LED lamp bead

Abstract

The utility model relates to the technical field of LED lighting, in particular to an LED lamp bead which comprises a substrate, the substrate is of a multi-layer composite structure, the substrate is sequentially provided with a heat conduction layer, an insulation layer and a heat dissipation layer from top to bottom, an LED chip is arranged on the upper surface of the heat conduction layer, a transparent packaging layer covers the LED chip and the heat conduction layer, a plurality of heat dissipation protruding points are arranged on the outer surface of the packaging layer, and the heat dissipation protruding points are arranged on the outer surface of the packaging layer. The heat dissipation protruding points are distributed in an array mode and used for increasing the surface area of the packaging layer and promoting heat to be dissipated to the surrounding environment, heat dissipation fins are attached to the surface of the heat dissipation layer, a plurality of micro grooves are formed in the surfaces of the heat dissipation fins and evenly distributed in the length direction of the heat dissipation fins, and a plurality of heat dissipation channels are further formed in the heat dissipation layer. And the plurality of heat dissipation channels are connected with the heat dissipation fins.

Description

A type of LED lamp bead Technical Field

[0001] This utility model relates to the field of LED lighting, and in particular to an LED lamp bead. Background Technology

[0002] LED chips, as core components of modern lighting technology, boast advantages such as high efficiency, energy saving, and long lifespan. However, LED chips generate a significant amount of heat during operation. Poor heat dissipation can lead to decreased luminous efficacy, shortened lifespan, and even damage. Existing heat dissipation methods for LED chips largely rely on external heat sinks or fins, but these methods increase the size and cost of the LED chips and offer limited heat dissipation effectiveness. Therefore, optimizing the heat dissipation performance of LED chips by addressing their inherent structure has become a pressing issue in the current LED lighting technology field. Summary of the Invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the purpose of this utility model is to provide an LED lamp bead that has the advantages of optimizing its own structure, solving the heat dissipation problem of LED lamp beads, and improving the service life of LED lamp beads.

[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0005] An LED lamp bead includes a substrate, which has a multi-layer composite structure. From top to bottom, the substrate is provided with a thermally conductive layer, an insulating layer, and a heat dissipation layer. An LED chip is disposed on the upper surface of the thermally conductive layer. A transparent encapsulation layer covers the LED chip and the thermally conductive layer. The outer surface of the encapsulation layer is provided with multiple heat dissipation bumps, which are distributed in an array to increase the surface area of ​​the encapsulation layer and promote heat dissipation to the surrounding environment. Heat dissipation fins are attached to the surface of the heat dissipation layer. Multiple micro-grooves are formed on the surface of the heat dissipation fins, which are evenly distributed along the length of the heat dissipation fins. Multiple heat dissipation channels are also provided inside the heat dissipation layer, and all of the heat dissipation channels are connected to the heat dissipation fins.

[0006] By adopting the above technical solution, the thermally conductive layer and the insulating layer are directly laminated together, ensuring that heat is quickly conducted from the LED chip to the insulating layer while providing electrical isolation. The insulating layer and the heat dissipation layer are connected by thermo-pressing, with the insulating layer blocking current and the heat dissipation layer enhancing heat dissipation. The multi-layer structure of the substrate allows direct contact with the LED chip, enabling rapid heat conduction and avoiding localized high temperatures. It also ensures electrical safety and has a certain thermal conductivity to prevent heat accumulation. Combined with heat dissipation fins and heat dissipation channels, heat is efficiently dissipated to the external environment. Micro-grooves are formed on the surface of the heat dissipation fins to enhance airflow, create a turbulence effect, improve heat dissipation efficiency, reduce the operating temperature of the LED chip, reduce light decay, and extend service life.

[0007] Further configuration: A thermally conductive adhesive is provided between the bottom of the LED chip and the thermally conductive layer. The thermally conductive adhesive is a silicone material with a high thermal conductivity, which is used to enhance the heat conduction between the LED chip and the thermally conductive layer.

[0008] By adopting the above technical solution, the LED chip is connected to the thermally conductive layer through thermally conductive adhesive, which can reduce contact thermal resistance and avoid poor heat dissipation caused by air gaps.

[0009] Further configuration: The outer surface of the heat dissipation layer is also coated with a heat dissipation coating, which is a high-emissivity nanomaterial used to enhance the heat radiation capability of the heat dissipation layer.

