Heat dissipation assembly, electronic equipment and vehicle

Abstract

The utility model relates to a heat dissipation assembly, electronic equipment and a vehicle, the heat dissipation assembly comprises a heat dissipation piece and a first heating device, the heat dissipation piece comprises a first main body part and a second main body part, the first main body part is provided with a first flow channel, and the second main body part is provided with a groove; the first heating device covers the groove and defines a second flow channel, the first flow channel is communicated with the second flow channel, and the first main body part is used for exchanging heat with a second heating device. By designing the second flow channel defined by the second main body part and the first heating device together, it is ensured that the cooling medium can make contact with the surface of the first heating device more directly and more effectively, heat is taken away more efficiently, and the heat dissipation efficiency is remarkably improved; therefore, the heat dissipation assembly can carry out efficient heat dissipation treatment on a plurality of heating sources at the same time, and the overall heat dissipation performance is greatly improved.

Description

Technical Field

[0001] This application relates to the field of vehicle parts technology, and in particular to a heat dissipation component, electronic equipment, and vehicle. Background Technology

[0002] Electronic devices such as chargers and motor controllers contain a variety of heat-generating components, including power devices, filter circuits, and magnetic components. These heat-generating components rely on heat dissipation structures for effective heat dissipation.

[0003] Currently, the common practice is to mount these heat-generating components onto the outer casing of the heat dissipation structure to achieve heat dissipation. However, this method has limitations in heat dissipation efficiency and capacity. Utility Model Content

[0004] This application provides a heat dissipation component, electronic device, and vehicle to improve heat dissipation efficiency and capacity, thereby at least partially solving the aforementioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, a heat dissipation component is provided, comprising:

[0006] A heat sink includes a first main body and a second main body, wherein the first main body is provided with a first flow channel and the second main body is provided with a groove;

[0007] A first heating element covers the groove and defines a second flow channel. The first flow channel and the second flow channel are connected. The first main body is used for heat exchange with the second heating element.

[0008] Optionally, the first main body and the second main body are spaced apart in a first direction, and the heat dissipation assembly further includes a first connecting portion that connects the first main body and the second main body.

[0009] Optionally, the first main body portion and the second main body portion are disposed opposite to each other in a first direction;

[0010] The groove is located on the side of the second main body that is away from the first main body.

[0011] Optionally, the heat sink further includes a third main body, which has a third flow channel that communicates with the second flow channel, and the third main body is used for heat exchange with a third heat-generating device.

[0012] Optionally, the heat sink further includes a fourth main body and a second connecting part, the second connecting part connecting the third main body and the fourth main body, the fourth main body having a fourth flow channel communicating with the third flow channel, the fourth main body and the third main body being disposed opposite to each other in a first direction, the fourth main body and the third main body being disposed on both sides of the third heating device.

[0013] Optionally, the second main body portion and the third main body portion are spaced apart in the second direction.

[0014] The heat dissipation assembly further includes a third connecting portion, which connects the second main body portion and the third main body portion, and the second main body portion and the third main body portion are connected to the same side of the third connecting portion.

[0015] Optionally, the heat dissipation assembly further includes a first sealing ring disposed between the groove wall and the first heat-generating device; and / or,

[0016] The heat dissipation assembly further includes a second sealing ring, which is disposed between the first main body and the first connecting portion; and / or,

[0017] The heat dissipation assembly also includes a third sealing ring, which is disposed between the second connecting portion and the fourth main body portion.

[0018] Optionally, the first heating device includes a base plate and components. The base plate covers the groove, and the components are disposed on the side of the base plate away from the groove and are at least partially opposite to the groove.

[0019] Optionally, the first heating device further includes a molding compound, through which the component is encapsulated in the base plate.

[0020] Optionally, the second side of the base plate is provided with a protrusion, and when the base plate covers the groove, the protrusion is located in the groove.

[0021] According to a second aspect of this application, an electronic device is provided, including a heat dissipation component and a second heat-generating device as described in any one of the above claims.

[0022] Optionally, the second heating device is sandwiched between the first main body and the second main body.

[0023] According to a third aspect of this application, a vehicle is provided, including the electronic equipment described above.

