Liquid cooling plate based on ultralow-conductivity material

Abstract

The utility model discloses a liquid cooling plate based on an ultralow-conductivity material, and relates to the technical field of liquid cooling plates. Comprising a plate body and further comprises a liquid cooling assembly, the outer wall of the liquid cooling assembly is fixedly connected with the inner wall of the plate body, and the inner wall of the plate body is fixedly connected with a heat dissipation assembly; the liquid cooling assembly comprises a spiral pipe, the liquid cooling plate forms a double protection system of physical insulation and material insulation through the arrangement of the plate body made of ultralow conductivity materials and the thermal insulation sleeve, a conductive path between cooling liquid and electronic equipment is blocked, the risk of short circuit caused by electric leakage is avoided, heat loss is reduced through the arrangement of the thermal insulation sleeve, and the service life of the electronic equipment is prolonged. According to the liquid cooling plate, performance reduction caused by temperature rise of surrounding parts is prevented, stable operation of equipment in severe environments such as high pressure and humidity is ensured, the contact area of cooling liquid and the plate body is increased through matrix type arrangement of the spiral pipes and the fluid self-driving design that the rotating ring drives the blades, and the purpose of the liquid cooling plate based on ultralow conductivity materials is achieved.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling plate technology, specifically a liquid cooling plate based on ultra-low conductivity material. Background Technology

[0002] In the field of heat dissipation for high-power electronic devices, liquid cooling technology has become the mainstream solution due to its efficient heat exchange capabilities. However, with the continuous increase in power density of new energy vehicles, data centers, and high-voltage power equipment, traditional liquid cooling plates face the dual challenges of electrical insulation risks and heat dissipation efficiency bottlenecks.

[0003] In terms of heat dissipation efficiency, conventional liquid cooling plates generally adopt straight-slot liquid cooling channels. When facing high-power heat sources, this design has a limited contact area between the coolant and the plate, resulting in low heat exchange efficiency and difficulty in quickly and effectively transferring heat away. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a liquid cooling plate based on ultra-low conductivity materials, which solves the problems of limited contact area between the coolant and the plate body and low heat exchange efficiency in conventional liquid cooling plates.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a liquid-cooled plate based on an ultra-low conductivity material, comprising a plate body and a liquid-cooling assembly, wherein the outer wall of the liquid-cooling assembly is fixedly connected to the inner wall of the plate body, and a heat dissipation assembly is fixedly connected to the inner wall of the plate body; the liquid-cooling assembly comprises a spiral tube, which is arranged in a linear array along the outer wall of the plate body, and the outer wall of the spiral tube is fixedly connected to the inner wall of the plate body; the inner wall of the plate body is fixedly connected to a main inlet pipe through a branch inlet pipe, and the outer wall of the branch inlet pipe is fixedly connected to the inner wall of the main inlet pipe; the main inlet pipe is used to connect to an external coolant inlet pipe.

[0008] Preferably, the outer wall of the liquid inlet branch pipe is fixedly connected to the inner wall of the plate, and a heat insulation sleeve is fixedly connected to the inner wall of the plate. The heat insulation sleeve is made of heat insulation material. A liquid inlet groove is opened in the wall of the plate, and a liquid outlet groove is opened in the wall of the plate away from the liquid inlet groove.

[0009] Preferably, the heat dissipation assembly includes a liquid outlet pipe, the outer wall of which is rotatably connected to a rotating ring via a connecting ring, and the inner wall of the connecting ring is rotatably connected to the outer wall of the rotating ring. The connecting ring is used to connect the rotating ring and the liquid outlet pipe. There are connecting rings on both sides of the outer wall of the rotating ring. The outer wall of the liquid outlet pipe is fixedly connected to a support pipe, and the support pipe is arranged in a linear array along the central axis of the liquid outlet pipe.

