Etching apparatus and etching system for manufacturing a metal mask

Abstract

The application provides an etching device and etching system for manufacturing a metal mask plate. The etching device comprises a liquid storage tank, the liquid storage tank is provided with an inlet and an outlet for a belt to pass through at a design speed, the belt separates the liquid storage tank into a first liquid storage area and a second liquid storage area, the lower liquid level of the first liquid storage area and the upper liquid level of the second liquid storage area are in contact with the two sides of the belt respectively, a first liquid inlet pipeline and a second liquid inlet pipeline are in communication with the first liquid storage area and the second liquid storage area respectively, a first liquid outlet pipeline and a second liquid outlet pipeline are in communication with the first liquid storage area and the second liquid storage area respectively, and a first adjusting valve and a second adjusting valve are used for adjusting the flow rate of the first liquid inlet pipeline into the first liquid storage area and the flow rate of the second liquid inlet pipeline into the second liquid storage area respectively, so that the flow rates of the etching liquid in the first liquid storage area and the second liquid storage area are matched with the design speed of the belt. The application can keep the etching rates of the two sides of the belt consistent, thereby ensuring uniform etching of the two sides of the belt.

Description

Etching equipment and etching systems for manufacturing metal photomasks Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, and more specifically, to an etching apparatus and etching system for manufacturing metal photomasks. Background Technology

[0002] In the field of semiconductor device manufacturing technology, metal masks are often used to manufacture various film layers. Metal masks are generally made from metal strips, and the metal strips need to be etched and thinned during the manufacturing process.

[0003] Generally, multiple swingable spray devices are installed on both the upper and lower sides of the strip to spray etching liquid onto both sides of the strip, thereby performing comprehensive etching on the strip.

[0004] However, during the oscillation of the spraying device, the spraying range between adjacent spraying devices has overlapping and separated areas, resulting in the accumulation of etching solution in some areas and the sparse etching solution in other areas on the upper surface of the strip. In other words, the etching solution concentration on the upper surface of the strip is uneven, which in turn leads to uneven etching rate on the upper surface of the strip, resulting in the Mura phenomenon. Summary of the Invention

[0005] This invention provides an etching apparatus and etching system for manufacturing metal photomasks, which solves the technical problems of uneven etching solution concentration and uneven etching rate on the upper surface of the strip in related technologies.

[0006] In a first aspect, embodiments of this application provide an etching apparatus for manufacturing metal photomasks, comprising:

[0007] The liquid storage tank contains etching liquid. When the liquid storage tank is upright, it has an inlet and an outlet on its two sides that are parallel to and opposite to the direction of gravity, which are used to allow the strip to pass through at the design speed. The strip divides the liquid storage tank into a first liquid storage area and a second liquid storage area. The lower liquid surface of the first liquid storage area and the upper liquid surface of the second liquid storage area are used to contact the two sides of the strip, respectively.

[0008] The first liquid inlet pipe and the second liquid inlet pipe are respectively connected to the first liquid storage area and the second liquid storage area, and both are set on the same side as the feed inlet.

[0009] The first liquid outlet pipe and the second liquid outlet pipe are respectively connected to the first liquid storage area and the second liquid storage area, and both are set on the same side as the discharge port;

[0010] The first liquid inlet pipe and the second liquid inlet pipe are respectively equipped with a first regulating valve and a second regulating valve, which are used to regulate the flow rate of the first liquid inlet pipe into the first liquid storage area and the flow rate of the second liquid inlet pipe into the second liquid storage area, so that the flow rate of the etching solution in the first liquid storage area and the second liquid storage area are matched with the design speed of the strip.

[0011] In some embodiments, it also includes:

[0012] The first leakage treatment device is located on the outside of the feed inlet;

[0013] The second leakage treatment device is located on the outside of the discharge port.

[0014] In some embodiments, the first leakage treatment device includes a flexible element and a first air curtain;

[0015] The flexible component is located at the edge of the feed inlet and is used to contact the upper surface of the strip;

[0016] The first air curtain is located outside the feed inlet, on the same side of the strip as the first liquid storage area, and the air outlet of the first air curtain is inclined towards the feed inlet.

