LED lamp bead and display module
By setting external threads on the outer periphery of the connecting post of the LED bead to engage with the internal threads of the substrate, a threaded connection is formed, which solves the problem of insufficient bonding strength between the LED bead and the PCB board, improves the pull-out resistance and stability of the bead, and extends its service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ABSEN OPTOELECTRONIC CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-05-01
AI Technical Summary
When existing LED beads are connected to the PCB board, the bonding strength is insufficient due to the face-to-face contact between the pins and the pads. This results in a small push force on the LED beads, making them prone to loosening or falling off, which affects the reliability and lifespan of the circuit system.
The LED bead adopts a threaded connection structure. The outer peripheral sidewall of the connecting post of the LED bead has an external thread, which mates with the internal thread of the mounting hole of the substrate or other mounting carrier to form a threaded connection and improve the bonding strength.
The threaded connection structure provides greater pull-out resistance, enhances the thrust of LED beads, improves service life and operational stability, and prevents loosening or detachment.
Smart Images

Figure CN224192364U_ABST
Abstract
Description
LED beads and display modules Technical Field
[0001] This utility model relates to the field of display equipment technology, and in particular to an LED lamp bead and a display module. Background Technology
[0002] LED beads have many advantages such as energy efficiency, long lifespan, fast response speed, small size, high reliability and environmental friendliness. They are widely used in lighting, display, backlight, signal indication and other fields, and have become an important part of modern electronic information technology and lighting.
[0003] LED beads are solid-state light-emitting devices based on the principle of semiconductor PN junction light emission. Their core structure consists of a semiconductor chip, electrode leads, and packaging structure. When a suitable voltage is applied across the positive and negative electrodes of the LED bead, electrons and holes in the semiconductor chip recombine in the PN junction region, releasing energy and radiating it in the form of photons, thereby realizing the conversion of electrical energy into light energy.
[0004] In electronic circuits, LED chips typically need to be connected to a PCB (Printed Circuit Board) to enable circuit conduction and functionality. A common connection method is to fix the LED chips to the PCB using soldering. Specifically, the PCB has pre-designed pads corresponding to the LED chip leads, and these pads are coated with solder or flux. During soldering, the LED chip leads are inserted into the pad holes on the PCB (for surface-mount LEDs, they are placed directly on the pads). Then, through soldering processes such as reflow soldering or wave soldering, the solder melts and fills the space between the leads and the pads, forming an electrical connection and mechanical fixation.
[0005] However, when existing LED chips are connected to the PCB board, the contact strength between the pins and pads is insufficient due to the surface-to-surface contact, resulting in a small thrust of the LED chips. When LED chips are affected by external environmental factors such as vibration, impact, and temperature changes, the small thrust can easily cause the chips to loosen or fall off, thus affecting the reliability and lifespan of the entire circuit system.
[0006] Therefore, how to increase the thrust after the LED beads are connected to the PCB board has become an important technical problem that needs to be solved. Summary of the Invention
[0007] The purpose of this invention is to solve the technical problems in the prior art, such as insufficient bonding strength between LED beads and PCB board, small push force of LED beads, and easy loosening of LED beads.
[0008] To solve the above-mentioned technical problems, this utility model provides an LED lamp bead, which includes:
[0009] LED chip;
[0010] A connecting post, which is connected to the light-emitting chip, has an external thread on its outer peripheral sidewall;
[0011] The lamp base is located on the outer peripheral sidewall of the connecting column;
[0012] A wire, one end of which is connected to the light-emitting chip, and the other end of which is connected to the lamp base, so that the lamp base is electrically connected to the light-emitting chip; the wire portion is arranged inside the connecting post.
[0013] In some embodiments of this application, the LED lamp bead further includes a bracket, which is a groove-shaped structure with a light-emitting slot formed on one side, and an installation groove is formed inside the bracket; the connecting post is disposed on the surface of the bracket opposite to the light-emitting slot, and the light-emitting chip is disposed in the installation groove.
