Etching device for processing semiconductor lead frame

Abstract

The utility model discloses an etching device for processing a semiconductor lead frame, and relates to the technical field of semiconductor manufacturing, a plurality of positioning plates are respectively and fixedly arranged on a belt of a belt conveyor, and four sides of the plurality of positioning plates are respectively provided with grooves; the abutting rods are fixedly arranged at the four corners of the positioning plate respectively. The multiple movable plates are arranged on the four sides of the positioning plate through connecting assemblies respectively, the movable plates are movably clamped in the grooves, and the two sides of each movable plate abut against the corresponding abutting rods in a matched mode; the fixing frames are fixedly arranged on a support of the belt conveyor, vertical rods on the front side and the rear side of each fixing frame are located on the front side and the rear side of the belt conveyor, and spray heads are arranged on transverse rods of the fixing frames and connected with an external water source. The etching liquid can be conveniently stored on the positioning plate through the abutting rod and the movable plate, so that the lead frame is soaked in the etching liquid, the lead frame is uniformly etched, and the etching efficiency is improved.

Description

An etching apparatus for semiconductor lead frame fabrication Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and specifically to an etching apparatus for processing semiconductor lead frames. Background Technology

[0002] In semiconductor manufacturing, the lead frame is a crucial component connecting the chip to external circuitry. Etching is a key step in lead frame fabrication, used to create the desired circuit patterns. Traditional etching equipment suffers from problems such as uneven etching and low efficiency; therefore, there is an urgent need for an etching apparatus specifically designed for semiconductor lead frame fabrication to address these issues. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings and deficiencies of the existing technology by providing an etching device for semiconductor lead frame processing that is simple in structure, reasonably designed, and easy to use, thereby solving the aforementioned problems.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: It comprises:

[0005] Positioning plates, wherein there are several positioning plates, which are respectively fixedly installed on the belt of the belt conveyor, and grooves are respectively opened on the four sides of the positioning plates;

[0006] Abutting rod, wherein there are several abutting rods, and the several abutting rods are respectively fixedly installed on the four corners of the positioning plate;

[0007] The movable plate consists of several movable plates, which are respectively set on the four sides of the positioning plate by connecting components. The movable plates are movably locked in the grooves, and the two sides of the movable plates are engaged with the corresponding abutment rods.

[0008] The fixed frame consists of several fixed frames, which are respectively fixedly installed on the support of the belt conveyor. The front and rear vertical bars of the fixed frame are located on the front and rear sides of the belt conveyor. The horizontal bar of the fixed frame is equipped with a nozzle, which is connected to an external water source.

[0009] The limiting plate consists of two plates, which are symmetrically fixed on the vertical bars on the front and rear sides of the fixed frame, and the limiting plates are in contact with the corresponding movable plates.

[0010] The fan is located on the right side of the fixed frame and is connected to an external power source.

[0011] Furthermore, the connection component includes:

[0012] The limiting rods are of several kinds, one end of each limiting rod is symmetrically fixed to the side wall of the movable plate, and the other end of the limiting rod is movably inserted into the side wall of the groove.

[0013] The guide plate comprises several guide plates, which are respectively fixedly installed in the groove of the positioning plate. Several guide rods are fixedly installed on the annular wall of the guide plate, and several guide blocks are movably sleeved on the guide rods.

[0014] Connecting rods, wherein there are several connecting rods, and the two ends of the several connecting rods are respectively screwed to the end of the limiting rod and the guide block by rotating rods;

[0015] The springs, which are several in number, are respectively sleeved on the limiting rod, and the two ends of the springs are respectively connected to the inner wall of the groove of the positioning plate and the limiting rod.

[0016] Furthermore, the ends of several guide rods are provided with limiting rings, and the guide blocks are set in abutting position with the limiting rings.

[0017] Furthermore, a waterproof sleeve is fixedly provided on the inner wall of the groove, and the limiting rod is movably inserted into the waterproof sleeve.

[0018] Furthermore, sealing gaskets are provided on both sides of several movable plates, and the sealing gaskets are set to abut against the contact rods.

[0019] Furthermore, each of the two limiting plates is provided with a buffer surface, and one side of the movable plate is set to abut against the movable surface.

[0020] Compared with the prior art, the beneficial effects of this utility model are: the etching device for semiconductor lead frame processing described in this utility model, through the baffle formed by the contact rod and the movable plate, facilitates the storage of etching solution on the positioning plate, so that the lead frame is immersed in the etching solution, so that the lead frame is etched evenly, thereby improving the etching efficiency. Attached Figure Description

[0021] Figure 1 is a structural schematic diagram of this utility model.

[0022] Figure 2 is an enlarged view of part A in Figure 1.

[0023] Figure 3 is a structural schematic diagram of the positioning plate and connecting assembly in this utility model.

