Integrated circuit chip welding device

Abstract

The utility model relates to the technical field of chip welding devices, and discloses an integrated circuit chip welding device which comprises a conveying belt, a base fixedly connected to the bottom of the conveying belt, welding equipment fixedly connected to the top of the conveying belt, a guide mechanism arranged on the left side of the top of the conveying belt, and an adjusting mechanism arranged on the top of the guide mechanism. The guiding mechanism comprises a supporting assembly and a position adjusting assembly, the supporting assembly is arranged at the top of the conveying belt, and the position adjusting assembly is arranged at the bottom of the supporting assembly. According to the integrated circuit chip welding device, through the arranged guide mechanism, a worker can adjust the angles of the guide baffles on the front side and the rear side according to the sizes of different chips, so that when the chips are conveyed rightwards from the top of the conveying belt, the chips can be kept in the middle of the conveying belt all the time; and subsequent welding equipment can conveniently weld the chip at the top of the conveying belt, workers do not need to manually adjust the position of the chip, the working intensity of the workers is reduced, and the device is convenient to use by the workers.

Description

Technical Field

[0001] This utility model relates to the technical field of chip welding equipment, specifically an integrated circuit chip welding device. Background Technology

[0002] An integrated circuit board is a carrier for integrated circuits. In electronics factories, workers often need to use solder wire to solder circuit components onto integrated circuit boards. By heating a soldering iron and bringing it into contact with the solder wire, molten solder is dripped onto the area to be soldered, thus completing the soldering work.

[0003] In integrated circuit chip manufacturing, the soldering equipment is a critical component. Existing integrated circuit chip soldering equipment has shortcomings. Its guiding function is imperfect, making it difficult to adapt to chips of different sizes. During chip transport, it cannot accurately maintain the chip's position in the center of the transport belt, often requiring manual adjustment of the chip's position. This not only increases the labor intensity of workers but also reduces production efficiency. Utility Model Content

[0004] The purpose of this invention is to provide an integrated circuit chip welding device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an integrated circuit chip welding device, comprising a conveyor belt, a base fixedly connected to the bottom of the conveyor belt, welding equipment fixedly connected to the top of the conveyor belt, a guide mechanism provided on the left side of the top of the conveyor belt, and an adjustment mechanism provided on the top of the guide mechanism.

[0006] The guiding mechanism includes a support component and an adjustment component. The support component is disposed at the top of the conveyor belt, and the adjustment component is disposed at the bottom of the support component.

[0007] The adjustment mechanism includes a drive component, a transmission component, and a limiting component. The drive component is located on the top of the support component, the transmission component is located on the front and rear sides of the drive component, and the limiting component is located on the outside of the transmission component.

[0008] Preferably, the support assembly includes a support plate disposed on the top of the conveyor belt and on the left side of the welding equipment, with a support rod fixedly connected to the bottom of the support plate and the support rod fixedly connected to the top of the conveyor belt.

[0009] Preferably, the adjustment component includes a fixed cylinder, which is fixedly connected to the left side of the support plate. The inner ring of the fixed cylinder is rotatably connected to a rotating shaft, and the outer ring of the rotating shaft is fixedly connected to a guide baffle, which is disposed below the support plate.

[0010] Preferably, the drive assembly includes a dual-axis motor, which is fixedly connected to the top of the support plate. Threaded rods are fixedly connected to the front and rear sides of the dual-axis motor. A supporting cylinder is rotatably connected to the outer end of the threaded rods. A fixed arm is fixedly connected to the bottom of the supporting cylinder, and the fixed arm is fixedly connected to the top of the support plate.

[0011] Preferably, the transmission assembly includes a threaded cylinder, which is threadedly connected to the outer ring of a threaded rod. A movable slide rod is fixedly connected to the bottom of the threaded cylinder. The movable slide rod is slidably connected to the support plate and the top of the guide baffle. A sliding plate is fixedly connected to the bottom of the movable slide rod and is slidably connected to the guide baffle.

