Heat dissipation type multilayer circuit board
By using a three-dimensional heat dissipation channel and a split modular design for the multi-layer circuit board, the shortcomings of traditional multi-layer circuit board heat dissipation structures are solved, achieving efficient heat management and stable equipment operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEIZHOU YAOCHAO ELECTRONICS CO LTD
- Filing Date
- 2025-05-23
- Publication Date
- 2026-05-01
AI Technical Summary
Traditional multilayer circuit board heat dissipation structures are difficult to meet the heat dissipation requirements of high-frequency and highly integrated electronic devices. The heat dissipation holes have poor air flow and low heat exchange efficiency, and equipment vibration can easily lead to poor contact.
It adopts a three-dimensional heat dissipation channel design and embeds a split heat dissipation module, including thermally conductive ceramic pillars, spiral heat dissipation fins and axial ventilation channels. Combined with a composite heat dissipation substrate and elastic shock-absorbing bracket, it forms a modular heat dissipation structure and is controlled by a closed-loop system of graphene thermal conductive layer and temperature sensing chip.
It significantly improves heat dissipation efficiency, enhances airflow and equipment stability, reduces the risk of poor connection due to vibration, and achieves dynamic temperature control and efficient thermal management.
Smart Images
Figure CN224192132U_ABST
Abstract
Description
A heat-dissipating multilayer circuit board Technical Field
[0001] This utility model relates to the field of circuit boards, specifically a heat-dissipating multilayer circuit board. Background Technology
[0002] Multilayer circuit boards are circuit boards made up of three or more conductive layers stacked alternately with insulating dielectric layers. Interlayer interconnection is achieved through plated vias, blind vias, or buried vias. They are widely used in communications, computers, automotive electronics, and other fields. Their core advantages include high-density wiring, excellent electromagnetic compatibility, and smaller size.
[0003] As electronic devices develop towards higher frequencies and higher integration, the heat dissipation structure of traditional multilayer circuit boards can no longer meet the requirements. Existing technologies mainly have the following defects: traditional heat dissipation through holes adopt a simple cylindrical design, resulting in poor airflow and low heat exchange efficiency; the heat dissipation device is rigidly connected to the circuit board body, and equipment vibration can easily lead to poor contact; heat sinks are mostly planar structures, with limited effective heat dissipation area. Summary of the Invention
[0004] Therefore, the purpose of this utility model is to provide a heat-dissipating multilayer circuit board to solve the technical problem that the heat dissipation structure of traditional multilayer circuit boards cannot meet the current heat dissipation requirements.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat-dissipating multilayer circuit board, comprising a multilayer circuit board body, wherein a three-dimensional heat dissipation channel is provided inside the multilayer circuit board body, the three-dimensional heat dissipation channel penetrates the front and rear surfaces of the multilayer circuit board body and extends to the outside, and a split heat dissipation module is embedded in the three-dimensional heat dissipation channel; the split heat dissipation module includes a thermally conductive ceramic pillar, a heat dissipation fin group and a ventilation guide groove, the upper and lower ends of the thermally conductive ceramic pillar protrude from the surface of the multilayer circuit board body, the heat dissipation fin group is spirally distributed on the outer wall of the thermally conductive ceramic pillar, and the ventilation guide groove is provided through the thermally conductive ceramic pillar along the axial direction; a heat dissipation fan bracket is provided on the upper surface of the multilayer circuit board body, and a composite heat dissipation substrate is provided on the lower surface, the composite heat dissipation substrate comprising a graphene thermally conductive layer and corrugated heat dissipation fins.
[0006] By adopting the above technical solution, the three-dimensional heat dissipation channel set inside the multilayer circuit board body runs through the front and rear surfaces and extends to the outside, which can directly connect the heat exchange path between the inside and outside of the equipment, significantly improving heat dissipation efficiency. The introduction of the split heat dissipation module realizes the modular design of the heat dissipation structure. The two ends of the thermally conductive ceramic pillar protrude from the surface of the board body, which can quickly conduct internal heat to the external environment. At the same time, the spirally distributed heat dissipation fins maximize the heat dissipation surface area in a limited space, and together with the axially penetrating ventilation guide groove, a directional airflow channel is formed, which enhances the guidance of air flow.
