High-pressure spraying device for cleaning semiconductor carrier

Abstract

The utility model provides a high-pressure spraying device for cleaning a semiconductor carrier, which comprises a bottom plate, the upper surface of the bottom plate is fixedly connected with a fence, two ends of an inner cavity of the fence are symmetrically connected with fixing columns, the outer side surfaces of the fixing columns are movably connected with sleeves through sealing bearings, moving grooves are formed in the fixing columns, and main screw rods are movably connected in the moving grooves through bearings. One end of the moving plate is slidably connected into the moving groove through a main screw rod in threaded connection, the other end of the moving plate is fixedly connected with the base plate, the lower surface of the sleeve is fixedly connected with a fixing plate, the upper end of the fixing plate is fixedly connected with a liquid injection pipe, and the lower end of the fixing plate is fixedly connected with a spraying plate. Through cooperation of the main motor, the gear ring, the sleeve, the fixing plate, the spraying plate and the liquid injection pipe, the device can rotate around the wafer box to conduct comprehensive high-pressure spraying cleaning, the cleaning effect of the wafer box can be enhanced in an auxiliary mode, and the overall cleaning efficiency of the device can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor carrier cleaning technology, specifically to a high-pressure spray device for cleaning semiconductor carriers. Background Technology

[0002] Semiconductor carriers are devices used to fix and protect chips or wafers during semiconductor manufacturing. Their main function is to transport, store, and protect chips or wafers in different manufacturing steps, ensuring their position and integrity remain unaffected during manufacturing. Semiconductor carriers mainly include wafer boats, wafer cassettes, CMP retaining rings, and photomask cassettes. During semiconductor manufacturing, impurities such as particles, metal contaminants, and organic matter may adhere to the carrier surface. These impurities can severely affect the performance and quality of the chips. For example, particle and metal contamination can cause short circuits or open circuits, affecting the electrical performance of the chips; organic residues can affect the manufacturing precision and stability of the chips. However, existing wet cleaning equipment, due to the relatively fixed position of its spray structure during wafer cassette cleaning, results in some areas of the wafer cassette surface not being cleaned by the cleaning solution. This necessitates workers to perform auxiliary flipping or increase the number of spray structures. The former reduces the efficiency of semiconductor carrier cleaning, and the use of special cleaning solutions can also affect worker safety, while the latter increases the complexity of the internal structure of the cleaning equipment and production costs. Utility Model Content

[0003] To overcome the shortcomings of the existing technology, a high-pressure spray device for cleaning semiconductor carriers is provided to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, a high-pressure spray device for cleaning semiconductor carriers is provided, comprising: a base plate, a barrier fixedly connected to the upper surface of the base plate, fixed columns symmetrically connected to both ends of the inner cavity of the barrier, a sleeve movably connected to the outer side of the fixed columns via a sealed bearing, a movable groove formed inside the fixed columns, a main screw movably connected to the movable groove via a bearing, and one end of a movable plate slidably connected to the movable groove via a screwed main screw, the other end of the movable plate being fixedly connected to a base plate, a fixed plate fixedly connected to the lower surface of the sleeve, a liquid injection pipe fixedly connected to the upper end of the fixed plate, a spray plate fixedly connected to the lower end of the fixed plate, the inner cavity of the spray plate communicating with the inner cavity of the fixed plate, a main motor fixedly connected to the outer side of the barrier, a drive wheel fixedly connected to the output shaft of the main motor meshing with a gear ring fixedly connected to the outer side of the sleeve, and a secondary screw movably connected to the base plate via a sealed bearing, with clamping blocks symmetrically screwed to both ends of the secondary screw.

[0005] Preferably, the base plate has a rectangular structure, and the cross-section of the manifold opened on the upper surface of the base plate is a right-angled triangle structure. The end of the manifold near the injection pipe is fixedly connected to the recovery pipe, and the enclosure fixedly connected at the edge of the upper surface of the base plate is a square cylindrical structure.