[0024] In the heat dissipation assembly of this application embodiment, the heat sink includes a first main body and a second main body. The first main body has a first flow channel; the second main body has a groove, and a first heating device covers the groove of the second main body, jointly defining a second flow channel. The first and second flow channels are connected, allowing the cooling medium to flow through both channels. By designing the second flow channel jointly defined by the second main body and the first heating device, it is ensured that the cooling medium can contact the surface of the first heating device more directly and effectively, thereby removing heat more efficiently and significantly improving heat dissipation efficiency. In addition, the first main body is also used for heat exchange with the second heating device, which means that the heat dissipation assembly can not only effectively handle the heat generated by the first heating device, but also manage the heat from the second heating device at the same time. This design enables the heat dissipation assembly to efficiently dissipate heat from multiple heat sources simultaneously, greatly enhancing the overall heat dissipation performance. In summary, by optimizing the heat conduction path and achieving efficient heat dissipation from multiple heat sources simultaneously, this heat dissipation assembly significantly improves heat dissipation efficiency and heat dissipation capacity.

[0025] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0028] Figure 1 This is a perspective view of the heat dissipation component provided in an exemplary embodiment of this disclosure;

[0029] Figure 2 yes Figure 1 An exploded view of the heat dissipation components;

[0030] Figure 3 yes Figure 1 A three-dimensional schematic diagram of the heat sink component;

[0031] Figure 4 yes Figure 1 A three-dimensional schematic diagram of the first heating element in the process;

[0032] Figure 5 yes Figure 4 A three-dimensional schematic diagram of the first heating element from another perspective.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Heat dissipation assembly; 1. Heat dissipation component; 11. First main body; 12. First connecting part; 13. Second main body; 131. Groove; 14. Third connecting part; 15. Third main body; 16. Second connecting part; 17. Fourth main body; 101. Liquid inlet; 102. Liquid outlet; 2. First heating element; 21. Base plate; 211. Protrusion; 22. Plastic encapsulation part; 23. Overcurrent terminal; 24. Signal terminal; 3. Second sealing ring; 4. Third sealing ring. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0036] Please see Figures 1 to 3 This application provides a heat dissipation assembly 100, including a heat sink 1 and a first heating device 2. The heat sink 1 includes a first main body 11 and a second main body 13. The first main body 11 is provided with a first flow channel, and the second main body 13 is provided with a groove 131. The first heating device 2 covers the groove 131 and defines a second flow channel. The first flow channel and the second flow channel are connected. The first main body 11 is used for heat exchange with the second heating device (not shown in the figure).

[0037] In the technical solution of this application, by designing a second flow channel jointly defined by the second main body 13 and the first heating element 2, the cooling medium can be ensured to contact the surface of the first heating element 2 more directly and effectively, thereby removing heat more efficiently and significantly improving heat dissipation efficiency. Furthermore, the first main body 11 is also used for heat exchange with the second heating element, meaning that the heat dissipation assembly 100 can not only effectively handle the heat generated by the first heating element 2, but also manage the heat from the second heating element simultaneously. This design enables the heat dissipation assembly 100 to efficiently dissipate heat from multiple heat sources simultaneously, greatly enhancing overall heat dissipation performance. In summary, by optimizing the heat conduction path and achieving efficient heat dissipation from multiple heat sources simultaneously, the heat dissipation assembly 100 significantly improves heat dissipation efficiency and capacity.

[0038] It should be noted that in certain specific application scenarios, such as low-temperature environments or when preheating equipment is required, the heat dissipation component 100 can also be used for heating operations. By adjusting the temperature of the cooling medium, the cooling medium carries heat through the first and second flow channels, thereby transferring heat to the first heating element 2 and the second heating element, ensuring that they reach a suitable operating temperature and can quickly enter the optimal working state.

