Electronic testing device

Abstract

An electronic test device comprises a test board, a circuit carrier board, an annular elastic structure, a probe module and an air passage group. The circuit carrier plate bears and is electrically connected with an object to be detected. The annular elastic structure is clamped between the testboard and the circuit carrier board, so that the internal space of the annular elastic structure is closed between the testboard and the circuit carrier board. The probe module is located on the test bench, partially extends into the internal space, and is connected with the circuit carrier board. The air channel group is located on the test bench and communicated with the internal space. When the internal space is vacuumized through the air passage group, and the circuit carrier plate is driven to compress the annular elastic structure and the internal space towards the test board, the circuit carrier plate is pressed and electrically connected with the probe module, so that the detection carrier plate can accurately, flatly and vertically descend, the alignment of the probe of the probe head and the conductive contact of the detection carrier plate is accurately completed, and the detection efficiency is improved. And the accuracy of test performance is improved.

Description

Technical Field

[0001] This utility model relates to an electronic testing device, and more particularly to an electronic testing device employing negative pressure contact alignment. Background Technology

[0002] Traditional testing equipment consists of a working module and a test substrate. The test substrate covers the probe head on the working module, and multiple probes on the probe head contact various conductive contacts on the test substrate. Therefore, the working module can transmit test signals to the device under test on the test substrate through the probe head, thereby performing relevant electrical tests.

[0003] However, due to the large area of ​​the test substrate and the high precision of all the probes in the probe head, conventional methods cannot ensure that the test substrate is fully and reliably lowered vertically to accurately align the probes with the conductive contacts of the test substrate, resulting in inaccurate test performance.

[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, and needs further improvement. Utility Model Content

[0005] This invention proposes an electronic testing device to solve the problems of prior art.

[0006] According to one embodiment of the present invention, an electronic testing device includes a test stage, a circuit board, an annular elastic structure, at least one probe module, and an air passage assembly. The circuit board includes multiple contacts. The annular elastic structure is sandwiched between the test stage and the circuit board, such that the internal space of the annular elastic structure is sealed between the test stage and the circuit board. The probe module is located on the test stage and partially extends into the internal space. The probe module includes multiple compression probes, which are respectively aligned with the contacts. The air passage assembly is located on the test stage and is connected to the internal space.

[0007] According to one or more embodiments of the present invention, in the above-described electronic testing device, the annular elastic structure includes an intermediate plate, an elastic airtight ring, and multiple vacuum channels. The intermediate plate is located between the test stage and the circuit board, and is situated within the internal space. The elastic airtight ring surrounds the internal space, surrounds and is fixedly connected to the intermediate plate, and is sandwiched between the test stage and the circuit board, such that the circuit board, the intermediate plate, and the elastic airtight ring together define a first air gap, and the test stage and the intermediate plate together define at least one second air gap, and the second air gap connects to the air channel assembly. These vacuum channels are distributed on the intermediate plate and respectively connect to the first air gap and the second air gap.

[0008] According to one or more embodiments of the present invention, in the above-described electronic testing device, the first air gap is larger than the second air gap.

[0009] According to one or more embodiments of the present invention, in the above-described electronic testing apparatus, these vacuum channels are spaced around the probe module.

[0010] According to one or more embodiments of the present invention, in the above-described electronic testing device, the outer side of the intermediate plate is directly connected to the inner wall of the elastic airtight ring, and is located between an upper side and a lower side of the elastic airtight ring. The upper side of the inner wall is removably connected to the circuit carrier, and the lower side of the inner wall is fixedly connected to the test stage.

[0011] According to one or more embodiments of the present invention, in the above-described electronic testing device, the test stage includes at least one placement opening, and the probe module is inserted into the placement opening. The probe module further includes an airtight collar, which is sleeved around the outer surface of the probe module and clamped between the probe module and the test stage to prevent communication between the second air gap and the placement opening.

[0012] According to one or more embodiments of the present invention, in the above-described electronic testing device, the annular elastic structure includes at least one through hole. The through hole is disposed in an intermediate plate, connecting two opposite surfaces of the intermediate plate and aligning with the placement opening. The probe module is simultaneously inserted into both the through hole and the placement opening.

