High-speed cable welding vertical separation type fixing structure and optical module

By adopting a top-bottom separated fixing structure in the optical module, the signal line and ground line are soldered in independent compartments and fixed by pressing the top cover and base together, the problem of increased impedance caused by excessive glue application in traditional optical modules is solved, resulting in a more stable cable connection and reducing loosening and signal interference.

CN224191241UActive Publication Date: 2026-05-01武汉瑞芯精密光通信设备有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
武汉瑞芯精密光通信设备有限公司
Filing Date
2025-01-13
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

In traditional optical modules, the signal and ground lines of high-speed cables are directly soldered onto the PCB board. Excessive application of UV adhesive during the curing process can affect impedance, especially in 800G and 1600G high-speed optical modules.

Method used

The system employs a high-speed cable welding and separate upper and lower fixing structure. The signal line and ground line are welded into independent compartments. The ground line is welded to the base to achieve grounding. The upper cover is pressed and fixed to the base to avoid glue application. Metal foil is used to weld the upper cover to reduce loosening and signal interference.

Benefits of technology

This ensures no increase in impedance, reduces the risk of high-speed cable loosening, avoids interference between signal lines, simplifies the fixing process, and reduces reliance on UV adhesive.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a high-speed cable welding vertical separation type fixing structure, which is characterized in that at least one grounded base is fixed on a PCB (printed circuit board) along the length direction of the PCB, an upper cover is fixed on each base, and a plurality of compartments which are distributed in rows and are independent from one another are arranged on the base in a cover sealing area of the upper cover; two signal bonding pads are arranged in an area surrounded by each compartment on the PCB, and signal lines in a plurality of high-speed cables of each high-speed cable group enter different compartments on one base respectively and are welded with the signal bonding pads; the upper cover is matched with the base to tightly press the section, provided with the protective sleeve, of the high-speed cable, and a ground wire in the high-speed cable is welded to the base. The fixing structure has the beneficial effects that the fixing structure does not need adhesive dispensing, so that the problem of impedance increase caused by excessive adhesive dispensing does not need to be considered, the performance of the high-speed optical module is not influenced, mutual interference among signal lines in a high-speed cable is effectively avoided, and the risk of loosening of the high-speed cable is reduced.
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Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to a high-speed cable welding upper and lower separated fixing structure and an optical module. Background Technology

[0002] In traditional optical modules, the signal lines and ground lines of high-speed cables (i.e., these high-speed cables are called dual-core coaxial cables with ground lines, which have two signal lines and two ground lines, with the two ground lines distributed outside the two signal lines) are all directly soldered onto the PCB board. The disadvantage of this method is that after soldering, UV glue must be applied and cured with a UV lamp to prevent the signal lines from falling off and affecting performance. If too much glue is applied during the glue application process, it will affect the impedance, thereby affecting the performance of the optical module. This problem has a smaller impact on low-speed optical modules such as 10G, 25G, 40G, 100G, and 200G, but a very large impact on high-speed optical modules such as 800G and 1600G. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a high-speed cable welding upper and lower separated fixed structure and optical module to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0005] A high-speed cable welding upper and lower separated fixing structure includes: a PCB board, at least one grounded base fixed along its length on the PCB board, a top cover fixed on each base, multiple rows of independent compartments on the base within the sealing area of ​​the top cover, two signal pads on the PCB board within the area enclosed by each compartment, signal lines of multiple high-speed cables in each high-speed cable group respectively enter different compartments on one of the bases and are welded to the signal pads; the top cover cooperates with the base to press the section of the high-speed cable with a protective sleeve, and the ground wire of the high-speed cable is welded to the base.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, through holes are made on the top cover in the area above the metal foil in each high-speed cable, and solder blocks are inserted into the through holes to solder the top cover to the metal foil in the high-speed cable.

[0008] Furthermore, the PCB board has multiple grounding pads at different locations, and each base is soldered to one of the grounding pads on the PCB board.