[0017] In some embodiments, the first leakage treatment device includes: a flexible element and a first spray device;

[0018] The flexible component is located at the edge of the feed inlet and is used to contact the upper surface of the strip;

[0019] The first spraying device is located outside the feed inlet and on the same side of the strip as the first liquid storage area. The first spraying device is used to spray etching liquid toward the upper surface of the strip.

[0020] In some embodiments, the second leakage treatment device includes: a squeezing roller and a liquid knife;

[0021] The dewatering roller is located outside the discharge port, on the same side of the strip as the first liquid storage area, and is used to contact the upper surface of the strip.

[0022] Along the direction from the feed inlet to the discharge outlet, the liquid knife is positioned between the first liquid storage area and the squeezing roller, spraying cleaning liquid or clean water toward the surface of the squeezing roller.

[0023] In some embodiments, the second leakage treatment device includes a second air curtain;

[0024] The second air curtain is located outside the discharge port and on the same side of the strip as the first liquid storage area; the air outlet of the second air curtain is inclined away from the discharge port and towards the strip.

[0025] In some embodiments, the second leakage treatment device further includes:

[0026] The second spraying device is located on the side of the squeezing roller away from the discharge port, in the direction from the feed inlet to the discharge outlet, and is used to spray cleaning liquid or clean water.

[0027] In some embodiments, a first flow meter and a second flow meter are respectively provided in the first liquid storage area and the second liquid storage area, respectively used to measure the flow rate in the first liquid storage area and the second liquid storage area;

[0028] The first flow meter is electrically connected to the first regulating valve, which is used to adjust the flow rate of the first inlet pipe according to the flow rate measured by the first flow meter.

[0029] The second flow meter is electrically connected to the second regulating valve, which is used to adjust the flow rate of the second inlet pipe according to the flow rate measured by the second flow meter.

[0030] In some embodiments, there is a gap between the outlet and the upper surface of the strip.

[0031] Secondly, embodiments of this application also provide an etching system, including any of the etching devices provided in the first aspect above, and a strip;

[0032] The strip passes through the liquid reservoir of the etching equipment at the designed speed. The flow rate of the etching liquid in the first and second liquid reservoirs of the etching equipment is matched with the designed speed of the strip.

[0033] The beneficial technical effects of the technical solutions provided in this application include:

[0034] This embodiment of the application sets up a liquid storage tank, so that when the strip passes through the liquid storage tank at the designed speed, a complete and continuous liquid film is formed on both sides of the strip inside the liquid storage tank. The first liquid storage area and the second liquid storage area on both sides of the strip are supplied with liquid through independent liquid inlet pipes. The liquid inlet pipe is set on the same side as the feed port, and the liquid outlet pipe is set on the same side as the discharge port. This forms a stable liquid flow channel between the liquid inlet pipe and the liquid outlet pipe that is consistent with the direction of strip movement, reducing turbulence and local stagnation of the etching solution in the liquid storage area, and ensuring that the concentration of etching solution in contact with each area of ​​the strip surface is always uniform.

[0035] Moreover, in a stable fluid flow channel, the flow rate of the etching solution matches the design speed of the strip. This ensures that the etching rates of the etching solution and the two sides of the strip are basically consistent, avoiding insufficient reaction due to excessive flow rate or excessive etching due to excessive flow rate. It can effectively solve the problem of strip etching thickness difference in existing technologies, thereby ensuring that the two sides of the strip are etched uniformly, improving the overall etching and thinning effect of the strip, and reducing the probability of Mura phenomenon formation. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 is a schematic diagram of one of the structures of an etching system provided in an embodiment of this application;

[0038] Figure 2 is a second schematic diagram of an etching system provided in an embodiment of this application;

[0039] Figure 3 is a third schematic diagram of an etching system provided in an embodiment of this application.

