Cooling device for enameled wire production

Abstract

The utility model discloses an enamelled wire production cooling device in the technical field of enamelled wire production cooling, which comprises a base, a multi-stage cooling mechanism and a modularized mechanism are arranged on the base, the multi-stage cooling mechanism comprises a water-cooling roller, the water-cooling roller is arranged above the base and is connected with a water-cooling assembly, and the modularized mechanism is connected with the water-cooling assembly. An air cooling box is arranged behind the water cooling roller, an air inlet seat is arranged on the air cooling box, an air cooling assembly is arranged in the air cooling box, the enameled wire sequentially passes through the water cooling roller and the interior of the air cooling box, the water cooling assembly comprises a water inlet pipe, the water inlet pipe is connected with an external water tank, and the other end of the water inlet pipe is connected with a circulating water pipe. According to the cooling device for enameled wire production, the process of first water cooling and then air cooling is achieved in the cooling process, cooling is more uniform and stable, the temperature of an enameled wire can be accurately controlled within a proper range, the situation that the performance of the enameled wire is affected due to too high or too low temperature is avoided, and the practicability and the cooling effect of the device are improved.

Description

A cooling device for enameled wire production Technical Field

[0001] This utility model relates to the field of cooling technology in enameled wire production, and in particular to a cooling device for enameled wire production. Background Technology

[0002] Enamelled wire is an important electromagnetic wire used in products such as motors, electrical appliances, and electrical instruments. It works in an electromagnetic field in the form of windings to realize the mutual conversion of electrical energy and magnetic energy. Enamelled wire is a conductor made by coating a layer of insulating varnish on the surface of copper or aluminum wire. This insulating varnish acts as insulation, keeping the windings and the iron core insulated from each other, preventing current leakage and short circuits, and ensuring the normal operation of electrical equipment. During the production process, enamelled wire needs to be cooled using a cooling device.

[0003] In response, Chinese patent application number CN202122480055.5 discloses a cooling device for enameled wire production, including a processing table, a water storage tank, and a cooling assembly. In use, the fins are cooled by a semiconductor cooling chip. A water pump draws cooling water from the water storage tank and discharges it into the cooling pipe through an outlet pipe. The cooling water entering the cooling pipe is discharged from the second inlet and second outlet, while some of the water in the outlet pipe enters the cooling assembly.

[0004] However, existing cooling devices for enameled wire production typically use water cooling to cool the enameled wire. While water cooling can rapidly exchange heat with the enameled wire, it cannot continuously cool the wire, resulting in uneven and unstable cooling. This makes it impossible to precisely control the temperature of the enameled wire within a suitable range, which can easily lead to problems such as excessively high or low temperatures affecting the performance of the enameled wire. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this utility model provides a cooling device for enameled wire production.

[0006] The purpose of this utility model is achieved as follows: A cooling device for enameled wire production includes: a base, on which a multi-stage cooling mechanism and a modular mechanism are provided; the multi-stage cooling mechanism includes a water-cooled roller, which is disposed above the base and connected to a water-cooling component; an air-cooling box is disposed behind the water-cooled roller, an air inlet is disposed on the air-cooling box, and an air-cooling component is disposed inside the air-cooling box; the enameled wire passes sequentially through the water-cooled roller and the inside of the air-cooling box.

[0007] The water-cooling assembly includes a water inlet pipe connected to an external water tank, and the other end of the water inlet pipe connected to a circulating water pipe. The end of the circulating water pipe away from the water inlet pipe is connected to the inside of the water-cooling roller. The circulating pipe inside the water-cooling roller is arranged in an annular shape, and the water-cooling roller is provided with a water outlet.

[0008] The air-cooling assembly includes a connecting pipe, which is fixedly connected inside the air-cooling box. One end of the connecting pipe is fixedly connected to a connecting plate. The two sets of side walls of the connecting plate are connected to each other by connecting columns, and nozzles are provided on the connecting columns.

[0009] Preferably, the circulating water pipe is equipped with a semiconductor cooling chip, and the semiconductor cooling chip is fitted with heat dissipation fins.

[0010] Preferably, the semiconductor cooling chip is mounted on the surface of the circulating water pipe by bolts.

