Constant-temperature damping device of crystal oscillator
By combining electromagnet suspension and damping fluid for vibration reduction, the problem of poor vibration reduction effect of metal springs under temperature changes is solved, achieving rapid response to high-frequency vibrations and temperature stability, thereby improving the frequency stability and long-term reliability of the crystal oscillator.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU ANSHENGHUA ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-01
AI Technical Summary
In the prior art, the expansion or contraction of metal spring damping devices when the temperature changes affects the damping effect, and they cannot respond quickly to high-frequency or sudden vibrations, resulting in a decrease in the frequency stability and long-term reliability of the crystal oscillator.
Electromagnets are used as a buffer component, combined with damping fluid and a cooling system. The main unit is suspended by the magnetic force of the electromagnets, the damping fluid absorbs vibration energy, and the temperature is controlled by an air supply fan and a spray system to ensure temperature stability.
It achieves rapid response to high-frequency or sudden vibrations, maintains the stability and frequency accuracy of the oscillator, and improves the compatibility of the temperature control system and the long-term reliability of the device.
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Figure CN224191909U_ABST
Abstract
Description
A temperature-controlled vibration damping device for a crystal oscillator Technical Field
[0001] This utility model relates to the field of crystal oscillator technology, and in particular to a constant temperature vibration damping device for crystal oscillators. Background Technology
[0002] Crystal oscillators are widely used in communications, measurement, navigation, and other fields. Their performance is highly dependent on the external environment, especially temperature changes and mechanical vibrations. Temperature changes cause the internal vibration frequency of the crystal to drift, affecting the stability of the oscillator; simultaneously, external vibrations can also interfere with the crystal's frequency, leading to system instability. Therefore, designing efficient temperature control and vibration damping devices is crucial for maintaining the high accuracy and reliability of crystal oscillators. Temperature control and vibration damping devices require precise temperature control and effective vibration isolation, typically achieved through a combination of thermal control systems and vibration damping technologies. Common techniques include using temperature-controlled boxes and heaters to maintain a constant temperature, employing springs, rubber pads, or hydraulic systems for vibration damping, or utilizing electromagnets and feedback control systems to provide active vibration damping. However, these technologies still face challenges, such as the slow response of temperature control systems to environmental changes and the poor performance of vibration damping systems in complex vibration environments. In the future, with the application of intelligent temperature control systems, integrated design, and new materials, temperature control and vibration damping technology for crystal oscillators is expected to be further optimized, improving its stability and reliability to meet the demands of higher precision applications.
[0003] However, in practical applications of existing solutions, some rely on springs for vibration damping. Springs are highly sensitive to temperature changes; metal springs may expand or contract due to temperature fluctuations, affecting the damping effect and potentially causing fluctuations in the operating temperature of the crystal oscillator, thus impacting its frequency stability. Secondly, the damping effect of springs may not respond quickly to rapidly changing vibrations, especially in high-frequency or sudden vibrations. In such cases, the spring's response is slow and may fail to absorb vibrations effectively, affecting the crystal oscillator's accuracy. Furthermore, prolonged use can lead to fatigue or wear on the springs, causing a gradual decline in their damping performance and affecting the long-term stability and reliability of the device.
[0004] Therefore, this utility model provides a constant temperature vibration damping device for a crystal oscillator. Summary of the Invention
[0005] The purpose of this invention is to solve the problem that the use of metal springs for buffering in the prior art may expand or contract due to temperature rise or fall, thus affecting the shock absorption effect, and proposes a constant temperature shock absorption device for crystal oscillators.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A temperature-controlled vibration damping device for a crystal oscillator includes a buffer box and further includes:
[0008] The lid is detachably attached to the inside of the top of the buffer box;
[0009] The buffer assembly is located around the inner wall of the buffer box;
[0010] The storage component is located inside the buffer tank and is filled with damping fluid on all sides.
[0011] The oscillation host is located inside the storage component;
[0012] Cooling components are located at the bottom of the buffer tank;
[0013] The spray component is located inside the cooling component on one side, with its water outlet located at the top of the air inlet of the cooling component.
[0014] The damping fluid delivery assembly is located inside the cooling assembly on the side away from the spray assembly.
[0015] As a preferred technical solution of this application, the buffer assembly includes an electromagnet fixed around the inner wall of the buffer box and an electrical connector fixed to the outer wall of the buffer box. The electrical connector passes through the side wall of the buffer box and is fixedly connected to the electromagnet. The other end of the electrical connector is connected to an external power source.