[0040] Figure label:

[0041] 10-Liquid storage tank; 11-Inlet; 12-Outlet; 13-First liquid storage zone; 14-Second liquid storage zone; 15-First flow meter; 16-Second flow meter;

[0042] 20 - First inlet pipe; 21 - First regulating valve; 30 - Second inlet pipe; 31 - Second regulating valve; 40 - First outlet pipe; 50 - Second outlet pipe;

[0043] 60-First leakage treatment device; 61-Flexible component; 62-First air curtain; 63-First spray device; 70-Second leakage treatment device; 71-Squeezing roller; 72-Liquid knife; 73-Second air curtain; 74-Second spray device;

[0044] 200 - Strip. Detailed Implementation

[0045] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0046] Those skilled in the art will understand that, unless specifically stated otherwise, the terms "described" and "the" as used herein may also include plural forms. It should be further understood that the term "comprising" as used in this application's specification means the presence of the described features, integers, and / or components, but does not exclude implementations of other features, data, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is "connected to" another element, the element may be directly connected or coupled to the other element, or it may mean that the element and the other element are connected through an intermediate element. The term "and / or" as used herein refers to at least one of the items defined by the term; for example, "A and / or B" can be implemented as "A," or as "B," or as "A and B."

[0047] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0048] This application provides an etching apparatus and etching system for manufacturing metal photomasks, in order to solve the above-mentioned technical problems of the prior art.

[0049] This application provides an etching apparatus for manufacturing metal photomasks, as shown in FIG1. ​​The etching apparatus includes: a liquid storage tank 10, a first liquid inlet pipe 20, a second liquid inlet pipe 30, a first liquid outlet pipe 40, and a second liquid outlet pipe 50.

[0050] The storage tank 10 contains etching fluid. When the storage tank 10 is upright, it has an inlet 11 and an outlet 12 on its two sides that are parallel to and opposite to the direction of gravity, for the strip 200 to pass through at the designed speed. The strip 200 divides the storage tank 10 into a first storage area 13 and a second storage area 14. The lower liquid surface of the first storage area 13 and the upper liquid surface of the second storage area 14 are respectively used to contact the two sides of the strip 200.

[0051] The first liquid inlet pipe 20 and the second liquid inlet pipe 30 are respectively connected to the first liquid storage area 13 and the second liquid storage area 14, and are both located on the same side as the feed inlet 11.

[0052] The first liquid outlet pipe 40 and the second liquid outlet pipe 50 are respectively connected to the first liquid storage area 13 and the second liquid storage area 14, and are both set on the same side as the discharge port 12.

[0053] A first regulating valve 21 and a second regulating valve 31 are respectively provided on the first liquid inlet pipe 20 and the second liquid inlet pipe 30, which are used to regulate the flow rate of the first liquid inlet pipe 20 into the first liquid storage area 13 and the flow rate of the second liquid inlet pipe 30 into the second liquid storage area 14, so that the flow rate of the etching solution in the first liquid storage area 13 and the second liquid storage area 14 are matched with the design speed of the strip 200.

[0054] In this embodiment, by setting up a liquid storage tank 10, when the strip 200 passes through the liquid storage tank 10 at a designed speed, a complete and continuous liquid film is formed on both sides of the strip 200 located in the liquid storage tank 10. The first liquid storage area 13 and the second liquid storage area 14 on both sides of the strip 200 are supplied with liquid through independent liquid inlet pipes, and the liquid inlet pipe is set on the same side as the feed port 11 and the liquid outlet pipe is set on the same side as the discharge port 12. This forms a stable liquid flow channel between the liquid inlet pipe and the liquid outlet pipe that is consistent with the direction of movement of the strip 200, reducing the turbulence and local stagnation of the etching solution in the liquid storage area, and ensuring that the concentration of the etching solution in contact with each area of ​​the strip 200 surface is always uniform.

[0055] Moreover, in a stable fluid flow channel, the flow rate of the etching solution matches the design speed of the strip 200. This ensures that the etching rates of the etching solution and the two sides of the strip 200 are basically consistent, avoiding insufficient reaction due to excessive flow rate or over-etching due to excessive flow rate. This effectively solves the problem of uneven etching thickness of the strip 200 in the existing technology, thereby ensuring that the two sides of the strip 200 are etched uniformly, improving the overall etching and thinning effect of the strip 200, and reducing the probability of Mura phenomenon formation.

[0056] Specifically, in this embodiment, the strip 200 divides the liquid storage tank 10 into a first liquid storage area 13 and a second liquid storage area 14 located on both sides of the strip 200. Along the movement direction of the strip 200, the first liquid storage area 13 is connected to a first liquid inlet pipe 20 and a first liquid outlet pipe 40 at its two ends, forming a stable liquid flow channel between the first liquid inlet pipe 20 and the first liquid outlet pipe 40. By controlling the first regulating valve 21 of the first liquid inlet pipe 20, the flow rate into the first liquid storage area 13 is controlled, thereby adjusting the flow rate of the etching solution in the first liquid storage area 13 so that the flow rate of the etching solution in the first liquid storage area 13 matches the design speed of the strip 200.