[0039] Please see Figure 3 In some embodiments, the first main body portion 11 and the second main body portion 13 are spaced apart in a first direction, and the heat dissipation assembly 100 further includes a first connecting portion 12, which connects the first main body portion 11 and the second main body portion 13. In these embodiments, by spaced apart in a first direction and connecting the two using the first connecting portion 12, this structural design provides the heat dissipation assembly 100 with a more flexible layout and a more efficient heat dissipation path. Specifically, the spaced arrangement of the first main body portion 11 and the second main body portion 13 optimizes the flow path of the cooling medium, avoids excessive heat accumulation in local areas, and thus improves heat dissipation efficiency. Simultaneously, the introduction of the first connecting portion 12 not only enhances the overall structural stability of the heat dissipation assembly 100 but also allows adjustment of the distance and relative position between the first main body portion 11 and the second main body portion 13 according to actual needs, further optimizing heat dissipation performance. This design enables the heat dissipation assembly 100 to better adapt to the layout and heat dissipation requirements of different heat-generating devices, improving the versatility and adaptability of the heat dissipation system. In summary, by arranging the first main body 11 and the second main body 13 at intervals and connecting them using the first connecting part 12, the heat dissipation assembly 100 can optimize the flow path of the cooling medium, avoid local heat accumulation, enhance structural stability, and improve the versatility and adaptability of the heat dissipation system, thereby significantly improving heat dissipation efficiency and heat dissipation capacity.

[0040] Please see Figure 3 In some embodiments, the first main body portion 11 and the second main body portion 13 are disposed opposite to each other in a first direction; a groove 131 is provided on the side of the second main body portion 13 opposite to the first main body portion 11. In these embodiments, the first main body portion 11 and the second main body portion 13 are disposed opposite to each other in the first direction, that is, the first main body portion 11 and the second main body portion 13 are connected to the same side of the first connecting portion 12, making the overall layout of the heat dissipation assembly 100 more compact and effectively saving space. At the same time, the groove 131 is provided on the side of the second main body portion 13 opposite to the first main body portion 11. This design facilitates the installation and maintenance of the first heat-generating device 2 and reduces the difficulty and time cost in the assembly process. Through this optimized structural layout, the heat dissipation assembly 100 maintains high-efficiency heat dissipation performance while improving assembly efficiency and maintenance convenience, further enhancing the overall performance of the product and the user experience.

[0041] This application does not specifically limit the shape of the groove 131 or the number of grooves 131, nor does it specifically limit the shape of the first heating element 2. The groove shape can be rectangular (as shown in the image). Figure 3 As shown), square or other shapes, the shape of the first heating device 2 can also be rectangular, square or other shapes, the number of grooves 131 can be multiple, and multiple first heating devices 2 can also be set, as long as the first heating device 2 can cover the grooves 131 to form a closed whole that defines the second flow channel.

[0042] Please see Figure 3 In some embodiments, the heat sink 1 further includes a third main body 15, which has a third flow channel communicating with the second flow channel. The third main body 15 is used for heat exchange with a third heat-generating device (not shown in the figure). In these embodiments, by introducing the third main body 15 and the third flow channel, this design allows the heat sink assembly 100 to simultaneously handle heat from multiple heat sources (first heat-generating device 2, second heat-generating device, and third heat-generating device) at different locations or of different types, further expanding the thermal management capability of the heat sink assembly 100. This layout not only enhances the system's support for multiple heat sources, ensuring that each heat-generating device can be effectively cooled, but also optimizes the flow path of the cooling medium throughout the heat sink system by interconnecting the various flow channels, improving the overall heat dissipation efficiency and uniformity. Therefore, in these embodiments, this design significantly improves the overall heat dissipation performance and adaptability of the heat sink assembly 100 by enhancing the management of multiple heat sources and optimizing the flow path of the cooling medium.

[0043] Please see Figure 3In some embodiments, the heat sink 1 further includes a fourth main body portion 17 and a second connecting portion 16. The second connecting portion 16 connects the third main body portion 15 and the fourth main body portion 17. The fourth main body portion 17 is provided with a fourth flow channel, which communicates with the third flow channel. The fourth main body portion 17 and the third main body portion 15 are arranged opposite to each other in a first direction and are positioned on both sides of the third heat-generating device. In these embodiments, by adding a fourth main body portion 17 to the heat sink 1 and connecting it with the second connecting portion 16, the fourth flow channel is connected to the third flow channel, allowing the cooling medium to flow over a wider area, thereby absorbing and dissipating heat more efficiently. Furthermore, the fourth main body portion 17 and the third main body portion 15 are arranged opposite to each other in the first direction and are positioned on both sides of the third heat-generating device. This arrangement allows for heat dissipation of the third heat-generating device from multiple directions, further improving heat dissipation efficiency. This multi-channel, multi-directional heat dissipation design not only enhances the heat dissipation capacity of the heat sink assembly 100 for multiple heat sources but also improves the overall performance and reliability of the heat dissipation system. In summary, by adding a fourth main body 17 and optimizing the flow channel layout, the heat dissipation assembly 100 can handle the heat from multiple heat sources more efficiently, significantly improving heat dissipation efficiency and heat dissipation capacity.