[0014] In some embodiments of this application, the LED bead further includes a packaging portion disposed in the mounting groove and covering the exterior of the light-emitting chip.
[0015] In some embodiments of this application, the diameter of the mounting groove gradually increases in the direction from the side of the bracket connected to the connecting column toward the light-emitting slot.
[0016] In some embodiments of this application, the lamp base is disposed in the area between adjacent external threads on the side wall of the connecting post.
[0017] In some embodiments of this application, the lamp feet are provided in multiples, and the multiple lamp feet are spaced apart on the outer peripheral sidewall of the connecting post. Each lamp foot is electrically connected to the light-emitting chip through the wire.
[0018] This application also provides a display module, which includes a substrate and the aforementioned LED beads. The substrate has mounting holes, and the inner wall of the mounting holes has internal threads adapted to the external threads. The connecting posts of the LED beads are screwed and fixed in the mounting holes.
[0019] In some embodiments of this application, the display module further includes a pad, which is annular and disposed on the inner wall of the mounting hole, and the pad abuts against the lamp base.
[0020] In some embodiments of this application, a plurality of pads are spaced apart on the inner wall of the mounting hole, and each LED bead includes a plurality of lamp feet spaced apart on the connecting post, with the plurality of lamp feet abutting against the plurality of pads in a one-to-one correspondence.
[0021] In some embodiments of this application, the substrate is provided with a plurality of mounting holes spaced apart, and each mounting hole is provided with an LED bead.
[0022] As can be seen from the above technical solution, the beneficial effects of this utility model are as follows: In the LED lamp bead and display module of this utility model, the LED lamp bead includes a light-emitting chip, a connecting post, a lamp base, and a wire. The external thread provided on the outer peripheral sidewall of the connecting post of the LED lamp bead can cooperate with the mounting hole with internal threads on the substrate or other mounting carrier. Compared with the traditional welding connection, this threaded connection structure can significantly improve the bonding strength between the LED lamp bead and the substrate or other mounting carrier. When the LED lamp bead is subjected to external vibration or impact, the threaded connection structure can provide greater pull-out force through the screw engagement to strengthen the thrust of the LED lamp bead, effectively improving the service life and working stability of the LED lamp bead. Attached Figure Description
[0023] Figure 1 is a structural schematic diagram of an embodiment of the LED lamp bead of this utility model.
[0024] Figure 2 is a side view of the LED beads shown in Figure 1.
[0025] Figure 3 is a cross-sectional view of the LED beads shown in Figure 1.
[0026] Figure 4 is an exploded view of the display module of this utility model.
[0027] The reference numerals in the attached figures are explained as follows: 10, LED bead; 11, light-emitting chip; 12, connecting post; 121, external thread; 13, lamp base; 14, wire; 15, bracket; 151, light-emitting slot; 152, mounting slot; 16, encapsulation part; 20, substrate; 21, mounting hole; 22, internal thread; 30, solder pad; 100, display module. Detailed Implementation
[0028] Typical embodiments embodying the features and advantages of this utility model will be described in detail in the following description. It should be understood that this utility model can have various variations in different embodiments, all of which do not depart from the scope of this utility model, and the descriptions and illustrations therein are for illustrative purposes only and not intended to limit this utility model.
[0029] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.
[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0031] Referring to Figures 1 to 3, one embodiment of this application provides an LED lamp bead 10, which includes a light-emitting chip 11, a connecting post 12, a lamp base 13, and a wire 14.
[0032] The connecting post 12 is connected to the light-emitting chip 11, and the outer peripheral sidewall of the connecting post 12 is provided with external threads 121. The lamp base 13 is disposed on the outer peripheral sidewall of the connecting post 12. One end of the wire 14 is connected to the light-emitting chip 11, and the other end of the wire 14 is connected to the lamp base 13, so that the lamp base 13 and the light-emitting chip 11 are electrically connected. The wire 14 is partially arranged inside the connecting post 12.
