Multi-layer circuit board capable of preventing electromagnetic interference

Abstract

The utility model relates to a multilayer circuit board capable of preventing electromagnetic interference. The multilayer circuit board capable of preventing electromagnetic interference comprises a first layer, a second layer, a third layer, a fourth layer, a fifth layer and a sixth layer which are sequentially arranged from top to bottom, a prepreg is arranged between the first layer and the second layer, and a core board is arranged between the second layer and the third layer. A prepreg is arranged between the third layer and the fourth layer, a core plate is arranged between the fourth layer and the fifth layer, and a prepreg is arranged between the fifth layer and the sixth layer; the first layer is provided with physical devices, the second layer is grounded, the third layer is provided with signal lines, the fourth layer is provided with power lines, the fifth layer is grounded, and the sixth layer is provided with physical devices. The multilayer circuit board capable of preventing electromagnetic interference has relatively good signal integrity and electromagnetic compatibility, and the service life of electronic equipment can be prolonged.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board technology, and in particular to a multilayer circuit board that is resistant to electromagnetic interference. Background Technology

[0002] Compared to single-layer circuit boards, multilayer circuit boards, due to their use of inner-layer signal lines, achieve shorter signal transmission paths and lower crosstalk, thus improving signal reliability and stability. Multilayer circuit boards are commonly used in complex electronic devices, providing more wiring space and higher integration to meet the demands of high performance and high reliability. However, as circuit board complexity continues to increase, the electromagnetic interference (EMI) problems faced by multilayer circuit boards are becoming increasingly prominent, severely impacting the performance of electronic devices. Utility Model Content

[0003] Therefore, it is necessary to provide a multilayer circuit board that is protected against electromagnetic interference, which is becoming increasingly prominent in multilayer circuit boards and seriously affects the performance of electronic devices.

[0004] A multilayer circuit board for electromagnetic interference protection includes a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer arranged sequentially from top to bottom. A prepreg is disposed between the first layer and the second layer, a core board is disposed between the second layer and the third layer, a prepreg is disposed between the third layer and the fourth layer, a core board is disposed between the fourth layer and the fifth layer, and a prepreg is disposed between the fifth layer and the sixth layer.

[0005] The first layer contains physical devices, the second layer is grounded, the third layer contains signal lines, the fourth layer contains power lines, the fifth layer is grounded, and the sixth layer contains physical devices.

[0006] The aforementioned multilayer circuit board for electromagnetic interference protection includes six layers arranged sequentially from top to bottom: a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer. A prepreg is placed between the first and second layers; a core board is placed between the second and third layers; a prepreg is placed between the third and fourth layers; a core board is placed between the fourth and fifth layers; and a prepreg is placed between the fifth and sixth layers. The first layer contains physical components, the second layer is grounded, the third layer contains signal lines, the fourth layer contains power lines, the fifth layer is grounded, and the sixth layer contains physical components. It can be seen that this multilayer circuit board for electromagnetic interference protection adopts a symmetrical structural design. Since the second and fifth layers are both grounded layers, a symmetrical shielding structure is formed, which can effectively suppress electromagnetic radiation leakage from the third and fourth layers to the outside. Simultaneously, external electromagnetic radiation, after penetrating the first or sixth layer, will be absorbed by the second or fifth layer, thereby reducing its impact on the third and fourth layers. This multilayer circuit board for electromagnetic interference protection has excellent electromagnetic interference protection capabilities and can effectively improve the service life of electronic equipment.

[0007] In one embodiment, the fourth layer is provided with multiple different power supply zones, each corresponding to a different power supply voltage.

[0008] In one embodiment, a surface-mount capacitor is used to bridge adjacent power supply areas.

[0009] In one embodiment, the capacitance of the patch capacitor is 0.1 μF.

[0010] In one embodiment, the surface mount capacitor is in a 0402 package.

[0011] In one embodiment, the fourth layer is further provided with a first grounding area, and a signal area is provided at the center of the first grounding area, and signal lines are arranged in the signal area.

[0012] In one embodiment, the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer are electrically connected via through-holes.

[0013] In one embodiment, the through holes are uniformly distributed at the edges of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer.

[0014] In one embodiment, the spacing between adjacent through holes is 100mil-200mil.

[0015] In one embodiment, the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer are all provided with a second grounding area, the through hole is provided in the second grounding area, and a surface-mount capacitor is bridged between the second grounding area and the adjacent power supply area. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the multilayer circuit board for electromagnetic interference protection according to this utility model;

[0017] Figure 2 This is a schematic diagram of the fourth layer in the multilayer circuit board for electromagnetic interference protection of this utility model. Detailed Implementation

[0018] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0019] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] This utility model discloses a multilayer circuit board for electromagnetic interference protection.

[0022] like Figures 1 to 2As shown, the multilayer circuit board for electromagnetic interference protection includes a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer arranged sequentially from top to bottom. A prepreg is placed between the first and second layers, a core board is placed between the second and third layers, a prepreg is placed between the third and fourth layers, a core board is placed between the fourth and fifth layers, and a prepreg is placed between the fifth and sixth layers. The first layer contains physical components, the second layer is grounded, the third layer contains signal lines, the fourth layer contains power lines, the fifth layer is grounded, and the sixth layer contains physical components.