[0057] Similarly, along the movement direction of the strip 200, the two ends of the second liquid storage area 14 are respectively connected to a second liquid inlet pipe 30 and a second liquid outlet pipe 50, forming a stable liquid flow channel between the second liquid inlet pipe 30 and the second liquid outlet pipe 50. By controlling the second regulating valve 31 of the second liquid inlet pipe 30, the flow rate into the second liquid storage area 14 is controlled, thereby adjusting the flow rate of the etching solution in the second liquid storage area 14 so that the flow rate of the etching solution in the second liquid storage area 14 matches the design speed of the strip 200.

[0058] It should be noted that in this embodiment, the flow rates of the etching solution in the first reservoir 13 and the second reservoir 14 are matched with the design speed of the strip 200. This does not mean that the flow rates of the etching solution in the first reservoir 13 and the second reservoir 14 are completely consistent with the design speed of the strip 200, but rather that they are approximately the same within an allowable error range. For example, the maximum difference between any two of the flow rates of the etching solution in the first reservoir 13 and the second reservoir 14 and the design speed of the strip 200 does not exceed ±10% of the maximum value among the three.

[0059] Considering that both the inlet 11 and the outlet 12 have gaps, in order for the strip 200 to pass smoothly through the liquid storage tank 10, the inlet 11 and the outlet 12 cannot be completely sealed with the strip 200, which may result in leakage. Therefore, in some embodiments, as shown in Figures 2-3, the etching equipment further includes: a first leakage treatment device 60 and a second leakage treatment device 70.

[0060] The first leakage treatment device 60 is located outside the feed inlet 11; the second leakage treatment device 70 is located outside the discharge outlet 12.

[0061] In this embodiment, the first leakage treatment device 60 and the second leakage treatment device 70 are both located outside the liquid storage tank 10 to treat the etching liquid leaking from the feed inlet 11 and the discharge outlet 12 respectively, preventing the leaked etching liquid from accumulating on the upper surface of the strip 200, and further making the etching rate and etching thickness consistent in each area of ​​the upper surface of the strip 200.

[0062] This application provides two parallel implementations of the first leakage treatment device 60.

[0063] Firstly, in some embodiments, as shown in FIG2, the first leakage treatment device 60 includes a flexible member 61 and a first air curtain 62.

[0064] The flexible element 61 is disposed at the edge of the feed port 11 and is used to contact the upper surface of the strip 200.

[0065] The first air curtain 62 is located outside the feed inlet 11 and on the same side of the strip 200 as the first liquid storage area 13. The air outlet direction of the first air curtain 62 is inclined towards the feed inlet 11.

[0066] In this embodiment, the flexible component 61 is disposed at the feed inlet 11, which can play a certain role in preventing liquid leakage. Moreover, the flexible component 61 is made of flexible material. When the strip 200 has a certain design speed, the blocking effect of the flexible component 61 on the strip 200 is small, and it basically does not affect the strip 200 passing through. The first air curtain 62 is disposed outside the feed inlet 11 and blows air towards the feed inlet 11, which can play a certain blocking role and prevent the etching liquid from flowing out of the feed inlet 11.

[0067] It should be noted that in this embodiment, the first air curtain 62 and the first liquid storage area 13 are located on the same side of the strip 200, that is, both the first air curtain 62 and the first liquid storage area 13 are located above the strip 200 along the direction of gravity, so that the first air curtain 62 blows away the etching liquid remaining on the upper surface of the strip 200. However, the etching liquid on the lower surface of the strip 200 can dissipate on its own under the influence of gravity, without the need for a separate first leakage device.

[0068] Secondly, in some embodiments, as shown in FIG3, the first leakage treatment device 60 includes: a flexible member 61 and a first spraying device 63.

[0069] The flexible element 61 is disposed at the edge of the feed port 11 and is used to contact the upper surface of the strip 200.

