On-chip integrated collimation optical device

Abstract

The utility model discloses an on-chip integrated collimation optical device, comprising a wafer, the surface of which is provided with a plurality of light-emitting areas arranged periodically; the adhesive layer covers the surface of the wafer, optical structures in one-to-one correspondence with the light-emitting areas are distributed on the outer side of the adhesive layer, the optical structures are used for collimating or collecting light beams emitted by the light-emitting areas, and the thickness T of the adhesive layer between the optical structures and the light-emitting areas is 10-500 microns; according to the on-chip integrated collimation optical device, through the innovative on-chip integrated design, the technical bottlenecks that a traditional collimation device is large in size, complex in alignment, high in cost and the like are solved, and remarkable breakthrough is achieved in the aspects of optical performance, production efficiency, application scenes and the like.

Description

An on-chip integrated collimating optical device Technical Field

[0001] This utility model relates to the field of optical device technology, and more specifically to an on-chip integrated collimating optical device. Background Technology

[0002] VCSEL, or Vertical Cavity Surface Emitting Laser, has advantages over traditional lasers, such as high photoelectric conversion efficiency, ease of integration, and low divergence angle, and is widely used in sensors, optical communications, and other fields.

[0003] Collimation and focusing of the light beam emitted from a light source are often achieved through lenses. After passing through a collimating lens, the light beam is formed into a collimated or small-angle beam, which can be applied to high-power laser processing, structured light 3D scanning, and other fields.

[0004] In current beam collimation or beam convergence scenarios, lenses (lens arrays) are usually placed behind the light source with a gap between them. This makes the thickness of the entire optical structure relatively large, and alignment and installation are also quite troublesome. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an on-chip integrated collimating optical device. Through innovative on-chip integration design, this on-chip integrated collimating optical device solves the technical bottlenecks of traditional collimating devices, such as large size, complex alignment, and high cost, and achieves significant breakthroughs in optical performance, production efficiency, and applicable scenarios.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An on-chip integrated collimating optical device, comprising:

[0008] A wafer, the surface of which is provided with several light-emitting areas arranged in a periodic manner;

[0009] An adhesive layer is applied to the surface of the wafer. Optical structures corresponding to the light-emitting areas are distributed on the outer side of the adhesive layer. The optical structures are used to collimate or converge the light beam emitted from the light-emitting areas. The thickness T of the adhesive layer between the optical structures and the light-emitting areas is 10-500 μm.

[0010] The adhesive layer further consists of several independently distributed columnar structures in each luminescent area.

[0011] Furthermore, the adhesive layer comprises at least two superimposed adhesive layers, each with a corresponding optical structure.

[0012] Furthermore, the thickness and refractive index of each adhesive layer are either the same or different.

[0013] Furthermore, the lens surface of the optical structure is either aspherical or spherical, and the lens diameter is 20-300 μm.

[0014] Furthermore, the adhesive layer is a resin or cured adhesive material, formed by imprinting, laser direct writing, photolithography or machining processes.

[0015] Furthermore, the refractive index of the adhesive layer is 1.4-2.0.

[0016] Furthermore, the light-emitting areas are arranged in a one-dimensional or two-dimensional periodic pattern according to coordinates.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. Compact structure and high integration: By directly integrating the optical structure onto the adhesive layer on the wafer surface, the gap between the traditional lens and the light source is eliminated, significantly reducing the overall thickness of the device and enabling a more miniaturized design. The adhesive layer thickness (10-500μm) can be flexibly adjusted, ensuring both the forming accuracy of the optical structure and adapting to the process requirements of uneven wafer surfaces.

[0019] 2. Simplified installation and alignment process: The optical structure and the light-emitting area correspond one-to-one and are arranged periodically, eliminating the need for a complicated external alignment process, which greatly reduces the difficulty and cost of assembly. Especially for arrayed light sources (such as VCSELs), this design can achieve batch integration and improve production efficiency.

