SiC wafer degumming protection device

Abstract

The utility model discloses a SiC wafer degumming protection device, which comprises a first fixer, the first fixer comprises a first fixing plate, and the axial direction of a wafer group is along a first direction; the surface, facing the wafer group, of the first fixing plate is matched with the semi-circumferential surface of the wafer group; and in the second direction, the first fixers are divided into two groups which are oppositely arranged, and the first fixing plates in the two groups of first fixers can be far away from each other or close to each other in the second direction. When the two first fixing plates are far away from each other, a sufficient space is formed between the two first fixing plates to accommodate the wafer group. When the two first fixing plates are close to each other, the surfaces, facing the wafer group, of the two first fixing plates can be matched with the two semi-circumferential surfaces of the wafer group respectively, so that the two first fixing plates can support wafers in the wafer group in the second direction, and the wafers are prevented from rolling in the second direction; therefore, the wafer can be prevented from rolling and being damaged in the degumming and wafer washing process, and the wafer quality is further improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing and manufacturing, and more specifically, to a SiC wafer debonding protection device. Background Technology

[0002] Currently, SiC ingots are processed into wafers with a thickness of approximately 400µm using multi-wire cutting. Before cutting, the ingot needs to be bonded to a resin holder using a special adhesive, and the resin holder is then bonded to a steel plate. After the sawing process, the resulting wafer assembly needs to undergo debonding and washing to detach the wafers from the resin holder.

[0003] During the degumming and washing processes, operators need to secure the wafer assemblies using fixing blocks. Specifically, the operator uses two fixing blocks applied to both ends of the wafer assemblies along their axial direction to fix them in place.

[0004] However, after the wafers in the wafer assembly are debonded, gaps may form between them and the adjacent wafers on the left and right, causing them to break free from the fixing effect of the fixing block and roll along the horizontal radial direction perpendicular to the axis of the wafer assembly. This will result in rolling damage and affect the quality of the wafers.

[0005] Therefore, how to avoid rolling damage to wafers during degumming and washing processes, thereby improving wafer quality, is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to prevent wafer rolling damage during the degumming and washing processes, thereby improving wafer quality. To achieve the above objective, this invention provides the following technical solution:

[0007] A SiC wafer debonding protection device includes a first fixture, the first fixture including a first fixing plate, the first fixing plate extending along a first direction, and the axial direction of the wafer group along the first direction;

[0008] In a second direction perpendicular to the first direction, the first fixing plate is located on one side of the wafer assembly, and the surface of the first fixing plate facing the wafer assembly matches the semi-circular surface of the wafer assembly.

[0009] In the second direction, the first fixtures are two sets arranged opposite to each other, and the first fixing plates in the two sets of first fixtures can move away from or closer to each other along the second direction.

[0010] Preferably, in the first direction, the two ends of the first fixing plate extend out of the wafer group.

[0011] Preferably, it further includes a fixing frame that can straddle the resin support along the second direction. The fixing frame includes two first mounting plates arranged opposite each other along the second direction, and two first fasteners are respectively disposed on the two first mounting plates.

[0012] The first fixture further includes a first drive assembly, which is disposed on the first mounting plate. The drive end of the first drive assembly is connected to the first fixture, and the drive direction of the first drive assembly on the first fixture is along the second direction.

[0013] Preferably, the first drive assembly includes a first screw, which is arranged along the second direction. A first threaded hole is provided on the first mounting plate. The first screw is threaded into the first threaded hole and passes through the first mounting plate through the first threaded hole. The inner end of the first screw is rotatably connected to the first fixing plate.

[0014] Preferably, a first rotating rod is connected to the portion of the first screw that extends outside the first mounting plate.

[0015] Preferably, the first drive assembly further includes a first guide rod, which is arranged along the second direction. A first guide hole is provided on the first mounting plate, the first guide rod is adapted to the first guide hole, and the first guide rod passes through the first guide hole and through the first mounting plate.

[0016] Preferably, the device further includes a second fixture, wherein the surface of the second fixture plate facing the end face of the wafer assembly can be abutted against the end face of the wafer assembly, and the second fixture is two sets arranged opposite to each other along the first direction; the fixture also includes two second mounting plates arranged along the first direction, and the two second fixtures are respectively disposed on the two second mounting plates.

