Chip resistor with radiating fins

Abstract

The utility model relates to the technical field of electronic components, and discloses a chip resistor with radiating fins, which comprises a resistor body, the radiating fins and a mechanical connection structure for connecting the resistor body and the radiating fins. The radiating fins are made of high-thermal-conductivity materials, and the mechanical connection structure ensures that the resistor body and the radiating fins are in close contact and stable connection, so that heat generated when the resistor works is quickly conducted to the radiating fins and dissipated to the surrounding environment, the reliability and the stability of the chip resistor are improved, the service life is prolonged, and the service life of the chip resistor is prolonged. The resistor is suitable for various electronic devices having requirements for heat dissipation of the resistor.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, specifically to a surface mount resistor with heat dissipation fins. Background Technology

[0002] Surface mount resistors are commonly used electronic components in electronic devices, serving functions such as limiting current and dividing voltage in circuits. With the miniaturization and increasing performance of electronic devices, the power requirements for surface mount resistors are becoming increasingly stringent. However, surface mount resistors generate heat during operation. If this heat cannot be dissipated in time, the resistor temperature will rise, affecting its performance and reliability, and potentially even causing damage and shortening the lifespan of the electronic device.

[0003] Currently, some methods to improve the heat dissipation performance of surface mount resistors involve coating the resistor surface with heat-dissipating materials or adding sensors in conjunction with heat dissipation devices. However, the heat dissipation effect of coating with heat-dissipating materials is limited, and the heat dissipation performance may decrease over time; adding sensors and other structures not only increases the cost and complexity of surface mount resistors but may also occupy more circuit board space, which is detrimental to the miniaturization design of electronic devices. Therefore, there is a need for a surface mount resistor that achieves efficient heat dissipation through a simple mechanical structure without adding complex components. Utility Model Content

[0004] The purpose of this invention is to provide a surface mount resistor with heat dissipation fins to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a surface mount resistor with heat dissipation fins, comprising:

[0006] Resistor body;

[0007] Heat dissipation fins, wherein the heat dissipation fins are made of a high thermal conductivity material;

[0008] A mechanical connection structure is provided for connecting the resistor body to the heat sink fins, so that the heat generated by the resistor body can be conducted to the heat sink fins. The mechanical connection structure includes a connection groove formed on the resistor body and a connection protrusion provided on the heat sink fins and adapted to the connection groove. The connection protrusion is embedded in the connection groove to realize the connection between the resistor body and the heat sink fins, and the connection protrusion and the connection groove are interference fit.

[0009] Preferably, the heat dissipation fins include a substrate and a plurality of fins disposed on the substrate, the plurality of fins being parallel to each other and spaced apart, and the substrate being connected to the resistor body through the mechanical connection structure.

[0010] Preferably, the fins are shaped as one of the following: wavy, cuboid, trapezoidal, or triangular.

[0011] Preferably, the high thermal conductivity material is one of copper, aluminum, or aluminum alloy, and its surface is plated with tin or silver.

[0012] Preferably, the surface where the resistor body connects to the heat sink fins is provided with a thermally conductive coating.

[0013] Preferably, the connecting groove is a dovetail groove, and the connecting protrusion is a dovetail protrusion adapted to the dovetail groove.

[0014] Preferably, the mechanical connection structure further includes fixing holes provided on the resistor body and the heat sink fins, and the resistor body and the heat sink fins are fixedly connected by a fastener passing through the fixing hole, wherein the fastener is a combination of bolts and nuts or a rivet.

[0015] Compared with the prior art, the advantages of this utility model are: by connecting the heat sink fins to the resistor body through a mechanical structure, there is no need to add complex structures such as sensors, which reduces costs and complexity, and does not occupy too much circuit board space, which is conducive to the miniaturization design of electronic devices.

[0016] The heat sink fins are made of highly thermally conductive material and are connected to the resistor body through a tight mechanical connection. This allows them to quickly conduct and dissipate the heat generated by the resistor body, effectively reducing the operating temperature of the resistor, improving the reliability and stability of the surface mount resistor, and extending its service life.

[0017] With multiple mechanical connection methods and heat dissipation fin structure design, it can adapt to different application scenarios and needs, and has good versatility and practicality. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a breakdown of the present utility model. Figure 1 ;

[0020] Figure 3 This is a breakdown of the present utility model. Figure 2 .

[0021] In the diagram: 1. Resistor body; 2. Fin; 3. Through slot; 4. Substrate; 5. Connecting protrusion; 6. Connecting groove; 7. Fixing hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-3 The present invention provides the following technical solution: a chip resistor with heat dissipation fins, comprising a resistor body 1, heat dissipation fins and a mechanical connection structure.

[0024] The heat sink fins are made of high thermal conductivity materials, such as copper, aluminum or aluminum alloy, and are tin- or silver-plated on the surface, which gives the heat sink fins good thermal conductivity and can quickly conduct away the heat generated by the resistor body 1.

[0025] The mechanical connection structure is used to connect the resistor body 1 to the heat sink fins, allowing the heat generated by the resistor body 1 to be conducted to the heat sink fins. Specifically, the mechanical connection structure includes a connection groove 6 formed on the resistor body 1 and a connection protrusion 5 provided on the heat sink fins and adapted to the connection groove 6. The connection protrusion 5 is embedded in the connection groove 6 to connect the resistor body 1 to the heat sink fins, and the connection protrusion 5 and the connection groove 6 are in an interference fit. This connection method ensures that the resistor body 1 and the heat sink fins are in close contact, reduces thermal resistance, improves heat conduction efficiency, and ensures the stability of the connection.