[0044] Please see Figure 3 In some embodiments, the second main body portion 13 and the third main body portion 15 are spaced apart in the second direction. The heat dissipation assembly 100 also includes a third connecting portion 14, which connects the second main body portion 13 and the third main body portion 15, and the second main body portion 13 and the third main body portion 15 are connected to the same side of the third connecting portion 14. In these embodiments, by spaced apart in the second direction, the flow path of the cooling medium is optimized, and excessive heat accumulation in local areas is avoided, thereby improving heat dissipation efficiency. At the same time, this connection method enhances the overall structural stability of the heat dissipation assembly 100 and reduces structural deformation caused by factors such as thermal expansion. In addition, connecting the second main body portion 13 and the third main body portion 15 to the same side of the third connecting portion 14 makes the heat dissipation assembly 100 more rational and compact in spatial layout. In summary, by optimizing the spacing and connection method of the second main body portion 13 and the third main body portion 15, the heat dissipation assembly 100 not only improves heat dissipation efficiency and structural stability, but also makes the spatial layout more rational and compact.

[0045] In some embodiments, the heat dissipation assembly 100 further includes a first sealing ring (not shown in the figure), which is disposed between the groove wall of the groove 131 and the first heating element 2. In these embodiments, the first sealing ring is disposed between the groove wall of the groove 131 and the first heating element 2. This design can effectively prevent the cooling medium from leaking from the gap between the groove 131 and the first heating element 2, ensuring that the cooling medium flows smoothly in the second flow channel, thereby improving the heat dissipation efficiency. At the same time, the first sealing ring can also play a buffering role, reducing damage to the first heating element 2 and the heat sink 1 caused by thermal expansion or mechanical vibration, and enhancing the reliability and service life of the heat dissipation assembly 100.

[0046] It should be further noted that this application does not limit the specific manner in which the first heating element 2 is disposed on the groove 131, nor the specific contact position between the first sealing ring and the groove wall. Specifically, in one implementation, when the size of the first heating element 2 is comparable to the groove opening, the first sealing ring can be disposed on the side of the groove wall facing inwards from the groove 131, located between the groove wall and the outer periphery of the first heating element 2, forming a radial seal. In another implementation, when the size of the first heating element 2 is larger than the groove opening, the first sealing ring can be disposed on the end face of the groove wall facing away from the bottom surface of the groove 131, located between the groove wall and one side of the first heating element 2, forming a planar seal.

[0047] Please see Figure 3 In some embodiments, the heat dissipation assembly 100 further includes a second sealing ring 3, which is disposed between the first main body portion 11 and the first connecting portion 12. In these embodiments, the second sealing ring 3 is disposed between the first main body portion 11 and the first connecting portion 12. This design effectively prevents the cooling medium from leaking from the connection between the first main body portion 11 and the first connecting portion 12, ensuring smooth flow of the cooling medium between the first and second flow channels, and improving the sealing performance and flow efficiency within the heat dissipation assembly 100. By providing the second sealing ring 3, the heat dissipation assembly 100 can maintain stable heat dissipation performance during operation, avoiding a decrease in heat dissipation efficiency due to cooling medium leakage, while also improving the structural stability and safety of the entire heat dissipation assembly 100. It should also be noted that the second sealing ring 3 can form a radial seal or a planar seal between the first main body portion 11 and the first connecting portion 12.