[0020] 3. Precise and controllable optical performance: The refractive index (1.4-2.0) and thickness of the adhesive layer material can be adjusted in tandem. Combined with aspherical or spherical lenses (diameter 20-300μm), the divergence angle of the emitted light (2-12°) can be precisely controlled to meet the stringent requirements for beam quality in high-power laser processing, 3D scanning and other scenarios.

[0021] 4. Flexible process and optimized cost: The adhesive layer can be efficiently formed through processes such as imprinting, photolithography, laser direct writing or machining, which is compatible with existing semiconductor manufacturing processes. At the same time, the design of independent columnar structure can reduce material waste, or the use of multi-layer adhesive layer stacking technology (thickness and refractive index can be differentiated) can further expand the optical control dimensions, while taking into account both cost and performance.

[0022] 5. Adaptable to complex application scenarios: The one-dimensional or two-dimensional periodic arrangement of the light-emitting area, combined with the optical structure of the adhesive layer, can support a variety of beam distribution modes (such as dot array, linear array or area array), which are suitable for diverse fields such as optical communication, sensing, and medical imaging, significantly improving the versatility and market competitiveness of the device.

[0023] This invention solves the technical bottlenecks of traditional collimation devices, such as large size, complex alignment, and high cost, through innovative on-chip integrated design, and achieves significant breakthroughs in optical performance, production efficiency, and applicable scenarios. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0025] Figure 1 is a schematic diagram of the structure of an on-chip integrated collimating optical device (Example 1);

[0026] Figure 2 is a schematic diagram of the structure of an on-chip integrated collimating optical device (Example 2);

[0027] Figure 3 is a schematic diagram of the structure of an on-chip integrated collimating optical device (Example 3);

[0028] The diagram is labeled as follows: 1. Wafer; 2. Light-emitting area; 3. Adhesive layer; 4. Optical structure. Detailed Implementation

[0029] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0031] Example 1:

[0032] An on-chip integrated collimating optical device, as shown in Figure 1, includes:

[0033] Wafer 1, whose surface is provided with a number of periodically arranged light-emitting areas 2;

[0034] An adhesive layer 3 is applied to the surface of the wafer 1. Optical structures 4, corresponding to the light-emitting regions 2, are distributed on the outer side of the adhesive layer 3. The optical structures 4 are used to collimate or converge the light beam emitted from the light-emitting regions 2. The thickness T of the adhesive layer 3 between the optical structures 4 and the light-emitting regions 2 is 10-500 μm.

[0035] Preferably, the adhesive layer 3 is an integral structure, and several optical structures 4 are disposed on the integral structure.

[0036] Preferably, the lens surface of the optical structure 4 is aspherical or spherical, and the lens diameter is 20-300 μm.

[0037] Preferably, the adhesive layer 3 is a resin or curable adhesive material, formed by imprinting, laser direct writing, photolithography or machining processes;

[0038] Specifically, the adhesive layer 3 and the optical structure 4 on it can be manufactured by imprinting. The master pattern with the corresponding surface shape is processed by laser direct writing, photolithography or machining, and then the adhesive layer 3 and the optical structure 4 on it are manufactured by filling the entire wafer 1 with adhesive, imprinting, curing, demolding and other processes.

[0039] Preferably, the refractive index of the adhesive layer 3 is 1.4-2.0.

[0040] Preferably, the light-emitting areas 2 are arranged in a one-dimensional or two-dimensional periodic pattern according to coordinates.

[0041] In this embodiment, the on-chip integrated collimating optical device mainly includes two parts: a wafer 1 and a photoresist layer 3. The wafer 1 is provided with a plurality of light-emitting areas 2, which are arranged in a one-dimensional or two-dimensional periodic manner according to a certain coordinate. The photoresist layer 3 is closely arranged on the light-emitting areas 2. The outer side of the photoresist layer 3 is distributed with optical structures 4 for collimation and beam convergence. The optical structures 4 correspond one-to-one with the light-emitting areas 2. After the light emitted from the light-emitting areas 2 passes through the photoresist layer 3, it is collimated or converged on the side of the optical structure 4 before being emitted. The divergence angle of the light emitted from the light source after being collimated by the structure can reach 2-12°.

