Conductive part structure fixedly connected with silver strip
By combining silver alloy conductors with copper alloy substrates, the shortcomings of traditional conductive components in terms of conductivity, mechanical strength, and cost control are solved, achieving efficient and stable current transmission and mechanical stability, thus meeting the compact requirements of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN DEWO ELECTRONICS TECH CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-05
AI Technical Summary
Traditional conductive components have shortcomings in terms of high conductivity, mechanical strength, cost control, structural design, and space layout, making it difficult to meet the compactness and integration requirements of modern electronic devices.
The second conductor, made of silver or silver alloy, is bonded to the base material made of copper alloy by welding, riveting, screwing or pressing. It is designed as a T-shaped plate structure with multiple columnar mounting parts and an anti-oxidation coating to increase the contact area, optimize stress distribution, and adapt to various installation environments.
It achieves efficient and stable current transmission, reduces contact resistance, improves mechanical stability and adaptability, reduces production costs, and meets the miniaturization requirements of electronic devices.
Smart Images

Figure CN224203970U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of conductive components technology, and in particular discloses a structure for fixing a silver strip conductive component. Background Technology
[0002] In various electronic devices and electrical connection systems, conductive components, as key parts for current transmission, play a decisive role in the stability and reliability of the system. Traditional conductive components suffer from several shortcomings in design and material application: some components use a single material, making it difficult to ensure high conductivity while simultaneously controlling cost and mechanical strength; or, due to a lack of effective protection, they are susceptible to oxidation, corrosion, and wear during use, leading to increased contact resistance and decreased conductivity. Furthermore, the structural design of traditional conductive components often suffers from small contact areas and uneven stress distribution, affecting not only conductivity efficiency but also susceptibility to structural damage from external forces. In addition, existing conductive components lack flexibility in spatial layout, making it difficult to adapt to the compact and integrated requirements of different devices.
[0003] To address the aforementioned issues, a novel fixed-connection silver strip conductive component structure has emerged. Through innovative material combinations and structural design, it effectively overcomes the performance bottlenecks of traditional conductive components. Its application in a sliding-slot switch structure significantly improves the switch's conductivity, mechanical stability, and spatial adaptability, providing a new solution for the optimization and upgrading of electrical connection systems. Utility Model Content
[0004] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this utility model is to provide a structure for fixing silver strip conductive components.
[0005] To achieve the above objectives, the present invention provides a fixed silver strip conductive component structure, comprising a substrate and a second conductive body disposed on the substrate. The second conductive body is used to make contact with two external conductive contacts, and the two conductive contacts are connected through the second conductive body. The second conductive body is a sheet structure made of silver or a silver alloy.
[0006] Furthermore, the substrate has a T-shaped plate structure, and the substrate includes a main board and a mounting part protruding from one side of the self board. The mounting part is used to mount the substrate to the external insulating structure, and the second conductor is located on the side of the main board away from the mounting part.
[0007] Furthermore, the motherboard body has outwardly convex chamfered portions at both ends on the side away from the mounting portion, and the second conductor is located between the outwardly convex chamfered portions at both ends of the motherboard body.
[0008] Furthermore, the substrate is a first conductor, the conductivity of which is lower than that of the second conductor, and the first conductor is made of a copper alloy.
[0009] Furthermore, the substrate and the second conductor are fixed together by one of welding, riveting, screwing or pressing.
[0010] Furthermore, the mounting part has a columnar structure, and the number of mounting parts is set to multiple, with the multiple mounting parts arranged in a linear array on the base.
[0011] Furthermore, the thickness of the second conductor is 0.5-2 mm.
[0012] Furthermore, the end of the mounting portion away from the main board is formed into an arc portion.
[0013] Furthermore, an oil film layer is provided on the outer side of the second conductor and the outer side of the substrate to facilitate lubrication.
[0014] Furthermore, the substrate is provided with an uneven structure layer, one side of the second conductor is used to press onto the uneven structure layer, and the other side of the second conductor is used for two conductive contacts to conduct to the outside.
