Energy-saving indoor environment regulation and control equipment and Internet of Things system

Abstract

The utility model discloses an energy-saving indoor environment regulation and control device and an internet of things system, which belong to the technical field of environment regulation and control, and comprise a case, and a temperature regulation cavity, an energy dissipation cavity, a first semiconductor chilling plate group, a second semiconductor chilling plate group, a Venturi tube, an air outlet pipeline, an air inlet pipeline, a waste gas exhaust pipeline and a control unit which are arranged in the case. All the devices are installed in the machine box, the functions of temperature adjustment, natural ventilation and convenient installation and maintenance can be integrated, one device can replace an air conditioner, a central heating system and a fresh air system, the device does not need to be installed on glass, and the cost is reduced. The device has the advantages of being low in energy consumption and use cost, convenient to install and maintain, environmentally friendly and capable of saving energy, and solves the technical problems that an existing device cannot have the functions of temperature adjustment and natural ventilation at the same time, energy consumption is high, use cost is high, and installation, maintenance and light shielding are inconvenient.

Description

An energy-saving indoor environment control device and Internet of Things system Technical Field

[0001] This utility model belongs to the field of environmental control technology, specifically relating to an energy-saving indoor environmental control device and an Internet of Things system. Background Technology

[0002] With global warming and increasing air pollution, the human living environment needs further improvement. Currently, the main equipment used for indoor air quality and temperature regulation in buildings includes air conditioning, heating systems, and fresh air systems. People typically need to purchase these devices to achieve good comfort and air quality indoors. However, air conditioning has drawbacks such as high power consumption, loud compressor noise, and environmentally unfriendly refrigerants. Heating systems have drawbacks such as high energy consumption, complex installation, large coal consumption, and environmental pollution. Even when using natural gas, energy consumption is high, and both air conditioning and heating systems require closing doors and windows. Fresh air systems can improve indoor air quality through indoor and outdoor ventilation, but they do not heat or cool the air themselves. Although some fresh air systems now have heat exchange cores, they only recover a portion of the heat or cold; they cannot maintain the indoor temperature through the heat exchange core alone. Therefore, if the fresh air system is continuously running while using air conditioning or heating, the indoor temperature will drop in winter and rise in summer, requiring more energy to maintain the indoor temperature. If the fresh air system is not continuously running, the indoor air quality will gradually deteriorate. At the same time, fresh air systems also have drawbacks such as high noise levels, large installation workload, and the potential to damage building structures.

[0003] As can be seen from the above, when using an air conditioning or heating system alone, although it can effectively regulate the indoor temperature, it cannot meet the requirements for natural ventilation; when using a fresh air system alone, although it can achieve natural ventilation, it cannot meet the requirements for temperature regulation; and when two or three of them are used in combination, there are drawbacks such as high equipment energy consumption and high user operating costs.

[0004] In addition, the inventor applied for a utility model patent in 2023 entitled "A Window-Type Fresh Air Device Based on a Semiconductor Cooler." This device can be directly connected to existing window frames and uses a semiconductor cooler as the cooling and heating element, making it suitable for use in both winter and summer. It integrates the effects of air conditioning and heating and has good practicality. However, after careful analysis, it was found that this device needs to be installed on the window, which has technical problems such as blocking light, inconvenient installation and maintenance, affecting the structural strength of the window, and still not achieving natural ventilation.

[0005] Therefore, it is necessary to develop a device that integrates temperature regulation and natural ventilation and is easy to install and maintain to solve the above-mentioned technical problems. Summary of the Invention

[0006] To overcome the aforementioned technical problems in the prior art, this utility model provides an energy-saving indoor environmental control device and Internet of Things system. This utility model integrates temperature regulation, natural ventilation, and easy installation and maintenance functions into one device, which can replace three devices: air conditioner, heating system, and fresh air system. Moreover, it does not need to be installed on glass. It has the advantages of low energy consumption, low operating cost, easy installation and maintenance, and environmental protection and energy saving. It solves the technical problems of existing devices that cannot simultaneously have temperature regulation and natural ventilation functions, high energy consumption, high operating cost, and are inconvenient to install and maintain and block light.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] An energy-saving indoor environment control device, comprising:

[0009] The chassis has a cold air outlet, an exhaust gas outlet, and a hot air outlet on the front, and an external air duct and an external exhaust gas duct are fixed on the back of the chassis.

[0010] The temperature regulation chamber is fixed on the upper part of the chassis. The temperature regulation chamber includes a cooling chamber and a heating chamber. A cold storage unit is fixed in the cooling chamber, and a heat storage unit is fixed in the heating chamber.

[0011] An energy dissipation chamber is fixed to one side of the temperature regulation chamber, and an energy dissipator is fixed inside the energy dissipation chamber;

[0012] The first semiconductor refrigeration chip assembly is fixed between the cold storage unit and the energy dissipator;

[0013] The second semiconductor cooling chip assembly is fixed between the heat storage unit and the energy dissipator;

[0014] A venturi tube is fixed above the energy dissipation cavity, and the upper middle part of the energy dissipation cavity is connected to the narrowest part of the middle of the venturi tube.

[0015] The air outlet ducts are connected to the upper end of the cooling chamber, the upper end of the heating chamber, the cold air outlet, and the hot air outlet, respectively.

[0016] The air inlet duct includes three branch ducts, each connected to an external air duct. The first branch duct is connected to the air inlet of the Venturi tube via a silent fan. The second branch duct is connected to the lower end of the energy dissipation chamber. The third branch duct is connected to the lower end of the cooling chamber and the lower end of the heating chamber via Venturi valves, respectively.

[0017] The exhaust gas discharge pipes are connected between the exhaust gas outlet and the lower end of the energy dissipation chamber, and between the venturi tube outlet and the external exhaust gas pipe.

[0018] The control unit is fixed at the bottom of the chassis and is connected to the first semiconductor refrigeration chip group, the second semiconductor refrigeration chip group, and the silent fan, respectively.

[0019] The lower part of the chassis is equipped with a water storage tank, and a submersible pump is installed inside the water storage tank. A spray pipe that extends into the refrigeration chamber and faces the cold storage unit is connected to the submersible pump. An electromagnetic water valve is installed on the spray pipe. A water collection pipe that communicates with the bottom of the refrigeration chamber is fixed on the upper part of the water storage tank. A one-way water valve is installed on the water collection pipe.

[0020] The cold storage device includes a cold-conducting plate and several cold-conducting fins integrally formed on the cold-conducting plate. Both the cold-conducting plate and the cold-conducting fins are arranged longitudinally. The cold end and hot end of the first semiconductor refrigeration chip group are respectively fixed on the cold-conducting plate and the energy dissipator. The heat storage device includes a heat-conducting plate with several heat-conducting fins fixed on it. Each heat-conducting fin is made of aluminum material that is fixedly wrapped with phase change material. Both the heat-conducting plate and the heat-conducting fins are arranged longitudinally. The hot end and cold end of the second semiconductor refrigeration chip group are respectively fixed on the heat-conducting plate and the energy dissipator.

[0021] The number of the cooling chamber, the cold storage unit, and the first semiconductor refrigeration chip group are all two, and the cold storage units in the two cooling chambers work in turn; the number of the heating chamber, the heat storage unit, and the second semiconductor refrigeration chip group are all two, and the heat storage units in the two heating chambers work in turn.

[0022] Both the first and second semiconductor refrigeration chip groups include 3-4 semiconductor refrigeration chips connected in parallel.

[0023] The temperature regulating cavity and the energy dissipation cavity have a common sidewall with several through holes. The first semiconductor cooling chip group is fixed between the cold storage unit and the energy dissipator through the through holes, and the second semiconductor cooling chip group is fixed between the heat storage unit and the energy dissipator through the through holes.

[0024] Temperature and humidity sensors are installed in both the cooling and heating chambers, and a wind speed sensor is installed in the energy dissipation chamber. The temperature and humidity sensors and the wind speed sensor are all connected to the control unit.

[0025] The air inlet duct also includes a heat exchange core fixed at the bottom of the chassis. The second branch duct and the third branch duct share one flow channel of the heat exchange core. The exhaust gas outlet duct between the exhaust gas outlet and the energy dissipation chamber is fixed at both ends of the other flow channel of the heat exchange core.

[0026] The silent fan is fixed inside the adapter box, and the inside of the adapter box is connected to the first branch pipeline.