[0042] On the optical structure 4, one collimating lens corresponds to one light-emitting region 2 on wafer 1. The spacing between the collimating lenses is consistent with the spacing P of the light-emitting regions 2. The lens diameter is generally 20-300 μm. The effective optical structure 4 and the light-emitting region 2 are often not seamless. There is often a certain thickness T of adhesive layer 3, which is generally 10-500 μm. This thickness can serve as an adjustment degree of freedom, and together with the lens surface shape of the structure area and the refractive index of the adhesive layer 3 material, it can achieve precise control of the divergence angle of the emitted light. On the other hand, the top surface of the light-emitting region 2 on wafer 1 is not necessarily flat. A certain adhesive thickness helps to make the imprinting of the optical structure 4 smoother and avoids imprinting crooked due to the uneven top surface of the light-emitting region 2.

[0043] Example 2:

[0044] An on-chip integrated collimating optical device, as shown in Figure 2, includes:

[0045] Wafer 1, whose surface is provided with a number of periodically arranged light-emitting areas 2;

[0046] An adhesive layer 3 is applied to the surface of the wafer 1. Optical structures 4, corresponding to the light-emitting regions 2, are distributed on the outer side of the adhesive layer 3. The optical structures 4 are used to collimate or converge the light beam emitted from the light-emitting regions 2. The thickness T of the adhesive layer 3 between the optical structures 4 and the light-emitting regions 2 is 10-500 μm.

[0047] Preferably, the adhesive layer 3 is a plurality of columnar structures independently distributed in each light-emitting area 2.

[0048] Preferably, the lens surface of the optical structure 4 is aspherical or spherical, and the lens diameter is 20-300 μm.

[0049] Preferably, the refractive index of the adhesive layer 3 is 1.4-2.0.

[0050] Preferably, the light-emitting areas 2 are arranged in a one-dimensional or two-dimensional periodic pattern according to coordinates.

[0051] As shown in Figure 2, the main difference between Example 2 and Example 1 is that the optical structure 4 is not attached to a whole adhesive layer 3, but is an independent adhesive. Its main advantage is that it can save raw materials.

[0052] During fabrication, this structure is slightly more complex than that of Example 1. When spin-coating the curing adhesive onto wafer 1, a mask is first used to expose it. After exposure, a developer is used to remove the exposed portion of the curing adhesive to form a fence corresponding to each light-emitting area 2. Then, the adhesive is applied to the light-emitting areas 2 between the fences according to the normal process, and the optical structure 4 on the adhesive layer 3 is imprinted. After curing and demolding, the curing adhesive on the fence is removed using a developer.

[0053] Example 3:

[0054] An on-chip integrated collimating optical device, as shown in Figure 3, includes:

[0055] Wafer 1, whose surface is provided with a number of periodically arranged light-emitting areas 2;

[0056] An adhesive layer 3 is applied to the surface of the wafer 1. Optical structures 4, corresponding to the light-emitting regions 2, are distributed on the outer side of the adhesive layer 3. The optical structures 4 are used to collimate or converge the light beam emitted from the light-emitting regions 2. The thickness T of the adhesive layer 3 between the optical structures 4 and the light-emitting regions 2 is 10-500 μm.

[0057] Preferably, the adhesive layer 3 comprises at least two superimposed adhesive layers 3, and each adhesive layer 3 is provided with a corresponding optical structure 4.

[0058] Preferably, the thickness and refractive index of each adhesive layer 3 are the same or different.

[0059] Preferably, the lens surface of the optical structure 4 is aspherical or spherical, and the lens diameter is 20-300 μm.

[0060] Preferably, the adhesive layer 3 is a resin or curable adhesive material, formed by imprinting, laser direct writing, photolithography or machining processes.

[0061] Preferably, the refractive index of the adhesive layer 3 is 1.4-2.0.

[0062] Preferably, the light-emitting areas 2 are arranged in a one-dimensional or two-dimensional periodic pattern according to coordinates.