[0015] The beneficial effects of this utility model are:
[0016] (1) High efficiency and stable contact: The second conductor is made of silver or silver-based alloy and plated with an anti-oxidation layer. Combined with the conductive plane design formed by the first flat part, it greatly increases the contact area with the conductive contact, reduces the contact resistance, realizes efficient and stable current transmission, reduces power loss and heat generation, and ensures reliable transmission of circuit signals under frequent switching operations.
[0017] (2) Stable and durable structure: The T-shaped plate-shaped base combined with the multi-column linear array mounting part disperses the force and enhances the installation stability; the arc design of the first plane part and the shielding structure of the second conductor part optimize the stress distribution and resist external impact; multiple fixing methods ensure a firm connection and effectively improve the mechanical strength and service life of the structure.
[0018] (3) Excellent adaptability and economy: Differentiated selection of first and second conductor materials ensures key conductivity performance while controlling costs; regular structural design adapts to various installation environments and conductive contacts; rounded end treatment of the mounting part facilitates assembly and reduces wear; compact layout facilitates switch miniaturization and meets the needs of modern electronic products. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of a fixed silver strip conductive component according to the present invention.
[0020] Figure 2 This is an exploded view of the present invention;
[0021] Figure 3 This is a schematic diagram of the structure of the antioxidant coating and the second conductor of this utility model.
[0022] The reference numerals in the accompanying drawings include: 1, substrate; 10, first conductor; 11, mounting portion; 12, arc portion; 13, outwardly convex arc chamfer portion; 14, concave-convex structure layer; 2, second conductor; 3, anti-oxidation plating layer. Detailed Implementation
[0023] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.
[0024] Please see Figures 1 to 3 As shown, the present invention provides a fixed silver strip conductive component structure, including a substrate 1 and a second conductor 2 disposed on the substrate 1. The second conductor 2 is used to make contact with two external conductive contacts, and the two conductive contacts are connected through the second conductor 2. The second conductor 2 is a sheet structure made of silver or silver alloy.
[0025] In practical use, the second conductor 2 is made of silver or a silver alloy. Silver and silver alloys have excellent conductivity, which effectively reduces resistance and minimizes power loss during transmission, ensuring smooth current flow between the two external conductive contacts and guaranteeing stable circuit operation. The second conductor 2 makes contact with the two external conductive contacts, forming a relatively stable electrical connection, ensuring reliable conductivity, and reducing the risk of circuit failure due to poor contact. This structure mainly consists of a base 1 and the second conductor 2 mounted on the base 1. The overall structure is relatively simple, requiring no complex processes or equipment during manufacturing, which helps reduce production costs and improve production efficiency.
[0026] This structure is applicable to various scenarios requiring two conductive contacts to conduct, offering a wide range of applications. For different electronic devices or circuit systems, as long as they meet their size and electrical parameter requirements, this fixed silver strip conductive component structure can be used. Silver and silver alloys possess good chemical stability and are not easily oxidized or corroded in normal environments, maintaining excellent conductivity over a long period. This ensures stable operation of the conductive component structure in different operating environments, extending the lifespan of the equipment. The second conductor 2 adopts a sheet structure. This shape increases the contact area with the conductive contacts, further improving conductivity and connection stability. Simultaneously, the sheet structure is relatively thin and light, occupying less space, which is beneficial for the miniaturization and lightweight design of electronic devices.
[0027] Specifically, the substrate 1 has a T-shaped plate structure, and the substrate 1 includes a main board and a mounting part 11 protruding from one side of the self board. The mounting part 11 is used to mount the substrate 1 to the external insulating structure, and the second conductor 2 is located on the side of the main board away from the mounting part 11.
[0028] In practical use, the mounting part 11 of the base 1 can be used to install the base 1 onto an external insulating structure. The T-shaped plate structure design makes the installation operation relatively simple. The presence of the mounting part 11 provides a clear installation position and method, which can firmly fix the base 1 onto the insulator, ensuring the stability of the entire conductive component structure during use and preventing loosening or displacement, thereby ensuring stable conductivity. The second conductor 2 is located on the side of the main body away from the mounting part 11. This layout can effectively utilize space, separating the conductor from the mounting part 11 and avoiding mutual interference. When installed in external equipment, it is beneficial for reasonable space planning with other components, facilitating overall assembly and wiring, and improving the compactness and rationality of the internal structure of the equipment.
