Heat dissipation inductor, matcher and radio frequency energy transmission device

Abstract

The utility model relates to the technical field of radio frequency power amplifiers, and discloses a heat dissipation inductor, a matcher and a radio frequency energy transmission device.The heat dissipation inductor is of a hollow tube structure and comprises a first sub-inductor, a connecting section and a second sub-inductor which are communicated in sequence, and the extending ends of the first sub-inductor and the second sub-inductor are used for being grounded respectively; the first end of the heat dissipation inductor is a cooling liquid input port, and the second end of the heat dissipation inductor is a cooling liquid output port. According to the utility model, the physical structure characteristics of the air core inductor can be fully utilized, heat generated by the coil due to current passing can be rapidly taken away by liquid in a limited space, cooling liquid is directly contacted with the hollow pipe structure, efficient heat dissipation is realized, a heat dissipation system occupying space does not need to be additionally arranged, the size and weight of equipment are reduced, and the cost is reduced. The equipment cost is reduced, and the reliability and stability of the matcher are ensured.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency power amplifier technology, specifically to a heat dissipation inductor, a matching circuit, and a radio frequency energy transmission device. Background Technology

[0002] Radio frequency (RF) power supplies can excite gases to generate plasma, which can then be used for vacuum deposition, etching, and other processes using ion beam sputtering. Since the impedance of the load within the ion chamber changes linearly with time and changes in the chamber's environmental parameters, directly connecting the RF power supply to the load will inevitably lead to impedance mismatch and high-power reflection, resulting in insufficient load capacity and overheating of the RF power supply. Therefore, an automatically adjusting matching circuit needs to be connected in series between the RF power supply and the load. For RF frequencies such as 13.56 MHz, 27 MHz, 40 MHz, and 60 MHz, the matching network of the matching circuit converts the load impedance to a standard 50 ohms to ensure the RF power supply operates efficiently and normally.

[0003] The most common matching circuit is an LC matching network composed of inductors and capacitors. By appropriately selecting or adjusting the values ​​of the inductors and capacitors, and the corresponding connection methods (such as L-type, T-type, π-type, etc.), the impedance of the load is transformed to match the output impedance of the power supply. However, in the operation of the matching circuit, the inductor is a component that operates based on the principle of electromagnetic induction. When current flows through the inductor, a magnetic field is generated around it. Changes in the magnetic field cause energy loss inside the inductor, which ultimately manifests as heat. If the heat generated by the inductor cannot be dissipated in time, the inductor temperature will rise, affecting its performance or even causing damage. In existing technologies, a dedicated cooling system is usually used to dissipate heat from the inductor, but this suffers from high cost, low efficiency, and long processing time. Utility Model Content

[0004] In view of this, the present invention provides a heat dissipation inductor, a matching circuit, and a radio frequency energy transmission device to solve the problems of high cost, low efficiency, and long time consumption of the matching circuit heat dissipation system.

[0005] In a first aspect, this utility model provides a heat dissipation inductor, which is a hollow tube structure, comprising: a first sub-inductor, a connecting section, and a second sub-inductor connected in sequence, wherein the extension ends of the first sub-inductor and the second sub-inductor are respectively used for grounding; the extension end of the first sub-inductor is the inlet of the cooling liquid, and the cooling end of the second sub-inductor is the outlet of the cooling liquid.

[0006] The heat dissipation inductor provided by this utility model adopts a hollow tube structure, with the first end being the inlet of the cooling liquid and the second end being the outlet of the cooling liquid. It can make full use of the physical structural characteristics of the hollow inductor, and use the liquid to quickly remove the heat generated by the current passing through the coil in a limited space. The cooling liquid is in direct contact with the hollow tube structure, achieving efficient heat dissipation. There is no need to deploy an additional heat dissipation system that occupies space, reducing the size and weight of the equipment, lowering the cost of the equipment, and ensuring the reliability and stability of the matching device.