[0033] For the LED bead 10 of this application, the external thread 121 provided on the outer peripheral sidewall of the connecting post 12 can mate with the mounting hole 21 with internal thread 22 of the substrate 20 or other mounting carrier. Compared with the traditional welding connection, this threaded connection structure can significantly improve the bonding strength between the LED bead 10 and the substrate 20 or other mounting carrier. When the LED bead 10 is subjected to external vibration or impact, the threaded connection structure can provide greater pull-out resistance through the screw engagement, thereby strengthening the thrust of the LED bead 10 and effectively improving the service life and operational stability of the LED bead 10.
[0034] In some embodiments of this application, the light-emitting chip 11 can be a three-primary-color chip, which may include an R chip, a G chip, and a B chip. Specifically, the R chip emits red light, the G chip emits green light, and the B chip emits blue light.
[0035] In some examples, the three primary color chips can be individually packaged, with each color chip having its own independent anode and cathode. In this example, six lamp leads 13 can be provided on the outer peripheral sidewall of the connecting post 12, with the six lamp leads 13 spaced apart on the connecting post 12.
[0036] Specifically, the anode and cathode of the R chip are connected to two lamp pins 13 via wires 14, the anode and cathode of the G chip are connected to two lamp pins 13 via wires 14, and the anode and cathode of the B chip are connected to the other two lamp pins 13 via wires 14.
[0037] Each color chip has its own independent anode and cathode, allowing for independent control of each color chip. By adjusting the current of different chips, various colors can be mixed to achieve different display effects.
[0038] In some examples, the three primary color chips can be integrated into a single package. The anodes of the R chip, G chip, and B chip can be connected together to form a common anode, while the cathode of each color chip is independent. In this example, four lamp leads 13 can be disposed on the outer peripheral sidewall of the connecting post 12, spaced apart from each other on the connecting post 12.
[0039] Specifically, the cathode of the R chip is connected to one of the lamp pins 13 via wire 14, the cathode of the G chip is connected to one of the lamp pins 13 via wire 14, the cathode of the B chip is connected to one of the lamp pins 13 via wire 14, and the common anode is connected to one of the lamp pins 13 via wire 14.
[0040] In other examples, the three primary color chips can be integrated into a single package. The cathodes of the R, G, and B chips can be connected together to form a common cathode, while the anode of each color chip is independent. In this example, four lamp leads 13 can be disposed on the outer peripheral sidewall of the connecting post 12, spaced apart from each other.
[0041] Specifically, the anode of the R chip is connected to one of the lamp pins 13 via wire 14, the anode of the G chip is connected to one of the lamp pins 13 via wire 14, the anode of the B chip is connected to one of the lamp pins 13 via wire 14, and the common cathode is connected to one of the lamp pins 13 via wire 14.
[0042] With a common anode configuration for the three primary color chips, the light-emitting state of each chip can be controlled by separately controlling the voltage of the three cathodes.
[0043] In addition, in some examples, the light-emitting chip 11 can also be a monochrome chip, a white light chip, etc. Depending on the type of light-emitting chip 11, the number and / or arrangement of lamp pins 13 on the connecting post 12 can be designed accordingly to achieve electrical connection between the light-emitting chip 11 and the lamp pins 13.
[0044] In some embodiments of this application, the LED bead 10 may further include a bracket 15. The bracket 15 is a groove-shaped structure with a light-emitting slot 151 formed on one side, and a mounting groove 152 is formed inside the bracket 15. The connecting post 12 is disposed on the surface of the bracket 15 opposite to the light-emitting slot 151, and the light-emitting chip 11 is disposed in the mounting groove 152.