[0011] Preferably, a support column is fixedly connected to the bottom end of the circulating water pipe, and the bottom end of the support column is fixedly connected to the surface of the support base.

[0012] Preferably, the modular mechanism includes a support plate, which is fixedly connected to the bottom end of the water-cooled roller and the upper end of the mounting plate. The mounting plate is assembled on the upper surface of the base, and a support seat is fixedly connected to the upper end of the support plate. The mounting plate, the support plate, and the support seat form an integral unit. The mounting plate and the air-cooled box are mounted on the upper end of the base through an assembly assembly.

[0013] Preferably, the assembly component includes a mounting base, which is fixedly connected to the outer wall of the mounting plate and the outer wall of the air-cooled box. The mounting base is equipped with fastening bolts, which are installed inside the base.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. This utility model utilizes a combination of a water-cooled roller, an air-cooled box, an air inlet seat, a water inlet pipe, a circulating water pipe, a semiconductor refrigeration chip, heat dissipation fins, a connecting pipe, a connecting plate, a connecting column, and a nozzle. The enameled wire is sequentially passed through through holes opened inside the water-cooled roller and the connecting pipe. External water is drawn into the water inlet pipe by a water pump and flows into the water-cooled roller via the circulating water pipe. With the cooperation of the semiconductor refrigeration chip and heat dissipation fins on the circulating water pipe, the water entering the water-cooled roller is cooled, rapidly reducing the temperature of the enameled wire. The enameled wire then enters the air-cooling unit, where air is injected from the air inlet seat, causing it to cool rapidly. The heat is delivered from the connecting disc and connecting column to the nozzle and sprayed onto the surface of the enameled wire. In addition to water cooling, the remaining heat of the enameled wire is further removed. This enameled wire production cooling device achieves a process of water cooling followed by air cooling during the cooling process. Water cooling can quickly exchange heat with the surface of the enameled wire, removing a large amount of heat. During air cooling, the airflow can continuously cool the enameled wire, making the cooling more uniform and stable. The temperature of the enameled wire can be precisely controlled within a suitable range, avoiding the impact of excessively high or low temperatures on the performance of the enameled wire, thus improving the practicality and cooling effect of the device.

[0016] 2. This utility model, through the cooperation of a support plate, mounting plate, mounting base, and fastening bolts, allows all water-cooling components to be mounted on the mounting plate via connectors, forming an independent and complete water-cooling unit. The air-cooling components are completely placed inside the air-cooling box. The water-cooling unit and the air-cooling unit can be modularized. With the external mounting base and fastening bolts, they can be easily integrated and installed, facilitating disassembly and maintenance. This modularization of the cooling device for enameled wire production facilitates the handling of specific faulty modules during maintenance, making operation simple and efficient, and improving the practicality and convenience of the device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 is a frontal perspective three-dimensional schematic diagram of the overall structure of this utility model.

[0019] Figure 2 is a rear-view perspective view of the overall structure of this utility model.

[0020] Figure 3 is a frontal three-dimensional cross-sectional view of a partial structure of the multi-stage cooling mechanism of this utility model.

[0021] Figure 4 is an enlarged schematic diagram of the structure at point A in Figure 1 of this utility model.

[0022] In the diagram: 111, base; 2, multi-stage cooling mechanism; 211, water-cooled roller; 212, air-cooled box; 213, air inlet seat; 214, water inlet pipe; 215, circulating water pipe; 216, semiconductor refrigeration chip; 217, heat dissipation fins; 218, connecting pipe; 219, connecting plate; 220, connecting column; 221, nozzle; 222, support seat; 223, support column; 3, modular mechanism; 311, support plate; 312, mounting plate; 313, mounting seat; 314, fastening bolt. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] As shown in Figures 1-4, this utility model provides an embodiment:

[0025] A cooling device for enameled wire production. The base 111 used in this application is a product that can be directly purchased on the market. Its principle and connection method are existing technologies known to those skilled in the art.

[0026] Includes: a base 111, on which a multi-stage cooling mechanism 2 and a modular mechanism 3 are provided. The multi-stage cooling mechanism 2 includes a water-cooled roller 211, which is located above the base 111 and connected to a water-cooling component. An air-cooled box 212 is provided behind the water-cooled roller 211, and an air inlet seat 213 is provided on the air-cooled box 212. An air-cooling component is provided inside the air-cooled box 212. The enameled wire passes through the water-cooled roller 211 and the inside of the air-cooled box 212 in sequence.