[0016] As a preferred technical solution of this application, the storage component includes a main unit suspended in the damping fluid inside the buffer tank. Except for the top wall, the main unit is fixedly connected to iron plates corresponding to electromagnets on all four sides. The main unit is engaged with the oscillation host.
[0017] As a preferred technical solution of this application, the cooling assembly includes a cooling box fixed to the bottom of the buffer box, a uniformly distributed air supply fan fixedly connected to the outer wall of the cooling box, and uniformly distributed heat dissipation holes opened inside the cooling box, the heat dissipation holes penetrating the cooling box.
[0018] As a preferred technical solution of this application, the spray assembly includes a second delivery pump fixed inside one side of the cooling box, a water pumping pipe fixedly connected to the top outer side of the second delivery pump, a diversion pipe fixedly connected to the bottom outer side of the second delivery pump, and an atomizing nozzle fixedly connected to the bottom of the diversion pipe. The atomizing nozzle is located at the top of the air inlet of the air supply fan.
[0019] As a preferred technical solution of this application, the damping fluid delivery assembly includes a flow hole opened inside the cooling tank and located between the heat dissipation holes, and a first delivery pump is fixedly connected inside the water inlet end of the flow hole.
[0020] Compared with the prior art, this utility model provides a constant temperature vibration damping device for a crystal oscillator, which has the following beneficial effects:
[0021] 1. The constant temperature damping device for a crystal oscillator described in this utility model uses an electromagnet to dampen and buffer the oscillator host, which can accurately control the damping effect, quickly respond to high frequency or sudden vibrations, maintain the stability of the oscillator, and improve frequency stability and long-term reliability. Unlike traditional damping methods, the electromagnet is not affected by temperature changes, is more compatible with temperature control systems, and has a compact design that is easy to adjust.
[0022] 2. The constant temperature damping device for a crystal oscillator described in this utility model utilizes the heat generated by the electromagnet during use, while simultaneously cooling the damping fluid through heat dissipation holes. At the same time, a cooling water from an atomizing nozzle is sprayed into the heat dissipation holes via an air supply fan, thereby accelerating the cooling rate of the damping fluid. This control of the temperature inside the buffer tank helps maintain temperature stability, preventing temperature fluctuations from affecting the oscillator's accuracy. This design improves temperature control accuracy, prevents overheating, optimizes system stability and energy efficiency, and ensures coordination between damping and temperature control. Attached Figure Description
[0023] Figure 1 is a three-dimensional structural schematic diagram of this utility model;
[0024] Figure 2 is a three-dimensional structural schematic diagram of this utility model;
[0025] Figure 3 is a schematic diagram of the internal structure of the buffer box in this utility model;
[0026] Figure 4 is a schematic diagram showing the internal structure of the buffer box in this utility model.
[0027] Figure 5 is a cross-sectional structural diagram of the buffer box in this utility model.
[0028] Figure 6 is a magnified view of part A in Figure 5;
[0029] Figure 7 is a schematic cross-sectional view of the buffer box in this utility model.
[0030] Figure 8 is a schematic cross-sectional view of the buffer box in this utility model.
[0031] In the picture:
[0032] 1. Buffer box; 11. Box cover; 12. Electromagnet; 13. Wire connector; 2. Main unit box; 21. Iron plate; 22. Vibrating main unit; 3. Cooling box; 31. Air supply fan; 32. Heat dissipation hole; 33. Flow hole; 34. First delivery pump; 35. Second delivery pump; 36. Water suction pipe; 37. Diverter pipe; 38. Atomizing nozzle. Detailed Implementation
[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0034] Example:
[0035] Referring to Figures 1-8, a temperature-controlled vibration damping device for a crystal oscillator includes a buffer box 1, and further includes:
[0036] The lid 11 is detachably connected to the inside of the top of the buffer box 1. The buffer box 1 supports and limits the lid 11, and the lid 11 seals the top of the buffer box 1.
[0037] A buffer assembly is disposed around the inner wall of the buffer box 1, and is mounted on the buffer box 1 via the buffer assembly;
[0038] The storage component is located inside the buffer tank 1 and is filled with damping fluid on all sides. The storage component is stored in the buffer tank 1 and lifted by the buffer tank 1 so that the entire storage component is suspended in the damping fluid inside the buffer tank 1.
[0039] The oscillation host 22 is located inside the storage component, and the oscillation host 22 is stored through the storage component;
[0040] A cooling component is located at the bottom of the buffer tank 1. The buffer tank 1 is connected to the cooling component, which dissipates heat from the damping fluid inside the buffer tank 1.
