Assembly tool of semiconductor component

Abstract

The utility model relates to the technical field of tool clamps, in particular to an assembly tool of a semiconductor component, which comprises a base and an upper cover, a positioning groove is arranged in the base, a module is arranged in the positioning groove, a plurality of stations are arranged in the module, a plurality of air holes matched with the stations are arranged on the base, and the upper cover is arranged on the base. The base is provided with a plurality of air holes, the base is provided with exhaust pipes connected with the air holes, one side of the base is provided with exhaust holes matched with the exhaust pipes, lead frames used for bearing wafers are placed on the stations, the upper cover is provided with injection molding holes matched with the stations, and the injection molding holes are externally connected with a negative pressure device through the exhaust holes. And negative pressure pumping operation is carried out in the base, so that scraps remaining on the bottom die are discharged from the air hole, the exhaust pipe and the exhaust hole, the scraps are prevented from influencing the performance of the wafer, and the scraps in the station of the bottom die are sucked out by arranging the air guide groove.

Description

Assembly fixture for semiconductor components Technical Field

[0001] This utility model relates to the field of tooling and fixture technology, and in particular to an assembly tooling for semiconductor components. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is diced into small wafers after the dicing process. Then, the diced wafers are mounted onto the islands of the corresponding substrate frame (lead frame) to form the required circuit. Usually, molding compounds such as epoxy resin are used to wrap the wafer and the connection between the wafer and the lead frame to protect the components from damage, prevent gas oxidation of the internal chips, and ensure the safety and stability of the product. Finally, the individual wafers are encapsulated and protected with plastic shells.

[0003] Existing semiconductor molding processes require the use of molding equipment for encapsulation. For example, Chinese Patent Publication No. CN220464541 U discloses "a semiconductor processing molding equipment", which places the chip in a mold cavity one, and then an electric push rod pushes the upper mold to move downward until the upper mold and lower mold are closed. The injection tube extends into the injection port and injects epoxy resin inward. The epoxy resin enters the mold cavity one and the mold cavity two through the connecting groove one and the connecting groove two to perform the molding operation.

[0004] However, in actual use, due to the precision of the internal structure of the wafer, a clean environment must be ensured during molding. During the molding process, some debris may remain in the mold cavity, which can easily damage the wafer after molding and reduce the performance of the packaged components. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as the tendency for residual debris to remain in the mold cavity during the encapsulation process, which can easily damage the subsequently encapsulated wafer and reduce the performance of the packaged components. Therefore, this invention proposes an assembly fixture for semiconductor components.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Design an assembly fixture for semiconductor components, including a base and a top cover. The base has a positioning groove, a module is arranged in the positioning groove, and multiple workstations are arranged in the module. The base has multiple air holes that cooperate with the workstations, and an exhaust pipe connected to the multiple air holes is provided on the base. An exhaust hole that cooperates with the exhaust pipe is provided on one side of the base. Each workstation has a lead frame for supporting wafers. The top cover has injection holes that cooperate with the workstations.

[0008] Furthermore, the module includes a bottom mold and an upper mold, the upper mold being provided with an injection port corresponding to the work station.

[0009] Furthermore, a positioning block corresponding to the lead frame is fixedly provided on the bottom mold, and a pressure block that cooperates with the lead frame is fixedly provided at the lower end of the upper mold.

[0010] Furthermore, each of the workstations has an air guide groove on one side, and the upper mold is fixedly connected to a sealing block corresponding to the air guide groove by a pressure block.

[0011] Furthermore, a support ring is fixedly provided at the lower end of the bottom mold, and the support ring is in contact with the bottom of the positioning groove.

[0012] Furthermore, a sealing part corresponding to the module is fixedly provided at the lower end of the upper cover, and multiple injection holes are connected by a guide pipe. An inlet corresponding to the guide pipe is opened on the upper cover.

[0013] The assembly fixture for semiconductor components proposed in this utility model has the following advantages:

[0014] In this invention, a negative pressure device is connected to the vent hole to perform a negative pressure operation inside the base, thereby discharging the debris remaining on the bottom mold along the vent hole, vent pipe and vent hole, preventing the debris from affecting the performance of the wafer.

[0015] Secondly, in this invention, by setting an air guide groove, the debris in the bottom mold station is sucked out. At the same time, during the plastic sealing process, the sealing block of the upper mold seals the air guide groove to prevent the air guide groove from being blocked during plastic sealing. Attached Figure Description

[0016] Figure 1 is a schematic diagram of the assembly fixture for a semiconductor device proposed in this utility model;

[0017] Figure 2 is a schematic diagram of the exhaust pipe of this utility model;

[0018] Figure 3 is a schematic diagram of the enlarged structure of region A of this utility model;

[0019] Figure 4 is a structural schematic diagram of the lower mold of this utility model;

[0020] Figure 5 is a schematic diagram of the enlarged structure of region B of this utility model.

