Heating structure

Abstract

The utility model relates to the technical field of semiconductors and photovoltaics, in particular to a heating structure, and solves the problems of poor temperature uniformity and stability when a heating structure used by heat treatment equipment heats a sheet in the prior art. The heating structure comprises a first heating assembly which is arranged on at least one side wall of the containing cavity; the second heating assembly is arranged in the accommodating chamber; and the third heating assembly is arranged in the containing cavity and located above the second heating assembly, a containing space is defined by the first heating assembly, the second heating assembly and the third heating assembly, the containing area is located in the containing space, the second heating assembly faces the lower surface of the containing area, and the third heating assembly faces the upper surface of the containing area. According to the heating structure provided by the invention, the uniformity and stability of the temperature during sheet heating can be improved.

Description

Technical Field

[0001] This disclosure relates to the fields of semiconductor and photovoltaic technology, and in particular to a heating structure. Background Technology

[0002] Perovskite solar cells are a type of solar cell that uses perovskite crystals as the photosensitive material to convert solar energy into electrical energy. They offer advantages such as high efficiency and low cost. A crystallization annealing furnace is one of the key pieces of equipment in the production of perovskite solar cells. Its main function is to promote the crystallization and growth of the perovskite solution coated on the substrate under high-temperature conditions, forming a perovskite thin film on the substrate surface. Currently, commonly used annealing equipment includes baking ovens, heating platforms, and tunnel furnaces. In these annealing devices, the heating structure used to heat the sheet is generally located above or below the sheet, at a considerable distance. Furthermore, the temperature at the edges of the heated sheet is often lower than the temperature in the center, making it impossible for all parts of the sheet to maintain a constant temperature. This results in poor uniformity in the thickness of the formed perovskite thin film. Utility Model Content

[0003] In view of this, the present disclosure provides a heating structure to solve the problem that the heating structure used in heat treatment equipment in the related art has poor temperature uniformity and stability when heating sheet materials.

[0004] One embodiment of this disclosure provides a heating structure applied to a heat treatment apparatus. The accommodating chamber of the heat treatment apparatus is configured to accommodate a carrier plate carrying a sheet material. The accommodating chamber has a placement area configured for placing the carrier plate. The heating structure includes: a first heating component disposed on at least one side wall of the accommodating chamber; a second heating component disposed in the accommodating chamber; and a third heating component disposed in the accommodating chamber, with the third heating component located above the second heating component. The first heating component, the second heating component, and the third heating component enclose an accommodating space. The placement area is located within the accommodating space, with the second heating component facing the lower surface of the placement area and the third heating component facing the upper surface of the placement area.

[0005] In some embodiments, the accommodating chamber has an air inlet and an air outlet, which are vertically disposed on both sides of the accommodating chamber, with the air inlet located below the air outlet. The first heating assembly includes: a plurality of first heating elements, respectively disposed on the side walls surrounding the accommodating chamber; the second heating assembly includes: a first flow equalizing plate, disposed on the side of the accommodating chamber near the air inlet, the first flow equalizing plate having a plurality of first air holes; second heating elements, dispersedly arranged on the first flow equalizing plate, the projection of the second heating elements on the first flow equalizing plate in the vertical direction not overlapping or partially overlapping with the first air holes; the third heating assembly includes: a second flow equalizing plate, disposed on... On the side of the accommodating chamber near the air outlet, a second flow equalizer is located above the first flow equalizer, and the second flow equalizer is provided with multiple second air holes; a third heating element is distributed on the second flow equalizer, and the vertical projection of the third heating element onto the second flow equalizer does not overlap or partially overlaps with the second air holes. The side wall of the accommodating chamber where the first heating element is arranged, the first flow equalizer, and the second flow equalizer form an accommodating space. There is a gap between the edge of the placement area and the side wall of the accommodating chamber. The first air holes face the lower surface of the placement area, and the second air holes face the upper surface of the placement area. The gap is configured to allow gas to pass through and diffuse into the placement area.

[0006] In some embodiments, a plurality of first air holes are uniformly arranged on a first flow equalizer, and / or a plurality of second air holes are uniformly arranged on a second flow equalizer.

[0007] In some embodiments, the first flow equalizer is divided into two or more first regions, and the second heating element includes: a plurality of second heating sections, each second heating section being disposed correspondingly in a first region; a first control unit electrically connected to each second heating section, the first control unit being configured to adjust the heating temperature of the second heating section on the corresponding first region according to the temperature of different regions in the placement area; and / or, the second flow equalizer is divided into two or more second regions, and the third heating element includes: a plurality of third heating sections, each third heating section being disposed correspondingly in a second region; a second control unit electrically connected to each third heating section, the second control unit being configured to adjust the heating temperature of the third heating section on the corresponding second region according to the temperature of different regions in the placement area when the carrier plate is located in the accommodating space.