[0027] The water-cooling assembly includes a water inlet pipe 214, which is connected to an external water tank. The other end of the water inlet pipe 214 is connected to a circulating water pipe 215. The end of the circulating water pipe 215 away from the water inlet pipe 214 is connected to the inside of the water-cooling roller 211. The internal circulation pipe of the water-cooling roller 211 is arranged in a ring shape. The water-cooling roller 211 is provided with a water outlet.

[0028] The air-cooled assembly includes a connecting pipe 218, which is fixedly connected inside the air-cooled box 212. One end of the connecting pipe 218 is fixedly connected to a connecting plate 219. The two sets of side walls of the connecting plate 219 are connected to each other by a connecting post 220. A nozzle 221 is provided on the connecting post 220.

[0029] When using this enameled wire production cooling device, the enameled wire is passed sequentially through the through holes opened inside the water-cooling roller 211 and the connecting pipe 218. The enameled wire is preferentially cooled by the water-cooling component. When the enameled wire just leaves the high-temperature environment, a large amount of heat has accumulated inside. The water cooling can quickly exchange heat with the surface of the enameled wire, carrying away a large amount of heat and causing the temperature of the enameled wire to drop rapidly. Subsequently, the enameled wire is uniformly cooled by the air-cooling component. On the basis of water cooling, the remaining heat of the enameled wire is further removed. The air flow can continuously cool the enameled wire, making the cooling more uniform and stable. The temperature of the enameled wire can be precisely controlled within a suitable range, avoiding the impact on the performance of the enameled wire due to excessively high or low temperatures.

[0030] A semiconductor cooling chip 216 is mounted on the circulating water pipe 215, and heat dissipation fins 217 are installed on the semiconductor cooling chip 216.

[0031] When the water entering from the inlet pipe 214 circulates inside the circulating water pipe 215, it can be easily cooled into cold water by the semiconductor cooling chip 216 installed on the circulating water pipe 215. Combined with the aluminum alloy heat dissipation fins 217 installed on the semiconductor cooling chip 216, the temperature can be dissipated quickly.

[0032] The semiconductor cooling chip 216 is mounted on the surface of the circulating water pipe 215 by bolts;

[0033] The thermoelectric cooler 216 is mounted on the surface of the circulating water pipe 215 by bolts, making it easy to replace the thermoelectric cooler 216.

[0034] The bottom end of the circulating water pipe 215 is fixedly connected to a support column 223, and the bottom end of the support column 223 is fixedly connected to the surface of the support base 222.

[0035] The modular mechanism 3 includes a support plate 311, which is fixedly connected to the bottom end of the water-cooled roller 211. The support plate 311 is also fixedly connected to the upper end of the mounting plate 312. The mounting plate 312 is mounted on the upper surface of the base 111. A support seat 222 is fixedly connected to the upper end of the support plate 311. The mounting plate 312, the support plate 311, and the support seat 222 form an integral unit. The mounting plate 312 and the air-cooled box 212 are mounted on the upper end of the base 111 through an assembly assembly.

[0036] When using this enameled wire to produce cooling devices, the water-cooled components are all installed on the mounting plate 312 through connectors to form an independent water-cooled unit. The air-cooled components are completely placed inside the air-cooled box 212. The water-cooled unit and the air-cooled unit can be modularized. With the external mounting base 313 and fastening bolts 314, they can be easily integrated and installed, and are convenient for disassembly and maintenance.

[0037] The assembly component includes a mounting base 313, which is fixedly connected to the outer wall of the mounting plate 312 and the outer wall of the air-cooled box 212. A fastening bolt 314 is installed inside the mounting base 313 and is installed inside the base 111.