[0013] According to one or more embodiments of the present invention, in the above-described electronic testing device, the side of the intermediate plate opposite to the circuit carrier plate has an outer flange and at least one annular flange. The outer edge of the intermediate plate is connected to the outer flange, and the annular flange surrounds the outline of the through hole, and a second air gap is formed between the outer flange and the annular flange.

[0014] According to one or more embodiments of the present invention, in the above-described electronic testing apparatus, the probe module includes a module body. These compression probes are respectively pressably disposed on the end face of the module body. The circuit board includes a wiring board. The wiring board is placed on an elastic hermetic ring, and these contacts are distributed on the bottom surface of the wiring board.

[0015] According to one or more embodiments of the present invention, in the above-described electronic testing device, each compression probe has a compression stroke, the length of which is the same as the height of the first air gap.

[0016] Thus, through the above architecture, the electronic testing device of this invention, which adopts negative pressure contact alignment, enables the test substrate to descend vertically accurately and flatly, thereby precisely aligning the probe of the probe head with the conductive contacts of the test substrate and improving the accuracy of the test performance.

[0017] The above description is only used to illustrate the problem that this utility model intends to solve, the technical means to solve the problem, and the effects it produces. The specific details of this utility model will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of this utility model more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a cross-sectional schematic diagram of an electronic testing device employing negative pressure contact alignment according to an embodiment of the present invention, and a partial enlarged view of region M.

[0020] Figure 2 for Figure 1 Exploded view of the electronic testing device;

[0021] Figure 3 for Figure 1 Top view of the annular elastic structure and probe module;

[0022] Figure 4 for Figure 1 A schematic diagram of the operation of an electronic testing device;

[0023] Figure 5 This is a cross-sectional schematic diagram of an electronic testing device employing negative pressure contact alignment according to an embodiment of the present invention.

[0024] Figure 6 for Figure 5 A schematic diagram viewed along line segment AA.

[0025] [Symbol Explanation]

[0026] 10,11: Electronic testing equipment

[0027] 100: Test bench

[0028] 110: Base

[0029] 111: Top

[0030] 120: Place an opening

[0031] 200: Circuit board

[0032] 210: Patch panel

[0033] 211: Top surface

[0034] 212: Bottom

[0035] 220:Contact

[0036] 300, 301: Ring-shaped elastic structure

[0037] 310: Intermediary Board

[0038] 311: First Page

[0039] 312: Second page

[0040] 313: outer side

[0041] 314: Outer flange

[0042] 315: Annular flange

[0043] 320: Elastic airtight ring

[0044] 321: Inner wall

[0045] 322: Upper side

[0046] 323: Lower side

[0047] 324: Interior Space

[0048] 330: Through hole

[0049] 340: Vacuum Channel

[0050] 400: Probe Module

[0051] 410: Module Body

[0052] 411: Outer surface

[0053] 412: End face

[0054] 420: Compression Probe

[0055] 430: Airtight collar

[0056] 500: Airway Group

[0057] 510: Meeting Channel

[0058] 520: Diversion Channel

[0059] 600: Vacuum generating device

[0060] AA: Line segment

[0061] D: Direction

[0062] M: Region

[0063] S1: First air gap

[0064] S2, S3: Second air gap

[0065] H: Height

[0066] X, Y, Z: Axes Detailed Implementation

[0067] The following describes multiple embodiments of the present invention with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, those skilled in the art will understand that these practical details are not essential in some embodiments and therefore should not be used to limit the present invention. Furthermore, for the sake of simplicity, some conventional structures and components are shown in the drawings in a simplified schematic manner. Additionally, for ease of viewing, the dimensions of the components in the drawings are not drawn to scale.

[0068] Figure 1 This is a cross-sectional schematic diagram and a partial enlarged view of region M of an electronic testing device 10 employing negative pressure contact alignment according to an embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the electronic testing device 10. Figure 3 for Figure 1 Top view of the annular elastic structure 300 and the probe module 400.