[0029] The base 1 is mounted on the external insulating structure via the mounting part 11. Since the second conductor 2 is relatively independent of the mounting part 11, and the mounting part 11 provides a certain degree of isolation, the insulation effect between the conductor and the insulator is better, effectively preventing current leakage to the insulator or other non-conductive components, thus improving the safety and electrical performance of the entire device. The T-shaped plate structure of the base 1 and the independently set second conductor 2 facilitate the disassembly, inspection, and replacement of the conductive components during equipment maintenance or in case of malfunction. If the second conductor 2 is damaged, only that part needs to be replaced, without replacing the entire base 1, reducing maintenance costs and difficulty. The T-shaped plate structure itself has a certain mechanical strength, and compared to other simple plate structures, it can better maintain its shape and structural integrity under external forces, ensuring that the contact between the second conductor 2 and the external conductive contacts is not affected, thereby maintaining good conductivity.
[0030] Specifically, the motherboard body has outwardly convex arc chamfered portions 13 at both ends on the side away from the mounting portion 11, and the second conductor 2 is located between the outwardly convex arc chamfered portions 13 at both ends of the motherboard body.
[0031] In practical use, the convex chamfered portion 13 effectively prevents the sharp edges at both ends of the main board from scratching or damaging other components (such as conductive contacts, insulators, or other electronic components) that come into contact with it. During installation and use, this reduces the risks associated with sharp edges, improving the overall safety and reliability of the device, while also protecting the second conductor 2 from accidental damage. The curved chamfer structure helps optimize the distribution of the electric field at the ends of the main board, reducing electric field concentration. This plays a positive role in preventing electrical breakdown and arcing caused by excessively high local electric field strength, improving the electrical performance and stability of the conductive components under high voltage or high electric field environments.
[0032] The convex chamfered portion 13 serves as a guide during assembly, making it easier for the main board to accurately align and install with other components. When installing conductive parts into the equipment, the chamfered portion guides them smoothly into their designated positions, improving assembly efficiency and accuracy. It also ensures that the second conductor 2 can accurately contact and conduct electricity with external conductive contacts. Compared to right-angle edges, the convex chamfered portion 13 effectively alleviates stress concentration at the ends of the main board when subjected to external forces. When the equipment is affected by vibration, impact, or other external forces, the chamfered portion disperses stress, reducing the likelihood of cracks or damage to the main board and extending the service life of the conductive component structure.
[0033] The second conductor 2 is located between the two convex chamfered portions 13, which provides a clear positional definition for the second conductor 2, making it less prone to displacement or shifting during use. This ensures stable contact between the second conductor 2 and external conductive contacts, thereby guaranteeing the reliability and consistency of conductivity.
[0034] Specifically, the substrate 1 is a first conductor 10, the conductivity of the first conductor 10 is lower than that of the second conductor 2, and the first conductor 10 is made of copper alloy.
[0035] In practical applications, copper alloys are relatively cheaper than silver or silver alloys. Using a copper alloy-made first conductor 10 as the base 1, while only using silver or silver alloys to make the second conductor 2, effectively reduces raw material costs through reasonable material selection while ensuring overall conductivity. In large-scale production, this significantly reduces production costs and enhances the product's market competitiveness. Copper alloys typically possess good mechanical properties, such as high strength, hardness, and toughness. As the base material, the copper alloy-made first conductor 10 provides excellent mechanical support for the entire conductive structure, maintaining its integrity and stability under external forces (such as compression during installation or vibration during use), protecting the second conductor 2 from damage, and thus indirectly ensuring stable conductivity.
[0036] Although the conductivity of the first conductor 10 (copper alloy) is lower than that of the second conductor 2 (silver or silver alloy), in this structure, the first conductor 10 mainly serves as the support for the base 1 and provides some conductivity, while the second conductor 2 undertakes the main task of conducting electricity to the external conductive contacts. This combination satisfies the structural requirements for conductivity while fully utilizing the advantages of different materials, enabling the entire conductive structure to operate efficiently. For example, in applications requiring high conductivity but also a certain level of mechanical strength, this design can achieve a balance between performance and function.