[0008] In some embodiments, when the first flow equalizer is divided into two or more first regions, the areas of the multiple first regions are all the same, and the density of the multiple first air holes arranged on each first region is the same; when the second flow equalizer is divided into two or more second regions, the areas of the multiple second regions are all the same, and the density of the multiple second air holes arranged on each second region is the same.

[0009] In some embodiments, the first heating element includes: a plurality of interconnected or disconnected first heating portions, each of which is disposed on a side wall of the accommodating chamber.

[0010] In some embodiments, it further includes: at least one lifting component disposed in the heat treatment apparatus, the lifting component being at least partially extendable into the receiving chamber to connect the second heating component and / or the third heating component, the lifting component being configured to drive the second heating component and / or the third heating component to move vertically within the receiving chamber.

[0011] In some embodiments, the lifting assembly includes: a mounting member disposed on a heat treatment device; a lifting drive member connected to the mounting member, wherein the top rod of the lifting drive member is movable in a vertical direction; and a connecting plate connected to the top rod of the lifting drive member, wherein the connecting plate is at least partially located in an accommodating chamber and connected to a second heating assembly or a third heating assembly, wherein the lifting drive member is capable of driving the second heating assembly or the third heating assembly to move in a vertical direction.

[0012] In some embodiments, the system further includes an auxiliary heating component disposed at the air inlet, the auxiliary heating component being configured to heat the gas before it enters the accommodating chamber from the air inlet.

[0013] In some embodiments, the system further includes: a third flow equalizer, disposed in the accommodating chamber, and located between the first flow equalizer and the air inlet; the third flow equalizer has a plurality of uniformly distributed third air holes, and in the vertical projection of the third flow equalizer onto the first flow equalizer, the third air holes do not overlap with the first air holes; and a fourth heating element, dispersedly arranged on the third flow equalizer, and in the vertical projection of the fourth heating element onto the third flow equalizer, it does not overlap with or partially overlaps with the third air holes.

[0014] The heating structure provided in this embodiment, when the carrier plate carrying the sheet is located in the accommodating chamber, further positions the sheet carrying the carrier plate within the accommodating space enclosed by the first heating component, the second heating component, and the third heating component. This effectively ensures the temperature uniformity within the accommodating space, thereby ensuring that the temperature at each position of the sheet remains consistent. This avoids a situation where the sheet has a lower temperature at the edges and a higher temperature in the middle, thus improving the temperature uniformity and stability when the heating structure heats the sheet.

[0015] In addition, by placing the carrier plate carrying the sheet within the accommodating space enclosed by the first heating component, the second heating component, and the third heating component, the heating structure can achieve rapid heating of the sheet by heating only the accommodating space. This allows the sheet to quickly reach and maintain the required temperature, thereby improving the heating efficiency of the sheet. Attached Figure Description

[0016] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a schematic of a heating structure provided in an embodiment of the present disclosure, which is disposed in a heat treatment device.

[0018] Figure 2 The image shown is a cross-sectional front view of a heating structure provided in an embodiment of this disclosure, disposed in a heat treatment device.

[0019] Figure 3 As shown Figure 2 The diagram shows a partial enlarged view of the heating structure located in section M of the heat treatment equipment.

[0020] Figure 4 The diagram shown is a schematic diagram of a heating structure disposed in a receiving chamber according to an embodiment of the present disclosure.

[0021] Figure 5 As shown Figure 4 The diagram shows a partial enlarged view of the heating structure located in section N of the accommodating chamber.

[0022] Figure 6 The diagram shown is a schematic diagram of a second heating component provided in an embodiment of this disclosure.

[0023] Figure 7 The diagram shown is a schematic diagram of a fourth heating element disposed on a third flow uniform plate according to an embodiment of the present disclosure.

[0024] Figure label:

[0025] 10. Heat treatment equipment; 1. Hot furnace; 11. Receiving chamber; 11a. Placement area; 111. Receiving space; 111a. Gap; 12. Lifting assembly; 121. Lifting drive component; 122. Connecting plate; 123. Mounting component; 13. Feed inlet; 14. Temperature measuring assembly; 1a. Air outlet; 1b. Air inlet; 2. Air extraction assembly; 3. Air intake assembly; 3a. Auxiliary heating assembly; 4. Flip valve; 5. Conveying assembly; 6. Heating structure; 61. First heating assembly; 611. First heating element; 62. The first heating element; Two heating components; 621, first flow equalizer; 621a, first vent; 621b, first region; 622, second heating element; 63, third heating component; 631, second flow equalizer; 631a, second vent; 632, third heating element; 64, third flow equalizer; 64a, third vent; 65, fourth heating element; 66, fifth flow equalizer; 66a, fifth vent; 67, fourth flow equalizer; 67a, fourth vent; 7, carrier plate; 71, sheet; X, first direction; Y, second direction; Z, vertical direction. Detailed Implementation

[0026] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0027] This disclosure provides a heating structure, such as... Figures 1 to 3 It is applied to heat treatment equipment 10, which has a furnace 1. The accommodating chamber 11 of the furnace 1 is configured to accommodate a carrier plate 7 carrying a sheet 71. The heating structure 6 is configured to heat the sheet 71 on the carrier plate 7 in the accommodating chamber 11.