[0007] In one alternative implementation, the first and second sub-inductors are symmetrically distributed. This arrangement generates a relatively uniform magnetic field within the space where the first and second sub-inductors interact. The symmetrical distribution of the first and second sub-inductors also facilitates uniform heat dissipation. When the sub-inductors operate, they generate heat; the symmetrical distribution allows the heat to spread more evenly in the surrounding space, preventing localized overheating. This helps extend the lifespan of the inductors and surrounding electronic components, improving the stability and reliability of the entire system.

[0008] In one alternative implementation, the first and second sub-inductors extend in the same direction, but their helical directions are opposite. The opposite helical directions of the first and second sub-inductors mean that they generate magnetic fields in opposite directions. Their identical extension directions ensure a good spatial correspondence. The opposite helical directions of the sub-inductors can affect their self-inductance and mutual inductance to some extent. By rationally designing the number of turns, wire diameter, and other parameters of the two sub-inductors, the equivalent inductance value of the entire inductor system can be flexibly adjusted.

[0009] In one optional embodiment, grounding connection pieces are respectively provided on the mutually distant sidewalls of the first sub-inductor and the second sub-inductor. When the first and second sub-inductors are operating, they generate a certain electromagnetic field. Providing grounding connection pieces on their mutually distant sidewalls allows the induced charge generated by the inductors to be promptly conducted to the ground.

[0010] This invention, through the combination of a heat-dissipating inductor and an adjustable capacitor, can form an LC filter unit at the input and output ends, thereby adjusting the impedance at the input and output ends respectively. This adaptively changes the impedance characteristics of the entire matching network, achieving better impedance matching, reducing signal reflection, improving power transmission efficiency, ensuring that the signal can be effectively transmitted from the signal source to the load, achieving optimal impedance matching between the load and the power supply, adapting to various different working scenarios and application requirements, and improving the versatility and applicability of the matching device.

[0011] Secondly, the present invention provides a matching device, comprising: the heat dissipation inductor described in the first aspect above.

[0012] In one alternative implementation, a first connecting plate is provided, and the connecting segment of the heat dissipation inductor is attached to the first connecting plate.

[0013] In one alternative embodiment, a second connecting plate is provided parallel to and spaced apart from the side of the first connecting plate that is away from the heat dissipation inductor, and a capacitor is connected between the first connecting plate and the second connecting plate.

[0014] In one alternative implementation, the capacitor includes an adjustable capacitor and a non-adjustable capacitor arranged in parallel.

[0015] The matching device provided by this utility model, by designing the heat dissipation inductor into two segments with opposite directions, can ensure that the temperature is kept low during operation, avoid performance degradation due to overheating, and ensure that the matching device can operate stably and reliably under various operating conditions. At the same time, it achieves the effect of mutual cancellation of the generated magnetic fields and realizes co-coupling, which significantly reduces the overall inductance compared with the same-direction winding, thereby reducing electromagnetic interference and common-mode interference, improving the electromagnetic compatibility of the device, and improving the performance stability and reliability of the entire matching device. In addition, the matching device does not require an additional complex heat dissipation system, which can reduce design costs and device size.

[0016] Thirdly, this utility model embodiment provides a radio frequency energy transmission device, including: a radio frequency power supply for emitting radio frequency signals; and the aforementioned matching device, wherein the input terminal of the matching device is connected to the radio frequency power supply and the output terminal is connected to a load, for matching the output impedance of the radio frequency power supply and the input impedance of the load.

[0017] Since the radio frequency power transfer device includes a matching unit and has the same effect as the matching unit, it will not be elaborated here. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a circuit diagram of a heat dissipation inductor according to an embodiment of the present utility model;

[0020] Figure 2 This is a three-dimensional structural diagram of a matcher according to an embodiment of the present utility model;

[0021] Figure 3 for Figure 2 A perspective view of the other side of the matcher shown;

[0022] Figure 4 A circuit diagram of a matching device provided for an embodiment of this utility model.