[0010] Preferably, the outer wall of the rotating ring is fixedly connected to blades, and the blades are arranged in a circular array along the central axis of the rotating ring. A liquid guide pipe is rotatably connected to the side of the outer wall of the rotating ring away from the liquid outlet pipe. The outer wall of the liquid guide pipe is fixedly connected to the inner wall of the plate, and the inner wall of the plate is fixedly connected to the outer wall of the support pipe.

[0011] (III) Beneficial Effects

[0012] This invention provides a liquid cooling plate based on an ultra-low conductivity material. It has the following beneficial effects:

[0013] (I) This liquid cooling plate based on ultra-low conductivity material forms a dual protection system of physical insulation and material insulation by setting the plate body of ultra-low conductivity material and the heat insulation sleeve. It blocks the conductive path between the coolant and the electronic equipment, avoiding the risk of short circuit caused by leakage. The setting of the heat insulation sleeve reduces heat loss and prevents the performance of surrounding components from deteriorating due to temperature rise. It ensures stable operation of the equipment in harsh environments such as high pressure and humidity. Through the matrix arrangement of the spiral tube and the fluid self-drive design of the rotating ring driving the blades, the contact area between the coolant and the plate body is increased. At the same time, the kinetic energy of the coolant flow forms forced air convection, which can accelerate heat dissipation without additional power. This design enables the liquid cooling plate to achieve efficient heat exchange without increasing energy consumption, meeting the heat dissipation requirements of high-power electronic equipment.

[0014] (II) This liquid cooling plate based on ultra-low conductivity material increases the contact area between the coolant and the plate by setting up a matrix arrangement of spiral tubes and a fluid self-driving design driven by the rotating ring to drive the blades. At the same time, it uses the kinetic energy of the coolant flow to form forced air convection, which can accelerate heat dissipation without additional power. This design enables the liquid cooling plate to achieve efficient heat exchange without increasing energy consumption, and meets the heat dissipation requirements of high-power electronic equipment. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a cross-sectional view of the present invention;

[0017] Figure 3 This is a schematic diagram of the liquid cooling component of this utility model;

[0018] Figure 4 This is a schematic diagram of the structure at point A of this utility model;

[0019] Figure 5 This is a schematic diagram of the heat dissipation component of this utility model;

[0020] Figure 6This is a schematic diagram of the rotating ring of this utility model.

[0021] In the diagram: 1. Plate; 2. Liquid cooling assembly; 3. Heat dissipation assembly; 21. Spiral tube; 22. Main inlet pipe; 23. Inlet tank; 24. Outlet tank; 25. Inlet branch pipe; 26. Insulation sleeve; 31. Outlet pipe; 32. Guide pipe; 33. Support pipe; 34. Rotating ring; 35. Connecting ring; 36. Blade. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-6 This utility model provides a technical solution: a liquid-cooled plate based on ultra-low conductivity material, including a plate body 1 and a liquid-cooling assembly 2. The outer wall of the liquid-cooling assembly 2 is fixedly connected to the inner wall of the plate body 1, and a heat dissipation assembly 3 is fixedly connected to the inner wall of the plate body 1. The liquid-cooling assembly 2 includes a spiral tube 21, which is arranged in a linear array along the outer wall of the plate body 1. The outer wall of the spiral tube 21 is fixedly connected to the inner wall of the plate body 1. The inner wall of the plate body 1 is fixedly connected to a main inlet pipe 22 through a branch pipe 25, and the outer wall of the branch pipe 25 is fixedly connected to the inner wall of the main inlet pipe 22. Coolant flows in from the main inlet pipe 22 and is distributed to each spiral tube 21 through the branch pipe 25. The spiral tubes 21 are arranged in a linear array along the outer wall of the plate body 1, which increases the contact area between the coolant and the plate body 1.

[0024] The outer wall of the liquid inlet branch pipe 25 is fixedly connected to the inner wall of the plate body 1. The inner wall of the plate body 1 is fixedly connected to the heat insulation sleeve 26. The wall of the plate body 1 is provided with a liquid inlet groove 23. The wall of the plate body 1 away from the liquid inlet groove 23 is provided with a liquid outlet groove 24.