[0023] The aforementioned multilayer circuit board for electromagnetic interference protection includes six layers arranged sequentially from top to bottom: a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer. A prepreg is placed between the first and second layers; a core board is placed between the second and third layers; a prepreg is placed between the third and fourth layers; a core board is placed between the fourth and fifth layers; and a prepreg is placed between the fifth and sixth layers. The first layer contains physical components, the second layer is grounded, the third layer contains signal lines, the fourth layer contains power lines, the fifth layer is grounded, and the sixth layer contains physical components. It can be seen that this multilayer circuit board for electromagnetic interference protection adopts a symmetrical structural design. Since the second and fifth layers are both grounded layers, a symmetrical shielding structure is formed, which can effectively suppress electromagnetic radiation leakage from the third and fourth layers to the outside. Simultaneously, external electromagnetic radiation, after penetrating the first or sixth layer, will be absorbed by the second or fifth layer, thereby reducing its impact on the third and fourth layers. This multilayer circuit board for electromagnetic interference protection has excellent electromagnetic interference protection capabilities and can effectively improve the service life of electronic equipment.

[0024] The fourth layer features multiple distinct power supply zones, each corresponding to a different supply voltage. This multilayer circuit board, designed to mitigate electromagnetic interference, contains multiple functional modules, each requiring a different supply voltage. By providing customized voltages to these modules through different power supply zones, damage or performance degradation caused by voltage mismatch can be avoided. Furthermore, the multiple power supply zones on the fourth layer reduce the current loop area of ​​individual power supply zones, effectively suppressing radiated noise. Moreover, each power supply zone is grounded via an independent grounding path, minimizing the superposition effect of common-mode currents and effectively suppressing common-mode noise.

[0025] Surface-mount capacitors are used to bridge adjacent power supply regions. By bridging adjacent power supply regions with surface-mount capacitors, high-frequency noise can be blocked from propagating between them, improving the system's signal-to-noise ratio. Furthermore, bridging surface-mount capacitors can also balance power supply fluctuations and enhance power supply stability.

[0026] The capacitance and package type of the surface mount capacitor can be set as needed. Preferably, the capacitance of the surface mount capacitor is 0.1μF, and the surface mount capacitor uses a 0402 package.

[0027] The fourth layer also includes a first grounding area, with a signal area at its center containing signal lines. By setting up a first grounding area on the fourth layer, placing a signal area at its center, and arranging signal lines within that signal area, a low-impedance return path can be provided for the signal, reducing electromagnetic radiation.

[0028] The first, second, third, fourth, fifth, and sixth layers are electrically connected via through-holes. Connecting these layers electrically vias reduces signal reflection, crosstalk, and other adverse effects, thus improving signal transmission quality.

[0029] The vias are evenly distributed along the edges of the first, second, third, fourth, fifth, and sixth layers. By evenly distributing the vias along the edges of these layers, they are kept away from sensitive internal circuitry on the circuit board, thereby reducing interference with other signals.

[0030] The spacing between adjacent through holes can be set according to actual needs. Preferably, the spacing between adjacent through holes is 100mil-200mil.

[0031] The system incorporates second grounding areas in layers one through six, with vias embedded within these areas. Surface-mount capacitors bridge the second grounding areas to adjacent power supply areas. By establishing second grounding areas in all six layers and embedding vias within them, a Faraday cage effect is created, shielding sensitive radio frequency signals and external interference. The Faraday cage effect refers to the function of a closed space made of metal or conductive material to block the intrusion of external electric fields and electromagnetic waves while preventing the leakage of internal electromagnetic waves. When an external electric field acts on the Faraday cage, the charge on the cage surface redistributes, neutralizing the influence of the external electric field and maintaining the electric field strength within the cage at an extremely low level, sometimes even close to zero. By bridging the second grounding areas to adjacent power supply areas with surface-mount capacitors, high-frequency noise generated by adjacent power supply areas can be directed to the second grounding areas, effectively suppressing the propagation of high-frequency noise. The second contact area is ring-shaped and distributed along the edges of the first, second, third, fourth, fifth, and sixth layers.

[0032] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0033] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A multilayer circuit board for electromagnetic interference protection, characterized in that, It includes a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer arranged from top to bottom. A semi-cured sheet is arranged between the first layer and the second layer, a core board is arranged between the second layer and the third layer, a semi-cured sheet is arranged between the third layer and the fourth layer, a core board is arranged between the fourth layer and the fifth layer, and a semi-cured sheet is arranged between the fifth layer and the sixth layer. The first layer contains physical devices, the second layer is grounded, the third layer contains signal lines, the fourth layer contains power lines, the fifth layer is grounded, and the sixth layer contains physical devices.

2. The multilayer circuit board for electromagnetic interference protection according to claim 1, characterized in that, The fourth layer is provided with multiple different power supply zones, and each power supply zone corresponds to a different power supply voltage.

3. The multilayer circuit board for electromagnetic interference protection according to claim 2, characterized in that, Surface mount capacitors bridge adjacent power supply areas.

4. The multilayer circuit board for electromagnetic interference protection according to claim 3, characterized in that, The capacitance of the surface-mount capacitor is 0.1μF.

5. The multilayer circuit board for electromagnetic interference protection according to claim 4, characterized in that, The surface-mount capacitor is in a 0402 package.

6. The multilayer circuit board for electromagnetic interference protection according to any one of claims 2 to 5, characterized in that, The fourth layer is also provided with a first grounding area, and a signal area is provided at the center of the first grounding area, and signal lines are arranged in the signal area.

7. The multilayer circuit board for electromagnetic interference protection according to claim 6, characterized in that, The first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer are electrically connected through through-holes.

8. The multilayer circuit board for electromagnetic interference protection according to claim 7, characterized in that, The through holes are evenly distributed on the edges of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer.

9. The multilayer circuit board for electromagnetic interference protection according to claim 8, characterized in that, The spacing between adjacent through holes is 100mil-200mil.

10. The multilayer circuit board for electromagnetic interference protection according to claim 9, characterized in that, The first layer, the second layer, the third layer, the fourth layer, the fifth layer and the sixth layer are all provided with a second grounding area, the through hole is provided in the second grounding area, and the second grounding area is bridged with the adjacent power supply area by a surface-mount capacitor.

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