[0070] The first spraying device 63 is located outside the feed inlet 11 and on the same side of the strip 200 as the first liquid storage area 13. The first spraying device 63 is used to spray etching liquid toward the upper surface of the strip 200.

[0071] In this embodiment, the flexible component 61 is disposed at the feed inlet 11, which can play a certain role in preventing leakage. The flexible component 61 is made of flexible material, so when the strip 200 has a certain design speed, the blocking effect of the flexible component 61 on the strip 200 is small, and it basically does not affect the strip 200 passing through. The first spraying device 63 is disposed outside the feed inlet 11, spraying etching liquid towards the upper surface of the strip 200 near the feed inlet 11 to pre-wet the strip 200, so that the etching liquid concentration on the upper surface of the strip 200 near the feed inlet 11 is consistent with the etching liquid concentration inside the storage tank 10. This ensures that the overall etching thickness of the upper surface of the strip 200 after passing through the storage tank 10 is consistent, guaranteeing a uniform etching effect. By pre-wetting the upper surface of the strip 200 before it enters the feed port 11, all positions on the upper surface of the strip 200 receive the same concentration of etching solution before entering the feed port 11. Even if there are individual positions on the upper surface of the strip 200 where etching solution leaks out from the feed port 11, the amount of leaked etching solution is much smaller than the amount of pre-wetting etching solution. Therefore, the effect of leaked etching solution on the upper surface of the strip 200 can be ignored, thereby reducing the impact of leaked etching solution on the uneven etching of the upper surface of the strip 200.

[0072] This application provides the following implementation methods for the second leakage treatment device 70.

[0073] In some embodiments, as shown in FIG2, the second leakage treatment device 70 includes a squeezing roller 71 and a liquid knife 72.

[0074] The dewatering roller 71 is located outside the discharge port 12 and on the same side of the strip 200 as the first liquid storage area 13, and is used to contact the upper surface of the strip 200.

[0075] Along the direction from the feed inlet 11 to the discharge outlet 12, the liquid knife 72 is positioned between the first liquid storage area 13 and the squeezing roller 71, spraying cleaning liquid or clean water toward the surface of the squeezing roller 71.

[0076] In this embodiment, the desqueezing roller 71 and the first liquid storage area 13 are located on the same side of the strip 200, that is, the desqueezing roller 71 is positioned above the strip 200 along the direction of gravity. The desqueezing roller 71 rotates around its axis and contacts the strip 200, thereby removing the etching liquid carried out from the upper surface of the strip 200 exiting from the discharge port 12. Since the desqueezing roller 71 rotates around its axis, etching liquid will adhere to its surface. Therefore, a liquid cutter 72 is provided next to the desqueezing roller 71. The liquid cutter 72 sprays cleaning liquid or clean water onto the surface of the desqueezing roller 71 to remove the residual etching liquid on the surface of the desqueezing roller 71, ensuring the cleanliness of the surface of the desqueezing roller 71 and preventing the etching liquid on the desqueezing roller 71 from adhering to the surface of the strip 200, which would cause uneven etching of the strip 200.

[0077] Furthermore, along the direction from the feed inlet 11 to the discharge outlet 12, the liquid knife 72 is positioned between the first liquid storage area 13 and the squeezing roller 71, with the liquid discharge direction tilted towards the squeezing roller 71. On the one hand, it can clean the etching liquid carried on the squeezing roller 71, and on the other hand, it can prevent the cleaning liquid or water sprayed by the liquid knife 72 from flowing back into the liquid storage tank 10 from the discharge outlet 12, contaminating the etching liquid inside the liquid storage tank 10, resulting in uneven distribution of etching liquid concentration and ultimately causing uneven etching of the strip 200.

[0078] It should be noted that in this embodiment, the flexible element 61 is not provided at the discharge port 12. If the flexible element 61 is provided at the discharge port 12, the etching solution at the discharge port 12 will accumulate, which will result in different etching solution concentrations and etching rates at the discharge port 12 compared to other areas, thus affecting the overall etching effect.

[0079] In some embodiments, as shown in FIG2, the second leakage treatment device 70 further includes a second air curtain 73.

[0080] The second air curtain 73 is located outside the discharge port 12 and on the same side of the strip 200 as the first liquid storage area 13; the air outlet direction of the second air curtain 73 is inclined away from the discharge port 12 and towards the strip 200.