[0027] The air outlet duct includes an air outlet pipe, a forced convection fan, a three-way valve, a branch pipe, and a first miniature electromagnetic valve. The air outlet pipe is connected to the cooling chamber, the heating chamber, and the three-way valve. The first miniature electromagnetic valve is fixed between the air outlet pipe and the cooling chamber and between the air outlet pipe and the heating chamber. The forced convection fan is fixed in a transition chamber, which is connected to the three-way valve and the air outlet pipe. One end of the three-way valve is connected to the cold air outlet, and the other end is connected to the hot air outlet through the branch pipe. The air inlet duct also includes an air inlet branch pipe and a second miniature electromagnetic valve. The air inlet branch pipe is fixed between the venturi valve and the temperature regulating chamber. The air inlet branch pipe is connected to the cooling chamber, the heating chamber, and the venturi valve respectively. The second miniature electromagnetic valve is fixed between the air inlet branch pipe and the cooling chamber and between the air inlet branch pipe and the heating chamber respectively. The cold air outlet, the exhaust gas outlet, and the hot air outlet are all louvered structures. The chassis is fixed with a third miniature electromagnetic valve for opening and closing the cold air outlet, the exhaust gas outlet, and the hot air outlet respectively. The first miniature electromagnetic valve, the second miniature electromagnetic valve, and the third miniature electromagnetic valve are all connected to the control unit.

[0028] The chassis houses a humidity control assembly, which includes a humidity control box, a heating wire, a first humidity sensor, a second humidity sensor, a first humidification / dehumidification layer, and a second humidification / dehumidification layer. The humidity control box is fixed to the air outlet duct. Both the first and second humidification / dehumidification layers are fixed inside the humidity control box and are used to regulate air humidity. The first humidification / dehumidification layer is made of biomimetic spider silk micro-nano fibers in a mesh structure. The second humidification / dehumidification layer is made of a precision humidity control material based on a metal-organic framework in a mesh structure. The first and second humidity sensors are used to detect the humidity of the first and second humidification / dehumidification layers, respectively. The heating wire is fixed inside the second humidification / dehumidification layer. The upper part of the humidity control box has a water spray pipe facing the first humidification / dehumidification layer, and the bottom has a return water pipe. The heating wire, the first humidity sensor, and the second humidity sensor are all connected to the control unit.

[0029] The indoor environment control equipment also includes an air quality adjustment component, which includes an air quality adjustment box, a micro differential pressure sensor, a primary air filter layer, and a secondary composite air filter layer. The primary air filter layer is fixed inside the external air duct, the air quality adjustment box is fixed on the air outlet duct, and the secondary composite air filter layer is fixed inside the air quality adjustment box. The micro differential pressure sensor is installed on the frame of the primary air filter layer and the frame of the secondary composite air filter layer, respectively. The micro differential pressure sensor is connected to the control unit and is used to monitor whether the primary air filter layer and the secondary composite air filter layer are ineffective.

[0030] The external duct is equipped with a wind speed sensor for detecting external wind speed, and the wind speed sensor is connected to the control unit.

[0031] An Internet of Things (IoT) system includes a main control unit, indoor sensors, and the aforementioned indoor environment control equipment. The main control unit is wirelessly connected to the control units in the indoor sensors and the indoor environment control equipment, respectively.

[0032] The advantages of using this utility model are:

[0033] 1. The indoor environmental control device provided by this utility model can achieve air cooling by combining a first semiconductor cooling chip group with a cold storage unit, and can achieve air heating by combining a second semiconductor cooling chip group with a heat storage unit. The combination of these two components enables temperature regulation. Natural ventilation between indoors and outdoors is achieved through the combination of an exhaust outlet, an energy dissipation chamber, a Venturi tube, and an exhaust pipe. Furthermore, the Venturi tube generates the Venturi effect. When the outside wind speed is high, on the one hand, the Venturi effect allows for automatic exhaust of indoor exhaust air without turning on a silent fan; on the other hand, air in the second branch pipe automatically enters the energy dissipation chamber under the Venturi effect, effectively saving energy consumption and improving environmental friendliness. Additionally, it allows outside air to continuously enter the cooling or heating chamber automatically. Moreover, the main body of this utility model is a box-like structure, which can be installed using conventional wall-mounting or placement against a wall, making installation and maintenance simpler and more convenient.

[0034] Furthermore, the semiconductor cooling chip assembly used in this invention operates without noise, and the designed Venturi tube replaces the motor and fan of the fresh air unit, which can make full use of natural wind power to drive the intake and exhaust of air. The silent fan inside the machine is only activated when there is no wind or when forced indoor convection is required. Therefore, the noise and energy consumption of the equipment are very low.

[0035] In summary, this invention integrates temperature regulation, natural ventilation, and easy installation and maintenance into one system, effectively combining three conventional devices into one. It eliminates the need for piping, ceiling ductwork, and structural damage, offering advantages such as low energy consumption, low operating costs, ease of installation and maintenance, and environmental friendliness. Furthermore, this invention preheats or cools outdoor air within the system to create fresh air before introducing it into the room. This fresh air then exchanges heat with the indoor air, overcoming the drawbacks of traditional air conditioning and heating systems, which require closed doors and windows, leading to a gradual deterioration of indoor air quality. Additionally, using a fresh air system results in either a rise (in summer) or a drop (in winter) in indoor air temperature, necessitating greater energy consumption to maintain the indoor temperature.

[0036] 2. This utility model uses semiconductor refrigeration chips in conjunction with a specific structure of cold storage and heat storage to achieve air cooling and heating, offering advantages such as fast cooling and heating speed, good effect, and low energy consumption. Furthermore, during the cooling process, water mist is sprayed onto the cold storage through a spray pipe, allowing the water mist to freeze on the cold storage and form a unique phase change material. This unique refrigeration structure, constructed using a cold storage and a self-made ice layer, fully utilizes the large latent heat of ice and the rapid ice-making characteristics of the semiconductor refrigeration chips. It enables the construction of the cold storage in a shorter time, increases the time for the cold storage to release its cooling capacity, saves electricity, achieves better cooling effect, and reduces equipment manufacturing costs. The water from the melted ice can then be recycled into a water tank, further contributing to energy and water conservation.

[0037] 3. When regulating indoor temperature, this utility model utilizes a cold storage unit and a heat storage unit within a small, insulated space to exchange heat with outdoor air, thereby cooling or heating the outdoor air. The cooled or heated air is then introduced into the room to exchange heat with the indoor air, indirectly cooling or heating the indoor air and thus regulating the indoor air temperature. This overcomes the drawbacks of air conditioning, such as the frequent operation of the compressor, high energy consumption, and release of environmentally harmful refrigerants, as well as the disadvantages of heating systems, such as the consumption of natural gas and electricity (exhaust fans) by gas-fired boilers and the consumption of large amounts of coal or natural gas by centralized heating systems.

[0038] Furthermore, the heat storage device of this utility model adopts a structure in which aluminum material is used to wrap the phase change material. On the one hand, it prevents the phase change material from leaking. On the other hand, it takes advantage of the high thermal conductivity of aluminum to allow the heat generated at the hot end of the second semiconductor refrigeration chip to be transferred to the phase change material for heating. This reduces the working time of the semiconductor refrigeration chip and reduces energy consumption, thereby minimizing energy consumption and achieving the purpose of energy saving and reducing environmental damage.

[0039] 4. When this utility model is in use, the indoor temperature regulation mainly relies on the release of cold energy by the cold storage unit or the release of heat energy by the heat storage unit. The semiconductor refrigeration chip only cools or heats the cold storage unit or the heat storage unit. It does not work normally. It only assists in cooling or heating when the equipment starts running or when the indoor temperature drops or rises rapidly and the cold storage unit or the heat storage unit cannot fully meet the indoor temperature regulation requirements. Moreover, the equipment can also perform cooling or heating during off-peak electricity periods as much as possible.

[0040] 5. This utility model enables indoor air and outdoor air to exchange heat on the heat exchange core, recovering a portion of the energy, thereby reducing the load on air heating or cooling and achieving the purpose of energy saving.

[0041] 6. This utility model facilitates the formation of phase change material in the cold storage device during refrigeration by using a water storage tank, and the water after the ice in the refrigeration chamber melts can be returned to the water storage tank for repeated use, saving water resources and reducing user operating costs.

[0042] 7. This utility model, through the Venturi valve designed on the third branch pipeline, can automatically adjust the wind speed according to the outdoor wind speed, without requiring energy, thereby ensuring the stability and comfort of the wind speed entering the room.

[0043] 8. This utility model can temporarily increase the air velocity and flow rate entering the room by using a forced convection fan. However, since the forced convection fan is located at the rear end of the cooling and heating chambers, it will not affect the air velocity entering the cooling or heating chambers, thus ensuring that the outdoor air can fully exchange energy with the cold storage or heat storage unit.