[0009] Furthermore, the top cover is made of tin-plated copper, the base is made of tin-plated copper, and the top cover and the base are fixed together by welding.

[0010] Furthermore, the top cover has a slope on the side near the gold fingers of the PCB board.

[0011] Furthermore, there is a gap between the upper surface of the base facing away from the gold fingers of the PCB board and the lower surface of the top cover facing away from the gold fingers of the PCB board. The height of the gap is greater than the outer diameter of the ground wire. There is a wiring channel in the gap between the base and the top cover, which is connected to each compartment and used to limit the high-speed cable. The top cover cooperates with the base to press the section of the high-speed cable with the protective sleeve into the wiring channel.

[0012] Furthermore, all the compartments on the base are arranged in rows along its length, and the two sides of the base along its width are lower than the middle. The middle area of ​​the upper surface of the base is provided with a first groove as a ground wire welding position between two adjacent compartments and on the outside of the two outermost compartments. The first groove is connected to the gap, and the ground wire in the high-speed cable is welded in the first groove. The lower surface of the cover has a first protrusion extending into the first groove at each corresponding first groove.

[0013] Furthermore, the middle area of ​​the upper surface of the base has a slope on the side away from the high-speed cable. A second groove is provided on the slope between two adjacent compartments and on the outer side of the two outermost compartments, serving as a welding position for the upper cover. The two ends of the second groove extend outward from the slope. On the lower surface of the upper cover, a second protrusion extends into the second groove at each corresponding second groove.

[0014] Furthermore, the lower surface of the upper cover has a third protrusion in the area corresponding to the slope, the second protrusion is located between the first protrusion and the third protrusion, and the upper surface of the base has a third groove to accommodate the third protrusion. The lengths of the third protrusion and the third groove both cover all the compartments on the base.

[0015] Based on the above technical solution, this utility model also provides an optical module, including the above-mentioned high-speed cable welding upper and lower separate fixing structure.

[0016] The beneficial effects of this utility model are:

[0017] 1) This fixing structure does not require glue application, so there is no need to consider the impedance increase caused by excessive glue application, thus ensuring that it does not affect the performance of the high-speed optical module.

[0018] 2) In this solution, the upper cover and base work together to press the section of the high-speed cable with the protective sleeve, thereby reducing the risk of the high-speed cable becoming loose;

[0019] 3) A specially designed base, with each high-speed cable in its own independent compartment, combined with a cover, effectively prevents interference between signal lines in the high-speed cable;

[0020] 4) The metal foil in the high-speed cable is soldered to the top cover by solder blocks, which further effectively reduces the risk of the high-speed cable becoming loose and reduces signal interference in adjacent high-speed cables;

[0021] 5) The side of the top cover away from the high-speed cable has a slope. When there are multiple adjacent bases on the same side of a PCB board along its length, the slope on the top cover facilitates the passage of the high-speed cable group in another base in front of it, reducing the bending angle of the high-speed cable group.

[0022] 6) The groove on the base and the protrusion on the top cover can serve as a welding point and also as a positioning point for the top cover and the base.

[0023] 7) There is a gap between the upper surface of the base near the high-speed cable assembly and the lower surface of the cover near the high-speed cable assembly. Within the gap between the base and the cover, there is a wiring channel connected to each compartment and used to limit the high-speed cable. The high-speed cable passes through the wiring channel, and the signal line in the high-speed cable enters the compartment connected to the wiring channel. After being bent and stripped of the protective layer (insulating medium), it is soldered to the signal pad. The cover and the base press the section of the high-speed cable with the protective sleeve into the wiring channel to limit and fix the high-speed cable, thereby reducing the risk of the high-speed cable loosening. Attached Figure Description

[0024] Figure 1 This is a structural diagram of the high-speed cable welding upper and lower separated fixing structure of this utility model;

[0025] Figure 2 This is a partial exploded view of the split-type fixing structure for welding medium and high speed cables according to this utility model;

[0026] Figure 3 This is a structural diagram of the shielding cover in this utility model;

[0027] Figure 4 This is a structural diagram of the upper cover in this utility model;

[0028] Figure 5 for Figure 1 A partial structural diagram after removing a shield.