[0081] In this embodiment, the second air curtain 73 and the first liquid storage area 13 are located on the same side of the strip 200, that is, the second air curtain 73 is also located above the strip 200 along the direction of gravity. It blows the etching liquid carried out from the surface of the strip 200 away from the liquid storage tank 10, so as to prevent the etching liquid from accumulating on the surface of the strip 200 that passes through the outlet 12, thereby causing over-etching in some areas, and thus ultimately forming an uneven etching effect on the surface of the strip 200.

[0082] In some embodiments, as shown in FIG2, the second leakage treatment device 70 further includes a second spray device 74.

[0083] Along the direction from the feed inlet 11 to the discharge outlet 12, the second spraying device 74 is located on the side of the squeezing roller 71 away from the discharge outlet 12, and is used to spray cleaning liquid or clean water.

[0084] In this embodiment, the second leakage treatment device 70 further includes a second spraying device 74. The second spraying device 74 is disposed on the side of the squeezing roller 71 away from the discharge port 12. After the strip 200 passes through the squeezing roller 71, the second spraying device 74 sprays cleaning liquid or clean water toward the upper surface of the strip 200 to clean the surface of the strip 200 and further remove any residual etching liquid. This ensures that the strip 200 is no longer etched by residual etching liquid after passing through the liquid storage tank 10, and avoids the formation of the Mura phenomenon after etching.

[0085] In some embodiments, as shown in FIG1, a first flow meter 15 and a second flow meter 16 are respectively provided in the first liquid storage area 13 and the second liquid storage area 14, which are used to measure the flow rate of the first liquid storage area 13 and the second liquid storage area 14, respectively.

[0086] The first flow meter 15 is electrically connected to the first regulating valve 21, which is used to adjust the flow rate of the first inlet pipe 20 according to the flow rate measured by the first flow meter 15.

[0087] The second flow meter 16 is electrically connected to the second regulating valve 31, which is used to adjust the flow rate of the second inlet pipe 30 according to the flow rate measured by the second flow meter 16.

[0088] In this embodiment, the first flow meter 15 and the second flow meter 16 can measure the flow rate of the first liquid storage area 13 and the second liquid storage area 14 in real time, and transmit the flow rate information to the first regulating valve 21 and the second regulating valve 31. This allows the first regulating valve 21 and the second regulating valve 31 to dynamically acquire the flow rate information of the first liquid storage area 13 and the second liquid storage area 14 and adjust the flow rate, thereby adjusting the flow rate in the first liquid storage area 13 and the second liquid storage area 14 so that the flow rate of the etching solution in the first liquid storage area 13 and the second liquid storage area 14 matches the design speed of the strip 200.

[0089] In some embodiments, the outlet 12 is spaced from the upper surface of the strip 200.

[0090] In this embodiment, there is a gap between the outlet 12 and the upper surface of the strip 200, so that a portion of the etching solution is carried out from the strip 200 through the outlet 12, preventing the etching solution from accumulating at the outlet 12, which would cause changes in the flow rate of the etching solution at the outlet 12 and consequently, changes in concentration, thus ensuring a comprehensive etching effect.

[0091] Based on the same inventive concept, embodiments of this application also provide an etching system, including etching equipment for manufacturing metal mask plates as provided in any of the above embodiments, and strip 200.

[0092] The strip 200 passes through the liquid storage tank 10 of the etching equipment at the designed speed. The flow rate of the etching liquid in the first liquid storage zone 13 and the second liquid storage zone 14 of the etching equipment is matched with the designed speed of the strip 200.

[0093] In this embodiment, the etching equipment provided in any of the foregoing embodiments is used, and its technology and principle are similar, so they will not be described again here. This embodiment of the application sets up a liquid storage tank 10 for the etching equipment, so that when the strip 200 passes through the liquid storage tank 10 at the designed speed, both sides of the strip 200 located within the liquid storage tank 10 are completely covered by the etching liquid in the liquid storage tank 10. Furthermore, the flow rate of the etching liquid on both sides of the strip 200 is consistent with the designed speed of the strip 200. After the etching liquid reacts with the surface of the strip 200, it flows synchronously with the strip 200. The flowing etching liquid causes the concentration of the etching liquid to be continuously updated along the direction of movement of the strip 200, ensuring that the etching rate is consistent at all points on both sides of the strip 200. This guarantees that both sides of the strip 200 are uniformly etched, improving the overall etching and thinning effect of the strip 200.