[0044] 9. This utility model is designed with two cooling chambers and two heating chambers. The cold storage units in the two cooling chambers work alternately, and the heat storage units in the two heating chambers also work alternately, with backup in between. Specifically, ice with a phase change temperature of zero degrees Celsius is used as the phase change material for refrigeration. In summer, hot outdoor air is cooled by the heat exchange core inside the casing and then exchanges heat with the ice layer on the cold storage unit. The airflow rate entering the cooling chamber is controlled by a Venturi valve, allowing the air to fully exchange heat with the ice layer on the cold storage unit before entering the room and exchanging heat with the indoor air, thereby lowering the indoor temperature (the user can preset the temperature, use the cold layer on the cold storage unit plus a semiconductor cooling chip to assist in refrigeration, and increase the airflow speed and volume into the room to quickly lower the indoor temperature to the set temperature). As the latent heat of the cold storage unit is gradually depleted, the temperature of the phase change material begins to rise gradually, and the indoor air temperature also gradually rises. At this time, the control unit can automatically switch to another standby cold storage unit to work, so that the indoor room temperature gradually drops. This cycle repeats, and the indoor room temperature can be dynamically controlled within a certain range (such as between 26°C and 30°C). This allows the rise and fall of the indoor room temperature to show a slow, step-like dynamic change, which is more conducive to improving human comfort and health.

[0045] Similarly, in winter, the outdoor cold air first passes through the heat exchange core and its temperature rises. Then, it exchanges heat with the heat storage device before entering the room and exchanging heat with the indoor air. The indoor air temperature can reach the preset temperature (the user can set the temperature in advance, use the heat storage device with semiconductor cooling chips to assist in heating, and increase the air speed and volume entering the room to quickly lower the indoor temperature to the set temperature). When the heat storage device gradually releases all the heat, the temperature of the phase change material gradually decreases, and the indoor air temperature also gradually decreases. At this time, the control unit can automatically switch to another backup heat storage device to work, and the indoor temperature gradually rises. This cycle repeats, and the indoor room temperature can be dynamically controlled within a certain range (such as between 17°C and 22°C). This allows the decrease and increase of the indoor room temperature to present a slow, step-like dynamic change.

[0046] In summary, this invention employs two cooling chambers and two heating chambers working together to control the indoor temperature within a suitable range, regardless of whether it is winter or summer. This makes it more suitable for special groups (such as people with related diseases).

[0047] 10. This utility model, through its humidity regulating component, can automatically regulate the humidity of the air entering the room, and through its air quality regulating component, can automatically improve the quality of the air entering the room. Combined with the temperature regulating function, these two components integrate temperature and humidity regulation, air quality control, natural ventilation, and ease of installation and maintenance. This allows for the creation of a comfortable indoor environment with suitable temperature, humidity, and better air quality. Thus, it not only creates a comfortable dynamic environment for people indoors but also trains the body's own temperature and humidity regulation capabilities, preventing various diseases, ensuring human health, and simultaneously achieving energy conservation. Attached Figure Description

[0048] Figure 1 is a cross-sectional view (a) of this utility model;

[0049] Figure 2 is a top sectional view of this utility model;

[0050] Figure 3 is a cross-sectional view (II) of this utility model;

[0051] Figure 4 is a front view of this utility model;

[0052] Figure 5 is a structural diagram of the air duct behind the panel of this utility model;

[0053] Figure 6 is a circuit principle system block diagram of this utility model;

[0054] Figure 7 is a schematic diagram of the Internet of Things system of this utility model.

[0055] The diagram is labeled as follows: 1. Chassis; 2. Cold air outlet; 3. Exhaust gas outlet; 4. Hot air outlet; 5. External air duct; 6. External exhaust gas pipe; 7. Temperature control chamber; 8. Cooling chamber; 9. Heating chamber; 10. Cold storage unit; 11. Heat storage unit; 12. Energy dissipation chamber; 13. Energy dissipator; 14. First semiconductor refrigeration chip assembly; 15. Second semiconductor refrigeration chip assembly; 16. Venturi tube; 17. First branch pipe; 18. Second branch pipe; 19. Third branch pipe; 20. Silent fan; 21. Venturi valve; 22. Exhaust gas discharge pipe; 23. Control unit; 24. Heat exchange core; 25. Adapter box; 26. 27. Water storage tank; 28. Spray pipe; 29. ​​Water spray pipe; 30. Water collection pipe; 31. Air outlet pipe; 32. Forced convection fan; 33. Three-way valve; 34. Diverter pipe; 35. First miniature electromagnetic valve; 36. Adapter chamber; 37. Air inlet branch pipe; 38. Second miniature electromagnetic valve; 39. Third miniature electromagnetic valve; 40. Humidity control box; 41. First humidification and dehumidification layer; 42. Second humidification and dehumidification layer; 43. Air quality control box; 44. Primary air filter layer; 45. Secondary composite air filter layer; 46. One-way valve; 47. Rodent-proof and insect-proof steel mesh; 48. One-way water valve; 49. Metal support frame; 40. Return water pipe. Detailed Implementation

[0056] The present invention will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0057] Example 1

[0058] As shown in Figures 1-5, this embodiment provides an energy-saving indoor environment control device, which includes:

[0059] The chassis 1 can be made of lightweight metal materials such as stainless steel or aluminum, and its shape can be rectangular. A metal support frame 48 is fixed inside the chassis 1 to support and secure the equipment inside. Two relatively small sides of the chassis 1 serve as the front and back of the equipment, respectively. The front of the chassis 1 has a cold air outlet 2, an exhaust gas outlet 3, and a hot air outlet 4, which can be located at the upper, middle, and lower parts of the front of the chassis 1, respectively. The back of the chassis 1 has a detachable external air duct 5 and an external exhaust gas pipe 6. Both the external air duct 5 and the external exhaust gas pipe 6 are equipped with rodent-proof and insect-proof steel mesh 46 to prevent rodents and insects from entering the equipment. The external exhaust gas pipe 6 also has a one-way valve 45, ensuring that indoor exhaust gas can only be discharged through the external exhaust gas pipe 6, while fresh outside air cannot enter through it.

[0060] The temperature regulating chamber 7 is fixed to the upper part of the chassis 1 by a metal support frame 48. The temperature regulating chamber 7 includes a cooling chamber 8 and a heating chamber 9. Both the cooling chamber 8 and the heating chamber 9 have enclosed spaces. A cold storage unit 10 is fixed in the cooling chamber 8, and a heat storage unit 11 is fixed in the heating chamber 9. Preferably, there are two cooling chambers 8, two cold storage units 10, two heating chambers 9, and two heat storage units 11. The cooling chambers 8 and 9 are preferably formed by the temperature regulating chamber 7, but they can also be formed by combining multiple independent chambers. The cooling chambers 8 and 9 are the same size and height, and are arranged in a straight line. A crossbar is fixed on the metal support frame 48, passing through the cooling chambers 8 and 9. The two cold storage units 10 are fixed in the two cooling chambers 8 by the crossbar, and the two heat storage units 11 are fixed in the two heating chambers 9 by the crossbar. The connection between the crossbar and the cooling chamber 8 and the connection between the crossbar and the heating chamber 9 are sealed. Both the lower ends of the cooling chamber 8 and the heating chamber 9 are equipped with air inlets, and the upper ends of both are equipped with air outlets. Outside air can enter the cooling chamber 8 or heating chamber 9 from the bottom, be cooled by the cold storage unit 10 or heated by the heat storage unit 11, and then be discharged from the upper air outlets. When the indoor temperature is high, the cold storage units 10 in the two cooling chambers 8 operate alternately; when the indoor temperature is low, the heat storage units 11 in the two heating chambers 9 operate alternately. In addition, the temperature regulating chamber 7 has a thermal insulation layer on its wall, providing insulation for the cooling chamber 8 or heating chamber 9, enabling the equipment to achieve faster and more efficient cooling or heating, and reducing energy loss.

[0061] The energy dissipation chamber 12 is fixed to one side of the temperature regulation chamber 7 by a metal support frame 48. The energy dissipation chamber 12 can be rectangular in shape, and its size and height are the same as those of the temperature regulation chamber 7. Its chamber wall also has a heat insulation layer. The energy dissipation chamber 12 is adjacent to the temperature regulation chamber 7, and the energy dissipation chamber 12 and the temperature regulation chamber 7 share a common side wall, which has several through holes. An energy emitter 13 is fixed inside the energy dissipation chamber 12. The energy emitter 13 can be a finned heat sink. There are two air inlets at the lower end of the energy dissipation chamber 12 and one air outlet at the middle of the upper end. The functions of the energy dissipation chamber 12 are twofold: first, to dissipate heat from the semiconductor cooling chip; and second, to provide a channel for exhaust gas to be discharged outdoors.