[0017] The second fixture further includes a second drive assembly, which is disposed on the second mounting plate. The drive end of the second drive assembly is connected to the second mounting plate, and the drive direction of the second drive assembly on the second mounting plate is along the first direction.

[0018] Preferably, the second drive assembly includes a second screw, which is arranged along the first direction. A second threaded hole is provided on the second mounting plate. The second screw is threaded into the second threaded hole and passes through the second mounting plate through the second threaded hole. The inner end of the second screw is rotatably connected to the second fixing plate.

[0019] Preferably, the second drive assembly further includes a second guide rod, which is arranged along the first direction. A second guide hole is provided on the second mounting plate, the second guide rod is adapted to the second guide hole, and the second guide rod passes through the second mounting plate through the second guide hole.

[0020] Preferably, the second mounting plate extends downward relative to the first mounting plate, so that a first clearance space is formed below the first mounting plate to avoid the resin holder;

[0021] The mounting bracket also includes two base plates, which are arranged horizontally and connected to the bottom of the two first mounting plates respectively. The space between the two base plates is adapted to the corresponding part of the bottom of the resin holder.

[0022] As can be seen from the above technical solution, the two first fixing plates in this utility model can move closer to or further away from each other along the second direction. When the two first fixing plates move away from each other, sufficient space is formed between them to accommodate the wafer assembly. When the two first fixing plates move closer to each other, the surfaces of the two first fixing plates facing the wafer assembly can mate with the two semi-circular surfaces of the wafer assembly. In this way, the two first fixing plates can support the wafers in the wafer assembly in the second direction, preventing the wafers from rolling along the second direction. This avoids wafer rolling damage during debinding and washing, thereby improving wafer quality. Attached Figure Description

[0023] To more clearly illustrate the solutions in the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is an overall structural diagram of a SiC wafer debonding protection device provided in a specific embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of the second fixator provided in a specific embodiment of the present utility model;

[0026] Figure 3 A schematic diagram of the structure of the first fixator provided in a specific embodiment of this utility model;

[0027] Figure 4 A top view of a SiC wafer debonding protection device provided in a specific embodiment of this utility model;

[0028] Figure 5This diagram illustrates the fit between the SiC wafer debonding protection device and the resin holder, as provided in a specific embodiment of this utility model.

[0029] Among them, 1-first fixture, 11-first fixing plate, 12-first screw, 13-first rotating rod, 14-first guide rod, 2-second fixture, 21-second fixing plate, 22-second screw, 23-second rotating rod, 24-second guide rod, 3-fixing frame, 31-first mounting plate, 32-second mounting plate, 33-base plate, 4-wafer assembly, 5-resin holder. Detailed Implementation

[0030] This utility model discloses a SiC wafer debonding protection device, which can prevent the wafer from rolling and breaking during the debonding and washing process, thereby improving the wafer quality.

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0032] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] Please refer to the attached document. Figure 1 Appendix Figure 3 Appendix Figure 4 This utility model discloses a SiC wafer debonding protection device, hereinafter referred to as the protection device. The protection device includes a first fixture 1, which includes a first fixing plate 11 extending along a first direction x. Wafer sets 4 on a resin holder 5 are arranged along the first direction x, meaning the axial direction of the wafer sets 4 is along the first direction x. In a second direction y, perpendicular to the first direction x, the first fixture 1 is located on one side of the wafer sets 4. The surface of the first fixing plate 11 facing the wafer sets 4 matches the semi-circular surface of the wafer sets 4. Specifically, for a wafer set 4 with a generally cylindrical outer contour, the semi-circular surface of the wafer set 4 is generally curved, so the surface of the first fixing plate 11 facing the wafer sets 4 is also curved. In the second direction y, the first fixture 1 consists of two sets arranged opposite each other, with the first fixing plates 11 of the two sets positioned on opposite sides of the wafer sets 4 in the second direction y.

[0034] In this invention, the two first fixing plates 11 can move closer to or further apart along the second direction y. When the two first fixing plates 11 are far apart, sufficient space is formed between them to accommodate the wafer assembly 4. When the two first fixing plates 11 are close together, the surfaces of the two first fixing plates 11 facing the wafer assembly 4 can mate with the two semi-circular surfaces of the wafer assembly 4. In this way, the two first fixing plates 11 can support the wafers in the wafer assembly 4 in the second direction y, preventing the wafers from rolling along the second direction y. This avoids rolling damage to the wafers during debinding and washing processes, thereby improving wafer quality.