[0028] It is understood that the receiving chamber 11 is provided with a placement area 11a, which is configured for placing the carrier plate 7. The placement area 11a can be understood as the area enclosed by the space occupied by the receiving chamber 11 when an empty carrier plate 7 or a carrier plate 7 carrying a sheet 71 is placed. The position, size, and shape of the placement area 11a can be matched according to the position, size, and shape of the carrier plate 7 and / or sheet 71 placed in the receiving chamber 11, and are not specifically limited.

[0029] It should be emphasized that the direction pointed to by arrow X in the diagram is the first direction, the direction pointed to by arrow Y is the second direction, and the direction pointed to by arrow Z is the vertical direction. The first direction X, the second direction Y, and the vertical direction Z are all perpendicular to each other, and will not be emphasized separately thereafter.

[0030] It is understood that the heat treatment equipment 10 can be any equipment that requires uniform heating of the sheet 71, such as coating equipment, curing equipment, oxidation equipment, or annealing equipment, without specific limitations.

[0031] Optionally, the sheet 71 can be a substrate with a perovskite solution coated on its upper surface. When the sheet 71 is placed in the accommodating chamber 11 for heat treatment, the perovskite solution crystallizes and grows under high temperature, thereby forming a perovskite thin film on the surface of the substrate, resulting in a perovskite solar cell. Furthermore, the carrier plate 7 used to support the sheet 71 can be a high-temperature resistant and thermally conductive metal plate or a non-metal plate. The upper surface of the carrier plate 7 is flat to ensure the stability of the sheet 71 placed on the carrier plate 7 and to ensure the uniformity of the perovskite solution coated on the substrate.

[0032] Specifically, the heating structure 6 includes a first heating component 61, a second heating component 62, and a third heating component 63. The first heating component 61 is disposed on at least one side wall of the accommodating chamber 11, the second heating component 62 is disposed in the accommodating chamber 11, and the third heating component 63 is disposed in the accommodating chamber 11, with the third heating component 63 located above the second heating component 62. The first heating component 61, the second heating component 62, and the third heating component 63 enclose an accommodating space 111, and the placement area 11a is located in the accommodating space 111. The second heating component 62 faces the lower surface of the placement area 11a, and the third heating component 63 faces the upper surface of the placement area 11a.

[0033] It is understandable that when the carrier plate 7 carrying the sheet 71 is located in the placement area 11a of the accommodating chamber 11, the carrier plate 7 is located in the accommodating space 111, the second heating component 62 faces the carrier plate 7, and the third heating component 63 faces the sheet 71.

[0034] The heating structure 6 provided in this embodiment, when the carrier plate 7 carrying the sheet 71 is located in the accommodating chamber 11, further positions the sheet 71 carrying the carrier plate 7 within the accommodating space 111 formed by the first heating component 61, the second heating component 62, and the third heating component 63. This effectively ensures the temperature uniformity within the accommodating space 111, thereby maintaining a consistent temperature at all positions of the sheet 71 and preventing a situation where the edge temperature of the sheet 71 is lower than the middle temperature. This improves the temperature uniformity and stability when the heating structure 6 heats the sheet 71.

[0035] In addition, by placing the carrier plate 7 carrying the sheet 71 within the accommodating space 111 enclosed by the first heating component 61, the second heating component 62, and the third heating component 63, the heating structure 6 can achieve rapid heating of the sheet 71 by heating only the accommodating space 111, enabling the sheet 71 to quickly reach and maintain the required temperature, thereby improving the heating efficiency of the sheet 71.

[0036] Understandably, the accommodating chamber 11 of the furnace 1 can be configured as a square structure with side walls on all four sides. The first heating components 61 are respectively disposed on the side walls around the accommodating chamber 11. When the carrier plate 7 carrying the sheet 71 is located in the accommodating space 111, the first heating component 61, the second heating component 62, and the third heating component 63 correspond to the six sides of the carrier plate 7 carrying the sheet 71. Among them, the first heating component 61 can mainly heat the edge area around the sheet 71, the third heating component 63 can mainly heat the area above the sheet 71, and the second heating component 62 can mainly heat the carrier plate 7. The heated carrier plate 7 can conduct heat to the sheet 71 it carries, so that the sheet 71 is heated evenly and can quickly rise to the temperature required for the process sheet 71 and maintain that temperature.