[0062] There are two first semiconductor refrigeration chip groups 14. The two first semiconductor refrigeration chip groups 14 are fixed between the cold storage unit 10 and the energy dissipator 13 through through holes. Each first semiconductor refrigeration chip group 14 includes 3-4 semiconductor refrigeration chips connected in parallel. The semiconductor refrigeration chips are evenly arranged. The cold end of each semiconductor refrigeration chip is fixed on the cold storage unit 10 and the hot end is fixed on the energy dissipator 13. It is used to cool the air passing through the refrigeration chamber 8 through the cold storage unit 10.

[0063] There are two second semiconductor refrigeration chip groups 15. The two second semiconductor refrigeration chip groups 15 are fixed between the heat storage unit 11 and the energy dissipator 13 through through holes. Each second semiconductor refrigeration chip group 15 includes 3-4 semiconductor refrigeration chips connected in parallel. The semiconductor refrigeration chips are evenly arranged. The hot end of each semiconductor refrigeration chip is fixed on the heat storage unit 11 and the cold end is fixed on the energy dissipator 13. It is used to heat the air passing through the heating chamber 9 through the heat storage unit 11.

[0064] It should be noted that the energy emitters 13 within the energy dissipation cavity 12 are preferably four separate finned heat sinks, but can also be a single integral finned heat sink. When the energy emitters 13 are four separate finned heat sinks, these four energy emitters 13 correspond to the two cold storage units 10 and the two heat storage units 11, respectively. Accordingly, two first semiconductor cooling chip groups 14 are fixed between the two cold storage units 10 and the two energy emitters 13 through through holes, and two second semiconductor cooling chip groups 15 are fixed between the two heat storage units 11 and the two energy emitters 13 through through holes.

[0065] The venturi tube 16 is horizontally fixed above the energy dissipation chamber 12 by a metal support frame 48, and the narrowest part of the venturi tube 16 is connected to the air outlet connector at the upper middle part of the energy dissipation chamber 12.

[0066] The air outlet duct is connected to the upper end of the cooling chamber 8, the upper end of the heating chamber 9, the cold air outlet 2, and the hot air outlet 4, respectively, so as to allow the cooled or heated air to enter the room through the cold air outlet 2 or the hot air outlet 4.

[0067] The air inlet duct is made of a material with good thermal insulation and air tightness. It includes three branch ducts that are all connected to the external air duct 5. The first branch duct 17 is connected to the air inlet of the Venturi tube 16 through the silent fan 20. The second branch duct 18 is connected to the lower end of the energy dissipation chamber 12 through one of the air inlet connectors. The third branch duct 19 is connected to the lower end of the cooling chamber 8 and the lower end of the heating chamber 9 through the Venturi valve 21 respectively.

[0068] The exhaust pipe 22 is made of a material with good thermal insulation and airtightness. It is connected between the exhaust outlet 3 and the lower end of the energy dissipation chamber 12, and between the air outlet of the venturi tube 16 and the external exhaust pipe 6.

[0069] It should be noted that after entering through external duct 5, the outside air is divided into three paths, among which...

[0070] The first stream of air flows upward through the silent fan 20 and into the Venturi tube 16. Since the middle section and outlet of the Venturi tube 16 are connected to the upper end of the energy dissipation chamber 12 and the exhaust gas discharge pipe 22, respectively, this first stream of air utilizes the Venturi effect within the Venturi tube 16. A low pressure is generated at the outlet joint at the narrowest point in the middle of the Venturi tube 16. This creates a pressure difference between the air pressure in the exhaust gas discharge pipe 22 (connected to the indoor environment) and the air pressure in the external duct 5 (connected to the outdoor environment), and the low pressure at the outlet joint at the narrowest point in the middle of the Venturi tube 16, thus automatically expelling indoor exhaust gas to the outside. Simultaneously, it allows outside air to continuously enter the cooling chamber 8 or the heating chamber 9.

[0071] The second airflow enters the energy dissipation chamber 12 to ensure airflow within the energy dissipation chamber 12 even when the exhaust outlet 3 is closed, thereby ensuring effective heat dissipation or cooling of the semiconductor cooling chip.

[0072] The third air path, depending on the need for cooling or heating, passes through Venturi valve 21 and enters either the cooling chamber 8 or the heating chamber 9 for cooling or heating treatment.

[0073] The control unit 23 includes a microcontroller (ESP32-S), a power module, and a wireless communication module. The microcontroller and the power module are fixed at the bottom of the chassis 1. The wireless communication module is integrated on the microcontroller. The microcontroller is connected to the power module, the wireless communication module, the first semiconductor cooling chip group 14, the second semiconductor cooling chip group 15, and the silent fan 20, respectively. The microcontroller can control the opening and closing of the first semiconductor cooling chip group 14, the second semiconductor cooling chip group 15, and the silent fan 20 through relays.

[0074] In this embodiment, as shown in Figures 1 and 3, the second branch pipe 18 is connected to the third branch pipe 19 through the branch pipe opening. The Venturi valve 21 is located at the rear end of the branch pipe opening. The function of the Venturi valve 21 is to automatically adjust the air flow rate entering the cooling chamber 8 or heating chamber 9 according to the wind speed in the duct without the need for electrical energy, so that the air in the cooling chamber 8 or heating chamber 9 is in a low-speed and stable state. When the air velocity inside the duct increases, the air velocity entering the section of the duct leading to the Venturi valve 21 also increases. Driven by the air pressure, the piston inside the Venturi valve 21 moves towards closing the inner air passage. At the same time, the spring connecting the piston is also compressed, thereby reducing the air velocity flowing out of the Venturi valve 21. When the air velocity inside the duct decreases, the piston inside the Venturi moves towards opening the air passage under the action of the inner spring, allowing more airflow to pass through. This ensures that the air velocity flowing into the cooling chamber 8 or heating chamber 9 is stable and slow, allowing the air to fully exchange heat with the cold storage unit 10 or the heat storage unit 11. At the same time, it also maintains a stable air velocity entering the room, ensuring that the air velocity reaches a flow rate suitable for human comfort.

[0075] In this embodiment, as shown in Figures 2 and 3, the cold storage device 10 includes a cold guiding plate and several cold guiding fins integrally formed on the cold guiding plate. Both the cold guiding plate and the cold guiding fins are arranged longitudinally, and an upward airflow channel is formed between the cold guiding fins. The cold end and the hot end of the first semiconductor refrigeration chip group 14 are respectively fixed on the cold guiding plate and the energy dissipator 13.

[0076] Furthermore, as shown in Figures 2 and 3, a water storage tank 26 is provided at the lower part of the chassis 1. This water storage tank 26 can be installed either outside or inside the chassis 1. A submersible pump is installed inside the water storage tank 26, and a spray pipe 27 extending into the refrigeration chamber 8 and towards the cold storage unit 10 is connected to the submersible pump. An electromagnetic water valve is installed on the spray pipe 27. A water collection pipe 29 communicating with the bottom of the refrigeration chamber 8 is fixed to the upper part of the water storage tank 26, and a one-way water valve 47 is installed on the water collection pipe 29. The control unit 23 can control the opening and closing of the submersible pump and the electromagnetic water valve through a relay, thereby spraying the cold storage unit 10 in any of the refrigeration chambers 8 as needed. When either of the cold storage units 10 is used for cooling, the sprayed water mist can quickly form an ice layer on the cooling fins of the corresponding first semiconductor refrigeration chip group 14. At this time, the corresponding first semiconductor refrigeration chip group 14 stops working, and the ice layer will release cold energy as the phase change material of the cold storage unit 10 to cool the passing air. When the ice layer on the cooling fins of the cold storage unit 10 has completely melted, the control unit 23 can switch to another cold storage unit 10 for cooling (the other cold storage unit 10 has completed ice making in advance). In this way, the two cold storage units 10 work in turn, taking turns to cool the backup, thereby reducing the working time of the first semiconductor refrigeration chip group 14 and saving energy. In addition, the water after the ice melts can be returned to the water storage tank 26 through the one-way water valve 47 for recycling, saving water resources.

[0077] Furthermore, both the cooling chamber 8 and the heating chamber 9 are equipped with temperature and humidity sensors connected to the control unit 23. The temperature and humidity sensors can detect the temperature and humidity in the cooling chamber 8 and the heating chamber 9, respectively.