[0041] The spray assembly is located inside the cooling assembly on one side. The cooling assembly delivers the atomized water sprayed by the spray assembly to the outside of the buffer tank 1. Its water outlet is located at the top of the air inlet of the cooling assembly. The spray assembly sprays atomized water into the cooling assembly to accelerate the cooling process.
[0042] The damping fluid delivery assembly is located inside the cooling assembly on the side away from the spray assembly. The cooling assembly fixes the damping fluid delivery assembly, and the damping fluid is delivered from one end to the other through the damping fluid delivery assembly, with cooling and heat dissipation treatment during the process.
[0043] The buffer assembly includes an electromagnet 12 fixed around the inner wall of the buffer box 1, which is supported and fixed by the buffer box 1, and an electrical connector 13 fixed to the outer wall of the buffer box 1, which is supported and fixed by the buffer box 1. The electrical connector 13 passes through the side wall of the buffer box 1 and is fixedly connected to the electromagnet 12. The other end of the electrical connector 13 is connected to an external power source, and external power is supplied into the electromagnet 12 through the electrical connector 13, thereby causing the electromagnet 12 to generate an attractive force.
[0044] The storage component includes a main unit 2 suspended in damping fluid inside a buffer tank 1. The buffer tank 1 stores the main unit 2. Except for the top wall, the main unit 2 has iron plates 21 corresponding to electromagnets 12 fixedly connected to its four sides. The main unit 2 supports and fixes the iron plates 21. The main unit 2 is engaged with the oscillating host 22 and stores the oscillating host 22. The strong magnetic force generated by the electromagnet 12 cooperates with the iron plates 21 to lift the entire storage component, thereby suspending it in the damping fluid. This can effectively reduce the frictional force of contact with the liquid, thereby reducing energy loss and heat generation. At the same time, the suspension height and stability of the main unit 2 can be flexibly controlled, thereby achieving a more precise vibration reduction effect. Moreover, the support of the damping fluid for the main unit 2 helps to isolate vibrations from the external environment.
[0045] The cooling assembly includes a cooling box 3 fixed to the bottom of the buffer box 1. The buffer box 1 supports and fixes the cooling box 3. The outer wall of the cooling box 3 is fixedly connected to a uniformly distributed air supply fan 31, which is supported and fixed by the cooling box 3. The cooling box 3 has uniformly distributed heat dissipation holes 32 inside, which penetrate the cooling box 3. The air supply fan 31 draws in external air and then delivers it into the heat dissipation holes 32. The heat dissipated by the external cold air and the inner wall of the heat dissipation holes 32 is exchanged with the air again, thereby cooling the damping fluid.
[0046] The spray assembly includes a second delivery pump 35 fixed inside one side of the cooling box 3. The second delivery pump 35 is supported and fixed by the cooling box 3. A water suction pipe 36 is fixedly connected to the top outer side of the second delivery pump 35 and is connected to an external water source. A diversion pipe 37 is fixedly connected to the bottom outer side of the second delivery pump 35. An atomizing nozzle 38 is fixedly connected to the bottom of the diversion pipe 37. The atomizing nozzle 38 is located at the top of the air inlet of the air supply fan 31. The second delivery pump 35 draws water from the external source through the water suction pipe 36 and then diverts it into the atomizing nozzle 38 through the diversion pipe 37. The atomizing nozzle 38 atomizes the cooling water and sprays it at high speed into the heat dissipation hole 32, where it adheres to the inner wall of the heat dissipation hole 32. When air flows over the surface, it accelerates the evaporation of the cooling water and absorbs the heat on the heat dissipation hole 32, thereby accelerating the cooling speed of the damping fluid.
[0047] The damping fluid delivery assembly includes a flow hole 33 located inside the cooling tank 3 and between the heat dissipation holes 32. A first delivery pump 34 is fixedly connected inside the water inlet of the flow hole 33. The damping fluid inside the buffer tank 1 is drawn by the first delivery pump 34 through the side of the flow hole 33 away from the first delivery pump 34, and then flows towards the side closer to the first delivery pump 34. During the flow, it passes around the heat dissipation holes 32, thereby transferring the heat in the damping fluid to the inner wall of the heat dissipation holes 32.
[0048] Specifically, when using the constant temperature damping device of this crystal oscillator: first, place the oscillator host 22 into the host box 2, then fix the top and bottom of the host box 2 to seal the inside of the host box 2, then place the host box 2 along with the oscillator host 22 into the damping fluid in the buffer box 1, and then put the box cover 11 into the buffer box 1 to seal the buffer box 1.