[0038] Working principle:

[0039] When using this enameled wire cooling device, the enameled wire is passed sequentially through the through holes opened inside the water-cooling roller 211 and the connecting pipe 218. External water is drawn into the water inlet pipe 214 by a water pump, and then flows into the water-cooling roller 211 through the circulating water pipe 215. With the cooperation of the semiconductor cooling chip 216 and heat dissipation fins 217 on the circulating water pipe 215, the water entering the water-cooling roller 211 can be turned into cold water to quickly cool the enameled wire. When the enameled wire just leaves the high-temperature environment, a large amount of heat has accumulated inside, and the water cooling can quickly cool the surface of the enameled wire. The surface undergoes heat exchange, carrying away a large amount of heat and rapidly reducing the temperature of the enameled wire. The enameled wire then enters the air-cooling unit, where air is injected from the air inlet 213 and delivered from inside the connecting plate 219 and connecting post 220 to the nozzle 221, spraying it onto the surface of the enameled wire. In addition to water cooling, the remaining heat of the enameled wire is further removed. The airflow can continuously cool the enameled wire, making the cooling more uniform and stable. The temperature of the enameled wire can be precisely controlled within a suitable range, avoiding the impact on the performance of the enameled wire due to excessively high or low temperatures.

[0040] When using this enameled wire to produce a cooling device, the water-cooled components are all installed on the mounting plate 312 through connectors to form an independent water-cooled unit. The air-cooled components are completely placed inside the air-cooled box 212. The water-cooled unit and the air-cooled unit can be modularized. With the external mounting base 313 and fastening bolts 314, they can be easily integrated and installed, and are convenient for disassembly and maintenance. The operation is now complete.

[0041] The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A cooling device for enameled wire production, comprising: The base (111) is characterized in that: a multi-stage cooling mechanism (2) and a modular mechanism (3) are provided on the base (111), the multi-stage cooling mechanism (2) includes a water-cooled roller (211), the water-cooled roller (211) is arranged above the base (111), the water-cooled roller (211) is connected to a water-cooling component, an air-cooled box (212) is arranged behind the water-cooled roller (211), an air inlet seat (213) is arranged on the air-cooled box (212), an air-cooling component is arranged inside the air-cooled box (212), and the enameled wire passes through the water-cooled roller (211) and the air-cooled box (212) in sequence; the water-cooling component includes a water inlet pipe (214), the water inlet pipe (214) and the water-cooled component are connected to the water-cooled roller (211) and the water-cooled component (212). An external water tank is connected, and the other end of the water inlet pipe (214) is connected to the circulating water pipe (215). The end of the circulating water pipe (215) away from the water inlet pipe (214) is connected to the inside of the water-cooled roller (211). The circulating pipe inside the water-cooled roller (211) is arranged in an annular shape. The water-cooled roller (211) is provided with a water outlet. The air-cooled assembly includes a connecting pipe (218). The connecting pipe (218) is fixedly connected to the inside of the air-cooled box (212). One end of the connecting pipe (218) is fixedly connected to a connecting plate (219). The two sets of side walls of the connecting plate (219) are connected to each other through a connecting column (220). The connecting column (220) is provided with a nozzle (221).

2. The cooling device for enameled wire production according to claim 1, characterized in that: The circulating water pipe (215) is equipped with a semiconductor cooling chip (216), and the semiconductor cooling chip (216) is equipped with heat dissipation fins (217).

3. The cooling device for enameled wire production according to claim 2, characterized in that: The semiconductor cooling chip (216) is mounted on the surface of the circulating water pipe (215) by bolts.

4. The cooling device for enameled wire production according to claim 1, characterized in that: The bottom end of the circulating water pipe (215) is fixedly connected to a support column (223), and the bottom end of the support column (223) is fixedly connected to the surface of the support base (222).

5. The cooling device for enameled wire production according to claim 1, characterized in that: The modular mechanism (3) includes a support plate (311), which is fixedly connected to the bottom end of the water-cooled roller (211). The support plate (311) is fixedly connected to the upper end of the mounting plate (312). The mounting plate (312) is assembled on the upper surface of the base (111). A support seat (222) is fixedly connected to the upper end of the support plate (311). The mounting plate (312), the support plate (311), and the support seat (222) form an integral unit. The mounting plate (312) and the air-cooled box (212) are mounted on the upper end of the base (111) through an assembly assembly.

6. The cooling device for enameled wire production according to claim 5, characterized in that: The assembly assembly includes a mounting base (313), which is fixedly connected to the outer wall of the mounting plate (312) and the outer wall of the air-cooled box (212). A fastening bolt (314) is installed inside the mounting base (313) and the fastening bolt (314) is installed inside the base (111).

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