[0078] In this embodiment, as shown in Figures 2 and 3, the heat storage device 11 includes a heat-conducting plate with several heat-conducting fins fixed on it. Each heat-conducting fin is made of aluminum material that is fixedly wrapped with phase change material. The heat-conducting plate and the heat-conducting fins are arranged longitudinally, and an upward airflow channel is formed between the heat-conducting fins. The hot end and cold end of the second semiconductor cooling chip group 15 are fixed on the heat-conducting plate and the energy dissipator 13, respectively. When any of the heat storage units 11 is used for heating, the control unit 23 can control the corresponding second semiconductor refrigeration chip group 15 to heat up the heat storage unit 11 via a relay. After the phase change material in the heat-conducting fins of the heat storage unit 11 has completely absorbed the latent heat and melted, the corresponding second semiconductor refrigeration chip group 15 stops working, and the phase change material releases heat energy to exchange heat with the passing air. When the latent heat of the heat storage unit 11 has been completely released, the control unit 23 starts to heat up the heat storage unit 11 again, while switching to another heat storage unit 11 to start releasing latent heat (the other heat storage unit 11 has been preheated). The two heat storage units 11 take turns to heat up and back up, and take turns to release heat, thereby reducing the working time of the second semiconductor refrigeration chip group 15 and saving energy.

[0079] Specifically, when the heat storage unit 11 needs to be used for heating in winter, the hot-end heating function of the second semiconductor cooling chip group 15 is first turned on to heat the heat storage unit 11 in the heating chamber 9. After the phase change material on the heat storage unit 11 has completely melted by absorbing latent heat, the operation of the second semiconductor cooling chip group 15 is stopped. Then, cold outdoor air is allowed to enter the heating chamber 9 to exchange heat with the heat storage unit 11. After the air is heated, it enters the room and exchanges heat with the room air, thereby indirectly raising the room temperature to a preset temperature suitable for human comfort, such as 22 degrees Celsius. After the latent heat of the heat storage unit 11 is completely released, the operation of another heat storage unit 11 can be switched.

[0080] It should be noted that when there is only one cooling chamber 8, the first semiconductor cooling chip group 14 can maintain the ice layer through intermittent operation. That is, when there is a large amount of ice on the cooling fins, the first semiconductor cooling chip group 14 stops working, and when there is a small amount of ice on the cooling fins, the first semiconductor cooling chip group 14 starts working. When there is only one heating chamber 9, the second semiconductor cooling chip group 15 can also maintain the heat energy on the heat-conducting fins through intermittent operation.

[0081] In this embodiment, a junction box 25 is fixed to the first branch pipe 17. The interior of the junction box 25 is connected to the first branch pipes 17 at both ends, and the silent fan 20 is fixed inside the junction box 25. When the outside wind speed is high, the wind speed of the outside air entering the first branch pipe 17 is also high. At this time, the Venturi effect can be used to make the air in the energy dissipation cavity 12 flow, and the silent fan 20 does not need to work. Only when the outside wind speed is low will the control unit 23 control the silent fan 20 to work. Specifically, the structure of the silent fan 20 and the adapter box 25 has two functions. One is to provide a high-speed airflow to the Venturi tube 16 when there is no wind or the wind speed is low outdoors, so that the Venturi effect is significant. The other function is to provide a continuous airflow to the cooling chamber 8 or heating chamber 9 and the energy dissipation chamber 12 when there is no wind or the wind speed is low outdoors. This ensures the airflow in the pipeline, so that air energy can continuously enter the cooling chamber 8 or heating chamber 9. It also ensures the basic heat dissipation or cooling requirements of the semiconductor cooling chip, protects the safety and reliability of the components, and saves energy.

[0082] In this embodiment, a wind speed sensor is installed inside the energy dissipation cavity 12. The wind speed sensor is connected to the control unit 23. This wind speed sensor monitors the wind speed inside the energy dissipation cavity 12 in real time. When the wind speed detected inside the energy dissipation cavity 12 is low, the control unit 23 controls the silent fan 20 to be activated, thereby increasing the wind speed inside the energy dissipation cavity 12 through the Venturi effect, ensuring that the semiconductor cooling chip can dissipate heat or cool down in a timely manner. Conversely, when the wind speed detected inside the energy dissipation cavity 12 is high, the silent fan 20 does not operate.

[0083] In this embodiment, as shown in Figures 1 and 3, the air inlet duct also includes a heat exchange core 24 fixed to the bottom of the chassis 1. This heat exchange core 24 is located on the shared duct of the second branch duct 18 and the third branch duct 19, and the second branch duct 18 and the third branch duct 19 share one flow channel of the heat exchange core 24. The exhaust gas outlet duct 22 between the exhaust gas outlet 3 and the energy dissipation chamber 12 is fixed at both ends of the other flow channel of the heat exchange core 24. Two airflows circulate between the core layers of the heat exchange core 24: air entering the room from the outside and exhaust gas exiting the room from the outside. These two airflows have a temperature difference. In winter, cold air from the outside enters the room, and warm air from the room is exhausted; in summer, the air entering from the outside is hot, while the air exiting the room is cool. The incoming and outgoing air do not mix when passing through the heat exchange core 24, but they can exchange heat. Therefore, the main function of the heat exchange core 24 is to recover the heat energy (winter) or cold energy (summer) from the exhaust gas discharged from the room, so that the outdoor air flowing through it is heated in winter and cooled in summer. This reduces the workload of the air when it flows through the cooling chamber 8 or the heating chamber 9, thus saving energy.

[0084] In this embodiment, as shown in Figures 1-4, the air outlet duct includes an air outlet duct 30, a forced convection fan 31, a three-way valve 32, a diverter duct 33, and a first miniature electromagnetic valve 34. The air outlet duct 30 is connected to the cooling chamber 8, the heating chamber 9, and the three-way valve 32. The number of first miniature electromagnetic valves 34 is the sum of the number of cooling chambers 8 and the number of heating chambers 9. Each first miniature electromagnetic valve 34 is fixed between the air outlet duct 30 and the cooling chamber 8 and between the air outlet duct 30 and the heating chamber 9, respectively, to connect the corresponding cooling chamber 8 or the corresponding heating chamber 9 to the air outlet duct 30 when any of the cold storage units 10 or heat storage units 11 is working. The forced convection fan 31 is fixed inside the transition cavity 35, which is connected to the three-way valve 32 and the air outlet duct 30. One end of the three-way valve 32 is connected to the cold air outlet 2, and the other end is connected to the hot air outlet 4 through the vertically arranged diverter duct 33. Since the cold air outlet 2 and the hot air outlet 4 are located at the upper and lower parts of the front of the chassis 1, respectively, cold air can enter the upper part of the indoor space from the upper part of the equipment, and hot air can enter the lower part of the indoor space from the lower part of the equipment. This design allows for better heat exchange between the fresh air and the indoor air.

[0085] In addition, the air inlet duct also includes an air inlet branch pipe 36 and a second miniature electromagnetic valve 37. The air inlet branch pipe 36 is fixed between the venturi valve 21 and the temperature regulating chamber 7. The air inlet branch pipe 36 is connected to the cooling chamber 8, the heating chamber 9 and the venturi valve 21 respectively. The number of second miniature electromagnetic valves 37 is the sum of the number of cooling chambers 8 and the number of heating chambers 9. Each second miniature electromagnetic valve 37 is fixed between the air inlet branch pipe 36 and the cooling chamber 8 and between the air inlet branch pipe 36 and the heating chamber 9 respectively. The cold air outlet 2, the exhaust gas outlet 3 and the hot air outlet 4 are all louvered structures. A third miniature electromagnetic valve 38 for opening and closing the cold air outlet 2, the exhaust gas outlet 3 and the hot air outlet 4 is fixed inside the casing 1. The three-way valve 32, the first miniature electromagnetic valve 34, the second miniature electromagnetic valve 37, and the third miniature electromagnetic valve 38 are all connected to the control unit 23. The control unit 23 can control the three-way valve 32, the first miniature electromagnetic valve 34, the second miniature electromagnetic valve 37, and the third miniature electromagnetic valve 38 to operate via relays, thereby connecting the refrigeration chamber 8 or the heating chamber 9 (when only in operation) to the corresponding air inlet branch pipe 36 and air outlet pipe 30, connecting the three-way valve 32 to the hot air outlet 4 or the cold air outlet 2, and opening or closing the cold air outlet 2, the exhaust gas outlet 3, and the hot air outlet 4.