[0025] The heat dissipation assembly 3 includes an outlet pipe 31. The outer wall of the outlet pipe 31 is rotatably connected to a rotating ring 34 via a connecting ring 35, and the inner wall of the connecting ring 35 is rotatably connected to the outer wall of the rotating ring 34. A support pipe 33 is fixedly connected to the outer wall of the outlet pipe 31, and the support pipe 33 is arranged in a linear array along the central axis of the outlet pipe 31. A blade 36 is fixedly connected to the outer wall of the rotating ring 34, and the blade 36 is arranged in a ring array along the central axis of the rotating ring 34. A guide pipe 32 is rotatably connected to the side of the outer wall of the rotating ring 34 away from the outlet pipe 31. The outer wall of the guide pipe 32 is fixedly connected to the inner wall of the plate 1, and the inner wall of the plate 1 is fixedly connected to the outer wall of the support pipe 33. The high-temperature coolant flowing out from the spiral tube 21 enters the guide pipe 32 and then flows into the outlet pipe 31. During the flow of coolant, the rotating ring 34 is pushed to rotate around the connecting ring 35, and the blade 36 fixed to the outer wall of the rotating ring 34 rotates accordingly. The rotation of the blade 36 accelerates the flow of the surrounding air.

[0026] When using,

[0027] The liquid cooling plate mainly consists of a plate body 1, a liquid cooling component 2, and a heat dissipation component 3. The plate body 1 is made of an ultra-low conductivity material, which ensures the electrical insulation performance of the liquid cooling plate from the material level and avoids the risk of leakage during the operation of electronic equipment. The liquid cooling component 2 is embedded inside the plate body 1 and undertakes the core function of heat exchange. The heat dissipation component 3 further enhances the heat dissipation effect. The two work together to achieve efficient heat dissipation.

[0028] The liquid cooling assembly 2 is the core component for heat transfer. Its core components include a spiral tube 21, a main inlet pipe 22, branch inlet pipes 25, and a heat insulation jacket 26. The coolant flows in from the main inlet pipe 22 and is distributed to each spiral tube 21 through the branch inlet pipes 25. The spiral tubes 21 are arranged in a linear array along the outer wall of the plate 1, which increases the contact area between the coolant and the plate 1. When the electronic device generates heat and it is transferred to the plate 1, the heat is quickly conducted to the outer wall of the spiral tube 21 and exchanges heat with the coolant flowing inside the tube. After absorbing heat, the temperature of the coolant rises and it finally flows out through the outlet groove 24 on the plate 1, completing one heat exchange cycle.

[0029] The plate 1 is made of ultra-low conductivity material, which has excellent electrical insulation performance. At the same time, the heat insulation sleeve 26 further isolates the coolant from the external environment, reduces heat loss to the surrounding environment, and ensures that as much heat as possible is carried away by the coolant. This not only improves the heat exchange efficiency, but also prevents the surrounding components from getting hot due to heat leakage, thus affecting the overall performance of the equipment.

[0030] The heat dissipation assembly 3 mainly consists of an outlet pipe 31, a connecting ring 35, a rotating ring 34, blades 36, a support pipe 33, and a guide pipe 32. Its function is to enhance the heat dissipation effect and accelerate the heat dissipation of the coolant. The high-temperature coolant flowing out of the spiral pipe 21 enters the guide pipe 32 and then flows into the outlet pipe 31. During the flow of the coolant, the rotating ring 34 is pushed to rotate around the connecting ring 35. The blades 36 fixed on the outer wall of the rotating ring 34 rotate accordingly. The rotation of the blades 36 accelerates the flow of the surrounding air and forms forced convection. This forced convection can quickly remove the heat from the surface of the plate 1 and also helps the coolant to further dissipate heat in the outlet pipe 31, reduce the coolant temperature, and improve its efficiency in participating in heat exchange again.