[0094] By applying the embodiments of this application, at least the following beneficial effects can be achieved:

[0095] (1) In this embodiment of the application, by setting up a liquid storage tank 10, when the strip 200 passes through the liquid storage tank 10 at the design speed, a complete and continuous liquid film is formed on both sides of the strip 200 located in the liquid storage tank 10. The first liquid storage area 13 and the second liquid storage area 14 on both sides of the strip 200 are supplied with liquid through independent liquid inlet pipes. The liquid inlet pipe is set on the same side as the feed port 11 and the liquid outlet pipe is set on the same side as the discharge port 12. This forms a stable liquid flow channel between the liquid inlet pipe and the liquid outlet pipe that is consistent with the direction of movement of the strip 200, reducing the turbulence and local stagnation of the etching solution in the liquid storage area, and ensuring that the concentration of the etching solution in contact with each area of ​​the surface of the strip 200 is always uniform. In a stable fluid flow channel, the flow rate of the etching solution is matched with the design speed of the strip 200. This ensures that the etching rates of the etching solution and the two sides of the strip 200 are basically consistent, avoiding insufficient reaction due to excessive flow rate or over-etching due to excessive flow rate. It can effectively solve the problem of uneven etching on the upper surface of the strip 200 and the Mura phenomenon caused by uneven etching in the existing technology, thereby ensuring that the two sides of the strip 200 are etched uniformly and improving the overall etching and thinning effect of the strip 200.

[0096] (2) The flexible component 61 is set at the feed inlet 11, which can play a certain role in preventing leakage. The flexible component 61 is made of flexible material. When the strip 200 has a certain design speed, the blocking effect of the flexible component 61 on the strip 200 is small and basically does not affect the strip 200 passing through. Furthermore, in order to prevent large droplets of etching liquid leaking from the feed inlet 11 from staying on the surface of the strip 200 and reacting with the strip 200, thereby causing uneven etching on the strip 200, the first air curtain 62 is set outside the feed inlet 11 and blows air towards the feed inlet 11, which can play a certain blocking role and prevent the etching liquid from flowing out of the feed inlet 11.

[0097] (3) The squeezing roller 71 and the first liquid storage area 13 are located on the same side of the strip 200, that is, the squeezing roller 71 is set above the strip 200 along the direction of gravity. The squeezing roller 71 rotates around the axis and contacts the strip 200. The squeezing roller 71 removes the etching liquid brought out from the upper surface of the strip 200 from the outlet 12 by squeezing the strip 200. Since the squeezing roller 71 rotates around the axis, the surface will be covered with etching liquid. Therefore, a liquid knife 72 is set next to the squeezing roller 71. The liquid knife 72 sprays cleaning liquid or clean water on the surface of the squeezing roller 71 to remove the residual etching liquid on the surface of the squeezing roller 71, ensure the cleanliness of the surface of the squeezing roller 71, prevent the etching liquid on the squeezing roller 71 from adhering to the surface of the strip 200 again, and avoid the strip 200 being unevenly etched by the etching liquid.