[0086] It should be noted that the function of the aforementioned forced convection fan 31 is to accelerate the airflow into the room when indoor air pollutants exceed the standard, the equipment activates the indoor forced ventilation mode, or the room needs to be rapidly heated or cooled. This increases the airflow entering the room, accelerates the heat exchange process between the fresh air and the indoor air, and forms convection with the exhaust air, accelerating the exhaust gas discharge from the room. The forced convection fan 31 is designed at the end of the temperature regulating chamber 7, while the venturi valve 21 is designed before the temperature regulating chamber 7. The purpose is to maintain the airflow velocity entering the temperature regulating chamber 7 at a low speed, so that the air can fully exchange heat with the cold storage unit 10 or the heat storage unit 11. The forced convection fan 31 can accelerate the airflow velocity into the room when needed.

[0087] The device described in this embodiment can be installed near an indoor window of a building. By drilling holes in the window glass or wall, the external air duct 5 and external exhaust pipe 6 are fixed inside the holes and connected to the device, allowing it to communicate with the outdoors. Outdoor air filtration and purification, air heating or cooling, and indoor exhaust gas discharge are all completed internally. Installation is simple and maintenance is convenient. Of course, depending on the needs, this device can also be wall-mounted or embedded in the wall during renovation.

[0088] In this embodiment, a wind speed sensor can also be installed at the air inlet of the external air duct 5 as needed to detect the external wind speed, so as to control the start and stop of the silent fan 20 according to the wind speed sensor.

[0089] The device provided in this embodiment mainly consists of a cold storage unit 10 or a heat storage unit 11 in a small space with good thermal insulation. It uses a cooling chamber 8 or a heating chamber 9 to cool or heat the outdoor air. The air then enters the room and exchanges heat with the indoor air, thereby indirectly lowering or raising the indoor temperature. The semiconductor cooling chip group only cools or heats the cold storage unit 10 or the heat storage unit 11, and provides auxiliary cooling or heating of the air when necessary. In this way, energy can be saved.

[0090] The working principle of this embodiment is as follows: Users can select the seasonal mode according to the actual season, as follows:

[0091] Spring Mode: As shown in Figures 2 and 3, neither the first semiconductor cooling chip group 14 nor the second semiconductor cooling chip group 15 is operational. Outdoor air flows through any of the heating chambers 9 and is injected into the room through the hot air outlet 4, with the indoor temperature varying according to the outdoor temperature. Therefore, the control unit 23, based on the user's selection, controls the opening of the first micro electromagnetic valve 34 and the second micro electromagnetic valve 37 corresponding to the heating chamber 9, and controls the opening of the hot air outlet 4 by the third micro electromagnetic valve 38, allowing outdoor air to enter the room. Simultaneously, the control unit 23 controls the third micro electromagnetic valve 38 to open the exhaust outlet 3, allowing indoor exhaust gas to be automatically discharged outdoors.

[0092] Autumn Mode: Similar to Spring Mode, neither the first semiconductor cooling chip group 14 nor the second semiconductor cooling chip group 15 is operational. Outdoor air flows through either cooling chamber 8 and is injected into the room through the cold air outlet 2, causing the indoor temperature to change with the outdoor temperature. Therefore, the control unit 23, based on the user's selection, controls the opening of the first micro electromagnetic valve 34 and the second micro electromagnetic valve 37 corresponding to that cooling chamber 8, and controls the opening of the cold air outlet 2 of the third micro electromagnetic valve 38 to allow outdoor air to enter the room. Simultaneously, the control unit 23 controls the third micro electromagnetic valve 38 to open the exhaust outlet 3, allowing indoor exhaust gas to be automatically discharged to the outside.

[0093] Summer Mode: Cooling is required using the cold storage unit 10. The control unit 23 controls the submersible pump in the water tank 26 and the electromagnetic water valve on the spray pipe 27 to open. The two spray pipes 27 alternately spray water mist onto the cooling fins of the cold storage unit 10. At the same time, the first semiconductor refrigeration chip group 14 is activated to form a uniform ice layer on the cooling fins as a phase change material. The temperature and humidity sensors in the cooling chamber 8 monitor the temperature in real time. When the temperature in the cooling chamber 8 reaches the target (e.g., 5°C) and the cooling capacity of the ice layer meets the design requirements (e.g., 8-hour cold storage capacity; the working time is preset in the control unit 23 after pre-testing, and the specific setting time is determined by the user according to their needs), the first semiconductor refrigeration chip group 14 stops working. Then, the phase change material ice and the cold storage unit 10 begin to release cold energy to cool the hot air passing through the cooling chamber 8. After the ice melts, the system switches to the other cold storage unit 10. The cooled hot air becomes cold air and enters the room through the air outlet duct and cold air outlet 2, thereby lowering and regulating the indoor temperature.

[0094] Winter mode: Heat storage unit 11 is required for heating. First, turn on the hot end heating function of the second semiconductor cooling chip group 15 to heat up the heat storage unit 11 in the heating chamber 9. After the phase change material on the heat storage unit 11 has completely melted by absorbing latent heat, stop the operation of the second semiconductor cooling chip group 15. Then, let the cold outdoor air enter the heating chamber 9 to exchange heat with the heat storage unit 11. After the air is heated, it enters the room and exchanges heat with the room air, thereby indirectly raising the room temperature to a preset temperature suitable for human comfort, such as 22 degrees Celsius. After the latent heat of the heat storage unit 11 has been completely released, switch to the operation of another heat storage unit 11.

[0095] It should be noted that in both summer and winter modes, exhaust outlet 3 can be opened for natural ventilation.

[0096] Example 2

[0097] Based on Example 1, this example further optimizes the device.

[0098] As shown in Figure 2, a humidity control component is installed inside the chassis 1. This component is specifically located between the air outlet duct 30 and the forced convection fan 31. The humidity control component includes a humidity control box 39, a heating wire, a first humidity sensor, a second humidity sensor, a first humidification / dehumidification layer 40, and a second humidification / dehumidification layer 41. The humidity control box 39 is fixed to the air outlet duct, with both ends connected to the duct. The first and second humidification / dehumidification layers 40 and 41 are both fixed inside the humidity control box 39 and are used to regulate air humidity. The humidifying and dehumidifying layer 40 is made of biomimetic spider silk micro-nano fibers in a mesh structure. The second humidifying and dehumidifying layer 41 is made of metal-organic framework-based precision humidity control material (MOFs-PHCM) in a mesh structure. The first humidity sensor and the second humidity sensor are used to detect the humidity of the first humidifying and dehumidifying layer 40 and the second humidifying and dehumidifying layer 41, respectively. The heating wire is fixed inside the second humidifying and dehumidifying layer 41. The humidity regulating box 39 has a water spray pipe 28 at the top facing the first humidifying and dehumidifying layer 40 and a return water pipe 49 at the bottom. To simplify the structure and save costs, the water spray pipe 28 is equipped with a valve and connected to the submersible pump in the water storage tank 26. The return water pipe 49 is connected to the water storage tank 26. The heating wire, the first humidity sensor, and the second humidity sensor are all connected to the control unit 23.

[0099] Specifically, the first humidification and dehumidification layer 40 utilizes the relevant characteristics of biomimetic spider silk: adhesion properties, which mainly manifest as the efficient capture of tiny droplets in the air and the active capture of tiny particulate matter in the air. Its function is to increase the humidity of the air entering the equipment in dry seasons and to remove the humidity of the air entering the equipment in humid seasons. During the dry season, a small amount of water is injected into the first humidification and dehumidification layer 40 through the water storage tank 26 and the submersible pump, allowing tiny droplets to adhere to it like spider silk. When dry outdoor air flows through, it absorbs the moisture, thereby increasing the humidity of the air. In the humid season, the adhesive properties can efficiently capture moisture in the air, thereby reducing the humidity of the air. When the water droplets in the biomimetic spider silk layer accumulate to a certain amount, due to capillary action, the droplets will become larger and larger. Under the action of gravity, the droplets will automatically fall off and flow out through the return water pipe 49. After that, it will start to circulate and absorb moisture in the air again. By controlling the amount of water injected, the humidity of the first humidification and dehumidification layer 40 can be controlled, thereby indirectly controlling the humidity of the air passing through it.