[0037] Copper alloys exhibit excellent machinability, facilitating various processing techniques such as forging, stamping, and machining. This simplifies and streamlines the manufacturing process of the substrate 1, enabling the rapid production of substrate 1 structures that meet design requirements, thereby increasing production efficiency. It also facilitates subsequent surface treatments and connections to the second conductor 2. Copper alloys are widely used in the electronics field and exhibit good compatibility with other common electronic materials (such as various insulating materials and semiconductor materials). When integrating this conductive component structure into complex electronic devices, the copper alloy substrate 1 allows for better integration with other components, reducing potential failure risks due to material compatibility issues and improving the overall reliability of the equipment.
[0038] Specifically, the substrate 1 and the second conductor 2 are fixed together by one of welding, riveting, screwing or pressing.
[0039] In practical applications, welding creates a strong and continuous metallic connection between the base material 1 and the second conductor 2, with almost no additional contact resistance, ensuring excellent conductivity. Current can flow smoothly between the two, ensuring the efficient operation of the entire conductive component. The welded connection is relatively compact, without adding excessive volume or weight, which is beneficial for the miniaturization and lightweight design of electronic devices, especially suitable for applications with high space requirements. Welding creates a sealed connection, effectively preventing external moisture, dust, and other impurities from entering the connection area, avoiding a decrease in conductivity due to corrosion or contamination, and improving the stability and lifespan of the conductive component structure.
[0040] Riveting provides high mechanical strength for the base 1 and the second conductor 2, making them less prone to separation under external forces (such as vibration and impact), thus ensuring the reliability of the conductive component structure. Riveting has significant advantages in environments requiring high mechanical stress. Screw connection is a detachable connection method, allowing for easy separation of the base 1 and the second conductor 2 during equipment maintenance, repair, or upgrades. This facilitates inspection, replacement, or adjustment of individual components, improving equipment maintainability.
[0041] The crimping process is relatively fast, enabling the connection of the substrate 1 and the second conductor 2 to be completed in a short time, thus improving production efficiency and meeting the needs of large-scale production. Crimping ensures a tight contact between the substrate 1 and the second conductor 2, effectively reducing contact resistance and guaranteeing good conductivity. Simultaneously, the crimped connection also possesses a certain degree of mechanical strength, meeting the requirements of general application scenarios. During the crimping process, there is minimal damage to the materials of the substrate 1 and the second conductor 2, avoiding the high temperatures that can affect material properties as in welding. This helps maintain the original properties of the materials, ensuring the stability and reliability of the conductive component structure.
[0042] Specifically, the mounting part 11 has a columnar structure, and the number of mounting parts 11 is set to multiple, with the multiple mounting parts 11 arranged in a linear array on the base 1.
[0043] In practical use, multiple columnar mounting parts 11 are arranged in a linear array, providing multiple mounting points. Compared to a single or few mounting parts 11, this layout can more evenly distribute external forces, effectively preventing the base 1 from shaking, shifting, or deforming after installation. This ensures the conductive component structure is firmly mounted on the external insulating structure, guaranteeing the stability of the contact between the second conductor 2 and the external conductive contacts, thereby ensuring reliable conductivity. The linear array arrangement makes the installation process more orderly and standardized, allowing for operation according to a certain sequence and pattern, reducing installation difficulty and improving efficiency. Furthermore, for installers, this regular layout makes alignment and positioning easier, reducing installation errors and ensuring installation quality.
[0044] The arrangement of multiple mounting parts 11 can be selected and adjusted according to different installation requirements and the characteristics of the external insulation structure. For example, when installing on insulators of different sizes or shapes, a suitable number and position of mounting parts 11 can be selected for installation, increasing the adaptability of the conductive component structure in different application scenarios and expanding its application range. When the substrate 1 is subjected to external forces (such as vibration, impact, etc.), the multiple mounting parts 11 arranged in a linear array can distribute the stress more evenly to the external insulation structure, avoiding stress concentration on one or a few mounting points, thereby reducing the risk of damage to the mounting parts 11 and the substrate 1 due to stress concentration and extending the service life of the conductive component structure.
