Illuminating device for wafer exposure and wafer exposure system
By designing the fiber bundle and lens group, optimizing the beam shape and uniformity, the problem of low beam utilization in traditional wafer edge exposure systems is solved, achieving a more efficient wafer edge exposure effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KINGSEMI CO LTD
- Filing Date
- 2025-05-13
- Publication Date
- 2026-05-01
AI Technical Summary
Traditional wafer edge exposure systems have low beam utilization, resulting in overexposure of the central area and underexposure of the edge area during the exposure process, which affects the reliability of the exposure.
The fiber bundle is composed of multiple optical fibers bundled together, with the light receiving end arranged in a circle and the light emitting end arranged in a rectangle. Combined with lens group, reflector and optical integrator, the beam shape and uniformity are optimized, and the beam utilization and exposure accuracy are improved.
It improves beam utilization, enhances the reliability and uniformity of wafer edge exposure, reduces light energy loss, and improves the edge exposure process effect.
Smart Images
Figure CN224190392U_ABST
Abstract
Description
An illumination device and a wafer exposure system for wafer exposure. Technical Field
[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to an illumination device and a wafer exposure system for wafer exposure. Background Technology
[0002] The wafer edge exposure unit is a crucial component in the integrated operation of the front-end photoresist coating and developing equipment with the lithography machine, and is a core component for achieving seamless integration of wafer coating, lithography, and developing. During the spin coating process, under the influence of centrifugal force and surface tension, the photoresist accumulates at the wafer edge, resulting in excessively thick lithography film in the edge area. This makes the photoresist easily peeled off in subsequent processes, causing defects at the wafer edge. To prevent this, an edge exposure unit is installed in the coating and developing machine to expose and develop the wafer edge area, thereby removing unwanted photoresist from the edge.
[0003] Methods for removing photoresist from wafer edges mainly include chemical edge removal and edge exposure. Chemical edge removal involves spraying solvent onto the wafer edges during the photoresist coating process to remove the photoresist. A drawback of this method is that the solvent can easily splash into the central patterned area of the wafer, affecting the pattern transfer quality in subsequent photolithography stages. Edge exposure, on the other hand, involves vacuum-adheding the wafer onto a rotating mechanism, fixing an exposure lens above the wafer to create a rectangular light spot of a specific size, and then using the rotation of a rotary stage to expose the wafer edges. The exposed photoresist can then be removed by the developer during the subsequent development stage. Compared to chemical edge removal, edge exposure offers higher exposure precision.
[0004] However, traditional edge exposure systems have low beam utilization, relying solely on the Gaussian focused spot obtained by the focusing system, which exhibits high energy in the middle and low energy at both ends. This often leads to overexposure in the middle area and underexposure in the edge area during the exposure process, affecting the reliability of the exposure. Summary of the Invention
[0005] The purpose of this invention is to provide an illumination device and a wafer exposure system for wafer exposure, which improves beam utilization and increases the reliability of wafer edge exposure.
[0006] To achieve the above objectives, in a first aspect, the present invention provides an illumination device for wafer exposure, comprising:
[0007] Light source assembly for providing ultraviolet light.
[0008] The optical fiber bundle has a light receiving end and a rectangular light emitting end, wherein the light receiving end is connected to the light source assembly and is used to receive ultraviolet light;
[0009] The lens, connected to the light emitting end, is used to irradiate the edge of the wafer with ultraviolet light.
[0010] In some embodiments, the fiber bundle is formed by connecting several optical fibers together, and the optical receiving end is circular.
[0011] In some embodiments, the lens includes a body and a lens group;
[0012] The main body has a channel for conducting the light, and one end is connected to the light emitting end;
[0013] The lens group is located within the channel.
[0014] In some embodiments, the lens further includes a reflector;
[0015] The channel includes a first channel and a second channel, the first channel being perpendicular to the second channel, and one end of the first channel being connected to the light emitting end;
[0016] The reflector is located at the junction of the first channel and the second channel, and is used to reflect ultraviolet light to the second channel and emit it through the second channel.