[0006] Preferably, the two sets of fixed columns fixedly connected to both ends of the inner cavity of the enclosure are cylindrical in shape, and the end faces of the two sets of fixed columns away from the enclosure are provided with moving grooves. At the same time, the moving grooves are cuboid in shape, and the dimensions of the moving grooves and the moving plates are compatible.

[0007] Preferably, the sleeve movably connected to the outer side of the fixed column has a cylindrical structure, the inner cavity of the sleeve and the outer side of the fixed column are matched in size, and the fixing plate fixedly connected to the lower surface of the sleeve has a rectangular structure, while the cross-section of the fixing plate has a U-shaped structure, and the liquid injection tube is connected to the inner cavity of the fixing plate.

[0008] Preferably, the spray plate has a long strip structure, with two sets of fixing plates fixedly connected to both ends of the spray plate. The spray plate and the fixing plates are combined to form a U-shaped structure, and the upper part of the end face of the spray plate has an isosceles trapezoidal structure. At the same time, multiple sets of high-pressure nozzles are fixedly connected to the middle plane and the two inclined planes on the upper surface of the spray plate at equal intervals along the length direction.

[0009] Preferably, the substrate has a rectangular structure, with a through hole in the center and guide holes symmetrically opened on both sides of the substrate. Both the through hole and the guide hole are cylindrical and penetrate both end faces of the substrate. The substrate and the movable plate are combined to form a T-shaped structure.

[0010] Preferably, the clamping block has an L-shaped structure, and the end face of the clamping plate body is connected to the guide rod corresponding to the guide hole. The length of the guide rod is less than the length of the guide hole. The clamping block, the base plate and the auxiliary lead screw are combined to form an L-shaped structure.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: through the cooperation of the main motor, fixed column, gear ring, sleeve, fixed plate, spray plate and liquid injection pipe, the high-pressure nozzle of the device can rotate around the wafer box, thereby enabling the wafer box to be thoroughly sprayed and cleaned by the cleaning fluid. This eliminates the need for workers to assist in turning the wafer box and does not require additional spraying structures. This not only ensures the personal safety of workers but also reduces the complexity and cost of the internal structure of the equipment, thereby helping to enhance the cleaning efficiency of semiconductor carriers such as wafer boxes. Attached Figure Description

[0012] Figure 1 This is a front view schematic diagram of an embodiment of the present utility model.

[0013] Figure 2 This is a side view of an embodiment of the present utility model.

[0014] Figure 3 This is a partial top view of an embodiment of the present utility model.

[0015] Figure 4 This is an embodiment of the present utility model. Figure 2 Enlarged diagram of point A.

[0016] In the diagram: 1. Base plate; 2. Enclosure; 3. Spray plate; 4. Fixing plate; 5. Injection pipe; 6. Fixing column; 7. Main lead screw; 8. Moving plate; 9. Sleeve; 10. Base plate; 11. Clamping block; 12. Secondary lead screw; 13. Main motor; 14. Gear ring; 15. Guide rod. Detailed Implementation

[0017] Reference Figures 1 to 4 As shown, this utility model provides a high-pressure spray device for cleaning semiconductor carriers, including: a base plate 1, a barrier 2 fixedly connected to the upper surface of the base plate 1, fixed columns 6 symmetrically connected to both ends of the inner cavity of the barrier 2, a sleeve 9 movably connected to the outer side of the fixed columns 6 through a sealed bearing, a movable groove opened in the fixed columns 6, a main screw 7 movably connected to the movable groove through a bearing, and one end of a movable plate 8 slidably connected to the movable groove through a screwed main screw 7, the other end of the movable plate 8 fixedly connected to a base plate 10, a fixed plate 4 fixedly connected to the lower surface of the sleeve 9, an injection pipe 5 fixedly connected to the upper end of the fixed plate 4, a spray plate 3 fixedly connected to the lower end of the fixed plate 4, and the inner cavity of the spray plate 3 communicating with the inner cavity of the fixed plate 4, a main motor 13 fixedly connected to the outer side of the barrier 2, a drive wheel fixedly connected to the output shaft of the main motor 13 meshing with a gear ring 14 fixedly connected to the outer side of the sleeve 9, and a secondary screw 12 movably connected to the base plate 10 through a sealed bearing, with clamping blocks 11 symmetrically screwed to both ends of the secondary screw 12.