[0029] The attached diagram lists the components represented by each number as follows:

[0030] 1. PCB board, 110. Signal pad, 120. Ground pad, 2. Base, 210. Compartment, 220. First groove, 230. Angled surface, 240. Second groove, 250. Third groove, 3. Top cover, 310. Through hole, 320. Ramp, 330. First bump, 340. Second bump, 350. Third bump, 4. High-speed cable, 410. Signal line, 420. Ground wire, 430. Metal foil, 5. Solder block, 6. Gap, 7. Wiring channel. Detailed Implementation

[0031] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0032] Example 1

[0033] like Figures 1-5 As shown, a high-speed cable welding upper and lower separation fixing structure includes: a PCB board 1, at least one grounded base 2 fixed on the PCB board 1, that is, the base 2 is made of metal. The bases 2 on the PCB board 1 are arranged in rows along the length direction of the PCB board 1. Since the multiple high-speed cables 4 of the high-speed cable group are arranged in rows along the width direction of the PCB board 1, the length direction of the base 2 is preferably distributed along the width direction of the PCB board 1. Each base 2 is fixed with an upper cover 3. The cooperation between the base 2 and the upper cover 3 forms a shielding cover.

[0034] The base 2 has multiple rows of independent compartments 210 in the sealing area of ​​the upper cover 3. The compartments 210 penetrate the upper and lower surfaces of the base 2. The multiple compartments 210 on the base 2 are preferably arranged in rows along the width direction of the PCB board 1. The number of compartments 210 on the base 2 is determined by the number of high-speed cables 4 in the high-speed cable group. For example, if each high-speed cable group has four or six high-speed cables 4, then the base 2 adapted to the high-speed cable group has four or six compartments 210. The PCB board 1 has two signal pads 110 in the area enclosed by each compartment 210.

[0035] The signal lines 410 of the multiple high-speed cables 4 in each high-speed cable group enter different compartments 210 on one of the bases 2, and are first bent and then stripped of the protective layer (insulating medium) before being soldered to the signal pads 110. For example, if each high-speed cable group has four or six high-speed cables 4, then the base 2 adapted to the high-speed cable group has four or six compartments 210, and the signal lines 410 of the four or six high-speed cables 4 enter the four or six compartments 210 on the base 2 respectively.

[0036] The top cover 3, together with the base 2, presses the section of the high-speed cable 4 with the protective sleeve. The ground wire 420 in the high-speed cable 4 is welded to the base 2. Since the base 2 is grounded, the ground wire 420 in the high-speed cable 4 is also grounded when the ground wire 420 is welded to the base 2.

[0037] Example 2

[0038] like Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:

[0039] A through hole 310 is made on the upper cover 3 in the area above the metal foil 430 in each high-speed cable 4. The through hole 310 penetrates the upper and lower surfaces of the upper cover 3. A solder block 5 is inserted into the through hole 310 to weld the upper cover 3 to the metal foil 430 in the high-speed cable 4. The metal foil 430 in the high-speed cable 4 is welded to the upper cover 3 as a whole by the solder block 5, which effectively reduces the risk of the high-speed cable 4 becoming loose and reduces signal interference in adjacent high-speed cables.

[0040] Example 3

[0041] like Figure 5 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:

[0042] The PCB board 1 has multiple grounding pads 120 at different locations. Each base 2 is soldered to one of the grounding pads 120 on the PCB board 1 to facilitate the grounding of the base 2.

[0043] Example 4

[0044] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below:

[0045] The top cover 3 is preferably made of tin-plated copper, and the base 2 is preferably made of tin-plated copper. Of course, in actual application, other materials are not excluded. Since the base 2 is made of metal and the top cover 3 is also made of metal, the top cover 3 and the base 2 are preferably fixed by welding.