[0017] In some embodiments, the lens group includes at least one biconvex lens and at least one single convex lens, and one side of the single convex lens is a plane;
[0018] The double-sided convex lens and the single-sided convex lens are spaced apart within the channel.
[0019] In some embodiments, the double-sided convex lens and the single-sided convex lens are spaced apart in the first channel, the single-sided convex lens is close to the light emitting end, and the plane of the single-sided convex lens faces the light emitting end;
[0020] The second channel is provided with a double-sided convex lens and a single-sided convex lens spaced apart, and the single-sided convex lens located in the second channel is positioned close to the wafer to irradiate the edge of the wafer with ultraviolet light.
[0021] In some embodiments, the lens further includes an optical integrator disposed within the channel and located between the lens group and the light-emitting end.
[0022] In some embodiments, the light source assembly includes a light box and a light emitter, a reflector, and a shutter disposed within the light box;
[0023] The reflector has a recessed structure, and the surface of the recessed structure is arc-shaped.
[0024] The light emitter is disposed within the recessed structure;
[0025] The shutter is positioned opposite to the light emitter;
[0026] The light receiver is connected to the light box and corresponds to the shutter.
[0027] In some embodiments, the light emitter is a mercury lamp.
[0028] In a second aspect, embodiments of the present invention provide a wafer exposure system, including a cavity, a carrier unit, and the aforementioned illumination device for wafer exposure;
[0029] The carrier unit is disposed within the cavity and is used to carry the wafer;
[0030] The illumination device is located inside the cavity and is used to expose the edges of the wafer.
[0031] The advantages of the illumination device and wafer exposure system for wafer exposure provided by this utility model are as follows:
[0032] 1. An optical fiber bundle is composed of multiple optical fibers bundled and bonded together. The optical receiving end of the optical fiber bundle is arranged in a circle to collect as much light as possible, and the optical emitting end of the optical fiber bundle is arranged in a rectangle. By utilizing the arrangement of the optical fiber bundle, the light beam is shaped from a circle to a rectangle with near-loss, reducing the loss of light energy in the subsequent beam shaping process and improving the beam utilization rate.
[0033] 2. By using the lens group, mirror and optical integrator together, the shape and uniformity of the beam output from the lens are homogenized and shaped, improving the effect of edge exposure process.
[0034] 3. The light emitter is placed at the focal point of the reflector, and the main light energy emitted by it will be focused on another focal point of the reflector to further improve the light utilization rate. Attached Figure Description
[0035] Figure 1 is a schematic diagram of the structure of the illumination device for wafer exposure provided in the embodiment of this utility model;
[0036] Figure 2 is a schematic diagram of the structure of the optical fiber bundle in an embodiment provided by this utility model;
[0037] Figure 3 is a schematic diagram of the lens structure of an embodiment provided by this utility model;
[0038] Figure 4 is a schematic diagram of the structure of the light source assembly in an embodiment of this utility model.
[0039] Figure label:
[0040] Light source assembly 1, light box 11, light emitter 12, reflector 13, recessed structure 131, shutter 14, fiber optic bundle 2, light receiver 21, light emitter 22, lens 3, main body 31, first channel 311, second channel 312, lens group 32, double-sided convex lens 321, single-sided convex lens 322, reflector 33, optical integrator 34. Detailed Implementation
[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.
[0042] Furthermore, it should be understood that the orientations or positional relationships indicated by terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" in this document are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. The terms "first" and "second" in this document are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise stated, "a plurality of" means two or more.
[0043] To address the problems existing in the prior art, embodiments of this utility model provide an illumination device for wafer exposure. Referring to Figures 1 and 2, the illumination device includes a light source assembly 1, an optical fiber bundle 2, and a lens 3. The light source assembly 1 provides ultraviolet light to illuminate the edge of the wafer. The optical fiber bundle 2 has a light receiving end 21 and a rectangular light emitting end 22. The light receiving end 21 is connected to the light source assembly 1 to receive ultraviolet light. The lens 3 is connected to the light emitting end 22 to illuminate the edge of the wafer with ultraviolet light.