[0012] Preferably, the limiting component includes a convex plate, which is fixedly connected to the left and right sides of the movable slide rod. A slide cylinder is fixedly connected to the inner side of the outer side of the convex plate. A reinforcing fin plate is fixedly connected to the inner side of the outer ring of the slide cylinder. The reinforcing fin plate is fixedly connected to the front and rear sides of the convex plate. A guide rod is slidably connected to the inner ring of the slide cylinder. A fixing plate is fixedly connected to the front and rear sides of the guide rod. The fixing plate is fixedly connected to the bottom of the support plate.

[0013] Compared with the prior art, the present invention provides an integrated circuit chip welding device, which has the following advantages:

[0014] 1. This integrated circuit chip welding device, through its guiding mechanism, allows operators to adjust the angle of the guide baffles on both the front and rear sides according to the size of different chips. This ensures that the chip remains in the middle of the conveyor belt as it is transported to the right from the top, facilitating subsequent welding processing of the chip at the top of the conveyor belt by the welding equipment. This eliminates the need for operators to manually adjust the chip's position, reducing their workload and making the device easier to use.

[0015] 2. This integrated circuit chip welding device, through its adjustable mechanism, allows operators to control the guide baffles on both the front and rear sides to flip synchronously inward or outward simply by starting the dual-axis motor. This facilitates the adjustment of the distance between the right ends of the guide baffles, enabling the device to be adapted to guide and position chips of different sizes during use. This increases the applicability of the device and makes it simple and convenient for operators to use. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a front view of the present utility model;

[0018] Figure 2 This is a schematic diagram of part of the structure of this utility model. Figure 1 ;

[0019] Figure 3 This is a schematic diagram of part of the structure of this utility model. Figure 2 ;

[0020] Figure 4 This is a schematic diagram of part of the structure of this utility model. Figure 3 ;

[0021] Figure 5 This is a schematic diagram of part of the structure of this utility model. Figure 4 ;

[0022] Figure 6 This is a sectional view of the adjustment mechanism.

[0023] In the diagram: 1. Guiding mechanism; 11. Support assembly; 1101. Support plate; 1102. Support rod; 12. Adjustment assembly; 1201. Fixed cylinder; 1202. Rotating shaft; 1203. Guide baffle; 2. Adjustment mechanism; 21. Drive assembly; 2101. Dual-axis motor; 2102. Threaded rod; 2103. Supporting rotating cylinder; 2104. Fixed arm; 22. Transmission assembly; 2201. Threaded cylinder; 2202. Moving slide rod; 2203. Sliding plate; 23. Limiting assembly; 2301. Protruding plate; 2302. Sliding cylinder; 2303. Reinforcing fin plate; 2304. Guide rod; 2305. Fixed plate; 3. Conveyor belt; 4. Base; 5. Welding equipment. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] This utility model provides a technical solution: Example

[0027] Combination Figures 1 to 6 An integrated circuit chip welding device includes a conveyor belt 3, a base 4 fixedly connected to the bottom of the conveyor belt 3, a welding device 5 fixedly connected to the top of the conveyor belt 3, a guide mechanism 1 provided on the top left side of the conveyor belt 3, and an adjustment mechanism 2 provided on the top of the guide mechanism 1.

[0028] The guide mechanism 1 includes a support component 11 and an adjustment component 12. The support component 11 is located at the top of the conveyor belt 3, and the adjustment component 12 is located at the bottom of the support component 11.

[0029] The support assembly 11 includes a support plate 1101, which is located on the top of the conveyor belt 3 and on the left side of the welding equipment 5. A support rod 1102 is fixedly connected to the bottom of the support plate 1101 and is fixedly connected to the top of the conveyor belt 3. The positioning assembly 12 includes a fixing cylinder 1201, which is fixedly connected to the left side of the support plate 1101. A rotating shaft 1202 is rotatably connected to the inner ring of the fixing cylinder 1201, and a guide baffle 1203 is fixedly connected to the outer ring of the rotating shaft 1202. The guide baffle 1203 is located below the support plate 1101.