[0100] The second humidification and dehumidification layer 41 uses a novel precision humidity control material based on metal-organic frameworks (MOFs) (PHCM: abbreviation for precision humidity control material), which is ideal for autonomously regulating indoor relative humidity. When the indoor relative humidity exceeds 60%, it can rapidly absorb moisture; when the relative humidity is below 45%, it can release moisture. Unlike traditional desiccants (such as zeolite, silica gel, etc.), MOFs-PHCM can autonomously control the indoor relative humidity within the desired comfortable range at room temperature. It can be completely dried simply by nighttime ventilation or a small amount of heating. Since the regeneration temperature of MOFs-PHCM is approximately 60-70 degrees Celsius, this embodiment also embeds a heating wire into the MOFs-PHCM. The control unit 23 can control the on / off state of the MOSFET field-effect transistor via PWM, thereby controlling the on / off state of the heating wire. When natural dehumidification of the MOFs-PHCM is insufficient and a small amount of electric heating is required to completely remove moisture, the heating wire can be turned on to remove the moisture. The first humidity sensor and the second humidity sensor can monitor the humidity of the first humidification and dehumidification layer 40 and the second humidification and dehumidification layer 41 in real time, and can control the energizing time of the heating wire accordingly, so as to control the amount of water released from the second humidification and dehumidification layer 41, thereby controlling the humidity of the air passing through it.

[0101] In humid seasons, the average outdoor air humidity is greater than 60%. Without water injection in the first humidification and dehumidification layer 40, the humidity will decrease slightly after the air passes through it. After passing through the second humidification and dehumidification layer 41, the humidity will reach the designed range, for example, greater than 45% and less than 60%. By controlling the heating wire's energizing time and using a second humidity sensor for real-time monitoring, the amount of moisture released from the second humidification and dehumidification layer 41 can be controlled, thus maintaining the humidity of the air passing through it within a dynamic range. In dry seasons, the outdoor air humidity is typically between 30% and 40%. By injecting a small amount of water into the first humidification and dehumidification layer 40, the humidity will increase after the air passes through it. If the air humidity is still less than 45% when passing through the second humidification and dehumidification layer 41, it will release moisture according to the characteristics of MOFs-PHCM, allowing the humidity to reach a value greater than 45% after the air passes through it. By controlling the amount of water injected into the first humidifying and dehumidifying layer 40, its humidity can be controlled (monitored in real time by a first humidity sensor on it), thereby controlling the humidity of the air passing through. Simultaneously, by controlling the energizing time of the heating wire and using a second humidity sensor for real-time monitoring, the amount of water released from the second humidifying and dehumidifying layer 41 can be controlled, thus controlling the amount of water retained on it, and indirectly controlling the humidity of the air after it passes through. Therefore, the first and second humidifying and dehumidifying layers 40, used in conjunction with the second humidifying and dehumidifying layer 41, and with their humidity sensors monitoring in real time, can control the indoor humidity within a dynamic range to meet the requirements of human comfort.

[0102] As shown in Figures 2 and 5, the indoor environmental control equipment also includes an air quality adjustment component. This component comprises an air quality adjustment box 42, a micro-differential pressure sensor, a primary air filter layer 43, and a secondary composite air filter layer 44. The primary air filter layer 43 is fixed inside the external duct 5, is removable, washable, and reusable, and its main function is to initially filter dust and fine particles in the air, keeping the duct clean. The air quality adjustment box 42 is fixed on the outlet duct and located between the humidity adjustment component and the forced convection fan 31, with both ends connected to the outlet duct. The secondary composite air filter layer 44 is fixed inside the air quality adjustment box 42 and can be removed and replaced. Its main function is to filter PM1.0, PM2.5, PM10.0, and TVOC in the air. Micro differential pressure sensors are installed on the frame of the primary air filter layer 43 and the frame of the secondary composite air filter layer 44, respectively. Both micro differential pressure sensors are connected to the control unit 23 and are used to monitor whether the primary air filter layer 43 and the secondary composite air filter layer 44 are faulty. Once they are faulty, the control unit 23 will sound an alarm to remind the user to replace them in time.

[0103] In this embodiment, both the primary air filter layer 43 and the secondary composite air filter layer 44 are existing conventional structural components. For example, the primary air filter layer 43 can be made of metal mesh, and the secondary composite air filter layer 44 can be made of HEPA (glass fiber / PP meltblown / PET) + activated carbon (granules / felt) + (optional antibacterial layer) + support layer.

[0104] In actual implementation, the control unit 23 can compare and calculate the humidity data monitored by the first humidity sensor, the second humidity sensor, the temperature and humidity sensor in the temperature regulation cavity 7, and the indoor temperature and humidity sensor to provide a basis for humidity control and ensure that the indoor humidity is always within a range suitable for the human body.

[0105] In this embodiment, the humidity control component adjusts as follows: Under relatively normal air humidity conditions, the device automatically dehumidifies or humidifies through the first humidifying / dehumidifying layer 40 and the second humidifying / dehumidifying layer 41 without consuming energy. However, during very humid seasons, when the indoor humidity sensor detects that the indoor humidity exceeds the preset humidity range, it indicates that natural forces alone cannot completely remove the moisture from the second humidifying / dehumidifying layer 41. In this case, the control unit 23 activates the heating wire integrated in the second humidifying / dehumidifying layer 41 to remove excess moisture and restore its dehumidification function until the second sensor detects that the humidity level meets the threshold, at which point the heating wire is deactivated. During dry seasons, based on data from the indoor humidity sensor, if the indoor humidity exceeds a threshold range, the control unit 23 controls the submersible pump in the water tank 26 to start via a relay and controls the valve on the spray pipe 28 to open, adding a small amount of water to the first humidification and dehumidification layer 40. This allows the dry outdoor air to absorb moisture as it passes through the first humidification and dehumidification layer 40, increasing the air humidity. When the first humidity sensor detects that the data exceeds a preset threshold, the control unit 23 closes the submersible pump and the valve on the spray pipe 28, stopping the injection of water into the first humidification and dehumidification layer 40.

[0106] In this embodiment, the air quality control component operates as follows: indoor air quality is controlled through two methods: first, the primary air filter layer 43, the secondary composite air filter layer 44, and a micro-differential pressure sensor; second, through forced ventilation (exhaust gas discharge) of the equipment. The micro-differential pressure sensor is wired to the ESP32-S microcontroller, which monitors the primary air filter layer 43 and the secondary composite air filter layer 44 in real time. The microcontroller receives or actively reads data from the micro-differential pressure sensor and determines whether the filter layer has failed based on the data. If it has failed, the microcontroller reminds the user to clean or replace the filter layer in a timely manner to ensure indoor air quality.

[0107] Example 3

[0108] As shown in Figure 7, this embodiment provides an Internet of Things system, including a main control unit, indoor sensors, and indoor environment control equipment as described in Embodiment 1 or Embodiment 2. The main control unit is wirelessly connected to the indoor sensors (including temperature, temperature sensor, etc.) and the control unit 23 in the indoor environment control equipment.

[0109] In detail, the implementation of this system depends on the equipment of Embodiment 1 or Embodiment 2. Therefore, this embodiment adopts the same technical means as Embodiment 1 when in use and can produce the same technical effect, which will not be repeated here.

[0110] It should be noted that this utility model involves a large number of sensors, but these sensors are all existing commercially available conventional devices. For example, the temperature and humidity sensor in the humidity control cavity can be a DS18B20, the first humidity sensor can be a DHT11, the second humidity sensor can be a SHT31-DIS-B2.5kS, the wind speed sensor in the energy dissipation cavity 12 can be a JT1401, etc. Various sensors can be installed in the corresponding positions according to the needs and common knowledge of those skilled in the art, and will not be described in detail here.

[0111] The above description is only a specific embodiment of the present utility model. Any feature disclosed in this specification may be replaced by other equivalent or similar features unless otherwise specified. All features or steps in all methods or processes disclosed may be combined in any way except for mutually exclusive features and / or steps.

Claims

1. An energy-saving indoor environment control device, characterized in that... include: The chassis (1) has a cold air outlet (2), an exhaust gas outlet (3) and a hot air outlet (4) on the front side, and an external air duct (5) and an external exhaust gas pipe (6) fixed on the back side; a temperature regulating chamber (7) is fixed on the upper part of the chassis (1), and the temperature regulating chamber (7) includes a cooling chamber (8) and a heating chamber (9), a cold storage unit (10) is fixed in the cooling chamber (8), and a heat storage unit (11) is fixed in the heating chamber (9); and an energy dissipation chamber (12). An energy emitter (13) is fixed inside the energy dissipation cavity (12) and fixed to one side of the temperature regulating cavity (7); a first semiconductor cooling chip assembly (14) is fixed between the cold storage unit (10) and the energy emitter (13); a second semiconductor cooling chip assembly (15) is fixed between the heat storage unit (11) and the energy emitter (13); a venturi tube (16) is fixed above the energy dissipation cavity (12), and the upper middle part of the energy dissipation cavity (12) is connected to the venturi tube (13). 16) is connected to the narrowest part in the middle; the air outlet duct is connected to the upper end of the cooling chamber (8), the upper end of the heating chamber (9), the cold air outlet (2), and the hot air outlet (4), respectively; the air inlet duct includes three branch ducts, each connected to an external air duct (5). The first branch duct (17) is connected to the air inlet of the venturi tube (16) through a silent fan (20). The second branch duct (18) is connected to the lower end of the energy dissipation chamber (12). The third branch duct (19) is connected to the air inlet of the venturi tube (16) through a silent fan (20). The venturi valve (21) is connected to the lower end of the cooling chamber (8) and the lower end of the heating chamber (9) respectively; the exhaust pipe (22) is connected between the exhaust outlet (3) and the lower end of the energy dissipation chamber (12) and between the air outlet of the venturi tube (16) and the external exhaust pipe (6) respectively; the control unit (23) is fixed at the bottom of the chassis (1) and is connected to the first semiconductor refrigeration chip group (14), the second semiconductor refrigeration chip group (15) and the silent fan (20) respectively.

