitate the recycling of the collected electroplating liquid.

[0016] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications, and equivalents. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 is a three-dimensional view of the overall structure of an automated semiconductor metal surface electroplating equipment with uniform coating according to the present invention;

[0019] Figure 2 is a perspective view of the feeding structure of an automated semiconductor metal surface electroplating equipment for uniform film deposition according to the present invention.

[0020] Figure 3 is a perspective view of the drying and collection structures of an automated semiconductor metal surface electroplating device with uniform coating according to the present invention.

[0021] Figure 4 is an exploded view of the collection structure of an automated semiconductor metal surface electroplating device with uniform coating according to the present invention.

[0022] Figure 5 is an exploded view of the drying structure of an automated semiconductor metal surface electroplating equipment with uniform coating according to the present invention.

[0023] In the diagram: 1. Device body; 2. Electroplating tank; 3. Drain pipe; 4. Valve; 5. Workbench; 6. Electric slide rail one; 7. U-shaped frame; 8. Electric slide rail two; 9. Sliding frame; 10. Cylinder; 11. Electric gripper; 12. Draining tank; 13. Draining board; 14. L-shaped buckle; 15. Placement slot; 16. Water collection tank; 17. Finger groove; 18. Support frame; 19. Drying oven; 20. Fan; 21. Air outlet pipe; 22. Air outlet head; 23. Snap ring. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] As shown in Figures 1-5, this embodiment provides an automated electroplating equipment for uniformly depositing semiconductor metal surfaces, including a device body 1. The device body 1 contains an electroplating tank 2 and a worktable 5. An electric slide rail 6 is installed on the outer wall of the worktable 5 and the electroplating tank 2. A U-shaped frame 7 is slidably arranged in the electric slide rail 6. An electric slide rail 8 is opened in the U-shaped frame 7. A sliding frame 9 is slidably arranged in the electric slide rail 8. A cylinder 10 is installed in the sliding frame 9. An electric gripper 11 is connected below the cylinder 10. A drain tank 12 is provided above the worktable 5. A drying box 19 is provided on the side of the drain tank 12, and a drain plate 13 is installed in the drain tank 12. A fan 20 is installed on the drying box 19, and one end of the drying box 19 is connected to an air outlet pipe 21. One end of the air outlet pipe 21 is connected to an air outlet head 22.

[0026] Preferably, one end of the electroplating tank 2 is connected to a drain pipe 3, and two sets of drain pipes 3 are provided. Valves 4 are installed on the two sets of drain pipes 3. By providing drain pipes 3, it is convenient to discharge the electroplating water in the electroplating tank 2. By providing valves 4, it is convenient for users to control and use the drain pipes 3, which increases the convenience of the device.

[0027] Preferably, an L-shaped clip 14 is fixedly connected to the top of the drain plate 13. The L-shaped clip 14 is movably engaged with the drain pool 12. By setting the L-shaped clip 14, the drain plate 13 can be installed and fixed, ensuring the safety and stability of the drain plate 13 during use and facilitating the user to disassemble and replace the drain plate 13 later. A placement groove 15 is provided in the workbench 5, and a water collection tank 16 is slidably installed in the placement groove 15. The water collection tank 16 is located below the drain pool 12. By setting the water collection tank 16, it is convenient to collect the water dripping from the drain pool 12, preventing electroplating liquid from dripping onto the workbench 5 and affecting the subsequent use of the device. A finger groove 17 is provided in the water collection tank 16. The finger groove 17 is a long rectangular opening. By setting the finger groove 17, it is convenient for the user to pull out and put in the water collection tank 16, increasing the convenience and flexibility of the device.

[0028] Preferably, a support frame 18 is provided below the drying oven 19. One end of the support frame 18 is welded and fixed to the workbench 5. By providing the support frame 18, the stability of the device is increased, ensuring the safety of the drying oven 19 during use. A retaining ring 23 is fixedly connected above the support frame 18. An air outlet pipe 21 is movably engaged in the retaining ring 23. The air outlet pipe 21 is made of an elastic and stretchable material. By providing the retaining ring 23, it is convenient to limit and fix the air outlet pipe 21, ensuring the safety of the air outlet pipe 21 during use.