[0037] Optionally, the accommodating chamber 11 has an inlet 13 and an outlet on opposite side walls in the horizontal direction. The inlet 13 is used to allow the carrier plate 7 carrying the unprocessed sheet 71 to enter the accommodating chamber 11, and the outlet is used to allow the carrier plate 7 carrying the processed sheet 71 to exit the accommodating chamber 11. It is understood that the inlet 13 and outlet can be arranged along the first direction X on opposite side walls of the accommodating chamber 11, and the inlet 13 and outlet can each be equipped with a flap valve 4. The driving mechanism can control the flap valve 4 to open or close the corresponding inlet 13 and outlet, so that when the flap valve 4 closes the inlet 13 and outlet, the accommodating chamber 11 can be in a closed state and can be evacuated. In this embodiment, the specific structure of the flap valve 4 and how the driving mechanism drives the flap valve 4 to open and close the inlet 13 and outlet are not described in detail.

[0038] It is understood that the furnace 1 may also be provided with a conveying assembly 5, which is disposed on at least one side of the furnace 1 in the second direction Y. The conveying assembly 5 is configured to carry the carrier plate 7 and drive the carrier plate 7 to move along the first direction X, so that the carrier plate 7 carrying the sheet 71 enters the receiving chamber 11 from the feed port 13 or is conveyed out of the receiving chamber 11 from the discharge port. The conveying assembly 5 may be, for example, a conveyor belt, conveyor roller, etc. for conveying the carrier plate 7 to move along the first direction X, and will not be described in detail.

[0039] In some embodiments, such as Figures 3 to 5The accommodating chamber 11 is provided with an air inlet 1b and an air outlet 1a, which are vertically arranged on both sides of the accommodating chamber 11. The air inlet 1b is located below the air outlet 1a. When the carrier plate 7 carrying the sheet 71 is located in the accommodating space 111, the second heating component 62 is located between the air inlet 1b and the carrier plate 7, and the third heating component 63 is located between the air outlet 1a and the carrier plate 7. The arrangement of the air inlet 1b and the air outlet 1a allows the gas to move from bottom to top. The gas entering from the air inlet 1b can carry the heat generated by the third heating component 63 to the carrier plate 7, and after heat exchange with the carrier plate 7, it is discharged from the air outlet 1a. This avoids the hot gas directly blowing onto the perovskite solution on the upper surface of the sheet 71, improves the heating uniformity of the sheet 71, and keeps the perovskite solution uniform on the sheet 71. In addition, the arrangement of the air inlet 1b and the air outlet 1a allows the gas to flow from bottom to top, enabling heat to be evenly diffused to all areas of the accommodating space 111 and maintaining the accommodating space 111 at a constant temperature, further improving the heating uniformity and stability of the sheet 71.

[0040] Optionally, such as Figure 1 and Figure 4 The air inlet 1b may be provided with a connected air inlet assembly 3, which is used to introduce gas from the air inlet 1b into the accommodating chamber 11. The air outlet 1a may be provided with a connected air extraction assembly 2, which is used to extract the gas from the accommodating chamber 11 from the air outlet 1a, so that the gas can circulate from bottom to top in the accommodating chamber 11, thereby making the hot gas diffuse evenly in the accommodating chamber 11.

[0041] Specifically, such as Figures 3 to 5The first heating assembly 61 includes a plurality of first heating elements 611, which are respectively disposed on the side walls around the accommodating chamber 11. The second heating assembly 62 includes a first flow equalizing plate 621 and a second heating element 622. The first flow equalizing plate 621 is disposed in the accommodating chamber 11 and has a plurality of first air holes 621a. The second heating element 622 is distributed on the first flow equalizing plate 621, and the orthographic projection of the second heating element 622 onto the first flow equalizing plate 621 in the vertical direction Z does not overlap with or partially overlaps with the first air holes 621a. The third heating assembly 63 includes a second flow equalizing plate 631 and a third heating element 632. The second flow equalizing plate 631 is disposed in the accommodating chamber 11 and has a plurality of second air holes 631a. The third heating element 632 is distributed on the second flow equalizing plate 631, and the orthographic projection of the third heating element 632 onto the second flow equalizing plate 631 in the vertical direction Z overlaps with orthographic projection of the second heating element 622 onto the second flow equalizing plate 631. The holes 631a do not overlap or partially overlap; wherein, the receiving chamber 11 is correspondingly provided with the side wall of the first heating element 611, the first flow equalizing plate 621 and the second flow equalizing plate 631 to form a receiving space 111, and there is a gap 111a between the edge of the placement area 11a and the side wall of the receiving chamber 11. It can also be understood that when the carrier plate 7 is located in the receiving space 111, there is a gap 111a between the edge of the carrier plate 7 and the side wall of the receiving chamber 11 (as a result of the gap between the carrier plate 7 and the side wall of the receiving chamber 11). After heat exchange on the carrier plate 7, the gas diffuses to the gas flow channel above the sheet 71. The first vent 621a faces the lower surface of the placement area 11a (i.e., towards the carrier plate 7), and the second vent 631a faces the upper surface of the placement area 11a (i.e., towards the sheet 71). The gas entering from the inlet 1b can flow from the first vent 621a to the carrier plate 7 and diffuse through the gap 111a to the top of the sheet 71 before being discharged from the outlet 1a through the second vent 631a.