[0035] The micro-arc surface of the first fixing plate 11 is preferably designed to completely encompass half of the circumference of the wafer assembly 4. Furthermore, in the first direction x, both ends of the first fixing plate 11 extend beyond the wafer assembly 4, thus ensuring that the first fixing plate 11 provides complete support for the wafer assembly 4 in the first direction x.

[0036] Please refer to the attached document. Figure 5 During wafer processing, the crystal rod is first bonded to the resin holder 5, and then the crystal rod is cut. The length direction of the resin holder 5 is along the first direction x, and the width direction of the resin holder 5 is along the second direction y. The protective device in this utility model also includes a fixing frame 3. Before debonding, the fixing frame 3 is straddling the resin holder 5 along the second direction y. The fixing frame 3 includes two first mounting plates 31 arranged opposite each other along the second direction y. The two first fixing plates 11 are respectively disposed on the two first mounting plates 31. The two first fixing plates 11 are located between the two first mounting plates 31.

[0037] In addition to a first fixing plate 11, the first fixture 1 also includes a first driving assembly. The first driving assembly is disposed on a first mounting plate 31. The driving end of the first driving assembly is connected to the corresponding first fixing plate 11. The driving direction of the first driving assembly on the first fixing plate 11 is along the second direction y. The first driving assemblies of the two first fixtures 1 are respectively disposed on two first mounting plates 31.

[0038] During use, the two first driving components first drive the two first fixing plates 11 away from each other, stopping them at the far end to create sufficient space between them. Then, the mounting bracket 3 is placed across the resin tray 5 along the second direction y, ensuring that the wafer assembly 4 on the resin tray 5 is positioned between the two first fixing plates 11. Next, the two first driving components drive the two first fixing plates 11 closer together to engage with the wafer assembly 4. During the debonding process, the two first fixing plates 11 provide support for the wafers in the wafer assembly 4, effectively preventing the wafers from rolling along the second direction y.

[0039] The first drive assembly can be a cylinder assembly or a lead screw assembly. In a specific embodiment of this utility model, the first drive assembly includes a first screw 12, which is arranged along a second direction y. A first threaded hole is provided on the first mounting plate 31, and the external thread of the first screw 12 engages with the internal thread of the first threaded hole. The first screw 12 is threaded into the first threaded hole and passes through the first mounting plate 31 through the first threaded hole. The end of the first screw 12 located between the two first mounting plates 31 is the inner end. The inner end of the first screw 12 is rotatably connected to the first fixing plate 11. Specifically, a first bearing is embedded in the first mounting plate 31, and the inner end of the first screw 12 is installed in the inner ring of the first bearing. When the first screw 12 is rotated in one direction, the first screw 12 will move outward relative to the first mounting plate 31, and at the same time drive the first fixing plate 11 to move outward, thus creating sufficient space between the two first fixing plates 11. When the first screw 12 is rotated in another direction, the first screw 12 will move inward relative to the first mounting plate 31, and at the same time drive the first fixing plate 11 to move closer to each other, forming a cooperation with the chip group 4 to provide effective support for the chip group 4.

[0040] In order to facilitate the rotation of the first screw 12, in a specific embodiment of the present invention, a first rotating rod 13 is connected to the part of the first screw 12 that extends out of the first mounting plate 31, and the first rotating rod 13 is perpendicularly connected to the first screw 12.

[0041] To ensure that the first fixed plate 11 moves stably along the second direction y, a first guide rod 14 is also provided in this specific embodiment of the invention. The first guide rod 14 is arranged along the second direction y. A first guide hole adapted to the first guide rod 14 is provided on the first mounting plate 31, and the first guide rod 14 passes through the first guide hole and penetrates the first mounting plate 31.

[0042] Furthermore, two first guide rods 14 are provided, and the two first guide rods 14 are distributed on both sides of the first screw 12 along the first direction x. Correspondingly, two first guide holes are provided on the first mounting plate 31.