[0007] Furthermore, the cross-section of the three-dimensional heat dissipation channel is distributed in a regular hexagonal honeycomb pattern, and adjacent three-dimensional heat dissipation channels are connected by micro heat conduction tapes.
[0008] By adopting the above technical solution, the three-dimensional heat dissipation channel with a regular hexagonal honeycomb distribution optimizes the uniformity of heat flow distribution through geometric symmetry, reducing the risk of local hot spots. At the same time, the mechanical stability of the honeycomb structure can reduce the deformation of the multilayer circuit board body under thermal stress.
[0009] Furthermore, the thermally conductive ceramic column is composed of two sections joined together, and the upper and lower ends are detachable by bolts.
[0010] By adopting the above technical solution, the thermally conductive ceramic column adopts a detachable structure with two sections spliced together, which facilitates the installation, replacement and maintenance of the split heat dissipation module and reduces the risk of overall heat dissipation system failure due to local damage.
[0011] Furthermore, the cooling fan bracket is fixed to a detachable end of the thermally conductive ceramic column by an elastic shock-absorbing bracket. The elastic shock-absorbing bracket includes a polyurethane damping block and a disc spring assembly, with the disc spring assembly arranged in a concentric circle array on one side of the polyurethane damping block.
[0012] By adopting the above technical solution, a multi-level buffer structure is formed by polyurethane damping blocks and concentric array of disc springs, which effectively absorbs the vibration energy generated during equipment operation and prevents the connection between the cooling fan frame and the heat-conducting ceramic column from becoming loose or having poor contact due to mechanical vibration.
[0013] Furthermore, the surface of the wavy heat dissipation fins is provided with a nano-coating, which is composed of a composite material of silicon carbide and aluminum nitride.
[0014] By adopting the above technical solution, the wave-shaped heat dissipation fins increase the contact area with air through a unique curved surface design, thereby enhancing the natural convection heat dissipation effect. At the same time, the silicon carbide-aluminum nitride nano-coating covering the surface utilizes the high thermal conductivity and emissivity of the composite material to further enhance the heat dissipation capacity of the fins. This nano-coating can effectively reduce the thermal resistance of the fin surface and accelerate the transfer of heat to the environment.
[0015] Furthermore, a temperature sensing chip is embedded in the graphene thermal conductive layer, and the temperature sensing chip and the cooling fan on the cooling fan bracket form a closed-loop control system through a PID controller.
[0016] By adopting the above technical solution, the temperature sensing chip embedded in the graphene thermal conductive layer can monitor the temperature changes of key areas of the multilayer circuit board in real time. At the same time, it forms a dynamic closed-loop temperature control system by linking the PID controller with the heat dissipation fan bracket.
[0017] In summary, the present invention has the following main advantages:
[0018] 1. This utility model optimizes the heat dissipation path through the three-dimensional heat dissipation channel inside the multi-layer circuit board body and the split heat dissipation module. The three-dimensional heat dissipation channel adopts a regular hexagonal honeycomb distribution and forms a heat conduction network through interconnection of micro heat conduction tapes, thereby improving the uniformity of heat diffusion. The heat conduction ceramic pillars of the split heat dissipation module protrude from the board surface at both ends, combined with spiral heat dissipation fin groups and axial ventilation guide grooves, to enhance heat conduction and convection efficiency.