[0018] In this embodiment, the wafer cassette is first placed inside the enclosure 2 with its opening facing downwards, and one end of the wafer cassette is attached to the surface of the substrate 10. The secondary lead screw 12 corresponding to the substrate 10 is rotated, causing the secondary lead screw 12 to push the two sets of screwed clamping blocks 11 to move synchronously in opposite directions, allowing the two sets of clamping blocks 11 to clamp one end of the wafer cassette. Then, the two sets of main lead screws 7 are rotated, allowing the main lead screws 7 to push the corresponding substrate 10 to move within the enclosure 2 via the screwed moving plate 8, so that the two sets of substrates 10 can attach to both ends of the outer surface of the wafer cassette. The secondary lead screw 12 of the other set of substrates 10 is rotated, and then the corresponding clamping blocks 11 clamp and fix the other end of the wafer cassette. At this time, the solenoid valve of the injection tube 5 is opened, and the cleaning fluid in the injection tube 5 flows into the inner cavity of the fixing plate 4. The cleaning fluid flows into the spray plate 3, and the high-pressure nozzles on the surface of the spray plate 3 can spray the cleaning fluid onto the surface of the wafer cassette. When the main motor 13 is turned on, the output shaft of the main motor 13 passes through the through hole in the enclosure 2 and drives the fixed drive wheel to rotate periodically in both directions. The drive wheel can drive the sleeve 9 to rotate through the meshing gear ring 14, and the sleeve 9 can drive the fixed plate 4, the spray plate 3 and the high-pressure nozzles to rotate synchronously. This allows the high-pressure cleaning fluid sprayed from the high-pressure nozzles to be sprayed evenly on the inner and outer surfaces of the wafer cassette. This avoids the need for workers to manually turn the wafer cassette during the cleaning process, ensuring the safety of the workers. This not only enhances the cleaning effect of the device on semiconductor carriers such as wafer cassettes, but also improves the cleaning efficiency of the device.

[0019] As a preferred embodiment, the base plate 1 has a rectangular structure, and the cross-section of the manifold opened on the upper surface of the base plate 1 is a right-angled triangular structure. The end of the manifold close to the injection pipe 5 is fixedly connected to the recovery pipe, and the enclosure 2 fixedly connected at the edge of the upper surface of the base plate 1 has a square cylindrical structure.

[0020] In this embodiment, as Figure 1 and Figure 2 The opening of the manifold allows the cleaning fluid sprayed by the device to be successfully recycled by the recovery pipe, thereby reducing the waste rate of resources.

[0021] As a preferred embodiment, the two sets of fixed columns 6 fixedly connected to both ends of the inner cavity of the enclosure 2 are both cylindrical in shape, and the end faces of the two sets of fixed columns 6 away from the enclosure 2 are provided with moving grooves. At the same time, the moving grooves are cuboid in shape, and the dimensions of the moving grooves and the moving plate 8 are compatible.

[0022] In this embodiment, as Figure 1 , Figure 2 and Figure 3 The enclosure 2 effectively intercepts splashes of cleaning fluid from impacting the wafer cassette surface. The matching size of the moving plate 8 and the moving slot effectively enhances the stability of the moving plate 8 during movement, preventing the substrate 10 from rotating unexpectedly.