[0024] Figure 4 is a structural schematic diagram of the movable plate and the limiting plate in this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] Positioning plate 1, belt conveyor 2, groove 3, contact rod 4, movable plate 5, connecting assembly 6, fixing frame 7, nozzle 8, limiting plate 9, fan 10, limiting rod 11, guide plate 12, guide rod 13, guide block 14, connecting rod 15, spring 16, limiting ring 17, waterproof sleeve 18, sealing gasket 19, buffer surface 20. Detailed Implementation

[0027] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. The preferred embodiments described are only examples. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0028] As shown in Figures 1-4, this specific embodiment adopts the following technical solution: It includes:

[0029] Positioning plate 1, there are several positioning plates 1, which are respectively fixed on the belt of the belt conveyor 2. The four sides of the positioning plates 1 are respectively provided with grooves 3, so that the lead frame can be placed on the positioning plate 1 and moved to a suitable location by the belt conveyor 2.

[0030] The abutment rod 4, there are several abutment rods 4, which are fixedly installed on the four corners of the positioning plate 1 respectively. The abutment rods 4 play a sealing role.

[0031] The movable plates 5, of which there are several, are respectively set on the four sides of the positioning plate 1 by the connecting components 6, and the movable plates 5 are movably locked in the grooves 3. The two sides of the movable plates 5 are engaged with the corresponding abutting rods 4. By engaging the several movable plates 5 with the abutting rods 4, a groove 3 is formed on the positioning plate 1, which facilitates the storage of etching solution in the groove, so that the lead frame is immersed in the etching solution, thereby improving the efficiency of etching the lead frame. The two sides of the several movable plates 5 are respectively provided with sealing gaskets 19, which are engaged with the abutting rods 4 to improve the sealing effect between the movable plates 5 and the abutting rods 4.

[0032] The fixing frame 7 consists of several fixing frames 7, which are respectively fixedly installed on the support of the belt conveyor 2. The vertical bars on the front and rear sides of the fixing frame 7 are located on the front and rear sides of the belt conveyor 2. The horizontal bar of the fixing frame 7 is equipped with a nozzle 8, which is connected to an external water source to facilitate fixing the position of the nozzle 8.

[0033] Limiting plates 9, there are two limiting plates 9, which are symmetrically fixed on the vertical bars on the front and rear sides of the fixed frame 7. The limiting plates 9 are in contact with the corresponding movable plates 5, and the position of the movable plates 5 is restricted by the limiting plates 9. Each of the two limiting plates 9 is provided with a buffer surface 20. One side of the movable plate 5 is in contact with the buffer surface. The buffer surface 20 is used to guide the movable plate 5 to move and avoid the movable plate 5 from directly hitting the limiting plate 9.

[0034] The fan 10 is located on the right side of the fixed frame 7 and is connected to an external power source. The fan 10 facilitates the drying of residual etching solution on the positioning plate 1.

[0035] Connection component 6 includes:

[0036] The limiting rod 11 consists of several rods, one end of which is symmetrically fixed to the side wall of the movable plate 5, and the other end of which is movably inserted into the side wall of the groove 3. The limiting rod 11 serves as a guide. A waterproof sleeve 18 is fixedly provided on the inner wall of the groove 3, and the limiting rod 11 is movably inserted into the waterproof sleeve 18 to prevent the etching solution from entering the interior of the positioning plate 1.

[0037] Guide plate 12, there are several guide plates 12, and several guide plates 12 are fixedly installed in the groove of positioning plate 1. Several guide rods 13 are fixedly installed on the annular wall of the guide plate 12. Several guide blocks 14 are movably sleeved on the guide rods 13. The guide rods 13 restrict the movement direction of the guide blocks 14. The ends of the several guide rods 13 are provided with limiting rings 17. The guide blocks 14 are engaged with the limiting rings 17 to restrict the movement position of the guide blocks 14.

[0038] Connecting rod 15, there are several connecting rods 15, and the two ends of the several connecting rods 15 are respectively screwed to the end of the limiting rod 11 and the guide block 14 by rotating rods. The connection of the connecting rods 15 facilitates the synchronous movement of the several limiting rods 11.

[0039] Several springs 16 are respectively sleeved on the limiting rod 11. The two ends of the springs 16 are respectively connected to the inner wall of the groove of the positioning plate 1 and the limiting rod 11. The elastic force of the springs 16 facilitates the movable plate 5 to abut against the limiting plate 9.