[0042] Understandably, the gas entering from the air inlet 1b can be dispersed into the accommodating space 111 through multiple first air holes 621a and carry heat to the carrier plate 7 in the placement area 11a, so that the carrier plate 7 is heated more evenly; the gas diffused above the sheet 71 can be discharged from the air outlet 1a through multiple second air holes 631a, so that the hot gas distribution above the sheet 71 is more even, thereby further improving the uniformity of heating of the sheet 71 on the carrier plate 7, and enabling the hot gas to quickly and evenly fill the accommodating space 111, so that the temperature in the accommodating space 111 can quickly reach the temperature required for heat treatment and be maintained at a constant temperature.

[0043] Optionally, a plurality of first air holes 621a are evenly arranged on the first flow equalizer 621. The size of the plurality of first air holes 621a and the density of their arrangement on the first flow equalizer 621 can be adaptively adjusted according to actual needs. A plurality of second air holes 631a are evenly arranged on the second flow equalizer 631. The size of the plurality of second air holes 631a and the density of their arrangement on the second flow equalizer 631 can be adaptively adjusted according to actual needs, without being specifically limited.

[0044] Optionally, the size of the first vent 621a can be the same as the size of the second vent 631a; the density of the plurality of first vents 621a arranged on the first flow equalizer 621 can be the same as the density of the plurality of second vents 631a arranged on the second flow equalizer 631; in the orthographic projection of the first flow equalizer 621 along the vertical direction Z to the second flow equalizer 631, the first vents 621a can be staggered with the second vents 631a, which can be adaptively adjusted according to actual needs and is not specifically limited.

[0045] In an optional embodiment, the first heating element 611, the second heating element 622 and the third heating element 632 can be radiant heating elements such as hot wires and heating rods located at corresponding positions, and can be adaptively adjusted according to actual needs.

[0046] Optionally, the first heating element 611 includes multiple interconnected or disconnected first heating sections, each of which is correspondingly disposed on one side wall of the receiving chamber 11. Specifically, when the first heating section is a hot wire, the hot wires are respectively arranged on the inner side walls around the receiving chamber 11, and the hot wires on each side wall are arranged in a wavy pattern. The hot wires arranged on the multiple side walls are at the same height within the receiving chamber 11, and the hot wires on the multiple side walls are interconnected or disconnected. When the carrier plate 7 is located in the receiving chamber 11, the hot wires surround the periphery of the carrier plate 7. It should be emphasized that when the feed inlet 13 and the discharge outlet are arranged horizontally on opposite side walls of the furnace 1, the arrangement of the hot wires needs to avoid the feed inlet 13 and the discharge outlet in order to facilitate the entry and exit of the carrier plate 7. This will not be described in detail.

[0047] Optionally, the second heating element 622 includes multiple electrically connected second heating sections and a first control section. These multiple interconnected or disconnected second heating sections are distributed on the surface of the first flow equalizer 621 opposite to the carrier plate 7. Specifically, when the second heating section is configured as a hot wire, the multiple hot wires are connected end-to-end and arranged in a wavy pattern on the surface of the first flow equalizer 621. The first control section can control the heating of the hot wires, and the heating efficiency of each part of the hot wire is the same. Alternatively, the multiple hot wires are arranged end-to-end on the first flow equalizer 621, such as... Figure 6The first flow equalizer 621 is divided into two or more first regions 621b. Each first region 621b is provided with an independent set of second heating elements (i.e., hot wires). The first control unit is electrically connected to each second heating element so that the second heating elements arranged in each first region 621b can be controlled independently. The first control unit is configured to adjust the heating temperature of the second heating elements on the corresponding first region 621b according to the temperature of different regions in the placement area 11a. That is, when the carrier plate 7 is located in the accommodating space 111, the first control unit is configured to adjust the heating temperature of the second heating elements on the corresponding first region 621b according to the temperature of different regions of the carrier plate 7. In this way, the heating efficiency of the second heating elements in the regions that have not reached constant temperature can be adjusted according to the actual temperature of different positions of the carrier plate 7, thereby maintaining the carrier plate 7 in a constant temperature state.