[0069] In this embodiment, as Figure 1 and Figure 2 As shown, the electronic testing apparatus 10 includes a test stage 100, a circuit board 200, an annular elastic structure 300, multiple probe modules 400, and an air duct assembly 500. The circuit board 200 carries and electrically connects to an object to be tested (e.g., an electronic component, not shown). The annular elastic structure 300 is compressible and completely surrounds an internal space 324. The annular elastic structure 300 is sandwiched between the test stage 100 and the circuit board 200, making the internal space 324 a sealed space between the test stage 100 and the circuit board 200. The probe modules 400 are located on the test stage 100, partially extending into the internal space 324, and connected to the circuit board 200. The air duct assembly 500 is located on the test stage 100 and communicates with the internal space 324.

[0070] More specifically, in this embodiment, as Figure 1 and Figure 2 As shown, the test stand 100 includes a base 110 and a plurality of placement openings 120. The interior of the base 110 is for accommodating test modules (not shown) and other components capable of testing the object to be tested. These placement openings 120 are spaced apart on the top 111 of the base 110 and are connected to the interior of the base 110. A portion of each probe module 400 is inserted into one of the placement openings 120 and is electrically connected to the test module inside the base 110, while the remainder extends out from the corresponding placement opening 120.

[0071] The circuit board 200 includes a wiring board 210 and a plurality of contacts 220. The wiring board 210 has a top surface 211 and a bottom surface 212 opposite to each other. The contacts 220 are distributed on the bottom surface 212 of the wiring board 210. The object to be tested is placed on the top surface 211 and is electrically connected to the contacts 220 through the wiring board 210.

[0072] The annular elastic structure 300 includes an intermediate plate 310, an elastic hermetic ring 320, and a plurality of vacuum channels 340. The elastic hermetic ring 320 surrounds the internal space 324, and the intermediate plate 310 is located within the internal space 324 and is situated between the test stage 100 and the circuit board 200.

[0073] More specifically, the intermediary plate 310 is flat and extends along the XY axis, including a first surface 311 and a second surface 312 facing each other, wherein the first surface 311 faces the circuit carrier 200 and the second surface 312 faces the test stage 100, and remains separate from the top 111 of the base 110. In this embodiment, the intermediary plate 310 is a fiberglass board; however, the present invention is not limited thereto.

[0074] An elastic airtight ring 320 surrounds and is fixedly connected to the intermediate plate 310. More specifically, the outer side 313 of the intermediate plate 310 is directly and fixedly connected to the inner sidewall 321 of the elastic airtight ring 320, and is located between the upper side 322 and the lower side 323 of the elastic airtight ring 320. The elastic airtight ring 320 is directly clamped between the test stage 100 and the circuit carrier board 200 on the Z-axis, such that the bottom surface 212 of the wiring board 210, the first surface 311 of the intermediate plate 310, and the elastic airtight ring 320 together define a first air gap S1, and the top surface 111 of the base 110, the second surface 312 of the intermediate plate 310, and the elastic airtight ring 320 together define a second air gap S2.

[0075] In this embodiment, more specifically, the upper side 322 of the elastic airtight ring 320 is removably in contact with the wiring board 210 of the circuit carrier board 200, and the lower side 323 is fixedly connected to the base 110 of the test bench 100. The wiring board 210 is located between the first air gap S1 and the second air gap S2, and the size of the first air gap S1 is larger than the size of the second air gap S2. However, the present invention is not limited thereto. In this embodiment, the elastic airtight ring 320 is a rubber or silicone product, and the interior of the elastic airtight ring 320 is hollow. However, the present invention is not limited thereto.

[0076] These vacuum channels 340 are evenly distributed on the intermediate plate 310. Figure 3Each vacuum channel 340 is connected at both ends to the first surface 311 and the second surface 312 of the intermediate plate 310, and is connected to the first air gap S1 and the second air gap S2, respectively. In this embodiment, these vacuum channels 340 are spaced around the probe module 400. Figure 3 However, this invention is not limited thereto. It should be understood that the higher the number and density of these vacuum channels 340 on the interposer plate 310, the more accurately and smoothly the circuit carrier plate 200 can descend vertically, thereby achieving more precise alignment between the probe module 400 and the circuit carrier plate 200.

[0077] Furthermore, the annular elastic structure 300 includes a plurality of through holes 330. These through holes 330 are spaced apart on the intermediate plate 310, respectively aligned with and connected to the placement openings 120. Each through hole 330 passes through the intermediate plate 310 and respectively connects the first surface 311 and the second surface 312 of the intermediate plate 310.