[0010] By adopting the above technical solution, a heat dissipation coating is sprayed on the outer surface of the heat dissipation layer, and heat dissipation is assisted by thermal radiation, which can improve the heat dissipation capacity in high-temperature environments.

[0011] Further configuration: A heat pipe is provided between the heat-conducting layer and the heat dissipation layer. The heat pipe has a vacuum structure and is filled with a thermally conductive silicone pad.

[0012] By adopting the above technical solution, the heat pipe and the thermally conductive silicone pad work together to achieve rapid heat distribution and improve heat dissipation.

[0013] Further configuration: The bottom of the LED chip is provided with a metal reflective layer, which is made of aluminum.

[0014] By adopting the above technical solution, the heat accumulation caused by light absorption can be reduced through the metal reflective layer made of aluminum.

[0015] Further configuration: the thermally conductive layer is made of high thermal conductivity aluminum material, the insulating layer is made of ceramic material, and the heat dissipation layer is made of aluminum alloy material.

[0016] By adopting the above technical solutions, the thermally conductive layer made of aluminum material can reduce costs, reduce weight and increase thermal conductivity, the insulating layer made of ceramic material can provide electrical isolation and improve thermal conductivity, and the heat dissipation layer made of aluminum alloy material can improve mechanical strength.

[0017] In summary, this utility model has the following beneficial effects:

[0018] The substrate, designed with a multi-layer composite structure including a thermally conductive layer, an insulating layer, and a heat dissipation layer, can directly contact the LED chip, quickly conduct heat, avoid localized high temperatures, and ensure electrical safety. It also has a certain thermal conductivity to prevent heat accumulation. Then, combined with heat dissipation fins and heat dissipation channels, heat is efficiently dissipated to the external environment. Micro-grooves are opened on the surface of the heat dissipation fins to enhance airflow, create a turbulence effect, improve heat dissipation efficiency, reduce the operating temperature of the LED chip, reduce light decay, and extend service life.

[0019] By adding a heat pipe between the heat-conducting layer and the heat-dissipating layer, and filling the inside with a thermally conductive silicone pad, an efficient heat conduction path is formed. The heat pipe can quickly conduct heat from the heat-conducting layer to the heat-dissipating layer for rapid heat dissipation. Attached Figure Description

[0020] The accompanying drawings, which are provided to further illustrate the present invention and form part of this application, do not constitute an undue limitation of the present invention. In the drawings:

[0021] Figure 1 is.

[0022] Figure 2 is.

[0023] In the diagram, 1. Substrate; 2. Thermally conductive layer; 3. Insulating layer; 4. Heat dissipation layer; 5. LED chip; 6. Transparent encapsulation layer; 7. Heat dissipation bumps; 8. Heat dissipation fins; 9. Micro-grooves; 10. Heat dissipation channels; 11. Thermally conductive adhesive; 12. Heat dissipation coating; 13. Heat pipe; 14. Thermally conductive silicone pad; 15. Metal reflective layer. Detailed Implementation

[0024] The foregoing and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of the embodiments with reference to Figures 1 and 2. All structural contents mentioned in the following embodiments are with reference to the accompanying drawings.

[0025] Exemplary embodiments of the present invention will now be described with reference to the accompanying drawings.

[0026] Example 1: An LED lamp bead, as shown in Figures 1 and 2, includes a substrate 1. The substrate 1 has a multi-layer composite structure. From top to bottom, the substrate 1 is provided with a thermally conductive layer 2, an insulating layer 3, and a heat dissipation layer 4. The thermally conductive layer 2 is made of high thermal conductivity aluminum material, the insulating layer 3 is made of ceramic material, and the heat dissipation layer 4 is made of aluminum alloy material. An LED chip 5 is provided on the upper surface of the thermally conductive layer 2. A transparent encapsulation layer 6 covers the LED chip 5 and the thermally conductive layer 2. The outer surface of the encapsulation layer is provided with multiple heat dissipation bumps 7, which are arranged in an array to increase the surface area of ​​the encapsulation layer and promote the dissipation of heat to the surrounding environment. Heat dissipation fins 8 are attached to the surface of the heat dissipation layer 4. Multiple micro-grooves 9 are formed on the surface of the heat dissipation fins 8. The multiple micro-grooves 9 are evenly distributed along the length direction of the heat dissipation fins 8. Multiple heat dissipation channels 10 are also provided inside the heat dissipation layer 4, and the multiple heat dissipation channels 10 are all connected to the heat dissipation fins 8.