[0043] During the process of driving the first fixed plate 11 to move by the first screw 12, the first fixed plate 11 cannot sway arbitrarily due to the constraint of the first guide rod 14, thereby ensuring that the first fixed plate 11 moves stably along the second direction y.

[0044] Please refer to the attached document. Figure 1 Appendix Figure 2 Appendix Figure 4The protective device in this invention includes a first fixture 1 and a second fixture 2. The second fixture 2 includes a second fixing plate 21, the side of the second fixing plate 21 facing the end face of the wafer assembly 4 being able to fit against the end face of the wafer assembly 4. Specifically, if the wafer is a circular wafer, then the second fixing plate 21 is a circular plate. The second fixtures 2 are arranged in two sets opposite each other along the first direction x. The second fixing plates 21 of the two sets of second fixtures 2 are respectively disposed at both ends of the wafer assembly 4 along the first direction x. After the two second fixing plates 21 approach each other along the first direction x, they can provide support for the wafer assembly 4 along the first direction x.

[0045] Furthermore, the diameter of the second fixing plate 21 is smaller than the diameter of the wafer, so as to avoid the second fixing plate 21 interfering with the first fixing plate 11 and ensure that the first fixing plate 11 can extend from both ends of the wafer group 4 in the first direction x.

[0046] In addition to the first mounting plate 31, the mounting bracket 3 also includes a second mounting plate 32. There are two second mounting plates 32, arranged opposite each other along the first direction x. Two second fasteners 2 are respectively mounted on the two second mounting plates 32. Thus, the first fastener 1, the second fastener 2, and the mounting bracket 3 form a whole. The two first mounting plates 31 and the two second mounting plates 32 enclose a cage-like structure for the mounting bracket 3.

[0047] In addition to the second fixing plate 21, the second fixture 2 also includes a second drive assembly. The second drive assembly is disposed on a corresponding second mounting plate 32. The drive end of the second drive assembly is connected to the corresponding second fixing plate 21. The driving direction of the second drive assembly on the second fixing plate 21 is along a first direction x.

[0048] Before debonding, the two second fixing plates 21 are first driven away from each other by two second driving components, and the two first fixing plates 11 are driven away from each other by two first driving components, to ensure that the two second fixing plates 21 and the two first fixing plates 11 form a sufficient space to accommodate the wafer assembly 4. While the mounting bracket 3 is placed across the resin support 5, the wafer assembly 4 is ensured to enter the space formed by the two second fixing plates 21 and the two first fixing plates 11. Then, the two second driving components drive the two second fixing plates 21 closer together to provide effective support for the wafer assembly 4 in the first x direction, and the two first driving components drive the two first fixing plates 11 closer together to provide effective support for the wafer assembly 4 in the second y direction. This prevents the wafers in the wafer assembly 4 from tipping over in both the first x and second y directions.

[0049] In a specific embodiment of this utility model, sponge pads are attached to the surfaces of the first fixing plate 11 and the second fixing plate 21 to ensure buffered contact between the first fixing plate 11 and the second fixing plate 21 and the wafer assembly 4, thereby avoiding hard contact that could damage the wafer.

[0050] The wafer assembly 4 includes multiple pillar wafers arranged along a first direction x, and each pillar wafer includes several wafers arranged along the first direction x. After a pillar wafer is removed from the wafer assembly 4, the remaining wafers will tilt due to gaps. However, due to the presence of the second fixing plate 21, the wafers will not be completely flattened, but will remain slightly tilted against the second fixing plate 21. Then, the two second fixing plates 21 are driven closer together again by two sets of second driving components, so that the remaining wafers return from the tilted state to the upright state, which facilitates subsequent wafer removal.

[0051] In existing technology, two operators are required to work together during the wafer removal process. The first operator uses two fixing blocks to clamp the wafer group 4 from both ends. After the second operator removes one wafer, the first operator needs to push the wafers together along the first direction x to re-fix the remaining wafers. However, in this invention, because a second fixing device 2 is provided to support the wafer group 4 in the first direction x, the first operator is no longer needed to fix the wafer group 4, thus freeing them up. Using the protective device in this invention, only one operator is required to perform the debonding and wafer removal operations.