[0098] (4) Further, a second air curtain 73 is provided, located on the same side of the strip 200 as the first liquid storage area 13, that is, the second air curtain 73 is also located above the strip 200 along the direction of gravity. On the one hand, it blows the etching liquid carried out from the surface of the strip 200 away from the liquid storage tank 10, preventing the etching liquid from accumulating on the surface of the strip 200 that passes through the discharge port 12, thus causing some areas to be over-etched. On the other hand, during the rotation of the squeezing roller 71, the etching liquid carried by the squeezing roller 71 is thrown onto the squeezing roller 71. On both sides, for the side of the squeezing roller 71 facing the discharge port 12, since the discharge port 12 cannot be equipped with a flexible part 61 similar to the feed port 11, in order to prevent the etching liquid thrown off by the squeezing roller 71 from re-entering the storage tank 10 from the discharge port 12 and contaminating the etching liquid concentration in the storage tank 10, a second air curtain 73 is provided. The blowing pressure of the second air curtain 73 can also form a relatively closed space on one side of the discharge port 12, preventing the etching liquid thrown off by the squeezing roller 71 from entering the storage tank 10 from the discharge port 12.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An etching apparatus for manufacturing metal photomasks, characterized in that, include: A storage tank contains etching solution. When the storage tank is upright, an inlet and an outlet are respectively located on opposite sides parallel to the direction of gravity, for the strip to pass through at a designed speed. The strip divides the storage tank into a first storage area and a second storage area. The lower liquid surface of the first storage area and the upper liquid surface of the second storage area are respectively used to contact the two sides of the strip. A first inlet pipe and a second inlet pipe are respectively connected to the first storage area and the second storage area, and are both located on the same side as the inlet. A first outlet pipe and a second outlet pipe are respectively connected to the first storage area and the second storage area, and are both located on the same side as the outlet. A first regulating valve and a second regulating valve are respectively provided on the first inlet pipe and the second inlet pipe, for regulating the flow rate of the etching solution entering the first storage area through the first inlet pipe and the flow rate of the etching solution entering the second storage area through the second inlet pipe, so that the flow rate of the etching solution in the first storage area and the second storage area matches the designed speed of the strip.

2. The etching apparatus for manufacturing metal photomasks according to claim 1, characterized in that, Also includes: A first leakage treatment device is located outside the feed inlet; a second leakage treatment device is located outside the discharge outlet.

3. The etching apparatus for manufacturing metal photomasks according to claim 2, characterized in that, The first leakage treatment device includes a flexible element and a first air curtain; the flexible element is disposed at the edge of the feed inlet for contacting the upper surface of the strip; the first air curtain is disposed outside the feed inlet, on the same side of the strip as the first liquid storage area, and the air outlet direction of the first air curtain is inclined toward the feed inlet.

4. The etching apparatus for manufacturing metal photomasks according to claim 2, characterized in that, The first leakage treatment device includes: a flexible component and a first spraying device; the flexible component is disposed at the edge of the feed inlet for contacting the upper surface of the strip; the first spraying device is disposed outside the feed inlet, on the same side of the strip as the first liquid storage area, and is used to spray etching liquid toward the upper surface of the strip.

5. The etching apparatus for manufacturing metal photomasks according to claim 2, characterized in that, The second leakage treatment device includes: a squeezing roller and a liquid knife; the squeezing roller is disposed outside the discharge port and on the same side of the strip as the first liquid storage area, for contacting the upper surface of the strip; along the direction from the feed port to the discharge port, the liquid knife is disposed between the first liquid storage area and the squeezing roller, and sprays cleaning liquid or clean water toward the surface of the squeezing roller.

6. The etching apparatus for manufacturing metal photomasks according to claim 5, characterized in that, The second leakage treatment device includes a second air curtain; the second air curtain is disposed outside the discharge port and is located on the same side of the strip as the first liquid storage area; the air outlet direction of the second air curtain is inclined away from the discharge port and towards the strip.

7. The etching apparatus for manufacturing metal photomasks according to claim 5, characterized in that, The second leakage treatment device further includes: a second spraying device; along the direction from the feed inlet to the discharge outlet, the second spraying device is disposed on the side of the squeezing roller away from the discharge outlet, for spraying cleaning liquid or clean water.

8. The etching apparatus for manufacturing metal photomasks according to claim 1, characterized in that, The first liquid storage area and the second liquid storage area are respectively equipped with a first flow meter and a second flow meter, which are used to measure the flow rate of the first liquid storage area and the second liquid storage area, respectively; the first flow meter is electrically connected to the first regulating valve, which is used to adjust the flow rate of the first liquid inlet pipe according to the flow rate measured by the first flow meter; the second flow meter is electrically connected to the second regulating valve, which is used to adjust the flow rate of the second liquid inlet pipe according to the flow rate measured by the second flow meter.

9. The etching apparatus for manufacturing metal photomasks according to claim 1, characterized in that, The discharge port is spaced from the upper surface of the strip.

10. An etching system, characterized in that, The method includes an etching apparatus as described in any one of claims 1-9, and a strip; the strip passes through the reservoir of the etching apparatus at a designed speed, and the flow rates of the etching fluid in the first and second reservoirs of the etching apparatus are matched with the designed speed of the strip.

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