[0040] When using this utility model, first place the lead frame on the positioning plate 1, and then move the positioning plate 1 to the right by the belt conveyor 2. When the positioning plate 1 moves to the fixed frame 7, the movable plates 5 on the front and rear sides contact the buffer surface 20, so that the movable plates 5 on the front and rear sides are inserted into the groove 3. The movable plates 5 on the front and rear sides drive the limiting rod 11 to move. The limiting rod 11 drives the corresponding guide block 14 to move towards the guide plate 12 on the guide rod 13 through the connecting rod 15. The guide block 14 drives the other side of the limiting rod 12 through the connecting rod 15. The position rod 11 moves, causing the movable plates 5 on the left and right sides to be inserted into the grooves 3. The movable plates 5 and the contact rod 4 form a water tank on the positioning plate 1, which facilitates the storage of the etching solution sprayed by the nozzle 8 on the positioning plate 1, so that the lead frame is immersed in the etching solution, improving the etching efficiency. Until the positioning plate 1 moves to the right side, the movable plate 5 disengages from the limiting plate 9. The elastic force of the spring 16 causes the movable plate 5 to disengage from the groove 3, which facilitates the discharge of the etching solution on the positioning plate 1. Then, the fan 10 dries the positioning plate 1 and the lead frame.

[0041] Compared with the prior art, the beneficial effects of this utility model are:

[0042] 1. The contact rod 4 and the movable plate 5 facilitate the storage of etching solution on the positioning plate 1, so that the lead frame is immersed in the etching solution, the lead frame is etched evenly, and the etching efficiency is improved.

[0043] 2. Set the connecting component 6, set the guide rod 13 to limit the movement direction of the guide block 14, and then connect it with the connecting rod 15 to facilitate the synchronous movement of the limit rods 11 on the four sides, thereby making the movable plates 5 on the four sides move synchronously.

[0044] 3. Install a waterproof sleeve 18 to improve the sealing between the limit rod 11 and the positioning plate 1, and prevent the etching solution from entering the positioning plate 1;

[0045] 4. A buffer surface 20 is provided. The buffer surface 20 is used to facilitate the movement of the movable plate 5 on the limiting plate 9 and prevent the movable plate 5 from directly hitting the limiting plate 9.

[0046] For those skilled in the art, modifications can be made to the technical solutions described in the foregoing embodiments, and equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An etching apparatus for processing semiconductor lead frames, characterized in that, It comprises: positioning plates (1), wherein there are several positioning plates (1), which are fixedly mounted on the belt of the belt conveyor (2), and grooves (3) are provided on the four sides of the positioning plates (1); abutting rods (4), wherein there are several abutting rods (4), which are fixedly mounted on the four corners of the positioning plates (1); movable plates (5), wherein there are several movable plates (5), which are respectively mounted on the four sides of the positioning plates (1) by means of connecting components (6), and the movable plates (5) are movably engaged in the grooves (3), and the two sides of the movable plates (5) are engaged with the corresponding abutting rods (4); and a fixing frame (7). The fixed frame (7) consists of several fixed frames (7), which are respectively fixed on the support of the belt conveyor (2). The front and rear vertical bars of the fixed frame (7) are located on the front and rear sides of the belt conveyor (2). The horizontal bar of the fixed frame (7) is provided with a nozzle (8), which is connected to an external water source. There are two limiting plates (9), which are symmetrically fixed on the front and rear vertical bars of the fixed frame (7). The limiting plates (9) are in contact with the corresponding movable plates (5). The fan (10) is located on the right side of the fixed frame (7) and is connected to an external power source.

2. The etching apparatus for semiconductor lead frame processing according to claim 1, characterized in that: The connecting component (6) includes: a limiting rod (11), wherein there are several limiting rods (11), one end of which is symmetrically fixedly connected to the side wall of the movable plate (5), and the other end of which is movably inserted into the side wall of the groove (3); a guide plate (12), wherein there are several guide plates (12), which are fixedly arranged in the groove of the positioning plate (1), and several guide rods (13) are fixedly arranged on the annular wall of the guide plate (12). Several guide blocks (14) are movably sleeved on the guide rod (13); several connecting rods (15) are connected at both ends to the end of the limiting rod (11) and the guide block (14) respectively by rotating rods; several springs (16) are sleeved on the limiting rod (11) respectively, and the two ends of the springs (16) are connected to the inner wall of the groove of the positioning plate (1) and the limiting rod (11) respectively.

3. The etching apparatus for semiconductor lead frame processing according to claim 2, characterized in that: Several guide rods (13) are provided with limiting rings (17) at their ends, and guide blocks (14) are set to abut against the limiting rings (17).

4. The etching apparatus for semiconductor lead frame processing according to claim 2, characterized in that: A waterproof sleeve (18) is fixedly provided on the inner wall of the groove (3), and the limiting rod (11) is movably inserted into the waterproof sleeve (18).

5. The etching apparatus for semiconductor lead frame processing according to claim 1, characterized in that: Several movable plates (5) are provided with sealing gaskets (19) on both sides, and the sealing gaskets (19) are set to abut against the contact rod (4).

6. The etching apparatus for semiconductor lead frame processing according to claim 1, characterized in that: The two limiting plates (9) are respectively provided with buffer surfaces (20), and one side of the movable plate (5) is set to abut against the movable surface.

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