[0046] Example 5

[0047] like Figure 1 , Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 4, as detailed below:

[0048] The top cover 3 has a ramp 320 on the side near the gold fingers of the PCB board 1. When a PCB board 1 has multiple adjacent bases 2 along its length on the same surface, the ramp 320 on the top cover 3 facilitates the passage of high-speed cable groups over another base 2 in front of it, reducing the bending angle of the high-speed cable groups.

[0049] Example 6

[0050] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 5, as detailed below:

[0051] There is a gap 6 between the upper surface of the base 2 facing away from the gold fingers of the PCB board 1 and the lower surface of the top cover 3 facing away from the gold fingers of the PCB board 1. The height of the gap 6 is greater than the outer diameter of the ground wire 420. Within the gap 6, the base 2 and the top cover 3 are respectively provided with a wiring channel 7 connected to each compartment 210 and used to limit the high-speed cable 4. The top cover 3 cooperates with the base 2 to press the section of the high-speed cable 4 with the protective sleeve into the wiring channel 7. The wiring channel 7 is formed by the upper and lower combination of the groove on the lower surface of the top cover 3 and the groove on the upper surface of the base 2. The high-speed cable 4 passes into the wiring channel 7. The signal line 410 in the high-speed cable 4 then enters the compartment 210 connected to the wiring channel 7, and is first bent and then the protective layer (insulating medium) is removed before being soldered to the signal pad 110. The top cover 3 cooperates with the base 2 to press the section of the high-speed cable 4 with the protective sleeve into the wiring channel 7, thereby limiting and fixing the high-speed cable 4 and reducing the risk of the high-speed cable 4 loosening.

[0052] Example 7

[0053] like Figure 2 , Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 6, as detailed below:

[0054] All compartments 210 on the base 2 are arranged in rows along its length. The sides of the base 2 are lower than the middle along its width. The middle area of ​​the upper surface of the base 2 has first grooves 220 as ground wire welding positions between two adjacent compartments 210 and outside the two outermost compartments 210. The first grooves 220 are connected to the gaps 6. When the high-speed cable 4 is inserted into the compartment 210 through the wiring channel 7, the ground wire 420 in the high-speed cable 4 enters the first groove 220 through the gap 6 and is welded into the first groove 220. The lower surface of the upper cover 3 has a first protrusion 330 that extends into the first groove 220 at each corresponding first groove 220. The first protrusion 330 can serve as a welding point between the upper cover 3 and the base 2, and the first protrusion 330 can cooperate with the first groove 220 to position the upper cover 3 and the base 2.

[0055] The upper surface of the base 2 has a slope 230 in the middle area on the side away from the high-speed cable 4. The slope 230 corresponds to the ramp 320. The slope 230 between two adjacent compartments 210 and on the slope 230 outside the two outermost compartments 210 are respectively provided as welding positions for the upper cover. The two ends of the second groove 240 extend out of the slope 230. The lower surface of the upper cover 3 has a second protrusion 340 that extends into the second groove 240 at each corresponding second groove 240. The second protrusion 340 can serve as a welding point between the upper cover 3 and the base 2. On the other hand, the second protrusion 340 and the second groove 240 cooperate to position the upper cover 3 and the base 2.

[0056] The lower surface of the upper cover 3 has a third protrusion 350 in the area corresponding to the slope 320. The second protrusion 340 is located between the first protrusion 330 and the third protrusion 350. The upper surface of the base 2 has a third groove 250 to accommodate the third protrusion 350. The lengths of the third protrusion 350 and the third groove 250 cover all the compartments 210 on the base 2. The third protrusion 350 can serve as a welding point between the upper cover 3 and the base 2. On the other hand, the third protrusion 350 and the third groove 250 can cooperate to position the upper cover 3 and the base 2.

[0057] Example 8

[0058] An optical module includes a high-speed cable welding upper and lower separate fixing structure as described in any of embodiments 1 to 7.