[0044] In this embodiment, by setting the light emitting end 22 of the fiber bundle 2 in a rectangular shape, the loss of light energy in the subsequent beam shaping process is reduced, and the beam utilization rate is improved.
[0045] Furthermore, the optical fiber bundle 2 is formed by connecting several optical fibers together, and the optical receiving end 21 is circular.
[0046] In this embodiment, referring to Figure 2, the fiber bundle 2 is composed of multiple optical fibers bundled and bonded together. The light receiving end 21 of the fiber bundle 2 is arranged in a circle to collect as much light as possible, and the light emitting end 22 of the fiber bundle 2 is arranged in a rectangle. By using this arrangement, the light beam is shaped from a circle to a rectangle with almost no loss, reducing the loss of light energy in the subsequent beam shaping process and improving the beam utilization rate.
[0047] Referring to Figures 1 to 3, in some embodiments, the lens 3 includes a body 31 and a lens group 32. The body 31 has a channel along its axial direction that conducts through it, and one end is connected to the light emitting end 22. The lens group 32 is disposed within the channel.
[0048] In this embodiment, by placing the lens group 32 within the channel, when ultraviolet light passes through the channel and through the lens group 32, the diffused light can be evenly distributed.
[0049] In some embodiments, the lens 3 further includes a reflector 33, and the channel includes a first channel 311 and a second channel 312. The first channel 311 is perpendicular to the second channel 312. One end of the first channel 311 is connected to the light emitting end 22. The reflector 33 is disposed at the connection between the first channel 311 and the second channel 312 and is used to reflect ultraviolet light to the second channel 312 and emit it through the second channel 312.
[0050] In this embodiment, the reflector 33 is positioned at a 45° angle at the connection between the first channel 311 and the second channel 312. By reflecting ultraviolet light from the first channel 311 to the second channel 312 and finally emitting it from the second channel 312, the reflector 33 and the lens group 32 work together to further ensure that the ultraviolet light is emitted evenly.
[0051] Furthermore, the lens group 32 includes at least one biconvex lens 321 and at least one uniconvex lens 322, and one side of the uniconvex lens 322 is a plane. The biconvex lens 321 and the uniconvex lens 322 are disposed at intervals in the channel.
[0052] Specifically, in this embodiment, both the first channel 311 and the second channel 312 are provided with a double-sided convex lens 321 and a single-sided convex lens 322, and adjacent double-sided convex lenses 321 and single-sided convex lenses 322 are spaced apart. The single-sided convex lens 322 located in the first channel 311 is positioned close to the light emitting end 22, and the plane of the single-sided convex lens 322 faces the light emitting end 22. The single-sided convex lens 322 located in the second channel 312 is positioned close to the wafer, that is, the single-sided convex lens 322 is positioned below the double-sided convex lens 321 in the second channel 312, for irradiating the edge of the wafer with ultraviolet light.
[0053] In this embodiment, the shape and uniformity of the beam output from the lens 3 are homogenized and shaped by the lens group 32, thereby improving the effect of the edge exposure process.
[0054] Referring to Figures 1 and 3, in some embodiments, the lens 3 further includes an optical integrator 34, which is disposed within the channel and located between the lens group 32 and the light emitting end 22.
[0055] In this embodiment, the optical integrator 34 can be a rod made of a transparent medium or a hollow light guide formed by a reflector 33. The cross-sectional shape of the optical integrator 34 can be rectangular, square, or hexagonal. By setting the optical integrator 34 in the channel, the light is further homogenized and shaped.
[0056] In some embodiments, the optical integrator 34 is fixedly embedded in the first channel 311 and located between the single-sided convex lens 322 and the light emitting end 22.