[0021] In the diagram: 1. Base; 11. Air hole; 12. Exhaust pipe; 13. Exhaust port; 2. Top cover; 21. Injection hole; 22. Sealing part; 23. Guide pipe; 24. Feed port; 3. Positioning groove; 4. Module; 41. Bottom mold; 42. Upper mold; 43. Injection port; 44. Positioning block; 45. Pressure block; 46. Sealing block; 47. Support ring; 5. Station; 51. Lead frame. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Referring to Figures 1-5, an assembly fixture for a semiconductor component includes a base 1 and a top cover 2. The base 1 has a positioning groove 3, a module 4, and multiple workstations 5. The base 1 has multiple air holes 11 that cooperate with the workstations 5. The base 1 also has an exhaust pipe 12 that connects to the multiple air holes 11. One side of the base 1 has an exhaust hole 13 that cooperates with the exhaust pipe 12. Each workstation 5 has a lead frame 51 for supporting wafers. The top cover 2 has injection holes 21 that cooperate with the workstations 5.

[0024] In this invention, a negative pressure device is connected to the vent 13 to perform a negative pressure operation on the positioning groove 3 in the base 1, thereby discharging the debris remaining in the positioning groove 3 along the vent 11, the vent pipe 12 and finally the vent 13, preventing the debris from affecting the performance of the wafer.

[0025] Furthermore, in this embodiment, the module 4 includes a bottom mold 41 and an upper mold 42. The upper mold 42 is provided with an injection port 43 corresponding to the station 5. The injection ports 43 located in the same column are connected by a connecting groove. That is, if the station 5 in the same column only needs to be injected into one of them, the other stations 5 in the same column will also be injected.

[0026] Furthermore, in this embodiment, a positioning block 44 corresponding to the lead frame 51 is fixedly provided on the bottom mold 41, and a pressure block 45 cooperating with the lead frame 51 is fixedly provided at the lower end of the upper mold 42. The positioning block 44 positions and fixes the pins of the lead frame 51 to prevent them from deviating from the preset position. The pressure block 45 partially blocks the pins of the lead frame 51 to prevent the pins from being completely wrapped by injection molding.

[0027] It should be noted that in this embodiment, air guide grooves are provided on one side of each station 5. The upper mold 42 is fixedly connected to a sealing block 46 corresponding to the air guide groove through a pressure block 45. By setting the air guide grooves, the debris in the station 5 is sucked out. At the same time, during the plastic sealing process, the sealing block 46 of the upper mold 42 seals the air guide grooves to prevent the air guide grooves from being blocked during the plastic sealing process.

[0028] Furthermore, in this embodiment, a support ring 47 is fixedly provided at the lower end of the bottom mold 41. The support ring 47 is in contact with the bottom of the positioning groove 3, and a negative pressure space is formed between the support ring 47 and the positioning groove 3 to prevent some of the air holes 11 from being blocked, which would cause the corresponding work station 5 to fail to perform the suction and impurity removal operation.

[0029] More specifically, in this embodiment, the lower end of the upper cover 2 is fixedly provided with a sealing part 22 corresponding to the module 4, and multiple injection holes 21 are connected by a guide pipe 23. The upper cover 2 is provided with a feed port 24 corresponding to the guide pipe 23. The injection molding material is transported to each injection hole 21 through the guide pipe 23, thereby performing injection molding on each row of workstations 5.

[0030] Working method: During operation, a negative pressure device is connected to the vent 13 to perform a negative pressure operation on the positioning groove 3 in the base 1, thereby discharging the residual debris in the positioning groove 3 along the vent 11, the vent pipe 12 and finally the vent 13, preventing the debris from affecting the performance of the wafer. The debris in the station 5 is sucked out by setting the air guide groove. At the same time, during the plastic sealing process, the sealing block 46 of the upper mold 42 seals the air guide groove to prevent the air guide groove from being blocked during the plastic sealing process.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An assembly fixture for a semiconductor component, comprising a base (1) and a top cover (2), characterized in that, The base (1) is provided with a positioning groove (3), the positioning groove (3) is provided with a module (4), the module (4) is provided with multiple workstations (5), the base (1) is provided with multiple air holes (11) that cooperate with the workstations (5), the base (1) is provided with an exhaust pipe (12) that connects to the multiple air holes (11), one side of the base (1) is provided with an exhaust hole (13) that cooperates with the exhaust pipe (12), each workstation (5) is provided with a lead frame (51) for carrying wafers, and the top cover (2) is provided with an injection hole (21) that cooperates with the workstations (5).

2. The semiconductor component assembly tool according to claim 1, wherein: The module (4) includes a bottom mold (41) and an upper mold (42), and the upper mold (42) is provided with an injection port (43) corresponding to the station (5).

3. The assembly fixture for a semiconductor component according to claim 2, characterized in that: The bottom mold (41) is fixedly provided with a positioning block (44) corresponding to the lead frame (51), and the lower end of the upper mold (42) is fixedly provided with a pressure block (45) that cooperates with the lead frame (51).

4. The semiconductor device assembly tool of claim 3, wherein: Each of the workstations (5) has an air guide groove on one side, and the upper mold (42) is fixedly connected to a sealing block (46) corresponding to the air guide groove by a pressure block (45).

5. The semiconductor device assembly tool of claim 2, wherein: A support ring (47) is fixedly provided at the lower end of the bottom mold (41), and the support ring (47) is in contact with the bottom of the positioning groove (3).

6. The semiconductor device assembly tool of claim 1, wherein: The lower end of the upper cover (2) is fixedly provided with a sealing part (22) corresponding to the module (4), and a plurality of injection holes (21) are connected by a guide pipe (23). The upper cover (2) is provided with a feed port (24) corresponding to the guide pipe (23).

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