[0030] Furthermore, staff can adjust the angle of the guide baffles 1203 on both the front and rear sides according to the size of different chips, so that when the chip is transported to the right at the top of the conveyor belt 3, it can always be kept in the middle position of the conveyor belt 3. This makes it easier for the subsequent welding equipment 5 to weld the chip at the top of the conveyor belt 3 without the need for staff to manually adjust the position of the chip, reducing the workload of staff and making it easier for staff to use. Example

[0031] See Figures 1 to 6 Furthermore, based on Embodiment 1, the adjustment mechanism 2 includes a drive assembly 21, a transmission assembly 22, and a limiting assembly 23. The drive assembly 21 is disposed on the top of the support assembly 11, the transmission assembly 22 is disposed on the front and rear sides of the drive assembly 21, and the limiting assembly 23 is disposed on the outside of the transmission assembly 22.

[0032] Drive assembly 21 includes a dual-axis motor 2101, which is fixedly connected to the top of support plate 1101. Threaded rods 2102 are fixedly connected to the front and rear sides of the dual-axis motor 2101. A supporting drum 2103 is rotatably connected to the outer end of the threaded rods 2102. A fixed arm 2104 is fixedly connected to the bottom of the supporting drum 2103 and is fixedly connected to the top of support plate 1101. Transmission assembly 22 includes a threaded cylinder 2201, which is threadedly connected to the outer ring of the threaded rod 2102. A movable slide rod 2202 is fixedly connected to the bottom of the threaded cylinder 2201 and is slidably connected inside support plate 1101. The movable slide rod 2202 is slidably connected to a guide... Inside the top of the baffle 1203, a sliding plate 2203 is fixedly connected to the bottom of the movable slide rod 2202. The sliding plate 2203 is slidably connected inside the guide baffle 1203. The limiting component 23 includes a convex plate 2301, which is fixedly connected to the left and right sides of the movable slide rod 2202. A slide cylinder 2302 is fixedly connected to the inner side of the outer side of the convex plate 2301. A reinforcing fin plate 2303 is fixedly connected to the inner side of the outer ring of the slide cylinder 2302. The reinforcing fin plate 2303 is fixedly connected to the front and rear sides of the convex plate 2301. A guide rod 2304 is slidably connected to the inner ring of the slide cylinder 2302. A fixing plate 2305 is fixedly connected to the front and rear sides of the guide rod 2304. The fixing plate 2305 is fixedly connected to the bottom of the support plate 1101.

[0033] Furthermore, by simply starting the dual-axis motor 2101, the operator can control the guide baffles 1203 on both the front and rear sides to flip inward or outward simultaneously. This allows the operator to adjust the spacing at the right end of the guide baffles 1203, enabling the device to be used with chips of different sizes for guidance and positioning. This increases the applicability of the device and makes it easy for operators to use.

[0034] In actual operation, when this device is used and it is necessary to reduce the spacing of the guide baffles 1203 to guide the chip, the operator first starts the dual-axis motor 2101. The dual-axis motor 2101 drives the threaded rods 2102 on both the front and rear sides to rotate synchronously. The rotation of the threaded rods 2102 drives the sliding rods 2202 on both the front and rear sides to move inward synchronously through the threaded cylinder 2201. The inward movement of the sliding rods 2202 drives the sliding plate 2203 to move inward. The sliding rods 2202 and the sliding plate on both the front and rear sides move inward. 2203 moves inward, causing the right ends of the front and rear guide baffles 1203 to flip inward until the distance between the right sides of the front and rear guide baffles 1203 is slightly greater than the chip's side length. Then, the dual-axis motor 2101 is turned off. At this time, the front and rear guide baffles 1203 are positioned by the thread self-locking between the threaded rod 2102 and the threaded cylinder 2201. After that, as the chip is transported to the right at the top of the conveyor belt 3, it will move to the middle position at the top of the conveyor belt 3 by the guide baffles 1203, whose distance gradually decreases from left to right.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. An integrated circuit chip welding apparatus, comprising a conveyor belt (3), characterized in that: The bottom of the conveyor belt (3) is fixedly connected to a base (4), the top of the conveyor belt (3) is fixedly connected to a welding device (5), a guide mechanism (1) is provided on the left side of the top of the conveyor belt (3), and an adjustment mechanism (2) is provided on the top of the guide mechanism (1). The guiding mechanism (1) includes a support component (11) and an adjustment component (12). The support component (11) is disposed on the top of the conveyor belt (3), and the adjustment component (12) is disposed on the bottom of the support component (11). The adjustment mechanism (2) includes a drive assembly (21), a transmission assembly (22) and a limiting assembly (23). The drive assembly (21) is located on the top of the support assembly (11), the transmission assembly (22) is located on the front and rear sides of the drive assembly (21), and the limiting assembly (23) is located on the outside of the transmission assembly (22).