[0023] In a preferred embodiment, the sleeve 9 movably connected to the outer side of the fixed column 6 has a cylindrical structure. The inner cavity of the sleeve 9 is matched with the outer side of the fixed column 6. The fixing plate 4 fixedly connected to the lower surface of the sleeve 9 has a rectangular structure, and the cross-section of the fixing plate 4 has a U-shaped structure. At the same time, the injection pipe 5 connects to the inner cavity of the fixing plate 4.

[0024] In this embodiment, as Figure 1 , Figure 2 and Figure 3 The dimensions of the outer sides of the sleeve 9 and the fixed column 6 are matched, which can help enhance the stability of the sleeve 9, the fixed plate 4 and the spray plate 3 when they rotate periodically in the forward and reverse directions. This can effectively prevent the injection pipe 5 from being completely wrapped around the surface of the sleeve 9 or the fixed column 6. Moreover, the injection pipe 5 is made of a flexible hose, which allows the injection pipe 5 to rotate several times with the fixed plate 4.

[0025] As a preferred embodiment, the spray plate 3 has a long strip structure, and two sets of fixing plates 4 are fixedly connected to both ends of the spray plate 3. The spray plate 3 and the fixing plates 4 are combined to form a U-shaped structure, and the upper part of the end face of the spray plate 3 has an isosceles trapezoidal structure. At the same time, multiple sets of high-pressure nozzles are fixedly connected to the middle plane and the two inclined surfaces of the upper surface of the spray plate 3 at equal intervals along the length direction.

[0026] In this embodiment, as Figure 1 , Figure 3 and Figure 4 The structure of the upper surface of the spray plate 3 allows the high-pressure nozzles on the upper surface of the spray plate 3 to face three directions respectively. This enhances the comprehensiveness of the cleaning fluid cleaning the inner and outer surfaces of the wafer box when the spray plate 3 rotates, thus improving the cleaning effect of the device. At the same time, the surface of the fixing plate 4 can also be fitted with or removed according to actual needs, enhancing the flexibility of the device during use.

[0027] In a preferred embodiment, the substrate 10 has a rectangular structure, a through hole is formed in the middle of the substrate 10, and guide holes are symmetrically formed on both sides of the substrate 10. Both the through hole and the guide hole have a cylindrical structure and both the through hole and the guide hole penetrate the end faces of the substrate 10. The substrate 10 and the movable plate 8 are combined to form a T-shaped structure.

[0028] In this embodiment, as Figure 1 , Figure 2 and Figure 3 The substrate 10 enables the device to perform preliminary positioning of the wafer cassette, thereby helping to enhance the stability of the wafer cassette during cleaning inside the device.

[0029] In a preferred embodiment, the clamping block 11 has an L-shaped structure, and the guide rod 15 is connected to the end face of the clamping plate body relative to the guide hole. The length of the guide rod 15 is less than the length of the guide hole. The clamping block 11, the base plate 10 and the auxiliary lead screw 12 are combined to form an L-shaped structure.

[0030] In this embodiment, as Figure 1 , Figure 2 and Figure 3 The guide rod 15 and the guide hole are matched in size, which helps to enhance the stability of the clamping block 11 when it moves, avoids the problem of accidental rotation of the clamping block 11, and ensures that the device can stably clamp and fix semiconductor carriers such as wafer cassettes.

[0031] The high-pressure spray device for cleaning semiconductor carriers of this utility model, through the cooperation of the main motor 13, gear ring 14, sleeve 9, fixing plate 4, spray plate 3 and liquid injection pipe 5, enables the device to rotate around the wafer cassette for comprehensive high-pressure spray cleaning. This not only helps to enhance the cleaning effect of the wafer cassette, but also improves the overall cleaning efficiency of the device, and eliminates the need for manual turning, ensuring the personal safety of workers.