[0048] Similarly, the third heating element 632 includes multiple electrically connected third heating sections and a second control section. These interconnected or disconnected third heating sections are distributed on the surface of the second flow equalizer 631 away from the carrier plate 7. Specifically, when the third heating section is a hot wire, multiple hot wires are connected end-to-end and arranged in a wavy pattern on the surface of the second flow equalizer 631. The second control section can control the heating of the hot wires to ensure that each part of the hot wire has the same heating efficiency. Alternatively, when multiple hot wires are disconnected end-to-end and distributed on the second flow equalizer 631, the second flow equalizer 631 is divided into multiple second regions (not shown in the figure). Each second region has a corresponding position with an independent set of third heating sections (i.e., hot wires), and the second control section is electrically connected to each third heating section. The second control unit is configured to adjust the heating temperature of the third heating unit on the corresponding second region according to the temperature of different regions in the placement area 11a. That is, when the carrier plate 7 is located in the accommodating space 111, the second control unit is configured to adjust the heating temperature of the third heating unit on the corresponding second region according to the temperature of different regions of the carrier plate 7. In this way, the heating efficiency of the third heating unit in the region that has not reached constant temperature can be adjusted according to the actual temperature of different positions of the carrier plate 7, so that the carrier plate 7 is kept in a constant temperature state.

[0049] It is understandable that the division method of the multiple regions on the first flow equalizer 621 and the second flow equalizer 631, as well as the size of each region, can be adaptively adjusted according to actual needs. The more regions there are, the higher the accuracy of temperature regulation, without any specific limitation.

[0050] Optionally, in the plurality of first regions 621b divided by the first flow equalizer 621, each first region 621b has the same area, and the plurality of first air holes 621a arranged on each first region 621b have the same density; in the plurality of second regions divided by the second flow equalizer 631, each second region has the same area, and the plurality of second air holes 631a arranged on each second region have the same density. This allows the gas to enter and exit the accommodating space 111 more uniformly from bottom to top, resulting in more uniform gas diffusion within the accommodating space 111.

[0051] In an optional embodiment, the first flow equalizer 621 and the second flow equalizer 631 can be fixedly connected to the side wall of the accommodating chamber 11 by welding, snap-fitting, or other methods, which will not be described in detail. At least one of the first flow equalizer 621 and the second flow equalizer 631 can also be movably connected to the side wall of the accommodating chamber 11, such as... Figure 3 and Figure 6 Taking the first flow equalizer 621 as an example, the edges of the first flow equalizer 621 are fitted with the gaps 111a around the accommodating chamber 11. The heating structure 6 also includes at least one lifting component 12. The lifting component 12 is disposed in the furnace 1. The lifting component 12 can at least partially extend into the accommodating chamber 11 to connect with the first flow equalizer 621. The lifting component 12 can drive the first flow equalizer 621 to move in the vertical direction Z so that the second heating element 622 on the first flow equalizer 621 can move closer to or further away from the carrier plate 7 according to the actual temperature of the carrier plate 7 in the accommodating space 111, so that the carrier plate 7 can be quickly brought to a constant temperature state.

[0052] Optionally, the lifting assembly 12 includes a lifting drive 121 and a connecting plate 122. The lifting drive 121 is disposed in the furnace 1. The push rod of the lifting drive 121 can move in the vertical direction Z. The connecting plate 122 is connected to the push rod. The connecting plate 122 extends at least partially into the receiving chamber 11 and is connected to the first flow equalizing plate 621. When the lifting drive 121 drives the push rod to move in the vertical direction Z, it can drive the first flow equalizing plate 621 to move closer to or away from the carrier plate 7 in the vertical direction Z. The lifting drive 121 can be, for example, a drive cylinder. In other examples, the lifting assembly 12 can also achieve the raising or lowering of the first flow equalizing plate 621 in the vertical direction Z through the cooperation of a drive motor and a lead screw and nut pair, which will not be described in detail.

[0053] It is understandable that the side wall of the accommodating chamber 11 may also be provided with a groove extending in the vertical direction Z, and the edge of the first flow equalizing plate 621 is provided with a slider that cooperates with the groove, so that the first flow equalizing plate 621 moves more smoothly and steadily in the vertical direction Z.

[0054] Optionally, the lifting assembly 12 may also include a mounting member 123, which is disposed in the furnace 1. The lifting drive member 121 is connected to the mounting member 123 and allows the top rod of the lifting drive member 121 to pass through the furnace 1 and extend into the receiving chamber 11.