[0052] The second drive assembly includes a second screw 22, which is arranged along a first direction x. A second threaded hole is provided on the second mounting plate 32, and the external thread of the second screw 22 engages with the internal thread of the second threaded hole. The second screw 22 is threaded into the second threaded hole and passes through the second mounting plate 32 via the second threaded hole. The end of the second screw 22 located between the two second mounting plates 32 is an inner end. The inner end of the second screw 22 is rotatably connected to the second fixed plate 21. Specifically, a second bearing is embedded in the second mounting plate 32, and the inner end of the second screw 22 is installed in the inner ring of the second bearing. When the second screw 22 is rotated in one direction, it moves outward relative to the second mounting plate 32, simultaneously causing the second fixed plate 21 to move outward, thus creating sufficient space between the two second fixed plates 21. When the second screw 22 is rotated in another direction, the second screw 22 will move inward relative to the second mounting plate 32, and at the same time drive the second fixing plate 21 to move closer to each other, forming a cooperation with the chip group 4 to provide effective support for the chip group 4.

[0053] In order to facilitate the rotation of the second screw 22, in a specific embodiment of the present invention, a second rotating rod 23 is connected to the part of the second screw 22 that extends out of the second mounting plate 32, and the second rotating rod 23 is perpendicularly connected to the second screw 22.

[0054] To ensure that the second fixed plate 21 moves stably along the first direction x, a second guide rod 24 is also provided in this specific embodiment of the invention. The second guide rod 24 is arranged along the first direction x. The second mounting plate 32 is provided with a second guide hole adapted to the second guide rod 24, and the second guide rod 24 passes through the second mounting plate 32 through the second guide hole.

[0055] Furthermore, two second guide rods 24 are provided, distributed along the second direction y on both sides of the second screw 22. Correspondingly, two second guide holes are provided on the second mounting plate 32.

[0056] During the process of moving the second fixed plate 21 by the second screw 22, the second fixed plate 21 cannot sway arbitrarily due to the constraint of the second guide rod 24, thereby ensuring that the second fixed plate 21 moves stably along the first direction x.

[0057] In a specific embodiment of this utility model, two second mounting plates 32 extend downward relative to two first mounting plates 31, thus creating a clearance space below the two first mounting plates 31 to avoid the resin support 5, facilitating the mounting bracket 3 to straddle the resin support 5 along the second direction y. In addition to the two first mounting plates 31 and two second mounting plates 32, the mounting bracket 3 also includes two base plates 33. The two base plates 33 are horizontally arranged. The two base plates 33 are respectively connected to the bottom of the two first mounting plates 31. The space between the two base plates 33 is adapted to the corresponding portion of the bottom of the resin support 5. Thus, the resin support 5 limits the movement of the two base plates 33, and consequently limits the entire protective device, preventing arbitrary shaking of the protective device during degumming or wafer removal.

[0058] The two base plates 33 can be formed by bending the bottom of the two first mounting plates 31 inwards.

[0059] In summary, the usage process of the SiC wafer debonding protection device of this utility model is as follows: First, two first driving components move two first fixing plates 11 to the far end, and two second driving components move two second fixing plates 21 to the far end, so that the space enclosed by the two first fixing plates 11 and the two second fixing plates 21 is sufficient to accommodate the wafer assembly 4. Then, the fixing frame 3 of the protection device is placed across the resin support 5 along the second direction y, while the wafer assembly 4 enters the space enclosed by the two first fixing plates 11 and the two second fixing plates 21. Then, the two second driving components drive the two second fixing plates 21 to move closer to each other along the first direction x to approach the two ends of the wafer assembly 4. The two first driving components drive the two first fixing plates 11 to move closer to each other along the second direction y to approach the two sides of the wafer assembly 4. In this way, the two second fixing plates 21 provide effective support for the wafer assembly 4 in the first direction x, and the two first fixing plates 11 provide effective support for the wafer assembly 4 in the second direction y. Then, the wafer assembly 4 is debonded and washed. After debonding and washing, the wafer is removed. The wafer set 4 includes multi-pillar wafers, with one pillar being removed at a time during wafer retrieval. After one pillar is removed, the remaining wafers will tilt slightly in the first direction x and rest against the second fixing plate 21. The operator uses two second drive components to bring the two second fixing plates 21 closer together, causing the tilted wafers to straighten again. The second pillar wafer is then removed. This process is repeated until all wafers have been removed.