[0048] Please see Figure 3In some embodiments, the heat dissipation assembly 100 further includes a third sealing ring 4, which is disposed between the second connecting portion 16 and the fourth main body portion 17. In these embodiments, the third sealing ring 4 is disposed between the second connecting portion 16 and the fourth main body portion 17. This design effectively prevents the cooling medium from leaking from the connection between the second connecting portion 16 and the fourth main body portion 17, ensuring smooth flow of the cooling medium between the third and fourth flow channels, and improving the sealing performance and flow efficiency within the heat dissipation assembly 100. The third sealing ring 4 not only improves the sealing performance of the heat dissipation assembly 100 but also reduces the impact of thermal expansion or mechanical vibration on the connection points, enhancing the overall structural stability and reliability of the heat dissipation assembly 100, thereby ensuring that the heat dissipation assembly 100 maintains high-efficiency heat dissipation performance under complex operating conditions. It should also be noted that the second sealing ring 3 can form a radial seal or a planar seal between the first main body portion 11 and the first connecting portion 12.

[0049] Please see Figure 4 and Figure 5 In some embodiments, the first heating device 2 includes a base plate 21 and components. The base plate 21 covers the groove 131, and the components are disposed on the side of the base plate 21 opposite to the groove 131, and at least partially opposite to the groove 131. In these embodiments, by directly covering the groove 131 with the base plate 21 of the first heating device 2, efficient heat conduction between the heating device and the heat dissipation assembly 100 can be achieved. The base plate 21, as an intermediate layer for heat conduction, can quickly transfer the heat generated by the components to the cooling medium, reducing thermal resistance and improving heat dissipation efficiency. Since the components are disposed on the side of the base plate 21 opposite to the groove 131, and at least partially opposite to the groove 131, this layout ensures that heat can be directly transferred from the area where the components are most concentrated to the base plate 21 and into the cooling medium. This helps to avoid local overheating and improve the uniformity of overall heat dissipation. Integrating the components on the base plate 21 makes the entire first heating device 2 a single module, facilitating installation and maintenance. Assembly can be completed simply by placing the base plate 21 over the groove 131, which reduces complicated installation steps and lowers assembly difficulty and time costs.

[0050] In some cases, the base plate 21 is made of aluminum. Aluminum not only has good heat exchange performance, but also has the characteristics of being lightweight. This not only improves heat exchange efficiency, but also helps to realize the lightweight design of the equipment.

[0051] In some examples, heat sink 1 is made of aluminum, which has the advantages of excellent heat exchange performance, lightweight properties and easy molding to construct internal flow channels. This not only improves heat dissipation efficiency, but also helps to achieve lightweight design of the equipment and reduces manufacturing costs.

[0052] In some examples, the base plate 21 covers the groove 131, and the outer periphery of the base plate 21 extends beyond the groove 131 to have an overhang. The overhang is provided with mounting holes for fasteners to be inserted to fix the base plate 21.

[0053] Please see Figure 4 and Figure 5 In some embodiments, the first heating device 2 further includes a molding compound 22, through which the component is encapsulated on the base plate 21. In these embodiments, the molding compound 22 provides additional physical protection for the component, preventing it from being affected by external environmental factors (such as moisture, dust, and mechanical shock), thereby improving the reliability and service life of the component. The molding compound 22 not only provides mechanical protection but also enhances the electrical insulation performance between components, reducing the risk of short circuits and other electrical faults, which is particularly important in high-density integrated electronic devices. By using the molding compound 22 to encapsulate the component, the entire manufacturing process can be simplified. The molding process is mature and easy to automate, helping to reduce production costs and improve production efficiency. Since the component is encapsulated in a single structure, the first heating device 2 becomes an independent module, facilitating installation and maintenance. Assembly can be completed simply by placing the integrated module with the molding compound 22 onto the recess 131, reducing complex installation steps and lowering assembly difficulty and time costs. The molding process allows for customized design according to actual needs, not only encapsulating different types of components but also adapting to various complex shapes and layout requirements, providing greater design flexibility. In summary, by introducing the molding compound 22 to encapsulate the components, this design not only significantly improves the mechanical protection of the components but also enhances electrical insulation, simplifies the manufacturing process, improves assembly convenience, and provides greater design flexibility. This design enables the first heat-generating device 2 to achieve higher reliability and a longer service life while ensuring efficient heat dissipation, making it suitable for a variety of complex application scenarios. The material of the molding compound 22 can be epoxy resin, polyethylene, etc., and this application does not impose specific limitations.