[0049] Connect the external power supply cable to the wire connector 13 to energize the electromagnet 12, causing the electromagnet 12 to generate magnetic force, which cooperates with the iron plate 21 to lift the main unit 2 as a whole and suspend it in the damping fluid. External vibrations are transmitted to the damping fluid inside the buffer box 1 through the buffer box 1. The damping fluid absorbs the vibration energy and provides additional shock absorption. At the same time, it reduces friction and makes the system run more smoothly.
[0050] During use, the electromagnet 12 generates heat, which heats the damping fluid. Simultaneously, the heat is transferred through the main unit 2 to the inside of the oscillating host 22. When the temperature is too low, the oscillating host 22 is heated. When the temperature is too high, the first delivery pump 34 and the flow hole 33 work together to make the damping fluid circulate in the buffer tank 1 and the flow hole 33. During the process, the heat is transferred to the inner wall of the heat dissipation hole 32. Then, the air supply fan 31 draws in the outside air and delivers it into the heat dissipation hole 32, where it exchanges heat with the inner wall of the heat dissipation hole 32 to remove the heat and achieve cooling.
[0051] When the temperature is too high, the second delivery pump 35 draws external cooling water through the water pumping pipe 36 and diverts it into the atomizing nozzle 38 through the diversion pipe 37. The cooling water is then atomized and sprayed out through the atomizing nozzle 38 and enters the heat dissipation hole 32, where it adheres to the inner wall of the heat dissipation hole 32. The heat on the heat dissipation hole 32 is then absorbed and carried away through the evaporation of the water, thereby accelerating the cooling process.
[0052] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A temperature-controlled vibration damping device for a crystal oscillator, comprising a buffer box (1), characterized in that, Also includes: The cover (11) is detachably connected to the inside of the top of the buffer box (1); the buffer assembly is located around the inner wall of the buffer box (1); the storage assembly is located inside the buffer box (1) and is filled with damping fluid around its perimeter; the oscillation host (22) is located inside the storage assembly; the cooling assembly is located at the bottom of the buffer box (1); the spray assembly is located inside the cooling assembly on one side, with its water outlet located at the top of the air inlet of the cooling assembly; and the damping fluid delivery assembly is located inside the cooling assembly on the side away from the spray assembly.
2. The temperature-controlled vibration damping device for a crystal oscillator according to claim 1, characterized in that, The buffer assembly includes an electromagnet (12) fixed around the inner wall of the buffer box (1) and an electrical connector (13) fixed to the outer wall of the buffer box (1). The electrical connector (13) passes through the side wall of the buffer box (1) and is fixedly connected to the electromagnet (12). The other end of the electrical connector (13) is connected to an external power source.
3. The temperature-controlled vibration damping device for a crystal oscillator according to claim 2, characterized in that, The storage component includes a main unit (2) suspended in the damping fluid inside the buffer tank (1). Except for the top wall, the main unit (2) is fixedly connected to an iron plate (21) corresponding to the electromagnet (12) on all four sides. The main unit (2) is engaged with the oscillation host (22).
4. The temperature-controlled vibration damping device for a crystal oscillator according to claim 3, characterized in that, The cooling assembly includes a cooling box (3) fixed to the bottom of the buffer box (1), and a uniformly distributed air supply fan (31) is fixedly connected to the outer wall of the cooling box (3). The cooling box (3) has uniformly distributed heat dissipation holes (32) inside, and the heat dissipation holes (32) penetrate the cooling box (3).
5. The temperature-controlled vibration damping device for a crystal oscillator according to claim 4, characterized in that, The spray assembly includes a second delivery pump (35) fixed inside one side of the cooling box (3). A water pumping pipe (36) is fixedly connected to the top outer side of the second delivery pump (35). A diversion pipe (37) is fixedly connected to the bottom outer side of the second delivery pump (35). An atomizing nozzle (38) is fixedly connected to the bottom of the diversion pipe (37). The atomizing nozzle (38) is located at the top of the air inlet of the air supply fan (31).
6. The temperature-controlled vibration damping device for a crystal oscillator according to claim 5, characterized in that, The damping fluid delivery assembly includes a flow hole (33) opened inside the cooling tank (3) and located between the gaps of the heat dissipation holes (32), and a first delivery pump (34) is fixedly connected inside the water inlet end of the flow hole (33).