[0055] It should be emphasized that the movable connection between the second flow equalizer 631 and the side wall of the accommodating chamber 11 can refer to the specific matching structure of the movable connection between the first flow equalizer 621 and the side wall of the accommodating chamber 11, and will not be described again.

[0056] In some embodiments, such as Figure 3 , Figure 5 and Figure 7 The heating structure 6 also includes a third flow equalizer 64 and a fourth heating element 65. The third flow equalizer 64 is disposed in the accommodating chamber 11 and is located between the first flow equalizer 621 and the air inlet 1b. The third flow equalizer 64 is provided with a plurality of uniformly distributed third air holes 64a. In the vertical Z-direction orthographic projection of the third flow equalizer 64 onto the first flow equalizer 621, the third air holes 64a do not overlap with the first air holes 621a. The fourth heating element 65 is dispersedly arranged on the third flow equalizer 64. In the vertical Z-direction orthographic projection of the fourth heating element 65 onto the third flow equalizer 64, it does not overlap with or partially overlaps with the third air holes 64a.

[0057] It is understandable that by using the third flow equalizer 64 and the fourth heating element 65, the gas entering from the inlet 1b is first heated by the fourth heating element 65 and then evenly distributed by the third flow equalizer 64, and then heated by the second heating element 622 and evenly distributed by the first flow equalizer 621, which further improves the heating rate of the accommodating space 111 and the diffusion rate and uniformity of the hot gas in the accommodating space 111.

[0058] Optionally, one or more fourth flow equalizers 67 may be provided between the first flow equalizer 621 and the third flow equalizer 64, or between the third flow equalizer 64 and the air inlet 1b. The plurality of fourth air holes 67a provided on each adjacent fourth flow equalizer 67 are staggered to further improve the flow equalization effect. Similarly, one or more fifth flow equalizers 66 may be provided between the second flow equalizer 631 and the air outlet 1a. The fifth flow equalizer 66 is provided with a plurality of fifth air holes 66a, which will not be described in detail.

[0059] In some embodiments, the heating structure 6 further includes an auxiliary heating component 3a disposed at the air inlet 1b. The auxiliary heating component 3a is configured to heat the gas before it enters the accommodating chamber 11 from the air inlet 1b, so as to further improve the heating efficiency of the sheet 71 on the carrier plate 7.

[0060] Optionally, when the air inlet 1b is connected to the air intake assembly 3 to supply gas to the accommodating chamber 11, the auxiliary heating assembly 3a can be specifically arranged in the air intake pipe in the air intake assembly 3 for communicating with the air inlet 1b, so that the gas supplied by the air intake assembly 3 can be preheated when passing through the auxiliary heating assembly 3a in the air intake pipe, thereby giving the gas entering the accommodating chamber 11 from the air inlet 1b a certain temperature and increasing the temperature rise rate in the accommodating chamber 11.

[0061] It is understood that the auxiliary heating component 3a can be, for example, a heater installed in the intake pipe, or a heating wire, heating rod, etc. installed in the intake pipe, without specific limitations.

[0062] In some embodiments, the heating structure 6 is electrically connected to a temperature sensing component 14 and a control component, which are distributed in the furnace 1, with the temperature sensing component 14 extending at least partially into the receiving chamber 11. When the carrier plate 7 is located in the receiving chamber 11, the temperature sensing component 14 is configured to detect the temperature of the carrier plate 7 and generate a detection signal, and the control component is configured to receive the detection signal and adjust the heating temperature of the heating structure 6 according to the detection signal, so that the temperature of the carrier plate 7 is maintained at the temperature required for the process.

[0063] It is understood that the temperature measuring component 14 can be configured as a heating furnace 1 and extend into the receiving chamber 11 to detect the temperature of the carrier plate 7, so as to monitor the temperature of the carrier plate 7 in real time and adjust the heating temperature of the heating component accordingly based on the actual temperature, thereby maintaining the carrier plate 7 at the temperature required by the process (i.e. the temperature required for perovskite solution crystallization and growth), and ensuring the uniformity of the thickness of the perovskite film on the sheet 71 after heat treatment.

[0064] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts and nuts, screws, clips, magnetic attraction, etc. In some connections where there is no particular requirement for a detachable fit, a non-detachable connection can be achieved through welding, bonding, or other methods.

[0065] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0066] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0067] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.