[0054] In some examples, the first heating device 2 is a power module, the components are switching devices, and the power module also includes an overcurrent terminal 23 and a signal terminal 24. The switching device, the overcurrent terminal 23 and the signal terminal 24 are encapsulated in the base plate 21 by the plastic encapsulation part 22.

[0055] Please see Figure 4In some embodiments, a protrusion 211 is provided on the second side of the base plate 21, and when the base plate 21 covers the groove 131, the protrusion 211 is located in the groove 131. In these embodiments, by providing the protrusion 211 on the second side of the base plate 21 and placing it within the groove 131, the protrusion 211 can more effectively transfer heat to the cooling medium, increasing the contact area between the base plate 21 and the cooling medium flowing through the second flow channel, thereby improving the heat dissipation performance of the entire heat dissipation assembly 100.

[0056] In some embodiments, the heat dissipation assembly 100 has a liquid inlet 101 and a liquid outlet 102. The liquid inlet 101 is formed in the first main body portion 11, and the liquid outlet 102 is formed in the fourth main body portion 17. It is understood that the closer to the liquid inlet 101, the better the heat dissipation effect of the cooling medium. The liquid inlet 101 is formed in the first main body portion 11, which makes the heat dissipation effect of the cooling medium in the first flow channel and the second flow channel better, and can effectively dissipate heat from the first heat-generating device 2 and the second heat-generating device.

[0057] In some embodiments, the first direction is the direction of gravity. The first main body 11 and the fourth main body 17 form the first and fourth flow channels in the lower layer, while the second main body 13 and the third main body 15 form the second and third flow channels in the upper layer. The inlet 101 and the outlet 102 are respectively connected to the first and fourth flow channels in the lower layer. The cooling medium enters the first flow channel in the lower layer through the inlet 101, then flows upward into the second flow channel in the upper layer, then into the third flow channel, then downward into the fourth flow channel, and finally flows out from the outlet 102. This flow path, from the lower layer to the upper layer and then back down, ensures that the cooling medium is evenly distributed throughout the system and effectively dissipates heat. The cooling medium undergoes heat exchange sequentially in the flow channels at different levels, maximizing the utilization of the entire surface area of ​​the heat dissipation assembly and significantly improving heat dissipation efficiency. Furthermore, concentrating the inlet 101 and outlet 102 in the lower layer simplifies pipe layout and connections, reduces complex piping design, and lowers manufacturing costs and assembly difficulty. At the same time, this design also makes it easier to inspect and clean the inside of the cooling system, especially for equipment that requires regular maintenance, making operation more convenient.

[0058] According to a second aspect of this application, an electronic device is provided, including a heat dissipation assembly 100 as described above and a second heat-generating device. The structure of the heat dissipation assembly 100 is as described above. Since this electronic device adopts all the technical solutions of all the above embodiments, it at least has the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0059] This application does not specifically limit the electronic device; the electronic device can be a charger, a motor controller, etc.

[0060] In some embodiments, the electronic device is a charger, wherein the first heat-generating device 2 is a power module. Components in the power module include switching devices used for high-frequency switching of the power circuit; the main source of heat generation is switching losses. These switching devices may include PFC fast transistors, PFC power frequency transistors, LLC primary-side switches, LLC secondary-side switches, DC-DC primary-side switches, and DC-DC secondary-side switches. Signal terminals 24 include leads for the gate, source, and drain of the switching devices, used for connection to external control circuitry (such as a driver board). The second heat-generating device is a magnetic device, mainly including a PFC inductor, an OBC transformer, and a DC transformer, used for voltage step-up / step-down and AC / DC conversion. The third heat-generating device is a filter circuit, composed of a common-mode inductor, a differential-mode inductor, and X and Y capacitors, used to filter out harmonic components in the power circuit, improve the power factor, reduce ripple, and enhance electromagnetic compatibility (EMC) performance. The charger also includes a power board and a driver board. The power board, serving as the main control board, includes power conversion circuits, internal and external communication circuits, sampling circuits, and protection circuits, enabling OBC charging, inverter functions, and DC-DC step-down functions. The driver board, connected to the power board via drive signal terminals, includes a drive power supply circuit and a driver chip, used to control the switching devices integrated on the power module. The filter circuit is connected to the power board via a high-voltage filter connector, and the magnetic components are connected to the power board via a magnetic component high-voltage connector and overcurrent terminal 23.