[0078] In this embodiment, each probe module 400 is simultaneously inserted into both the corresponding through hole 330 and placement opening 120. That is, another portion of each probe module 400 passes through the through hole 330 and continues to extend from the first surface 311 of the intermediate plate 310 to the bottom surface 212 of the circuit carrier 200. Furthermore, the probe module 400 includes a module body 410 and a plurality of compression probes 420. These compression probes 420 are pressably disposed on the end face 412 of the module body 410 and are respectively aligned with the corresponding contact 220. One end of each compression probe 420 directly contacts one of the contacts 220 of the circuit carrier 200.

[0079] In this embodiment, the probe module 400 further includes multiple airtight collars 430. Each airtight collar 430 is fitted around the outer surface 411 of the module body 410 of the probe module 400. When the module body 410 is inserted into the corresponding placement opening 120, the airtight collar 430 is airtightly clamped between the module body 410 and the test stage 100 to block the communication between the second air gap S2 and the placement opening 120.

[0080] The airway assembly 500 includes at least one collecting channel 510 and multiple diverting channels 520. These diverting channels 520 are spaced apart within the base 110 of the test bench 100. One end of each diverting channel 520 is connected to the second air gap S2, and the other end is connected to the collecting channel 510. The end of the collecting channel 510 away from the second air gap S2 is connected to the vacuum generating device 600. Thus, the vacuum generating device 600 can connect the airway assembly 500, the second air gap S2, the vacuum channel 340, and the first air gap S1. In this embodiment, the collecting channel 510 and the diverting channels 520 of the airway assembly 500 are either a single integral tube or ventilation grooves within the test bench 100; however, this invention is not limited to these configurations.

[0081] Figure 4 for Figure 1 A schematic diagram of the operation of the electronic testing device 10. (See diagram below.) Figure 1 and Figure 4 As shown, when the vacuum generating device 600 is activated, causing the vacuum generating device 600 to evacuate the internal space 324 (i.e., the second air gap S2, the vacuum channel 340, and the first air gap S1) through the air channel group 500, the air in the first air gap S1 begins to converge from all the vacuum channels 340 into the second air gap S2, and then is transmitted to the vacuum generating device 600 through the air channel group 500, thereby creating a negative pressure in the internal space 324.

[0082] Thus, due to the negative pressure generated within the internal space 324, the suction force of the vacuum generating device 600 forces the circuit carrier 200 to move vertically along the Z-axis towards the test stage 100 in the direction D, thereby vertically compressing the first air gap S1 and the annular elastic structure 300. Therefore, the circuit carrier 200 begins to press the probe module 400 downwards and electrically connects the probe module 400 accordingly.

[0083] Furthermore, when the internal space 324 is evacuated, the contacts 220 of the circuit board 200 press all or at least part of the corresponding compression probes 420 into the module body 410, thereby electrically contacting the compression probes 420.

[0084] In this embodiment, for example, each compression probe 420 has a compression stroke (reference height H), the length of which is the same as the height H of the first air gap S1. That is, when the contact 220 of the circuit carrier 200 presses the entire compression probe 420 into the module body 410, the bottom surface 212 of the circuit carrier 200 directly adheres to the first surface 311 of the intermediate plate 310.

[0085] Figure 5 This is a cross-sectional schematic diagram of an electronic testing device 11 employing negative pressure contact alignment according to an embodiment of the present invention. Figure 6 for Figure 5 A schematic diagram viewed along line segment AA. (See diagram below.) Figure 5 and Figure 6 As shown, the electronic testing device 11 in this embodiment is substantially the same as the electronic testing device 10 in the above embodiment. The difference is that if the annular elastic structure 301 and the circuit carrier 200 are large-area products and a depression is generated from their center, the second surface 312 of the intermediate plate 310 can partially contact the top 111 of the base 110 to enhance the support strength of the test stage 100 for the annular elastic structure 301 and the circuit carrier 200.