[0019] 2. This utility model integrates a graphene thermal conductive layer and a corrugated heat dissipation fin through a composite heat dissipation substrate. The surface silicon carbide-aluminum nitride nano-coating enhances heat dissipation capacity and resists environmental corrosion. The elastic shock-absorbing bracket uses polyurethane damping blocks and disc springs to absorb vibration energy, preventing poor contact between the heat dissipation fan bracket and the thermally conductive ceramic column due to vibration, thus ensuring the stability of the heat dissipation structure. In addition, the temperature sensing chip embedded in the graphene thermal conductive layer is linked with the PID controller to form a closed-loop temperature control system, dynamically adjusting the speed of the heat dissipation fan to adapt to different heat load scenarios and avoid energy waste or insufficient heat dissipation. Attached Figure Description
[0020] Figure 1 is a three-dimensional structural diagram of this utility model;
[0021] Figure 2 is a schematic diagram of the main structure of this utility model;
[0022] Figure 3 is an enlarged structural schematic diagram of point A in Figure 2 of this utility model.
[0023] In the diagram: 1. Multilayer circuit board body; 2. Three-dimensional heat dissipation channel; 3. Split heat dissipation module; 301. Thermally conductive ceramic pillar; 302. Heat dissipation fin assembly; 4. Heat dissipation fan bracket; 5. Composite heat dissipation substrate; 6. Miniature heat dissipation tape; 7. Elastic shock absorption bracket; 701. Polyurethane damping block; 702. Disc spring assembly. Detailed Implementation
[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0025] In this embodiment:
[0026] A heat-dissipating multilayer circuit board, as shown in Figures 1-3, includes a multilayer circuit board body 1. The multilayer circuit board body 1 has a three-dimensional heat dissipation channel 2 inside, which penetrates the front and rear surfaces of the multilayer circuit board body 1 and extends to the outside. A split-type heat dissipation module 3 is embedded within the three-dimensional heat dissipation channel 2. The split-type heat dissipation module 3 includes a thermally conductive ceramic pillar 301, a heat dissipation fin assembly 302, and a ventilation guide groove. The upper and lower ends of the thermally conductive ceramic pillar 301 protrude from the surface of the multilayer circuit board body 1. The heat dissipation fin assembly 302 is spirally distributed on the outer wall of the thermally conductive ceramic pillar 301. The ventilation guide groove is axially arranged along the thermally conductive ceramic pillar 301. A heat dissipation fan bracket 4 is provided on the upper surface of the multilayer circuit board body 1, and a composite heat dissipation substrate 5 is provided on the lower surface. The composite heat dissipation substrate 5 includes a graphene thermally conductive layer and corrugated heat dissipation fins. The three-dimensional heat dissipation channel 2 inside the circuit board body 1 runs through the front and rear surfaces and extends to the outside, which can directly connect the heat exchange path between the inside and outside of the equipment, significantly improving heat dissipation efficiency. The introduction of the split heat dissipation module 3 realizes the modular design of the heat dissipation structure. The thermally conductive ceramic pillars 301 protrude from the board surface at both ends, which can quickly conduct internal heat to the external environment. At the same time, the spirally distributed heat dissipation fin group 302 maximizes the heat dissipation surface area in a limited space. Combined with the axially penetrating ventilation guide groove, it forms a directional airflow channel, enhancing the guidance of airflow. In addition, the coordinated arrangement of the heat dissipation fan bracket 4 and the composite heat dissipation substrate 5 can quickly transfer heat to the wave-shaped heat dissipation fins through the efficient thermal conductivity of the graphene thermal conductive layer. Combining the dual mechanisms of active air cooling and passive heat dissipation, it effectively reduces the temperature concentration problem in the core area.