[0061] In some embodiments, the second heating element is sandwiched between the first main body portion 11 and the second main body portion 13. In these embodiments, sandwiching the second heating element between the first main body portion 11 and the second main body portion 13 allows the heat generated by the second heating element to be directly transferred to both the first and second main body portions 11 and 13, enabling the second heating element to dissipate heat from both sides simultaneously, improving heat dissipation efficiency, and ensuring that heat is quickly conducted and dissipated. By sandwiching the second heating element between the two main body portions, this design makes the entire heat dissipation assembly 100 more compact and saves space. This compact layout is particularly suitable for space-constrained electronic devices, improving the applicability of the heat dissipation assembly 100.

[0062] In some examples, the first heating device 2 is a power module, wherein the components are switching devices and the second heating device is a magnetic device. The power module covers the groove 131 of the second main body 13, and the magnetic device is sandwiched between the first main body 11 and the second main body 13, so that the power module and the magnetic device are located on both sides of the second main body 13, which facilitates the connection between the switching device and the magnetic device.

[0063] According to a third aspect of this application, a vehicle is provided, including an electronic device. The structure of the electronic device is as described above. Since this vehicle adopts all the technical solutions of all the above embodiments, it has at least the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0064] The vehicle may be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this disclosure does not make any specific restrictions.

[0065] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0066] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0067] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0068] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A heat dissipation component, characterized in that, include: A heat sink includes a first main body and a second main body, wherein the first main body is provided with a first flow channel and the second main body is provided with a groove; A first heating element covers the groove and defines a second flow channel. The first flow channel and the second flow channel are connected. The first main body is used for heat exchange with the second heating element.

2. The heat dissipation assembly according to claim 1, characterized in that, The first main body and the second main body are spaced apart in a first direction, and the heat dissipation assembly further includes a first connecting part, which connects the first main body and the second main body.

3. The heat dissipation assembly according to claim 2, characterized in that, The first main body portion and the second main body portion are disposed opposite to each other in a first direction; The groove is located on the side of the second main body that is away from the first main body.

4. The heat dissipation assembly according to any one of claims 1 to 3, characterized in that, The heat sink further includes a third main body, which has a third flow channel that communicates with the second flow channel. The third main body is used for heat exchange with a third heat-generating device.

5. The heat dissipation assembly according to claim 4, characterized in that, The heat sink further includes a fourth main body and a second connecting part. The second connecting part connects the third main body and the fourth main body. The fourth main body is provided with a fourth flow channel, which communicates with the third flow channel. The fourth main body and the third main body are arranged opposite to each other in a first direction. The fourth main body and the third main body are used to be disposed on both sides of the third heating device.

6. The heat dissipation assembly according to claim 5, characterized in that, The second main body portion and the third main body portion are spaced apart in the second direction. The heat dissipation assembly further includes a third connecting portion, which connects the second main body portion and the third main body portion, and the second main body portion and the third main body portion are connected to the same side of the third connecting portion.

7. The heat dissipation assembly according to claim 5, characterized in that, The heat dissipation assembly further includes a first sealing ring, which is disposed between the groove wall and the first heat-generating device; and / or, The heat dissipation assembly further includes a second sealing ring, which is disposed between the first main body and the first connecting portion; and / or, The heat dissipation assembly also includes a third sealing ring, which is disposed between the second connecting portion and the fourth main body portion.

8. The heat dissipation assembly according to claim 1, characterized in that, The first heating device includes a base plate and components. The base plate covers the groove, and the components are disposed on the side of the base plate away from the groove and are at least partially opposite to the groove.

9. The heat dissipation assembly according to claim 8, characterized in that, The first heating device also includes a plastic encapsulation portion, through which the component is encapsulated in the base plate.

10. The heat dissipation assembly according to claim 8, characterized in that, The second side of the base plate is provided with a protrusion, and when the base plate covers the groove, the protrusion is located in the groove.

11. An electronic device, characterized in that, It includes the heat dissipation component and the second heat-generating device as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The second heating element is sandwiched between the first main body and the second main body.

13. A vehicle, characterized in that, Including the electronic device as described in claim 11 or 12.

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