[0059] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A high speed cable welding upper and lower split fixing structure, characterized in that, include: A PCB board (1) is fixed with at least one grounded base (2) along its length. Each base (2) is fixed with a top cover (3). The base (2) has multiple rows of independent compartments (210) in the covered area of ​​the top cover (3). The PCB board (1) has two signal pads (110) in the area enclosed by each compartment (210). The signal lines (410) of the multiple high-speed cables (4) in each high-speed cable group enter different compartments (210) on one of the bases (2) and are soldered to the signal pads (110). The top cover (3) cooperates with the base (2) to press the section of the high-speed cable (4) with a protective sleeve. The ground wire (420) of the high-speed cable (4) is soldered to the base (2).

2. The high speed cable welding upper and lower split fixing structure according to claim 1, characterized in that, On the top cover (3), through holes (310) are opened in the area above the metal foil (430) in each high-speed cable (4), and solder blocks (5) are inserted into the through holes (310) to weld the top cover (3) to the metal foil (430) in the high-speed cable (4).

3. The high-speed cable welding upper and lower separated fixing structure according to claim 1, characterized in that, The PCB board (1) has multiple grounding pads (120) at different locations, and each base (2) is soldered to one of the grounding pads (120) on the PCB board (1).

4. The high speed cable welding upper and lower split fixing structure according to claim 1, characterized in that, The top cover (3) is made of tin-plated copper, the base (2) is made of tin-plated copper, and the top cover (3) and the base (2) are fixed together by welding.

5. The high-speed cable welding upper and lower split fixing structure according to any one of claims 1-4, characterized in that, The top cover (3) has a ramp (320) on the side of the gold finger of the PCB board (1).

6. The high-speed cable welding upper and lower separated fixing structure according to claim 1, characterized in that, There is a gap (6) between the upper surface of the base (2) away from the gold finger side of the PCB board (1) and the lower surface of the cover (3) away from the gold finger side of the PCB board (1). The height of the gap (6) is greater than the outer diameter of the ground wire (420). There is a wiring channel (7) in the gap (6) between the base (2) and the cover (3) for each compartment (210) to communicate with the compartment (210) and to limit the high-speed cable (4). The cover (3) cooperates with the base (2) to press the section of the high-speed cable (4) with the protective sleeve into the wiring channel (7).

7. The high-speed cable welding upper and lower separated fixing structure according to claim 6, characterized in that, All compartments (210) on the base (2) are arranged in rows along its length. The two sides of the base (2) are lower than the middle along its width. The middle area of ​​the upper surface of the base (2) is provided with first grooves (220) as ground wire welding positions between two adjacent compartments (210) and outside the two outermost compartments (210). The first grooves (220) are connected to the gap (6). The ground wire (420) in the high-speed cable (4) is welded in the first groove (220). The lower surface of the cover (3) has a first protrusion (330) extending into the first groove (220) at each corresponding first groove (220).

8. The high speed cable welding upper and lower split fixing structure according to claim 7, characterized in that, The upper surface of the base (2) has a slope (230) in the middle area on the side away from the high-speed cable (4). The slope (230) between two adjacent compartments (210) and on the outer side of the two outermost compartments (210) are respectively provided as welding positions for the upper cover. The two ends of the second groove (240) extend out of the slope (230). The lower surface of the upper cover (3) has a second protrusion (340) that extends into the second groove (240) at each corresponding second groove (240).

9. The high speed cable welding upper and lower split fixing structure according to claim 8, characterized in that, The lower surface of the upper cover (3) has a third protrusion (350) in the area corresponding to the slope (320), the second protrusion (340) is located between the first protrusion (330) and the third protrusion (350), the upper surface of the base (2) has a third groove (250) for accommodating the third protrusion (350), and the lengths of the third protrusion (350) and the third groove (250) both cover all the compartments (210) on the base (2).

10. An optical module characterized by comprising: Including the high-speed cable welding upper and lower separated fixing structure as described in any one of claims 1 to 9.