[0045] The light-emitting slot 151 of the bracket 15 guides the light, concentrating the light emitted by the light-emitting chip 11 in a specific direction, thus improving light utilization and light emission efficiency. This allows the LED bead 10 to project light more accurately onto the target area in lighting or display applications, reducing light scattering and waste. For example, in directional lighting devices such as flashlights, it can make the beam more concentrated and the lighting effect better.
[0046] Furthermore, the slotted structure of the bracket 15 acts as a shield, reducing the scattering of light emitted by the light-emitting chip 11 to the sides or back, thus preventing stray light. This design helps improve the contrast and color purity of the LED beads, resulting in clearer and more vibrant images and reduced visual interference in display applications.
[0047] Furthermore, the mounting slot 152 of the bracket 15 provides a stable mounting position for the light-emitting chip 11, effectively fixing the chip and preventing it from shifting or being damaged due to vibration, impact, or other factors during use. Simultaneously, the slotted structure of the bracket 15 also provides some protection for the light-emitting chip 11, preventing external objects from directly contacting the chip and improving its reliability and lifespan.
[0048] In some examples, the LED chip 10 may also include a package 16. The package 16 is disposed in the mounting groove 152 and covers the outside of the light-emitting chip 11.
[0049] In this example, the encapsulation section 16 can be formed by filling the mounting groove 152 of the bracket 15 with encapsulating adhesive to encapsulate the light-emitting chip 11 as a whole. The adaptive setting of the number of lamp pins 13 when encapsulating the light-emitting chip 11 has been described above and will not be repeated here.
[0050] The encapsulation section 16 provides reliable physical protection for the light-emitting chip 11, preventing it from being damaged by external impacts, vibrations, friction, etc. During production, transportation, and use, the LED bead 10 may encounter various mechanical stresses, and the encapsulation section 16 can buffer these external forces to ensure the integrity of the light-emitting chip 11.
[0051] Furthermore, the encapsulation section 16 can isolate the light-emitting chip 11 from the external environment, preventing impurities such as water vapor, oxygen, and dust from entering, avoiding oxidation of the electrodes of the light-emitting chip 11 caused by water vapor and oxygen, ensuring the performance and lifespan of the light-emitting chip 11, ensuring the light emission effect of the light-emitting chip 11, and improving the stability and reliability of the LED lamp bead 10.
[0052] Furthermore, the encapsulation unit 16 provides an integral encapsulation for the light-emitting chip 11, which can be achieved by filling the mounting groove 152 with encapsulating adhesive. The overall process is relatively simple and easy to mass-produce. It only requires injecting encapsulating adhesive into the mounting groove 152 of the bracket 15 and curing it to complete the encapsulation process, resulting in high production efficiency and low cost.
[0053] In some examples, the diameter of the mounting slot 152 gradually increases on the side of the bracket 15 that connects to the connecting post 12 and faces the light outlet slot 151.
[0054] In this example, the mounting slot 152 of the bracket 15 gradually increases in diameter, providing a wider emission space for the light emitted by the light-emitting chip 11. Reduced obstruction during light propagation allows light from more angles to exit the LED beads 10 smoothly, effectively expanding the light emission angle of the LED beads 10. In display applications, this arrangement enables users to see the displayed content clearly from more angles, enhancing the viewing experience.
[0055] Furthermore, during the encapsulation process, when forming the encapsulation portion 16, encapsulating adhesive needs to be filled into the mounting groove 152 to cover the light-emitting chip 11. The gradually increasing diameter design of the mounting groove 152 allows the encapsulating adhesive to flow more easily and fill the entire mounting groove 152, avoiding air bubbles or insufficient encapsulating adhesive filling in the encapsulation portion 16. This design helps improve encapsulation quality, ensuring that the encapsulating adhesive can uniformly cover the light-emitting chip 11 to provide good physical protection and optical performance.
[0056] In addition, in some examples, the bracket 15 can be omitted from the LED bead 10, and the light-emitting chip 11 can be directly placed on the connecting post 12.