[0031] The support tubes 33 are arranged in a linear array along the central axis of the outlet tube 31, providing stable support for components such as the outlet tube 31 and the rotating ring 34. This ensures that the entire heat dissipation assembly structure remains stable during the rotation of the blades 36 and that its performance is not affected by vibration or other factors. At the same time, the support tubes 33 also play a certain role in guiding the flow, assisting the coolant to flow smoothly within the outlet tube 31.

[0032] The liquid cooling component 2 and the heat dissipation component 3 do not operate independently, but cooperate with each other to ensure the heat dissipation performance of the liquid cooling plate. The liquid cooling component 2 removes the heat from the plate 1 through the circulation of coolant, converting the heat into the internal energy of the coolant. After the coolant flows out, the heat dissipation component 3 accelerates air convection through the rotation of blades 36, reducing the temperature of the coolant, so that the coolant can re-enter the liquid cooling component 2 at a lower temperature, forming an efficient heat transfer cycle to continuously dissipate heat for electronic devices.

[0033] The liquid cooling component 2 and the heat dissipation component 3 are closely integrated inside the plate 1. The spiral tube 21 and the inlet branch pipe 25 of the liquid cooling component 2 provide circulation channels for the coolant, while the outlet pipe 31 and the guide pipe 32 of the heat dissipation component 3 receive the coolant and further dissipate heat. The reasonable structural layout of the two ensures smooth flow of coolant. At the same time, with the protection of the ultra-low conductivity material of the plate 1, the entire system operates safely and stably, providing reliable heat dissipation for electronic equipment.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A liquid-cooled plate based on an ultra-low conductivity material, comprising a plate body (1), characterized in that, It also includes a liquid cooling component (2), the outer wall of which is fixedly connected to the inner wall of the plate (1), and a heat dissipation component (3) is fixedly connected to the inner wall of the plate (1); The liquid cooling assembly (2) includes a spiral tube (21), which is arranged in a linear array along the outer wall of the plate (1). The outer wall of the spiral tube (21) is fixedly connected to the inner wall of the plate (1). The inner wall of the plate (1) is fixedly connected to the main inlet pipe (22) through the liquid inlet branch pipe (25), and the outer wall of the liquid inlet branch pipe (25) is fixedly connected to the inner wall of the main inlet pipe (22).

2. The liquid cooling plate based on an ultra-low conductivity material according to claim 1, characterized in that: The outer wall of the liquid inlet branch pipe (25) is fixedly connected to the inner wall of the plate (1), and the inner wall of the plate (1) is fixedly connected to a heat insulation sleeve (26).

3. A liquid cooling plate based on an ultra-low conductivity material according to claim 1, characterized in that: The plate (1) has an inlet groove (23) in its wall and an outlet groove (24) in its wall away from the inlet groove (23).

4. A liquid cooling plate based on an ultra-low conductivity material according to claim 1, characterized in that: The heat dissipation assembly (3) includes an outlet pipe (31), the outer wall of the outlet pipe (31) is rotatably connected to a rotating ring (34) via a connecting ring (35), and the inner wall of the connecting ring (35) is rotatably connected to the outer wall of the rotating ring (34). The outer wall of the outlet pipe (31) is fixedly connected to a support pipe (33), and the support pipe (33) is arranged in a linear array along the central axis of the outlet pipe (31).

5. A liquid cooling plate based on an ultra-low conductivity material according to claim 4, characterized in that: The outer wall of the rotating ring (34) is fixedly connected with blades (36), and the blades (36) are arranged in a ring array along the central axis of the rotating ring (34). A liquid guide pipe (32) is rotatably connected to the side of the outer wall of the rotating ring (34) away from the liquid outlet pipe (31).

6. A liquid cooling plate based on an ultra-low conductivity material according to claim 5, characterized in that: The outer wall of the liquid guide tube (32) is fixedly connected to the inner wall of the plate (1), and the inner wall of the plate (1) is fixedly connected to the outer wall of the support tube (33).

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