[0045] Specifically, the thickness of the second conductor 2 is 0.5-2 mm.
[0046] In practical applications, a thickness range of 0.5-2mm ensures that the second conductor 2 has sufficient conductive cross-sectional area. Within this thickness range, the second conductor 2, made of silver or a silver alloy, effectively reduces resistance, ensuring smooth current flow and meeting the conductivity requirements for conduction between two external conductive contacts. This reduces energy loss during power transmission and maintains stable circuit operation. With a thickness of 0.5-2mm, the second conductor 2 possesses sufficient mechanical strength, making it less prone to deformation or damage during contact with external conductive contacts and use, thus ensuring structural reliability. Simultaneously, this thickness also allows the second conductor 2 to exhibit a degree of flexibility, enabling appropriate deformation adjustment during installation or under slight external force, better conforming to the conductive contacts, enhancing contact tightness, and thereby improving conductivity.
[0047] For many electronic devices, internal space is often limited. A thickness of 0.5-2mm is relatively thin, allowing it to fit into confined installation spaces, facilitating layout and installation within the device, and promoting miniaturization and compact design. This prevents the second conductor 2 from taking up excessive space and affecting the installation and normal operation of other components. The second conductor 2 is made of silver or a silver alloy, which are relatively expensive materials. Controlling the thickness to 0.5-2mm, while ensuring conductivity and mechanical properties, allows for reasonable control of material usage, avoiding unnecessary increases in material costs due to excessive thickness. This achieves a better balance between cost and performance, improving the product's cost-effectiveness.
[0048] Specifically, the end of the mounting portion 11 away from the main body forms an arc-shaped portion 12.
[0049] In practical use, the presence of the arc portion 12 makes the end of the mounting portion 11 smoother, providing excellent guidance when installing the base 1 onto the external insulating structure. It allows for easier insertion into the corresponding mounting hole or groove, reducing friction and resistance caused by sharp ends during installation, lowering installation difficulty, improving installation efficiency, and preventing unnecessary damage to the insulating structure. During installation and use, the mounting portion 11 may be subjected to various external forces. The arc portion 12 at the end effectively disperses stress, preventing stress concentration at the end of the mounting portion 11. Stress concentration can easily lead to cracks or damage to the mounting portion 11, while the arc portion 12 design allows for a more even distribution of stress on the mounting portion 11, enhancing its structural strength and durability, thereby ensuring the stability of the entire conductive component structure.
[0050] When the mounting part 11 mates with the external insulation structure, the arc-shaped part 12 can better fit against the inner surface of the insulator, reducing the presence of gaps and air gaps. This reduces the risk of increased local electric field strength caused by air gaps, effectively preventing electrical breakdown and further improving the insulation performance between the conductive structure and the insulator, thus enhancing equipment safety. Inside the equipment, the arc-shaped part 12 at the end of the mounting part 11 can prevent scratching or damage to other adjacent components (such as wires, electronic components, etc.). During the assembly and operation of the equipment, the smooth end will not cause accidental damage to surrounding components, ensuring the integrity of all internal components and reducing the probability of equipment failure due to component damage.
[0051] Specifically, an oil film layer is provided on the outer side of the second conductor 2 and the outer side of the substrate 1 to facilitate lubrication.
[0052] In actual use, during installation or use, the second conductor 2 and the substrate 1 may move or come into contact with other components. The presence of the oil film layer can form a lubricating film between the contact surfaces, effectively reducing the coefficient of friction and decreasing frictional force. This makes the installation operation smoother, reduces component wear and damage caused by excessive friction, and extends the service life of the conductive structure and its mating components. For situations where the conductive structure needs to be installed in a specific position, the lubrication of the oil film layer makes the component easier to insert, align, and position. Installers do not need to apply excessive force to accurately install it in place, thereby improving assembly efficiency and saving installation time and labor costs.
[0053] The oil film layer can isolate the second conductor 2 and the substrate 1 from the external environment to a certain extent, reducing the erosion caused by moisture, oxygen, and corrosive gases in the air. This helps prevent oxidation and corrosion of the metal surface, maintaining the good performance of the conductor and the substrate 1, especially for the second conductor 2 made of silver or silver alloy, effectively maintaining its excellent conductivity. During equipment operation, the conductive structure may be subjected to dynamic loads such as vibration and impact. The oil film layer can buffer these external forces, reduce direct collisions and wear between components, lower the risk of structural damage due to wear and fatigue, and ensure the long-term stable operation of the conductive structure.