[0029] The working principle and process of this utility model are as follows: During use, the user places the component to be electroplated in the electroplating tank 2 for electroplating. After the plating is completed, the control cylinder 10 is pushed downwards, causing the electric gripper 11 to move downwards. Once the component is in the appropriate position, the control cylinder 10 clamps the electric gripper 11. After successful clamping, the control cylinder 10 resets the electric gripper 11. Then, the control electric slide rail 6 moves the U-shaped frame 7. As the U-shaped frame 7 moves, it moves the sliding frame 9, cylinder 10, electric gripper 11, and component above the drain tank 12. Once in the appropriate position, the control cylinder 11 releases the component, placing it on the drain plate 13. This process is repeated until the electroplated component is placed on the drain plate 13. The remaining electroplating solution then flows through the openings in the drain plate 13 into the drain tank 12. The electroplating solution enters the water collection tank 16 through the opening for centralized collection. Then, the drying chamber 19 and the fan 20 are controlled to operate. The user removes the air outlet pipe 21 from the retaining ring 23. After removal, the user aligns the air outlet 22 with the component, and air is discharged from the air outlet pipe 21 and the air outlet 22 onto the component until the component is completely dried. Then, the user pulls the water collection tank 16 out of the placement tank 15 through the finger groove 17. After pulling it out, the collected electroplating solution can be poured back into the electroplating tank 2 for subsequent use. This device can dry and load components that have not yet been electroplated, making it convenient for users to dry the components. This increases the practicality and convenience of the device, improves the flexibility of the device, ensures the uniformity and quality of the component coating, and can also centrally collect and treat the waste liquid generated by electroplating, reducing pollution diffusion, saving investment costs, and facilitating the recycling of the collected electroplating solution.

[0030] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] The present invention has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present invention. Those skilled in the art can make various modifications and variations to the present invention based on its spirit and principles, and these modifications and variations are also within the scope of the present invention.

Claims

1. An automated equipment for uniformly depositing electroplating on semiconductor metal surfaces, characterized in that, The device includes a main body (1), which contains an electroplating tank (2) and a workbench (5). An electric slide rail (6) is installed on the outer wall of the workbench (5) and the electroplating tank (2). A U-shaped frame (7) is slidably provided in the electric slide rail (6). An electric slide rail (8) is opened in the U-shaped frame (7). A sliding frame (9) is slidably provided in the electric slide rail (8). A cylinder (10) is installed in the sliding frame (9). An electric gripper (11) is connected below the cylinder (10). A drain pool (12) is provided above the workbench (5). A drying box (19) is provided on the side of the drain pool (12), and a drain board (13) is installed in the drain pool (12). A fan (20) is installed on the drying box (19), and one end of the drying box (19) is connected to an air outlet pipe (21). One end of the air outlet pipe (21) is connected to an air outlet head (22).

2. The automated equipment for uniformly depositing semiconductor metal surfaces by electroplating according to claim 1, characterized in that, One end of the electroplating tank (2) is connected to a drain pipe (3), and two sets of drain pipes (3) are provided, with valves (4) installed on the two sets of drain pipes (3).

3. The automated equipment for uniformly depositing semiconductor metal surfaces according to claim 1, characterized in that, An L-shaped buckle (14) is fixedly connected above the drain plate (13), and the L-shaped buckle (14) is movably engaged with the drain pool (12).

4. The automated equipment for uniformly depositing semiconductor metal surfaces by electroplating according to claim 1, characterized in that, The workbench (5) has a placement slot (15) and a water collection tank (16) is slidably disposed in the placement slot (15). The water collection tank (16) is located below the drain pool (12).

5. The automated equipment for uniformly depositing semiconductor metal surfaces by electroplating according to claim 4, characterized in that, The water collection tank (16) is provided with a finger groove (17), which is a long rectangular opening.

6. The automated equipment for uniformly depositing semiconductor metal surfaces by electroplating according to claim 1, characterized in that, A support frame (18) is provided below the drying oven (19), and one end of the support frame (18) is welded and fixed to the workbench (5).

7. The automated equipment for uniformly depositing semiconductor metal surfaces according to claim 6, characterized in that, A retaining ring (23) is fixedly connected above the support frame (18), and an air outlet pipe (21) is movably engaged inside the retaining ring (23). The air outlet pipe (21) is made of an elastic and stretchable material.

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