[0023] Figure label:

[0024] 1. First sub-inductor; 2. Second sub-inductor; 3. Connecting section; 4. Non-adjustable capacitor; 5. Adjustable capacitor; 6. Connecting piece; 7. First connecting plate; 8. Second connecting plate; 9. Input terminal; 10. Output terminal. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] In related technologies, inductor heat dissipation methods include: ① Natural heat dissipation, which dissipates heat through the inductor's own casing and the natural convection of the surrounding air. This method is suitable for inductors with lower power and less heat generation. ② Adding heat sinks: For higher power inductors, heat sinks are added to the inductor surface to increase the heat dissipation area and improve heat dissipation efficiency. Heat sinks are usually made of materials with good thermal conductivity, such as aluminum or copper. Through close contact with the inductor, the heat generated by the inductor is conducted to the heat sink, and then dissipated into the air by the heat sink. ③ Air cooling: In some applications with higher heat dissipation requirements, air cooling is used. A fan forces airflow to remove heat from the inductor and heat sink. This method can significantly improve heat dissipation and is suitable for high-power inductors. ④ Liquid cooling: In extreme cases, such as for ultra-high power inductors, liquid cooling technology is used. Heat is removed by the circulation of coolant around the inductor. Coolants usually have high specific heat capacity and thermal conductivity, enabling them to absorb and transfer heat more effectively. However, apart from natural heat dissipation, other methods all require additional heat dissipation devices, resulting in large equipment size and high cost. Therefore, this utility model embodiment provides a heat dissipation inductor that utilizes the physical structural characteristics of inductors to achieve rapid heat dissipation and reduce costs.

[0027] The following is combined Figures 1 to 4 The following describes embodiments of the present invention.

[0028] According to an embodiment of the present invention, a heat dissipation inductor is provided, which is a hollow tube structure, comprising: a first sub-inductor 1, a connecting section 3, and a second sub-inductor 2 connected in sequence, wherein the extension ends of the first sub-inductor 1 and the second sub-inductor 2 are respectively used for grounding; the extension end of the first sub-inductor 1 is the input port of the cooling liquid, and the cooling end of the second sub-inductor 2 is the output port of the cooling liquid.

[0029] Specifically, in this embodiment of the invention, an inductor is generally referred to as an inductor, which is essentially a coil. When current flows through the inductor coil, a magnetic field is generated around it, and energy is stored in the magnetic field. When the current changes, the magnetic field also changes accordingly. From a physical structure perspective, an inductor is usually made by winding wire into a coil. The number of turns, shape, size, and whether there is a magnetic core all affect the magnitude of the inductance. An air-core inductor is an inductor without a magnetic core in the middle of the coil. Because there is no magnetic core, an air-core inductor does not have hysteresis loss or eddy current loss. Therefore, in high-frequency applications, air-core inductors have relatively low energy loss and higher efficiency. The inductance of an air-core inductor is relatively stable, and parasitic parameters such as parasitic capacitance and parasitic resistance are relatively small, resulting in a generally smaller inductance. This embodiment utilizes the physical structure of an air-core inductor, such as... Figure 2 As shown, one end of the hollow inductor serves as the input port for the coolant, and the other end serves as the output port, allowing the coolant to directly contact the hollow inductor for heat dissipation. The coolant can be cold water or other liquids with cooling effects; no specific limitation is made here.

[0030] In some alternative implementations, thermal inductors can be applied to various circuits that require handling high current and high power, such as switching power supplies, automotive electronics, industrial automation equipment, and server power supplies. In switching power supplies, thermal inductors serve as important energy storage and filtering components, effectively addressing the issue of significant heat generation during operation and ensuring normal functioning.

[0031] The heat dissipation inductor provided in this embodiment adopts a hollow tube structure, with the first end being the inlet of the cooling liquid and the second end being the outlet of the cooling liquid. It can make full use of the physical structural characteristics of the hollow inductor and use the liquid to quickly remove the heat generated by the current passing through the coil in a limited space, thereby achieving efficient heat dissipation. There is no need to deploy an additional space-consuming heat dissipation system, which reduces the size and weight of the equipment, lowers the cost of the equipment, and ensures the reliability and stability of the matching device.

[0032] like Figure 2As shown, in the heat dissipation inductor provided in this embodiment, the first sub-inductor 1 and the second sub-inductor 2 are symmetrically distributed. This arrangement generates a relatively uniform magnetic field within the space where the first sub-inductor 1 and the second sub-inductor 2 work together. The symmetrical distribution of the first sub-inductor 1 and the second sub-inductor 2 also facilitates the uniform dissipation of heat. When the sub-inductors operate, they generate heat; the symmetrical distribution allows the heat to diffuse more evenly in the surrounding space, preventing localized overheating. This helps extend the lifespan of the inductor and surrounding electronic components, improving the stability and reliability of the entire system.