[0057] The LED bead 10, with its bracket 15 removed, has a simpler overall structure, reducing the manufacturing and installation steps of the bracket 15, thus simplifying the production process and improving production efficiency. Furthermore, the light-emitting chip 11 is directly mounted on the connecting post 12, shortening the heat transfer path and allowing for more direct heat dissipation, reducing heat accumulation around the chip and improving the stability and lifespan of the LED bead 10. In addition, eliminating the bracket 15 allows the light emitted by the chip 11 to propagate more freely into the surrounding space, reducing light loss during propagation and contributing to improved light extraction efficiency and luminous flux of the LED bead 10.
[0058] Furthermore, in some embodiments of this application, the connecting post 12 is disposed on the surface of the bracket 15 opposite to the light-emitting slot 151, and the outer peripheral sidewall of the connecting post 12 is provided with external threads 121. The connecting post 12 is used to connect with the mounting hole 21 on the substrate 20, so that the LED bead 10 is fixed on the substrate 20.
[0059] The external thread 121 on the connecting post 12 can mate with the mounting hole 21 of the substrate 20 or the threaded hole of other mounting carriers to provide a reliable mechanical connection. When the LED bead 10 is subjected to external impact or vibration, this threaded connection can effectively prevent the bead from loosening or falling off, ensuring the LED bead 10 is firmly installed on the substrate 20 or other mounting carriers, and maintaining the normal working state of the LED bead 10.
[0060] Furthermore, during LED bead 10 installation, simply align the connecting post 12 with the mounting hole 21 of the substrate 20 or the screw hole of other mounting carrier, and then rotate the LED bead 10 to screw the connecting post 12 into the mounting hole 21 through the external thread 121, without the need for complex tools or processes. Similarly, disassembly is also easy; simply rotate in the opposite direction to remove the LED bead 10. This greatly facilitates assembly during the production process and subsequent maintenance and replacement of the LED beads, helping to improve production efficiency and reduce maintenance costs.
[0061] In this example, lamp feet 13 are provided on the outer peripheral sidewall of the connecting post 12. The lamp feet 13 are electrically connected to the light-emitting chip 11 through wires 14. The number of lamp feet 13 can be designed according to the type and packaging form of the light-emitting chip 11, as described above, and will not be repeated here.
[0062] In the LED lamp bead 10 of this application, the light-emitting chip 11 is indirectly connected to the lamp pin 13 on the connecting post 12 through the wire 14. This arrangement can increase the electrical isolation between the light-emitting chip 11 and the lamp pin 13 and reduce electromagnetic interference. Especially for LED lamp beads 10 with multiple light-emitting chips 11 integrated, signal crosstalk between different components can be avoided, ensuring the stable operation of the light-emitting chip 11.
[0063] Furthermore, when the LED bead 10 is subjected to external impact or vibration, the wire 14 connecting the light-emitting chip 11 and the lamp base 13 can play a buffering role, reducing the stress transmitted to the light-emitting chip 11, reducing the risk of damage to the light-emitting chip 11 due to mechanical stress, and improving the reliability and stability of the LED bead 10.
[0064] In some examples, the lamp base 13 is a strip-shaped structure, which is located in the area between adjacent external threads 121 on the sidewall of the connecting post 12.
[0065] This design makes the mechanical and electrical connections between the LED chip 10 and the substrate 20 or other mounting carrier more stable. Specifically, the strip-shaped lamp base 13 has a larger contact area with the sidewall of the connecting post 12 and is located between the external threads 121, which allows it to better withstand external forces and torques. When the LED chip 10 is mounted on the substrate 20, this structure reduces loosening or damage caused by uneven stress on the lamp base 13, improving the overall stability of the connection between the chip and the substrate 20. Furthermore, the strip-shaped structure of the lamp base 13 increases the contact area with the wires 14 and external circuits, which helps to reduce contact resistance and improve the reliability of the electrical connection.