[0027] As shown in Figure 1, thermally conductive adhesive 11 is provided between the bottom of the LED chip 5 and the thermally conductive layer 2. The thermally conductive adhesive 11 is a silicone material with a high thermal conductivity, which is used to enhance the thermal conduction between the LED chip 5 and the thermally conductive layer 2.

[0028] As shown in Figure 1, the outer surface of the heat dissipation layer 4 is also coated with a heat dissipation coating 12, which is a nanomaterial with high emissivity, used to enhance the heat radiation capability of the heat dissipation layer 4.

[0029] As shown in Figure 2, a heat pipe 13 is provided between the heat-conducting layer 2 and the heat dissipation layer 4. The heat pipe 13 is a vacuum structure and is filled with a thermally conductive silicone pad 14.

[0030] As shown in Figure 1, the bottom of the LED chip 5 is provided with a metal reflective layer 15, which is made of aluminum.

[0031] In this embodiment of the invention, the thermally conductive layer 2 and the insulating layer 3 are directly laminated together to ensure that heat is quickly conducted from the LED chip 5 to the insulating layer 3, while providing electrical isolation. The insulating layer 3 and the heat dissipation layer 4 are thermo-pressed together, with the insulating layer 3 blocking current and the heat dissipation layer 4 enhancing heat dissipation. The multi-layer structure of the substrate 1 allows direct contact with the LED chip 5, enabling rapid heat conduction and avoiding localized high temperatures. It also ensures electrical safety and has a certain thermal conductivity to prevent heat accumulation. Combined with the heat dissipation fins 8 and the heat dissipation channels 10, heat is efficiently dissipated to the external environment. The surface of the heat dissipation fins 8 has micro-grooves 9 to enhance airflow, create a turbulence effect, improve heat dissipation efficiency, reduce the operating temperature of the LED chip 5, reduce light decay, and extend service life.

[0032] The above description is a further detailed explanation of the present utility model in conjunction with specific embodiments, and it should not be considered that the specific implementation of the present utility model is limited to this. For those skilled in the art to which the present utility model pertains and related fields, any extensions, operation methods, and data substitutions made based on the technical solution concept of the present utility model should fall within the protection scope of the present utility model.

Claims

1. An LED lamp bead, comprising a substrate (1), characterized in that: The substrate (1) is a multi-layer composite structure. The substrate (1) is arranged from top to bottom as a heat-conducting layer (2), an insulating layer (3), and a heat dissipation layer (4). An LED chip (5) is provided on the upper surface of the heat-conducting layer (2). A transparent encapsulation layer (6) covers the LED chip (5) and the heat-conducting layer (2). A plurality of heat dissipation bumps (7) are provided on the outer surface of the encapsulation layer. The heat dissipation bumps (7) are arranged in an array to increase the surface area of ​​the encapsulation layer and promote the dissipation of heat to the surrounding environment. A heat dissipation fin (8) is attached to the surface of the heat dissipation layer (4). A plurality of micro grooves (9) are opened on the surface of the heat dissipation fin (8). The plurality of micro grooves (9) are evenly distributed along the length direction of the heat dissipation fin (8). A plurality of heat dissipation channels (10) are also provided inside the heat dissipation layer (4). The plurality of heat dissipation channels (10) are all connected to the heat dissipation fin (8).

2. The LED lamp bead of claim 1, wherein: A thermally conductive adhesive (11) is provided between the bottom of the LED chip (5) and the thermally conductive layer (2). The thermally conductive adhesive (11) is a silicone material with a high thermal conductivity, which is used to enhance the thermal conduction between the LED chip (5) and the thermally conductive layer (2).

3. The LED lamp bead according to claim 1, characterized in that: The outer surface of the heat dissipation layer (4) is also coated with a heat dissipation coating (12), which is a nanomaterial with high emissivity, used to enhance the heat radiation capability of the heat dissipation layer (4).

4. The LED lamp bead according to claim 1, characterized in that: A heat pipe (13) is provided between the heat-conducting layer (2) and the heat dissipation layer (4). The heat pipe (13) is a vacuum structure and is filled with a thermally conductive silicone pad (14).

5. An LED lamp bead according to claim 1, characterized in that: The bottom of the LED chip (5) is provided with a metal reflective layer (15), which is made of aluminum.

6. An LED lamp bead according to claim 5, characterized in that: The thermally conductive layer (2) is made of high thermal conductivity aluminum, the insulating layer (3) is made of ceramic material, and the heat dissipation layer (4) is made of aluminum alloy material.

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