[0060] Finally, it should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0061] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0062] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A SiC wafer debonding protection device, characterized in that, Includes a first fixture (1), the first fixture (1) includes a first fixing plate (11), the first fixing plate (11) extends along a first direction, and the axial direction of the wafer group (4) is along the first direction; In a second direction perpendicular to the first direction, the first fixing plate (11) is located on one side of the wafer group (4), and the surface of the first fixing plate (11) facing the wafer group (4) matches the semi-circular surface of the wafer group (4). In the second direction, the first fixture (1) consists of two sets arranged opposite to each other, and the first fixing plates (11) in the two sets of first fixtures (1) can move away from or close to each other along the second direction.

2. The SiC wafer debonding protection device according to claim 1, characterized in that, In the first direction, the two ends of the first fixing plate (11) extend out of the wafer group (4).

3. The SiC wafer debonding protection device according to claim 1, characterized in that, It also includes a fixing frame (3), which can straddle the resin support (5) along the second direction. The fixing frame (3) includes two first mounting plates (31) arranged opposite to each other along the second direction, and two first fasteners (1) are respectively disposed on the two first mounting plates (31). The first fixture (1) further includes a first drive assembly, which is disposed on the first mounting plate (31). The drive end of the first drive assembly is connected to the first fixture plate (11), and the drive direction of the first drive assembly on the first fixture plate (11) is along the second direction.

4. The SiC wafer debonding protection device according to claim 3, characterized in that, The first drive assembly includes a first screw (12) arranged along the second direction. A first threaded hole is provided on the first mounting plate (31). The first screw (12) is threaded into the first threaded hole and passes through the first mounting plate (31) through the first threaded hole. The inner end of the first screw (12) is rotatably connected to the first fixing plate (11).

5. The SiC wafer debonding protection device according to claim 4, characterized in that, The first screw (12) is connected to a first rotating rod (13) on the part of the first screw (12) that extends out of the first mounting plate (31).

6. The SiC wafer debonding protection device according to claim 4, characterized in that, The first drive assembly further includes a first guide rod (14), which is arranged along the second direction. A first guide hole is provided on the first mounting plate (31). The first guide rod (14) is adapted to the first guide hole, and the first guide rod (14) passes through the first mounting plate (31) through the first guide hole.

7. The SiC wafer debonding protection device according to claim 3, characterized in that, It also includes a second fixture (2), which includes a second fixing plate (21). The surface of the second fixing plate (21) facing the end face of the wafer group (4) can be attached to the end face of the wafer group (4). The second fixture (2) consists of two sets arranged opposite to each other along the first direction. The fixing frame (3) also includes two second mounting plates (32) arranged along the first direction. The two second fixtures (2) are respectively disposed on the two second mounting plates (32). The second fixture (2) further includes a second drive assembly, which is disposed on the second mounting plate (32). The drive end of the second drive assembly is connected to the second fixing plate (21), and the drive direction of the second drive assembly on the second fixing plate (21) is along the first direction.

8. The SiC wafer debonding protection device according to claim 7, characterized in that, The second drive assembly includes a second screw (22) arranged along the first direction. The second mounting plate (32) is provided with a second threaded hole. The second screw (22) is threaded into the second threaded hole and passes through the second mounting plate (32) through the second threaded hole. The inner end of the second screw (22) is rotatably connected to the second fixing plate (21).

9. The SiC wafer debonding protection device according to claim 8, characterized in that, The second drive assembly further includes a second guide rod (24), which is arranged along the first direction. The second mounting plate (32) is provided with a second guide hole. The second guide rod (24) is adapted to the second guide hole, and the second guide rod (24) passes through the second mounting plate (32) through the second guide hole.

10. The SiC wafer debonding protection device according to claim 7, characterized in that, The second mounting plate (32) extends downward relative to the first mounting plate (31) so that a first clearance space is formed below the first mounting plate (31) to avoid the resin holder (5); The fixing frame (3) also includes two base plates (33), which are arranged horizontally and connected to the bottom of the two first mounting plates (31) respectively. The space between the two base plates (33) is adapted to the corresponding part of the bottom of the resin holder (5).

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