[0054] Some lubricating oils have a certain degree of thermal conductivity, and the oil film can assist in heat dissipation to some extent, helping the second conductor 2 and the substrate 1 dissipate the heat generated during operation. This helps maintain the conductive component structure within a suitable operating temperature range, preventing overheating from affecting its performance and service life. When relative movement occurs between components, friction may generate noise. The lubricating effect of the oil film can reduce the generation of this frictional noise, making the equipment operate more quietly and improving the user experience and comfort of the working environment.
[0055] Specifically, the substrate 1 is provided with a concave-convex structure layer 14, one side of the second conductor 2 is used to press onto the concave-convex structure layer 14, and the other side of the second conductor 2 is used to conduct two conductive contacts to the outside.
[0056] In practical use, the uneven structure layer 14 makes the connection between the second conductor 2 and the substrate 1 more stable. When the second conductor 2 is pressed onto it, the raised portion embeds into the second conductor 2, increasing the contact area between the two and making them less prone to relative sliding or separation, thus ensuring the stability of the structure under complex working conditions such as vibration and impact. This structure can effectively resist the force that causes the second conductor 2 to peel off from the substrate 1. Compared with planar connections, the uneven structure provides an additional mechanical locking effect, allowing the second conductor 2 and the substrate 1 to remain tightly connected even when subjected to external pulling forces, extending the service life of the conductive components.
[0057] The uneven structure allows for a more uniform distribution of current between the second conductor 2 and the substrate 1. This avoids current concentration in certain localized areas, reduces the risk of damage to the conductive components due to localized overheating, and ensures the stability of conductivity.
[0058] In this embodiment, an anti-oxidation coating 3 is provided on the surface of the second conductor 2. The anti-oxidation coating 3 is made of gold, tin or nickel, and the thickness of the anti-oxidation coating 3 is 2-5 μm.
[0059] In practical applications, gold, tin, and nickel all possess excellent oxidation resistance. After an anti-oxidation coating 3 is formed on the surface of the second conductor 2 (silver or silver-based alloy), it effectively prevents oxygen and moisture in the air from directly contacting the second conductor 2, further slowing down its oxidation process. Even under long-term use or harsh environmental conditions, it maintains good conductivity, reducing problems such as increased contact resistance and decreased conductivity caused by oxidation, thus extending the service life of the slide-type switch. In addition to oxidation resistance, the gold, tin, and nickel coatings also enhance the corrosion resistance of the second conductor 2. In applications where it may come into contact with corrosive gases, liquids, or chemicals, the coating can protect the second conductor 2 from corrosion, maintaining its surface integrity and conductivity, and ensuring stable operation of the switch.
[0060] A plating layer of suitable thickness (2-5 μm) can make the contact between the second conductor 2 and the conductive contact more stable and reliable. The surface properties of gold, tin, and nickel help reduce contact resistance and improve the tightness of the contact. This ensures good electrical connection during frequent sliding operations of the switch, reduces the occurrence of faults such as poor contact and momentary open circuits, and improves the reliability of the switch. In some cases, the second conductor 2 (silver or silver-based alloy) may experience metal migration, affecting its performance. The anti-oxidation plating layer 3 acts as a barrier, preventing silver atoms from diffusing into the surrounding environment or reacting with other substances, ensuring the chemical stability and electrical consistency of the second conductor 2.
[0061] In this embodiment, the arc-shaped portion 15 works in conjunction with the first conductor 10 and the second conductor 2 to mitigate tip discharge.