[0063] Example 3, as shown in Figure 3, differs from Example 1 mainly in that a new adhesive layer 32 is imprinted on the adhesive layer 3-1 of the existing optical structure 4. The thickness and refractive index of adhesive layer 3-1 and adhesive layer 32 can be different. Optical structure 4-1 and optical structure 4-2 work together to achieve collimation and convergence of the emitted light.

[0064] Beneficial effects:

[0065] 1. Compact structure and high integration: By directly integrating the optical structure 4 onto the adhesive layer 3 on the surface of wafer 1, the gap between the traditional lens and the light source is eliminated, significantly reducing the overall thickness of the device and achieving a more miniaturized design. The thickness of the adhesive layer 3 (10-500μm) can be flexibly adjusted, ensuring the forming accuracy of the optical structure 4 while adapting to the process requirements of uneven wafer 1 surface.

[0066] 2. Simplified installation and alignment process: The optical structure 4 corresponds one-to-one with the light-emitting area 2 and is arranged periodically, eliminating the need for a complex external alignment process. This significantly reduces assembly difficulty and cost. Especially for arrayed light sources (such as VCSELs), this design can achieve batch integration and improve production efficiency.

[0067] 3. Precise and controllable optical performance: The refractive index (1.4-2.0) and thickness of the adhesive layer 3 material can be adjusted in tandem. Combined with aspherical or spherical lenses (diameter 20-300μm), the divergence angle of the emitted light (2-12°) can be precisely controlled to meet the stringent requirements for beam quality in high-power laser processing, 3D scanning and other scenarios.

[0068] 4. Flexible process and optimized cost: The adhesive layer 3 can be efficiently formed through processes such as imprinting, photolithography, laser direct writing, or machining, and is compatible with existing semiconductor manufacturing processes. The independent fence structure design in Example 2 can reduce material waste, and the multilayer adhesive layer 3 stacking technology in Example 3 (thickness and refractive index can be differentiated) further expands the optical control dimensions, while taking into account both cost and performance.

[0069] 5. Adaptable to complex application scenarios: The one-dimensional or two-dimensional periodic arrangement of the light-emitting area 2, combined with the optical structure 4 of the adhesive layer 3, can support a variety of beam distribution modes (such as dot array, linear array or area array), which are suitable for diverse fields such as optical communication, sensing, and medical imaging, significantly improving the versatility and market competitiveness of the device.

[0070] This invention solves the technical bottlenecks of traditional collimation devices, such as large size, complex alignment, and high cost, through innovative on-chip integrated design, and achieves significant breakthroughs in optical performance, production efficiency, and applicable scenarios.

[0071] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. An on-chip integrated collimating optical device, characterized in that, include: A wafer, the surface of which is provided with several light-emitting areas arranged in a periodic manner; An adhesive layer is applied to the surface of the wafer. Optical structures corresponding to the light-emitting areas are distributed on the outer side of the adhesive layer. The optical structures are used to collimate or converge the light beam emitted from the light-emitting areas. The thickness T of the adhesive layer between the optical structures and the light-emitting areas is 10-500 μm.

2. The on-chip integrated collimating optical device according to claim 1, characterized in that: The adhesive layer consists of several independently distributed columnar structures in each luminescent area.

3. The on-chip integrated collimating optical device according to claim 1, characterized in that: The adhesive layer comprises at least two superimposed adhesive layers, each with a corresponding optical structure.

4. The on-chip integrated collimating optical device according to claim 3, characterized in that: The thickness and refractive index of each adhesive layer may be the same or different.

5. The on-chip integrated collimating optical device according to claim 1, characterized in that: The lens surface of the optical structure is either aspherical or spherical, and the lens diameter is 20-300 μm.

6. The on-chip integrated collimating optical device according to claim 1, characterized in that: The adhesive layer is a resin or cured adhesive material, formed by imprinting, laser direct writing, photolithography or machining processes.

7. The on-chip integrated collimating optical device according to claim 1, characterized in that: The refractive index of the adhesive layer is 1.4-2.

0.

8. The on-chip integrated collimating optical device according to claim 1, characterized in that: The light-emitting areas are arranged in a one-dimensional or two-dimensional periodic pattern according to coordinates.

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