[0033] Alternatively, as an alternative implementation, the first sub-inductor 1 and the second sub-inductor 2 can adopt an asymmetrical staggered layout. Specifically, the magnetic core axes of the two sub-inductors are at a certain angle, and a high thermal conductivity insulating material is embedded between the winding layers. This high thermal conductivity insulating material forms axial and radial heat dissipation channels between the windings, directionally conducting heat to the heat sink around the inductor. The heat sink evenly distributes the heat to the surrounding space, avoiding localized heat concentration. The asymmetrical layout can adapt to irregularly shaped circuit boards or the internal space of compact devices, while the staggered structure reduces the electromagnetic interference radiation area, further improving system reliability.

[0034] like Figure 2 As shown, in the heat dissipation inductor provided in this embodiment, the first sub-inductor 1 and the second sub-inductor 2 extend in the same direction, but their spiral directions are opposite. The opposite spiral directions of the first sub-inductor 1 and the second sub-inductor 2 mean that they generate magnetic fields in opposite directions. However, their identical extension directions ensure a good spatial correspondence. The opposite spiral directions of the sub-inductors can affect their self-inductance and mutual inductance to some extent. By rationally designing the number of turns, wire diameter, and other parameters of the two sub-inductors, the equivalent inductance value of the entire inductor system can be flexibly adjusted.

[0035] Grounding connection pieces 6 are respectively provided on the mutually distant sidewalls of the first sub-inductor 1 and the second sub-inductor 2. When the first sub-inductor 1 and the second sub-inductor 2 are working, a certain electromagnetic field is generated. The grounding connection pieces 6 on their mutually distant sidewalls can promptly conduct the induced charge generated by the inductors to the ground.

[0036] According to an embodiment of the present invention, another aspect provides a matching device, comprising: a heat-dissipating inductor, a first connecting plate 7, wherein a connecting segment 3 of the heat-dissipating inductor is attached to the first connecting plate 7. A second connecting plate 8 is provided parallel to and spaced apart on the side of the first connecting plate 7 facing away from the heat-dissipating inductor, and a capacitor is connected between the first connecting plate 7 and the second connecting plate 8. Figure 3 As shown, in this embodiment, the first connecting plate 7 has an access terminal 9 for electrical connection, and the second connecting plate 8 has an output terminal 10 for electrical connection.

[0037] like Figure 3 As shown, in this embodiment, the capacitor includes an adjustable capacitor 5 and a non-adjustable capacitor 4 arranged in parallel.

[0038] Specifically, in this embodiment of the invention, the applicable operating frequency of the matching device is 13MHz, and the maximum operating current is 120A, but it is not limited thereto. Figure 4 As shown, the matching network structure inside the matching circuit is an LC matching network composed of inductors and capacitors. The heat-dissipating inductor is symmetrically divided into two segments: a first sub-inductor 1 and a second sub-inductor 2 connected together. The first sub-inductor 1 and the second sub-inductor 2 have opposite spiral directions, i.e., they rotate in opposite directions. The two inductor segments rotating in opposite directions generate opposite magnetic fields, and their inductance values ​​partially cancel each other out. This allows for flexible adjustment of the inductance value, achieving better impedance matching. The magnetic fields generated by the two inductor segments rotating in opposite directions cancel each other out, greatly reducing the outward radiated magnetic field and effectively suppressing electromagnetic interference. Furthermore, using a reverse-winding inductor structure can reduce the size and weight of the inductor while achieving the same inductance performance.