[0062] In practical use, the shape of the arc-shaped portion 15 allows the electric field to be distributed more evenly on its surface, avoiding excessive concentration of the electric field in local areas and the formation of a tip effect. The first conductor 10 and the second conductor 2, as conductive components, generate an electric field during operation. The arc-shaped portion 15, in conjunction with them, effectively changes the distribution of the electric field, reducing the difference in electric field strength between different parts. This significantly reduces the possibility of tip discharge during the switching of the slide-out switch circuit or during normal operation, improving the stability of electrical performance. Tip discharge easily damages insulating materials, leading to decreased insulation performance and even short circuits. The arc-shaped portion 15, in conjunction with the first and second conductors 2, mitigates tip discharge, reducing damage to surrounding insulating materials and maintaining the integrity and effectiveness of the insulation layer. During the long-term operation of the slide-out switch, good insulation performance ensures that current flows along a predetermined path, preventing current leakage and guaranteeing the safety and reliability of the switching system.
[0063] Sharp discharge generates electromagnetic radiation, interfering with surrounding electronic equipment and circuits and affecting their normal operation. The synergistic effect of the arc-shaped portion 15 and the first and second conductors 2 effectively suppresses sharp discharge, thereby reducing the generation of electromagnetic radiation. This is particularly important for slide-type switches used in complex electromagnetic environments, helping to improve the anti-interference capability of the switching system itself, while also reducing interference to other equipment and improving the electromagnetic compatibility of the entire system. Because sharp discharge generates high temperatures and electric sparks, it corrodes and wears the surface materials of the first conductor 10 and the second conductor 2, shortening their service life. The arc-shaped portion 15 mitigates sharp discharge, reducing this harmful physical effect, protecting the surfaces of the first and second conductors 2, and delaying material aging and wear. During frequent operation of the slide-type switch, sharp discharge may cause unexpected circuit connection or disconnection, affecting the normal function of the switch. The arc-shaped portion 15, in conjunction with the first and second conductors 2, mitigates sharp discharge, ensuring that the switch can accurately control the circuit connection and disconnection under various operating conditions, improving the reliability and stability of the switch action, and guaranteeing the normal operation of the equipment.
[0064] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A structure for fixing a silver strip conductive component, characterized in that: It includes a substrate (1) and a second conductor (2) disposed on the substrate (1). The second conductor (2) is used to make contact with two conductive contacts in the outside world. The two conductive contacts are connected through the second conductor (2). The second conductor (2) is a sheet structure made of silver or silver alloy.
2. The structure for fixing a silver strip conductive component according to claim 1, characterized in that: The substrate (1) has a T-shaped plate structure and includes a main board and a mounting part (11) protruding from one side of the self board. The mounting part (11) is used to mount the substrate (1) onto the external insulating structure. The second conductor (2) is located on the side of the main board away from the mounting part (11).
3. The structure for fixing a silver strip conductive component according to claim 2, characterized in that: The main board body has outwardly convex arc chamfered portions (13) at both ends on the side away from the mounting portion (11), and the second conductor (2) is located between the outwardly convex arc chamfered portions (13) at both ends of the main board body.
4. The structure for fixing a silver strip conductive component according to claim 1, characterized in that: The substrate (1) is a first conductor (10), the conductivity of the first conductor (10) is lower than that of the second conductor (2), and the first conductor (10) is made of copper alloy.
5. The structure for fixing a silver strip conductive component according to claim 1, characterized in that: The substrate (1) and the second conductor (2) are fixed together by one of welding, riveting, screwing or pressing.
6. The structure for fixing a silver strip conductive component according to claim 2, characterized in that: The mounting part (11) has a columnar structure, and the number of mounting parts (11) is set to multiple, with multiple mounting parts (11) arranged in a linear array on the base (1).
7. The structure for fixing a silver strip conductive component according to claim 1, characterized in that: The thickness of the second conductor (2) is 0.5-2 mm.
8. The structure for fixing a silver strip conductive component according to claim 2, characterized in that: The end of the mounting portion (11) away from the main body forms an arc portion (12).
9. The structure for fixing a silver strip conductive component according to claim 1, characterized in that: The outer side of the second conductor (2) and the outer side of the substrate (1) are provided with an oil film layer to facilitate lubrication.
10. The structure for fixing a silver strip conductive component according to claim 1, characterized in that: The substrate (1) is provided with a concave-convex structure layer (14), one side of the second conductor (2) is used to press onto the concave-convex structure layer (14), and the other side of the second conductor (2) is used to conduct two conductive contacts to the outside.