[0057] Referring to Figures 1 to 4, in some embodiments, the light source assembly 1 includes a light box 11 and a light emitter 12, a reflector 13, and a shutter 14 disposed within the light box 11. The reflector 13 has a recessed structure 131 with an arc-shaped surface. The light emitter 12 is disposed within the recessed structure 131 and located at the focal point of the recessed structure 131. The shutter 14 is disposed opposite to the light emitter 12. The light receiving end 21 is connected to the light box 11 and corresponds to the shutter 14.
[0058] In this embodiment, the light emitter 12 is a mercury lamp that can provide ultraviolet light. The reflector 13 has a "semi-circular arc structure" so that the inner surface of the reflector 13 has a recessed structure 131. By placing the light emitter 12 in the recessed structure 131 and at the focal point of the recessed structure 131, the ultraviolet light generated by the light emitter 12 is collected and emitted to the light receiving end 21 as much as possible.
[0059] In another embodiment of this utility model, a wafer exposure system is provided, including a cavity, a carrier unit, and the aforementioned illumination device for wafer exposure. The carrier unit is disposed in the cavity and is used to carry the wafer. The illumination device is located in the cavity and is used to expose the edge of the wafer.
[0060] In this embodiment, the reliability of wafer edge exposure is improved by using the illumination device provided in the above embodiments to expose the wafer edge.
[0061] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.
Claims
1. An illumination device for wafer exposure, characterized in that, include: Light source assembly for providing ultraviolet light; The optical fiber bundle has a light receiving end and a rectangular light emitting end, wherein the light receiving end is connected to the light source assembly and is used to receive ultraviolet light; The lens, connected to the light emitting end, is used to irradiate the edge of the wafer with ultraviolet light.
2. The illumination apparatus for wafer exposure according to claim 1, characterized in that, The optical fiber bundle is formed by connecting several optical fibers together, and the optical receiving end is circular.
3. The illumination apparatus for wafer exposure according to claim 1, characterized in that, The lens includes a main body and a lens group; the main body has a channel for conducting light through it, and one end is connected to the light emitting end; the lens group is disposed within the channel.
4. The illumination apparatus for wafer exposure according to claim 3, characterized in that, The lens also includes a reflector; the channel includes a first channel and a second channel, the first channel is perpendicular to the second channel, and one end of the first channel is connected to the light emitting end; the reflector is disposed at the connection between the first channel and the second channel, and is used to reflect ultraviolet light to the second channel and emit it through the second channel.
5. The illumination apparatus for wafer exposure according to claim 4, characterized in that, The lens group includes at least one biconvex lens and at least one single convex lens, and one side of the single convex lens is a plane; the biconvex lens and the single convex lens are disposed alternately in the channel.
6. The illumination apparatus for wafer exposure according to claim 5, characterized in that, The first channel is provided with a double-sided convex lens and a single-sided convex lens spaced apart. The single-sided convex lens is close to the light emitting end, and the plane of the single-sided convex lens faces the light emitting end. The second channel is provided with a double-sided convex lens and a single-sided convex lens spaced apart. The single-sided convex lens located in the second channel is positioned close to the wafer and is used to irradiate the edge of the wafer with ultraviolet light.
7. The illumination apparatus for wafer exposure according to any one of claims 3 to 6, characterized in that, The lens also includes an optical integrator, which is disposed within the channel and located between the lens group and the light-emitting end.
8. The illumination apparatus for wafer exposure according to claim 1, characterized in that, The light source assembly includes a light box and a light emitter, a reflector, and a shutter disposed within the light box; the reflector has a recessed structure with an arc-shaped surface; the light emitter is disposed within the recessed structure and located at the focal point of the recessed structure; the shutter is disposed opposite to the light emitter; the light receiving end is connected to the light box and corresponds to the shutter.
9. The illumination apparatus for wafer exposure according to claim 8, characterized in that, The light source is a mercury lamp.
10. A wafer exposure system, characterized in that, The device includes a cavity, a support unit, and an illumination device for wafer exposure as described in any one of claims 1 to 9; the support unit is disposed within the cavity and is used to support the wafer; the illumination device is located within the cavity and is used to expose the edges of the wafer.