[0039] In some alternative implementations, such as Figure 4As shown, the capacitors in the matching network structure inside the matching circuit include a first adjustable capacitor Cp (parallel capacitor) and a second adjustable capacitor Cs (series capacitor), where the first adjustable capacitor Cp is a parallel capacitor and the second adjustable capacitor Cs is a series capacitor. When the capacitance value is small and the impedance is large, the parallel impedance between the capacitor and the parallel resistor will be significantly higher than the series resistance. In this case, the instrument should be set to the first adjustable capacitor Cp mode when measuring the capacitance. For example, in some impedance analysis instruments, the first adjustable capacitor Cp setting is selected for more accurate capacitance measurement when the capacitance impedance is greater than 10kΩ. When the capacitance value is large and the impedance is small, the parallel impedance between the capacitor and the parallel resistor is relatively insignificant. In this case, the instrument will use the second adjustable capacitor Cs setting to measure the capacitance. Generally, for capacitance impedance values ​​less than 10Ω, the rule of thumb is to use the second adjustable capacitor Cs mode for measurement. Under the above configuration, the connection segment 3 (i.e., the middle part of the heat dissipation inductor) of the first sub-inductor 1 and the second sub-inductor 2 is connected to the first terminal of the first adjustable capacitor Cp and the first terminal of the second adjustable capacitor Cs, respectively, while the other terminals of the first sub-inductor 1 and the second sub-inductor 2 are grounded. Therefore, the heat dissipation inductor is a grounded inductor. Thus, the first sub-inductor 1 and the first adjustable capacitor Cp constitute the first filter unit at the input terminal, and the second sub-inductor 2 and the second adjustable capacitor Cs constitute the second filter unit at the output terminal 10. This allows for adjustment of the impedance at the input terminal and the output terminal 10, adaptively changing the impedance characteristics of the entire matching network, achieving better impedance matching, reducing signal reflection, improving power transmission efficiency, ensuring that the signal can be effectively transmitted from the signal source to the load, achieving optimal impedance matching between the load and the power supply, adapting to various different working scenarios and application requirements, and improving the versatility and applicability of the matching device. In matching devices for RF or other high-frequency circuits, a low-impedance return path for the signal is required. Grounding an inductor helps create a low-impedance loop, allowing signals to transmit more smoothly, reducing signal reflection and loss, and facilitating good impedance matching between the power supply and load, thus improving power transmission efficiency. Furthermore, common-mode interference signals can appear on both signal lines and ground lines in a circuit. When an inductor is grounded, it presents a high impedance to common-mode interference signals, thereby suppressing their propagation. Therefore, grounding an inductor reduces the intensity of magnetic field radiation, lowering interference to surrounding circuits. It also provides some shielding against external electromagnetic interference, enhancing the circuit's anti-interference capability.

[0040] In some alternative implementations, such as Figure 4 As shown, the second end of the first adjustable capacitor Cp is connected to the first end of an inductor L3, and the second end of the second adjustable capacitor Cs is connected to the first end of an inductor L4.

[0041] In one optional implementation, the two ends of the non-adjustable capacitor 4 are connected in parallel with the two ends of the second adjustable capacitor Cs. The aforementioned inductor L3 and inductor L4 are relatively small inductors compared to the heat-dissipating inductor. By combining various inductors and capacitors, the number of adjustable parameters of the matching circuit can be increased, forming a flexibly adjustable LC network. This adaptively changes the impedance characteristics of the entire matching network, achieving optimal impedance matching for the load and power supply, thereby adapting to various different working scenarios and application requirements, and improving the versatility and applicability of the matching circuit. Figure 2 As shown, the non-adjustable capacitor 4 and the second adjustable capacitor Cs are connected and fixed by a copper sheet. The non-adjustable capacitor 4 can also be set as multiple small capacitors, which is not limited here.

[0042] In some alternative implementations, the matcher also includes an adjustment device for adjusting the parameters of the adjustable capacitor 5 in practical applications. In practice, this can be achieved through manual adjustment or automatic adjustment based on feedback control; no limitation is made here.

[0043] The matching device provided in this embodiment, through the cooperation of the heat dissipation inductor and the adjustable capacitor 5, can flexibly adjust the impedance characteristics of the matching device according to different working requirements on the basis of the stable operation of the heat dissipation inductor. This ensures that the temperature is kept low during operation, avoids performance degradation due to overheating, and ensures that the matching device can operate stably and reliably under various working conditions. This improves the overall performance stability and reliability of the matching device. In addition, the matching device does not require an additional complex heat dissipation system, which can reduce design costs and device size.