[0068] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0069] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A heating structure, characterized in that, An apparatus for use in heat treatment equipment, wherein a accommodating chamber of the heat treatment equipment is configured to accommodate a carrier plate carrying sheets, the accommodating chamber having a placement area configured for placing the carrier plate, and the heating structure comprising: A first heating component is disposed on at least one side wall of the accommodating chamber; A second heating component is disposed in the accommodating chamber; A third heating component is disposed in the accommodating chamber, and the third heating component is located above the second heating component. The first heating component, the second heating component, and the third heating component enclose an accommodating space. The placement area is located in the accommodating space, with the second heating component facing the lower surface of the placement area and the third heating component facing the upper surface of the placement area.

2. The heating structure according to claim 1, characterized in that, The accommodating chamber is provided with an air inlet and an air outlet, which are vertically arranged on both sides of the accommodating chamber, with the air inlet located below the air outlet. The first heating component includes: Multiple first heating elements are respectively disposed on the side walls around the accommodating chamber; The second heating component includes: A first flow equalizer is disposed on the side of the accommodating chamber near the air inlet, and the first flow equalizer is provided with a plurality of first air holes; The second heating element is distributed on the first flow equalization plate, and the projection of the second heating element in the vertical direction onto the first flow equalization plate does not overlap with or partially overlaps with the first air hole. The third heating component includes: The second flow equalizer is disposed on the side of the accommodating chamber near the air outlet. The second flow equalizer is located above the first flow equalizer and has a plurality of second air holes. A third heating element is dispersed on the second flow equalizer. The vertical projection of the third heating element onto the second flow equalizer does not overlap with or partially overlaps with the second air hole. The sidewall of the accommodating chamber where the first heating element is arranged, the first flow equalizer, and the second flow equalizer enclose the accommodating space. There is a gap between the edge of the placement area and the sidewall of the accommodating chamber. The first air hole faces the lower surface of the placement area, and the second air hole faces the upper surface of the placement area. The gap is configured to allow gas to pass through and diffuse into the placement area.

3. The heating structure according to claim 2, characterized in that, A plurality of first air holes are uniformly arranged on the first flow equalizer, and / or a plurality of second air holes are uniformly arranged on the second flow equalizer.

4. The heating structure according to claim 2, characterized in that, The first flow equalizer is divided into two or more first regions. The second heating element includes: Multiple second heating elements are provided, each of which is arranged in a corresponding first region. A first control unit is electrically connected to each of the second heating units, and the first control unit is configured to adjust the heating temperature of the second heating unit on the corresponding first region according to the temperature of different regions in the placement area; and / or The second flow uniform plate is divided into two or more second regions. The third heating element includes: Multiple third heating elements, each of which is arranged in a corresponding second region; The second control unit is electrically connected to each of the third heating units, and the second control unit is configured to adjust the heating temperature of the third heating unit on the corresponding second region according to the temperature of different regions in the placement area.

5. The heating structure according to claim 4, characterized in that, When the first flow equalizer is divided into two or more first regions, the areas of the multiple first regions are the same, and the density of the multiple first air holes arranged on each first region is the same. When the second flow equalizer is divided into two or more second regions, the areas of the multiple second regions are all the same, and the density of the multiple second air holes arranged on each second region is the same.

6. The heating structure according to claim 2, characterized in that, The first heating element includes: Multiple interconnected or disconnected first heating elements, each of which is disposed on one side wall of the accommodating chamber.

7. The heating structure according to any one of claims 1-6, characterized in that, Also includes: At least one lifting assembly is disposed in the heat treatment equipment, the lifting assembly being at least partially extendable into the receiving chamber to connect the second heating assembly and / or the third heating assembly, the lifting assembly being configured to drive the second heating assembly and / or the third heating assembly to move vertically within the receiving chamber.

8. The heating structure according to claim 7, characterized in that, The lifting assembly includes: Mounting components are provided on the heat treatment equipment; A lifting drive component is connected to the mounting component, and the top rod of the lifting drive component can move in the vertical direction; A connecting plate is connected to the top rod of the lifting drive component. The connecting plate is at least partially located in the accommodating chamber and connected to the second heating component or the third heating component. The lifting drive component can drive the second heating component or the third heating component to move in the vertical direction.

9. The heating structure according to any one of claims 2-6, characterized in that, Also includes: An auxiliary heating component is disposed at the air inlet, and the auxiliary heating component is configured to heat the gas before it enters the accommodating chamber from the air inlet.

10. The heating structure according to any one of claims 2-6, characterized in that, Also includes: A third flow equalizer is disposed in the accommodating chamber, and the third flow equalizer is located between the first flow equalizer and the air inlet. The third flow equalizer is provided with a plurality of evenly distributed third air holes. In the vertical projection of the third flow equalizer onto the first flow equalizer, the third air holes do not overlap with the first air holes. The fourth heating element is distributed on the third flow equalization plate, and the vertical projection of the fourth heating element onto the third flow equalization plate does not overlap with or partially overlaps with the third air hole.

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