[0086] More specifically, the second surface 312 of the intermediate plate 310 has an outer flange 314 and a plurality of annular flanges 315. The outer edge 313 of the intermediate plate 310 connects to the outer flange 314, and the outer flange 314 completely surrounds these annular flanges 315. Each annular flange 315 completely surrounds the contour of the through hole 330. Therefore, the base 110, the intermediate plate 310, the outer flange 314, and these annular flanges 315 together define the second air gap S3, and the second air gap S3 is formed between the outer flange 314 and the annular flanges 315. Figure 6 ).

[0087] However, the present invention is not limited thereto. In other embodiments, those skilled in the art to which the present invention pertains may also design the base 110, intermediate plate 310, outer flange 314 and these annular flanges 315 together to define a plurality of mutually isolated second air gaps S3, and each second air gap S3 is connected to one of the diversion channels 520 and several vacuum channels 340.

[0088] However, this invention is not limited to the number of probe modules, second air gaps, placement openings, through holes and annular flanges described above. In other embodiments, the probe modules, second air gaps, placement openings, through holes and annular flanges may also be a single unit.

[0089] Thus, through the above architecture, the electronic testing device of this utility model with negative pressure contact alignment can make the test carrier plate descend accurately and flatly vertically, thereby accurately completing the alignment of the electronic testing device and the test carrier plate and improving the accuracy of the test performance.

[0090] Finally, the embodiments disclosed above are not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention, and all such modifications and refinements will be protected under the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An electronic testing device, characterized in that, Include: Test bench; A circuit board containing multiple contacts; A ring-shaped elastic structure is sandwiched between the test stage and the circuit board, so that the internal space enclosed by the ring-shaped elastic structure is sealed between the test stage and the circuit board. At least one probe module is located on the test bench and extends partially into the internal space. The probe module includes a plurality of compression probes, which are respectively aligned with the plurality of contacts. as well as The airway assembly is located on the test stand and is connected to the internal space.

2. The electronic testing device as described in claim 1, characterized in that, The annular elastic structure includes: An intermediate board is located between the test bench and the circuit board, and is situated within the internal space. An elastic airtight ring surrounds the internal space, surrounds and is fixedly connected to the intermediate plate, and is sandwiched between the test bench and the circuit board, such that the circuit board, the intermediate plate and the elastic airtight ring together define a first air gap, and the test bench and the intermediate plate together define at least one second air gap, and the second air gap is connected to the air passage assembly. as well as Multiple vacuum channels are distributed on the intermediate plate and are respectively connected to the first air gap and the second air gap.

3. The electronic testing device as described in claim 2, characterized in that, The first air gap is larger than the second air gap.

4. The electronic testing device as described in claim 2, characterized in that, The plurality of vacuum channels are spaced apart around the probe module.

5. The electronic testing device as described in claim 2, characterized in that, The outer edge of the intermediate plate is directly connected to the inner wall of the elastic airtight ring, and is located between the upper and lower sides of the elastic airtight ring. The upper side of the inner sidewall is removably in contact with the circuit board, and the lower side of the inner sidewall is fixedly in contact with the test stage.

6. The electronic testing device as described in claim 2, characterized in that, The test stand includes at least one placement opening, into which the probe module is inserted; and The probe module further has an airtight collar, which is fitted around the outer surface of the probe module and clamped between the probe module and the test stage to block the communication between the second air gap and the placement opening.

7. The electronic testing apparatus as described in claim 6, characterized in that, The annular elastic structure includes: At least one through hole is provided in the intermediate plate, connecting two opposite surfaces of the intermediate plate and aligning with the placement opening, wherein the probe module is simultaneously inserted into the through hole and the placement opening.

8. The electronic testing apparatus as described in claim 7, characterized in that, The intermediate plate has an outer flange and at least one annular flange on one side opposite the circuit carrier plate. The outer edge of the intermediate plate is connected to the outer flange, and the annular flange surrounds the outline of the through hole. The second air gap is formed between the outer flange and the annular flange.

9. The electronic testing device as described in claim 2, characterized in that, The probe module includes a module body, and the plurality of compression probes are respectively pressably disposed on the end face of the module body; and The circuit board includes a wiring board placed on the elastic airtight ring, and the plurality of contacts are distributed on the bottom surface of the wiring board.

10. The electronic testing apparatus as described in claim 9, characterized in that, Each of the plurality of compression probes has a compression stroke, the length of which is the same as the height of the first air gap.

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