2. The energy-saving indoor environment control device according to claim 1, characterized in that: The lower part of the chassis (1) is provided with a water storage tank (26), and a submersible pump is provided inside the water storage tank (26). A spray pipe (27) that extends into the refrigeration chamber (8) and faces the cold storage unit (10) is connected to the submersible pump. An electromagnetic water valve is provided on the spray pipe (27). A water collection pipe (29) that communicates with the bottom of the refrigeration chamber (8) is fixed on the upper part of the water storage tank (26). A one-way water valve (47) is provided on the water collection pipe (29).

3. The energy-saving indoor environment control device according to claim 1, characterized in that: The cold storage device (10) includes a cold-conducting plate and several cold-conducting fins integrally formed on the cold-conducting plate. Both the cold-conducting plate and the cold-conducting fins are arranged longitudinally. The cold end and the hot end of the first semiconductor refrigeration chip group (14) are respectively fixed on the cold-conducting plate and the energy dissipator (13). The heat storage device (11) includes a heat-conducting plate. Several heat-conducting fins are fixed on the heat-conducting plate. Each heat-conducting fin is made of aluminum material fixedly wrapped with phase change material. Both the heat-conducting plate and the heat-conducting fins are arranged longitudinally. The hot end and the cold end of the second semiconductor refrigeration chip group (15) are respectively fixed on the heat-conducting plate and the energy dissipator (13).

4. The energy-saving indoor environment control device according to claim 1, characterized in that: The number of the cooling chamber (8), the cold storage unit (10) and the first semiconductor refrigeration chip group (14) are all two, and the cold storage unit (10) in the two cooling chambers (8) works in turn; the number of the heating chamber (9), the heat storage unit (11) and the second semiconductor refrigeration chip group (15) are all two, and the heat storage unit (11) in the two heating chambers (9) works in turn.

5. The energy-saving indoor environment control device according to claim 1, characterized in that: The first semiconductor refrigeration chip group (14) and the second semiconductor refrigeration chip group (15) each include 3-4 semiconductor refrigeration chips connected in parallel.

6. The energy-saving indoor environment control device according to claim 1, characterized in that: The temperature regulating cavity (7) and the energy dissipation cavity (12) have a common sidewall with several through holes. The first semiconductor cooling chip group (14) is fixed between the cold storage (10) and the energy dissipator (13) through the through holes, and the second semiconductor cooling chip group (15) is fixed between the heat storage (11) and the energy dissipator (13) through the through holes.

7. The energy-saving indoor environment control device according to claim 1, characterized in that: Temperature and humidity sensors are provided in both the cooling chamber (8) and the heating chamber (9), and a wind speed sensor is provided in the energy dissipation chamber (12). Both the temperature and humidity sensors and the wind speed sensor are connected to the control unit (23).

8. The energy-saving indoor environment control device according to claim 1, characterized in that: The air inlet pipe also includes a heat exchange core (24) fixed at the bottom of the chassis (1). The second branch pipe (18) and the third branch pipe (19) share one flow channel of the heat exchange core (24). The exhaust pipe (22) between the exhaust outlet (3) and the energy dissipation chamber (12) is fixed at both ends of the other flow channel of the heat exchange core (24).

9. The energy-saving indoor environment control device according to claim 1, characterized in that: The silent fan (20) is fixed inside the adapter box (25), and the interior of the adapter box (25) is connected to the first branch pipe (17).

10. An energy-saving indoor environment control device according to claim 1, characterized in that: The air outlet duct includes an air outlet duct (30), a forced convection fan (31), a three-way valve (32), a branch pipe (33), and a first miniature electromagnetic valve (34). The air outlet duct (30) is connected to the cooling chamber (8), the heating chamber (9), and the three-way valve (32) respectively. The first miniature electromagnetic valve (34) is fixed between the air outlet duct (30) and the cooling chamber (8) and between the air outlet duct (30) and the heating chamber (9) respectively. The forced convection fan (31) is fixed in the transition cavity (35), which is connected to the three-way valve (32) and the air outlet duct (30) respectively. One end of the three-way valve (32) is connected to the cold air outlet (2), and the other end is connected to the hot air outlet (4) through the branch pipe (33). The air inlet duct also includes an air inlet branch pipe (36) and a second miniature electromagnetic valve. (37) The air inlet branch pipe (36) is fixed between the venturi valve (21) and the temperature regulating chamber (7). The air inlet branch pipe (36) is connected to the refrigeration chamber (8), the heating chamber (9) and the venturi valve (21) respectively. The second micro electromagnetic valve (37) is fixed between the air inlet branch pipe (36) and the refrigeration chamber (8) and between the air inlet branch pipe (36) and the heating chamber (9) respectively. The cold air outlet (2), the exhaust gas outlet (3) and the hot air outlet (4) are all louvered structures. The chassis (1) is fixed with a third micro electromagnetic valve (38) for opening and closing the cold air outlet (2), the exhaust gas outlet (3) and the hot air outlet (4) respectively. The first micro electromagnetic valve (34), the second micro electromagnetic valve (37) and the third micro electromagnetic valve (38) are all connected to the control unit (23).

11. An energy-saving indoor environment control device according to claim 2, characterized in that: The chassis (1) is equipped with a humidity control component, which includes a humidity control box (39), a heating wire, a first humidity sensor, a second humidity sensor, a first humidification and dehumidification layer (40), and a second humidification and dehumidification layer (41). The humidity control box (39) is fixed on the air outlet duct. The first humidification and dehumidification layer (40) and the second humidification and dehumidification layer (41) are both fixed inside the humidity control box (39) and are used to regulate air humidity. The first humidification and dehumidification layer (40) is made of biomimetic spider silk micro-nano fibers and has a mesh structure. The second humidification and dehumidification layer (40) is made of biomimetic spider silk micro-nano fibers and has a mesh structure. The humidification and dehumidification layer (41) is made of a precision humidity control material based on a metal-organic framework and has a mesh structure. The first humidity sensor and the second humidity sensor are used to detect the humidity of the first humidification and dehumidification layer (40) and the second humidification and dehumidification layer (41), respectively. The heating wire is fixed inside the second humidification and dehumidification layer (41). The humidity adjustment box (39) has a water spray pipe (28) facing the first humidification and dehumidification layer (40) at the top and a return water pipe (49) at the bottom. The heating wire, the first humidity sensor and the second humidity sensor are all connected to the control unit (23).

12. The energy-saving indoor environment control device according to claim 1, characterized in that: The indoor environment control equipment also includes an air quality control component, which includes an air quality control box (42), a micro differential pressure sensor, a primary air filter layer (43), and a secondary composite air filter layer (44). The primary air filter layer (43) is fixed inside the external air duct (5), the air quality control box (42) is fixed on the air outlet duct, and the secondary composite air filter layer (44) is fixed inside the air quality control box (42). The micro differential pressure sensor is installed on the frame of the primary air filter layer (43) and the frame of the secondary composite air filter layer (44), respectively. The micro differential pressure sensor is connected to the control unit (23) and is used to monitor whether the primary air filter layer (43) and the secondary composite air filter layer (44) are ineffective.

13. The energy-saving indoor environment control device according to claim 1, characterized in that: The external duct (5) is equipped with a wind speed sensor for detecting external wind speed, and the wind speed sensor is connected to the control unit (23).

14. An Internet of Things (IoT) system, characterized in that: The device includes a main control unit, an indoor sensor, and an energy-saving indoor environment control device according to any one of claims 1-13, wherein the main control unit is wirelessly connected to the indoor sensor and the control unit (23) in the indoor environment control device.

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