2. The integrated circuit chip welding apparatus according to claim 1, characterized in that: The support assembly (11) includes a support plate (1101), which is located on the top of the conveyor belt (3) and on the left side of the welding equipment (5). A support rod (1102) is fixedly connected to the bottom of the support plate (1101) and the support rod (1102) is fixedly connected to the top of the conveyor belt (3).

3. The integrated circuit chip welding apparatus according to claim 1, characterized in that: The adjustment component (12) includes a fixed cylinder (1201), which is fixedly connected to the left side of the support plate (1101). The inner ring of the fixed cylinder (1201) is rotatably connected to a rotating shaft (1202), and the outer ring of the rotating shaft (1202) is fixedly connected to a guide baffle (1203). The guide baffle (1203) is located below the support plate (1101).

4. The integrated circuit chip welding apparatus according to claim 1, characterized in that: The drive assembly (21) includes a dual-axis motor (2101), which is fixedly connected to the top of the support plate (1101). Threaded rods (2102) are fixedly connected to the front and rear sides of the dual-axis motor (2101), and a support cylinder (2103) is rotatably connected to the outer end of the threaded rods (2102).

5. The integrated circuit chip welding apparatus according to claim 4, characterized in that: The bottom of the support cylinder (2103) is fixedly connected to a fixed arm (2104), and the fixed arm (2104) is fixedly connected to the top of the support plate (1101).

6. The integrated circuit chip welding apparatus according to claim 1, characterized in that: The transmission assembly (22) includes a threaded cylinder (2201), which is threadedly connected to the outer ring of the threaded rod (2102), and a movable slide rod (2202) is fixedly connected to the bottom of the threaded cylinder (2201).

7. The integrated circuit chip welding apparatus according to claim 6, characterized in that: The movable slide rod (2202) is slidably connected inside the support plate (1101), and the movable slide rod (2202) is slidably connected inside the top of the guide baffle (1203).

8. The integrated circuit chip welding apparatus according to claim 7, characterized in that: The bottom of the movable slide bar (2202) is fixedly connected to a slide plate (2203), and the slide plate (2203) is slidably connected inside the guide baffle (1203).

9. The integrated circuit chip welding apparatus according to claim 1, characterized in that: The limiting component (23) includes a protruding plate (2301), which is fixedly connected to the left and right sides of the movable slide rod (2202). A slide cylinder (2302) is fixedly connected to the outer side of the protruding plate (2301), and a reinforcing fin plate (2303) is fixedly connected to the inner side of the outer ring of the slide cylinder (2302). The reinforcing fin plate (2303) is fixedly connected to the front and rear sides of the protruding plate (2301).

10. The integrated circuit chip welding apparatus according to claim 9, characterized in that: The inner ring of the slide cylinder (2302) is slidably connected to a guide rod (2304), and the front and rear sides of the guide rod (2304) are fixedly connected to a fixing plate (2305), and the fixing plate (2305) is fixedly connected to the bottom of the support plate (1101).

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