[0044] According to an embodiment of the present invention, another aspect provides a radio frequency energy transmission device, comprising: a radio frequency power supply for emitting radio frequency signals; Figures 1 to 4 The matching device shown has its input terminal 9 connected to the RF power supply and its output terminal 10 connected to the load. It is used to match the output impedance of the RF power supply and the input impedance of the load.

[0045] Specifically, in the embodiments of this utility model, such as Figure 1 As shown, the RF input of the matching unit's internal network structure is the input terminal, connected to the RF power supply, and the RF output is the output terminal 10, connected to the load, as shown. Figure 2As shown, the RF power supply is connected to the copper plate corresponding to inductor L3, and the load is connected to the copper plate corresponding to inductor L4. The RF power supply is the signal generator, responsible for converting DC power into high-frequency AC signals within the RF range. When the RF power supply emits an RF signal, the matching circuit adjusts the parameters of the adjustable capacitor 5 to achieve impedance matching between the RF power supply and the load, thereby minimizing reflected power, improving power transmission efficiency, and allowing more power to be absorbed and utilized by the load. During the operation of the matching circuit, the inductors in the internal network structure of the matching circuit generate a magnetic field around them when current flows. Changes in the magnetic field cause energy losses within the inductor, mainly including copper losses (heat generated due to the resistance of the wires when current flows through the inductor coil) and iron losses (energy losses caused by the hysteresis and eddy current phenomena of the magnetic core in inductors with magnetic cores). These losses ultimately manifest as heat. At this time, the cooling liquid in the heat dissipation inductor is circulated by driving the circuit to reduce the inductor temperature.

[0046] The radio frequency energy transmission device provided in this embodiment can be applied to semiconductor manufacturing equipment, medical equipment, radio frequency heating systems and other scenarios. By ensuring the stable operation of the matching device, it can achieve efficient energy transmission and good impedance matching between the radio frequency power supply and the load, thereby improving system performance and stability.

[0047] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.

Claims

1. A heat-dissipating inductor, characterized in that, It has a hollow tube structure, including: a first sub-inductor (1), a connecting section (3), and a second sub-inductor (2) connected in sequence, and the extension ends of the first sub-inductor (1) and the second sub-inductor (2) are respectively used for grounding; The extension end of the first sub-inductor (1) is the inlet of the cooling liquid, and the cooling end of the second sub-inductor (2) is the outlet of the cooling liquid.

2. The heat dissipation inductor according to claim 1, characterized in that, The first sub-inductor (1) and the second sub-inductor (2) are symmetrically distributed.

3. The heat dissipation inductor according to claim 2, characterized in that, The first sub-inductor (1) and the second sub-inductor (2) extend in the same direction, and the first sub-inductor (1) and the second sub-inductor (2) have opposite spiral directions.

4. The heat dissipation inductor according to claim 3, characterized in that, On the mutually distant sidewalls of the first sub-inductor (1) and the second sub-inductor (2), there are respectively a connecting piece (6) for grounding.

5. The heat dissipation inductor according to any one of claims 1-4, characterized in that, The connecting segment (3) has a U-shaped structure.

6. A matcher, characterized in that, include: The heat dissipation inductor according to any one of claims 1-4.

7. The matcher according to claim 6, characterized in that, Also includes: The first connecting plate (7) is attached to the connecting segment (3) of the heat dissipation inductor.

8. The matcher according to claim 7, characterized in that, A second connecting plate (8) is provided parallel to the side of the first connecting plate (7) facing away from the heat dissipation inductor, and a capacitor is connected between the first connecting plate (7) and the second connecting plate (8).

9. The matcher according to claim 8, characterized in that, The capacitors include adjustable capacitors (5) and non-adjustable capacitors (4) arranged in parallel.

10. A radio frequency power transmission device, characterized in that, include: Radio frequency (RF) power supply, used to emit RF signals; The matching device according to any one of claims 6-9, wherein the input terminal of the matching device is connected to the radio frequency power supply and the output terminal (10) is connected to the load, for matching the output impedance of the radio frequency power supply and the input impedance of the load.

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