[0026] Furthermore, the heat dissipation fins include a substrate 4 and multiple fins 2 disposed on the substrate 4. The multiple fins 2 are parallel to each other and spaced apart. The substrate 4 is connected to the resistor body 1 by a mechanical connection structure. The arrangement of the fins 2 increases the heat dissipation area, enabling more effective heat dissipation to the surrounding environment. The shape of the fins 2 can be one of the following: wavy, cuboid, trapezoidal, or triangular. Different shapes have different heat dissipation efficiency and space occupation, and can be selected according to actual needs. In addition, through grooves 3 are formed on the outer wall of the fins 2 to increase the surface area.

[0027] To further improve heat conduction, a thermally conductive coating is provided on the surface where the resistor body 1 connects to the heat sink fins. The thermally conductive coating can fill any tiny gaps that may exist between the resistor body 1 and the heat sink fins, thereby further reducing thermal resistance.

[0028] In some embodiments, the connecting groove 6 is a dovetail groove, and the connecting protrusion 5 is a dovetail protrusion adapted to the dovetail groove. The cooperation between the dovetail groove and the dovetail protrusion can provide better connection stability and prevent the heat sink fins from shifting during use.

[0029] The mechanical connection structure may also include fixing holes 7 provided on the resistor body 1 and the heat sink fins. The resistor body 1 and the heat sink fins are fixedly connected by fasteners passing through the fixing holes 7. The fasteners may be a combination of bolts and nuts or rivets. This dual fixing method further enhances the reliability of the connection between the resistor body 1 and the heat sink fins.

[0030] Example 1:

[0031] A surface-mount resistor with heat sink fins is disclosed. The resistor body 1 is made of conventional resistor material. The heat sink fins are made of aluminum alloy and include a substrate 4 and multiple cuboid fins 2 disposed on the substrate 4. The fins 2 are parallel to each other and spaced 5 mm apart. A dovetail groove is formed on the resistor body 1 as a connection groove 6. A dovetail protrusion is formed on the substrate 4 of the heat sink fins as a connection protrusion 5, which is adapted to the dovetail groove. The dovetail protrusion is interference-fitted into the dovetail groove to achieve the initial connection between the resistor body 1 and the heat sink fins. Then, fixing holes 7 are formed at corresponding positions on the resistor body 1 and the heat sink fins, and rivets are used to pass through the fixing holes 7 to further fix the two together. A layer of thermally conductive grease is coated on the surface where the resistor body 1 and the heat sink fins are connected as a thermally conductive coating.

[0032] Example 2:

[0033] The difference from Embodiment 1 is that the fins 2 on the heat sink are wavy, and the fixing components are a combination of bolts and nuts. In actual use, depending on the different electronic device requirements and space constraints, the above-described embodiments can be flexibly selected or the structure can be appropriately adjusted, all of which can achieve the purpose of efficient heat dissipation of the surface mount resistor with heat sink fins of the present invention.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A surface mount resistor with heat dissipation fins, characterized in that, include: Resistor body (1); Heat dissipation fins, wherein the heat dissipation fins are made of a high thermal conductivity material; A mechanical connection structure is used to connect the resistor body (1) to the heat sink fins so that the heat generated by the resistor body (1) can be conducted to the heat sink fins. The mechanical connection structure includes a connection groove (6) formed on the resistor body (1) and a connection protrusion (5) provided on the heat sink fins and adapted to the connection groove (6). The connection protrusion (5) is embedded in the connection groove (6) to realize the connection between the resistor body (1) and the heat sink fins, and the connection protrusion (5) and the connection groove (6) are interference fit.

2. A surface mount resistor with heat dissipation fins according to claim 1, characterized in that: The heat dissipation fins include a substrate (4) and a plurality of fins (2) disposed on the substrate (4). The plurality of fins (2) are parallel to each other and spaced apart. The substrate (4) and the resistor body (1) are connected by the mechanical connection structure.

3. A surface mount resistor with heat dissipation fins according to claim 2, characterized in that: The shape of the fin (2) is one of wavy, cuboid, trapezoidal or triangular.

4. A surface mount resistor with heat dissipation fins according to claim 1, characterized in that: The high thermal conductivity material is one of copper, aluminum, or aluminum alloy, and its surface is plated with tin or silver.

5. A surface mount resistor with heat dissipation fins according to claim 1, characterized in that: The surface of the resistor body (1) connected to the heat sink fins is provided with a thermally conductive coating.

6. A surface mount resistor with heat dissipation fins according to claim 1, characterized in that: The connecting groove (6) is a dovetail groove, and the connecting protrusion (5) is a dovetail protrusion adapted to the dovetail groove.

7. A surface mount resistor with heat dissipation fins according to claim 1, characterized in that: The mechanical connection structure also includes fixing holes (7) provided on the resistor body (1) and the heat sink fins. The resistor body (1) and the heat sink fins are fixedly connected by a fastener passing through the fixing hole (7). The fastener is a combination of bolts and nuts or a rivet.

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