[0066] In addition, placing the lamp base 13 between adjacent external threads 121 can reduce the wear of the lamp base 13 during the installation of the LED lamp bead 10 by rotation operation, ensure the stability of the lamp base 13 and the overall structure of the LED lamp bead 10, and ensure the overall reliability of the LED lamp bead 10.
[0067] In this example, a portion of the wire 14 can be placed inside the bracket 15 and the connecting post 12. The wire 14 is partially hidden inside the bracket 15 and the connecting post 12, preventing damage such as pulling during LED installation. Furthermore, the bracket 15 and the connecting post 12 provide physical protection for the internal wire 14, shielding it from external environmental factors such as mechanical wear, oxidation, and corrosion, thus extending its lifespan and improving the reliability of the LED. In addition, the bracket 15 and the connecting post 12 provide electromagnetic shielding for the internal wire 14, reducing the outward radiation of electromagnetic interference generated by the current in the wire 14 and minimizing interference from external electromagnetic signals, thereby improving the electromagnetic compatibility of the LED and enabling stable operation in various electromagnetic environments.
[0068] Furthermore, as shown in FIG4, an embodiment of this application also provides a display module 100, which includes a substrate 20 and LED beads 10. The specific structure of the LED beads 10 has been described above and will not be repeated here.
[0069] The substrate 20 of this application can be a printed circuit board, a glass substrate 20, a flexible substrate 20, etc., which can provide stable physical support for the LED beads 10, ensure that the LED beads 10 maintain the correct position and arrangement during installation and use, and enable the display module 100 to have a certain structural strength and stability, and be able to withstand a certain external force and vibration without being damaged or deformed.
[0070] In this application, the substrate 20 is provided with a mounting hole 21, and the inner wall of the mounting hole 21 is provided with an internal thread 22 that is adapted to the external thread 121 for screwing. The connecting post 12 of the LED bead 10 is screwed and fixed in the mounting hole 21.
[0071] The connecting post 12 of the LED bead 10 and the mounting hole 21 on the substrate 20 form a threaded connection, which can provide a reliable mechanical fixing force, so that the LED bead 10 can maintain a stable position on the substrate 20 and is not easy to loosen or shift due to vibration, impact or other external forces, thus ensuring the stability and reliability of the display module 100.
[0072] In some examples, the display module 100 includes a pad 30, which is annular and disposed on the inner wall of the mounting hole 21, and the pad 30 abuts against the lamp base 13.
[0073] The pads 30 on the substrate 20 directly contact the leads 13 of the LED beads 10, providing a stable electrical connection path between the LED beads 10 and the substrate 20. With this connection structure, current can be smoothly transmitted through the pads 30 to the leads 13, thereby driving the LED beads 10 to emit light and ensuring the normal operation of the display module 100. Furthermore, this direct contact method reduces intermediate steps in the electrical connection, lowers contact resistance, improves the efficiency and stability of current transmission, and helps reduce signal loss and interference during transmission.
[0074] Furthermore, the annular arrangement of the pads 30 increases their contact area with the lamp leads 13. While ensuring an effective electrical connection between the LED beads 10 and the substrate 20, it also reduces current density, decreases the risk of localized overheating, and improves the reliability of the electrical connection. Moreover, this arrangement helps to distribute the pressure on the lamp leads 13, preventing damage to the lamp leads 13 or the pads 30 due to excessive localized pressure.
[0075] In this example, for an LED bead 10 with multiple lamp feet 13, multiple pads 30 can be spaced out on the inner wall of the mounting hole 21, and the multiple lamp feet 13 and the multiple pads 30 are in one-to-one contact.
[0076] Each lamp pin 13 in the LED lamp bead 10 is provided with a corresponding solder pad 30. This arrangement enables independent electrical connection and control of each lamp pin 13 of the LED lamp bead 10, providing accurate signals and power to each lamp pin 13, thereby achieving more precise control and richer display effects.