Claims

1. A high-pressure spray device for cleaning semiconductor carriers, comprising: The base plate (1) is characterized in that: a barrier (2) is fixedly connected to the upper surface of the base plate (1), and fixed columns (6) are symmetrically connected to both ends of the inner cavity of the barrier (2). The outer side of the fixed column (6) is movably connected to the sleeve (9) through a sealed bearing. A moving groove is opened in the fixed column (6), and a main screw (7) is movably connected to the moving groove through a bearing. One end of the moving plate (8) is slidably connected to the moving groove through the screwed main screw (7). The other end of the moving plate (8) is fixedly connected to the base plate (10), and the lower surface of the sleeve (9) is fixedly connected to the fixed plate (10). The upper end of the fixed plate (4) is fixedly connected to the injection pipe (5), and the lower end of the fixed plate (4) is fixedly connected to the spray plate (3). At the same time, the inner cavity of the spray plate (3) and the inner cavity of the fixed plate (4) are connected. The outer side of the enclosure (2) is fixedly connected to the main motor (13). The output shaft of the main motor (13) is fixedly connected to the gear ring (14) on the outer side of the drive wheel meshing sleeve (9). The base plate (10) is movably connected to the auxiliary screw (12) through the sealed bearing. The two ends of the auxiliary screw (12) are symmetrically screwed to the clamping blocks (11).

2. The high-pressure spray device for cleaning semiconductor carriers according to claim 1, characterized in that, The base plate (1) has a rectangular structure. The cross-section of the chute on the upper surface of the base plate (1) is a right-angled triangle. The end of the chute near the injection pipe (5) is fixedly connected to the recovery pipe. Meanwhile, the enclosure (2) fixedly connected to the edge of the upper surface of the base plate (1) has a square cylindrical structure.

3. The high-pressure spray device for cleaning semiconductor carriers according to claim 1, characterized in that, The two sets of fixed columns (6) fixedly connected to the two ends of the inner cavity of the enclosure (2) are both cylindrical in shape, and the end faces of the two sets of fixed columns (6) away from the enclosure (2) are opened with moving grooves. At the same time, the moving grooves are rectangular in shape, and the dimensions of the moving grooves and the moving plate (8) are compatible.

4. The high-pressure spray device for cleaning semiconductor carriers according to claim 1, characterized in that, The sleeve (9) movably connected to the outer side of the fixed column (6) has a cylindrical structure. The inner cavity of the sleeve (9) and the outer side of the fixed column (6) are matched in size. The fixed plate (4) fixedly connected to the lower surface of the sleeve (9) has a rectangular structure, and the cross section of the fixed plate (4) has a square structure. At the same time, the injection pipe (5) connects to the inner cavity of the fixed plate (4).

5. The high-pressure spray device for cleaning semiconductor carriers according to claim 1, characterized in that, The spray plate (3) has a long strip structure. Two sets of fixing plates (4) are fixedly connected to both ends of the spray plate (3). The spray plate (3) and the fixing plates (4) are combined to form a U-shaped structure. The upper part of the end face of the spray plate (3) has an isosceles trapezoidal structure. At the same time, multiple sets of high-pressure nozzles are fixedly connected to the middle plane and the two inclined planes on the upper surface of the spray plate (3) at equal intervals along the length direction.

6. The high-pressure spray device for cleaning semiconductor carriers according to claim 1, characterized in that, The substrate (10) has a rectangular structure. A through hole is opened in the middle of the substrate (10), and guide holes are symmetrically opened on both sides of the substrate (10). Both the through hole and the guide hole have a cylindrical structure and both the through hole and the guide hole penetrate the two end faces of the substrate (10). The substrate (10) and the movable plate (8) are combined to form a T-shaped structure.

7. The high-pressure spray device for cleaning semiconductor carriers according to claim 1, characterized in that, The clamping block (11) has an L-shaped structure. The end face of the clamping plate body is connected to the guide rod (15) at the position relative to the guide hole. The length of the guide rod (15) is less than the length of the guide hole. The clamping block (11), the base plate (10) and the auxiliary lead screw (12) are combined together to form a [-shaped structure.

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