[0027] Referring to Figures 1, 2, and 3, the cross-section of the three-dimensional heat dissipation channel 2 is distributed in a regular hexagonal honeycomb pattern. Adjacent three-dimensional heat dissipation channels 2 are connected by micro heat conduction tapes 6. The regular hexagonal honeycomb distribution of the three-dimensional heat dissipation channel 2 optimizes the uniformity of heat flow distribution through geometric symmetry, reducing the risk of local hot spots. At the same time, the mechanical stability of the honeycomb structure can reduce the deformation of the multilayer circuit board body 1 under thermal stress. Adjacent channels are connected by micro heat conduction tapes 6 to form an interconnected three-dimensional heat conduction network, further improving the heat diffusion efficiency between channels. The flexible connection characteristics of the micro heat conduction tapes 6 can alleviate stress concentration caused by the difference in the thermal expansion coefficient of materials and prevent channel structure cracking.
[0028] Referring to Figures 1, 2, and 3, the thermally conductive ceramic pillar 301 is composed of two sections joined together, with the upper and lower ends connected by bolts to form a detachable structure. The detachable structure of the thermally conductive ceramic pillar 301 facilitates the installation, replacement, and maintenance of the split-type heat dissipation module 3, reducing the risk of overall heat dissipation system failure due to local damage. At the same time, the bolt connection method provides a flexible assembly solution while ensuring mechanical strength, allowing for the selection of appropriate ceramic pillar materials or sizes for different heat dissipation needs. For example, in high-frequency scenarios, it can be replaced with ceramic materials with lower dielectric loss, thereby balancing heat dissipation performance and signal integrity.
[0029] Referring to Figures 1, 2, and 3, the cooling fan bracket 4 is fixed to the detachable end of the thermally conductive ceramic column 301 by an elastic shock-absorbing bracket 7. The elastic shock-absorbing bracket 7 includes a polyurethane damping block 701 and a disc spring assembly 702. The disc spring assembly 702 is arranged in a concentric circle array on one side of the polyurethane damping block 701. The polyurethane damping block 701 and the concentric circle array of disc spring 702 form a multi-level buffer structure, which effectively absorbs the vibration energy generated during equipment operation and prevents the connection between the cooling fan bracket 4 and the thermally conductive ceramic column 301 from becoming loose or having poor contact due to mechanical vibration. At the same time, this design reduces the risk of impact damage to the solder joints and circuits of the multilayer circuit board body 1 by dispersing vibration stress. The high damping characteristics of polyurethane material can suppress the transmission of high-frequency vibration, while the concentric circle layout of the disc spring assembly provides uniform elastic support in a limited space, further ensuring the stability of the cooling fan operation and avoiding noise or efficiency reduction problems caused by vibration.
[0030] Referring to Figures 1, 2, and 3, the surface of the wavy heat sink fins is coated with a nano-coating composed of silicon carbide and aluminum nitride composite materials. The wavy heat sink fins increase the contact area with air through a unique curved surface design, enhancing the natural convection heat dissipation effect. At the same time, the silicon carbide-aluminum nitride nano-coating covering the surface utilizes the high thermal conductivity and emissivity of the composite material to further improve the heat dissipation capacity of the fins. This nano-coating can effectively reduce the thermal resistance of the fin surface, accelerate the transfer of heat to the environment, and its chemical stability can resist the erosion of the fins by oxidizing or corrosive environments, extending the service life of the heat sink substrate.
[0031] Referring to Figures 1, 2, and 3, a temperature sensing chip is embedded in the graphene thermal conductive layer. The temperature sensing chip and the cooling fan on the cooling fan bracket 4 form a closed-loop control system through a PID controller. The temperature sensing chip embedded in the graphene thermal conductive layer can monitor the temperature changes of key areas of the multilayer circuit board body 1 in real time. At the same time, through the linkage between the PID controller and the cooling fan bracket 4, a dynamic closed-loop temperature control system is formed, which can automatically adjust the fan speed according to the actual heat load, avoiding the energy waste or insufficient heat dissipation problems caused by traditional fixed power heat dissipation solutions. The PID control algorithm accurately eliminates temperature fluctuations through the synergistic effect of proportional, integral, and derivative components, ensuring that the equipment can maintain a stable operating temperature under transient high heat loads.