[0077] Furthermore, the multiple lamp pins 13 correspond one-to-one with the multiple solder pads 30, which enables the LED beads 10 to be evenly stressed within the mounting holes 21. The external force on the LED beads 10 can be distributed to different solder pads 30 through each lamp pin 13, avoiding excessive stress at a single point. This improves the fixing strength of the LED beads 10 on the substrate 20, making them more resistant to external impacts and vibrations, and reducing the risk of damage or loosening of the beads due to uneven stress.
[0078] In some embodiments of this application, a plurality of mounting holes 21 may be provided on the substrate 20 at intervals, and an LED bead 10 is provided in each mounting hole 21.
[0079] The arrangement of multiple LED beads 10 enables the presentation of more delicate image details, which is crucial for high-resolution display applications such as televisions, computer monitors, and outdoor high-definition billboards, meeting users' requirements for clear and realistic images. Furthermore, the light emitted by each LED bead 10 complements each other, reducing brightness and color uniformity, improving the display quality of the display module 100, and allowing users to see clearer and more consistent images.
[0080] For the LED beads and display module of this application, the external threads on the outer peripheral sidewalls of the connecting posts of the LED beads can mate with the internally threaded mounting holes of the substrate or other mounting carrier. Compared with traditional welding connections, this threaded connection structure can significantly improve the bonding strength between the LED beads and the substrate or other mounting carrier. When the LED beads are subjected to external vibration or impact, the threaded connection structure can provide greater pull-out resistance through the screw engagement, thereby strengthening the thrust of the LED beads and effectively improving their service life and operational stability.
[0081] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.
Claims
1. An LED lamp bead, characterized in that, include: LED chip; A connecting post is connected to the light-emitting chip, and the outer peripheral sidewall of the connecting post is provided with external threads; a lamp foot is disposed on the outer peripheral sidewall of the connecting post; A wire, one end of which is connected to the light-emitting chip, and the other end of which is connected to the lamp base, so that the lamp base is electrically connected to the light-emitting chip; the wire portion is arranged inside the connecting post.
2. The LED lamp bead according to claim 1, characterized in that, The LED bead also includes a bracket, which is a groove-shaped structure with a light-emitting slot on one side and a mounting slot inside the bracket; the connecting post is disposed on the surface of the bracket opposite to the light-emitting slot, and the light-emitting chip is disposed in the mounting slot.
3. The LED lamp bead according to claim 2, characterized in that, The LED bead also includes a packaging part, which is disposed in the mounting groove and covers the outside of the light-emitting chip.
4. The LED lamp bead according to claim 2, characterized in that, On the side of the bracket that connects to the connecting column, in the direction facing the light-emitting slot, the diameter of the mounting slot gradually increases.
5. The LED lamp bead according to claim 1, characterized in that, The lamp base is located in the area between adjacent external threads on the side wall of the connecting post.
6. The LED lamp bead according to claim 1, characterized in that, The lamp base is provided in multiple ways, and the multiple lamp bases are arranged at intervals on the outer peripheral sidewall of the connecting post. Each lamp base is electrically connected to the light-emitting chip through the wire.
7. A display module, characterized in that, The device includes a substrate and an LED bead as described in any one of claims 1-6. The substrate has a mounting hole, and the inner wall of the mounting hole has an internal thread adapted to the external thread for screwing. The connecting post of the LED bead is screwed and fixed in the mounting hole.
8. The display module according to claim 7, characterized in that, The display module also includes a solder pad, which is annular and disposed on the inner wall of the mounting hole, and the solder pad abuts against the lamp base.
9. The display module according to claim 8, characterized in that, The inner wall of the mounting hole is provided with a plurality of pads spaced apart. Each LED lamp bead includes a plurality of lamp feet spaced apart on the connecting post. The plurality of lamp feet and the plurality of pads are in one-to-one contact.
10. The display module according to claim 7, characterized in that, The substrate is provided with a plurality of mounting holes spaced apart, and each mounting hole is provided with an LED bead.