[0032] The implementation principle of this embodiment is as follows: Based on the structural optimization of the multilayer circuit board body 1, efficient heat dissipation is achieved by setting a regular hexagonal honeycomb three-dimensional heat dissipation channel 2 inside and embedding a split heat dissipation module 3 in the channel. The split heat dissipation module 3 includes a thermally conductive ceramic pillar 301, a spirally distributed heat dissipation fin group 302 and an axially penetrating ventilation guide groove. The two ends of the thermally conductive ceramic pillar 301 protrude from the surface of the board body to facilitate heat conduction. The upper surface of the multilayer circuit board body 1 is equipped with a heat dissipation fan bracket 4 through an elastic shock-absorbing bracket 7, and the lower surface is provided with a composite heat dissipation substrate 5. The elastic shock-absorbing bracket 7 is composed of a polyurethane damping block 701 and a concentric array of disc spring groups 702, which can buffer the impact of vibration. The composite heat dissipation substrate 5 integrates a graphene thermally conductive layer and a wave-shaped heat dissipation fin. The temperature sensing chip is embedded in the graphene thermally conductive layer and linked with the heat dissipation fan bracket 4 to form a closed-loop temperature control system. Through the honeycomb interconnection structure of the three-dimensional heat dissipation channel 2, the spiral guide design of the split module and the synergistic effect of the elastic shock-absorbing components, rapid heat diffusion and stable operation of the equipment are achieved.
[0033] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.
Claims
1. A heat-dissipating multilayer circuit board, characterized in that: The system includes a multi-layer circuit board body (1), which has a three-dimensional heat dissipation channel (2) inside. The three-dimensional heat dissipation channel (2) penetrates the front and rear surfaces of the multi-layer circuit board body (1) and extends to the outside. The three-dimensional heat dissipation channel (2) is embedded with a split heat dissipation module (3). The split heat dissipation module (3) includes a thermally conductive ceramic pillar (301), a heat dissipation fin group (302), and a ventilation guide groove. The upper and lower ends of the thermally conductive ceramic pillar (301) protrude from the surface of the multi-layer circuit board body (1). The heat dissipation fin group (302) is spirally distributed on the outer wall of the thermally conductive ceramic pillar (301). The ventilation guide groove is axially arranged along the thermally conductive ceramic pillar (301). The upper surface of the multi-layer circuit board body (1) is provided with a heat dissipation fan bracket (4), and the lower surface is provided with a composite heat dissipation substrate (5). The composite heat dissipation substrate (5) includes a graphene thermally conductive layer and a wave-shaped heat dissipation fin.
2. The heat-dissipating multilayer circuit board according to claim 1, characterized in that: The cross-section of the three-dimensional heat dissipation channel (2) is distributed in a regular hexagonal honeycomb pattern, and adjacent three-dimensional heat dissipation channels (2) are connected by a micro heat conduction tape (6).
3. The heat-dissipating multilayer circuit board according to claim 1, characterized in that: The thermally conductive ceramic column (301) is composed of two sections spliced together, and the upper and lower ends are detachable by bolts.
4. The heat-dissipating multilayer circuit board according to claim 1, characterized in that: The cooling fan bracket (4) is fixed to one detachable end of the thermally conductive ceramic column (301) by an elastic shock-absorbing bracket (7). The elastic shock-absorbing bracket (7) includes a polyurethane damping block (701) and a disc spring assembly (702). The disc spring assembly (702) is arranged in a concentric circle array on one side of the polyurethane damping block (701).
5. The heat-dissipating multilayer circuit board according to claim 1, characterized in that: The surface of the wavy heat dissipation fins is covered with a nano-coating, which is composed of a composite material of silicon carbide and aluminum nitride.
6. The heat-dissipating multilayer circuit board according to claim 1, characterized in that: The graphene thermal conductive layer is embedded with a temperature sensing chip, and the temperature sensing chip and the cooling fan on the cooling fan bracket (4) form a closed-loop control system through a PID controller.