Transplanter behind reflow soldering furnace

Abstract

The utility model discloses a transfer machine behind a reflow soldering furnace. The transfer machine comprises a rack, a double-track mechanism, a translation buffering mechanism and a cooling mechanism, the double-track mechanism comprises a first track, a first jacking mechanism, a second track and a second jacking mechanism, and the first track and the second track are used for conveying PCBs; the translation caching mechanism comprises a PCB Y-axis transverse moving module and a caching manipulator, and the caching manipulator is mounted at the movable end of the PCB Y-axis transverse moving module; the cooling mechanism comprises a first fan and a second fan, the first fan is arranged at the top of the machine base, the second fan is arranged at the top of the machine cover, the first fan is used for blowing air, and the second fan is used for exhausting air. According to the transfer machine, double-track conveying can be changed into single-track conveying, the transfer machine can adapt to conveying of PCBs between reflow soldering equipment and cleaning detection equipment, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED chip technology, specifically to a reflow oven post-transfer machine. Background Technology

[0002] LED technology is considered one of the most promising high-tech technologies of the 21st century, and advanced machinery and equipment are essential for the development of the LED industry. LED production line equipment mainly includes printing presses, dispensing machines, chip mounters, reflow soldering machines, and cleaning and inspection equipment. Among these, a transfer machine is needed to transport the mounted PCBs to the reflow soldering equipment for soldering. Generally, reflow soldering equipment has a dual-track design, while the cleaning and inspection equipment has a single track. However, existing transfer machines only have one track, which can only connect to one track of the reflow soldering equipment. This leaves one track of the reflow soldering equipment idle, wasting capacity. Alternatively, two transfer machines could be used to connect two cleaning and inspection machines and one reflow soldering machine, but this increases production costs. The PCBs exiting the reflow soldering equipment need to be cooled down, but existing transfer machines rely on natural cooling, which is slow. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, this utility model provides a reflow oven transfer machine that can change the dual-track conveyor to a single-track conveyor, which can adapt to the conveying of PCB boards between reflow soldering equipment and cleaning and testing equipment, thereby improving production efficiency.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A reflow oven transfer machine includes a frame, a double-track mechanism, a translation buffer mechanism, and a cooling mechanism;

[0006] The frame includes a base, columns mounted on the base, and a cover;

[0007] The dual-track mechanism is mounted on the base and includes a first track, a first lifting mechanism, a second track, and a second lifting mechanism. The first track and the second track are used to transport PCB boards. The first lifting mechanism is used to lift the PCB board on the first track, and the second lifting mechanism is used to lift the PCB board on the second track.

[0008] The translational buffer mechanism includes a PCB board Y-axis transverse module and a buffer robot. The PCB board Y-axis transverse module is mounted on the column, and the buffer robot is mounted on the movable end of the PCB board Y-axis transverse module. The buffer robot is used to pick up and place PCB boards.

[0009] The cooling mechanism includes a first fan and a second fan. The first fan is located on the top of the base, and the second fan is located on the top of the cover. The first fan is used for blowing air, and the second fan is used for exhausting air.

[0010] As a further improvement to the above technical solution, multiple first fans and multiple second fans are provided, and the multiple first fans are arranged in a multi-row array. At least two rows of first fans are provided below the first track and the second track.

[0011] As a further improvement to the above technical solution, both the first track and the second track include two conveying rails and a first driving device. The conveying rail includes a conveying profile beam, a roller conveying chain, sprockets, chain idlers, and chain support rails. The roller conveying chain is installed on the conveying profile beam through sprockets, chain idlers, and chain support rails. The first driving device is used to drive the sprockets of the two conveying rails to rotate so as to drive the roller conveying chain transmission.

[0012] As a further improvement to the above technical solution, both ends of the first track and the second track are respectively connected to a conveyor rail spacing adjustment mechanism, which is used to adjust the spacing between the two conveyor rails of the first track and the second track.

[0013] As a further improvement to the above technical solution, both the first lifting mechanism and the second lifting mechanism include a lifting cylinder and a fixture support bar disposed at the movable end of the lifting cylinder, wherein the lifting cylinder is mounted on the machine base.

[0014] As a further improvement to the above technical solution, the buffer robot includes two buffer mechanisms arranged opposite to each other. Each buffer mechanism includes a buffer bin support frame, a hopper drive shaft, a fixed guide rod, a second drive device, and multiple lifting buffer components. The buffer bin support frame is connected to the movable end of the PCB board Y-axis transverse module. The second drive device, the hopper drive shaft, and the fixed guide rod are all connected to the buffer bin support frame. The lifting buffer components are mounted on the fixed guide rod. The second drive device is used to drive the hopper drive shaft to rotate so as to drive the lifting buffer components to move.

[0015] As a further improvement to the above technical solution, the lifting buffer assembly includes a support plate, a drive sprocket, a driven sprocket, a curved plate chain, and a lifting tray. The support plate is fixedly connected to a fixed guide rod. The drive sprocket is mounted on the hopper drive shaft. The driven sprocket is mounted on the support plate via a driven shaft. The curved plate chain is connected between the drive sprocket and the driven sprocket. The lifting tray includes multiple trays that are spaced apart on the curved plate chain.

[0016] As a further improvement to the above technical solution, the transplanter also includes a buffer spacing adjustment mechanism, which includes an adapter plate, a linear guide rail and a lead screw module. The buffer compartment support frames of the two buffer mechanisms are both connected to the adapter plate, and the adapter plate is slidably connected to the movable end of the Y-axis transverse module of the PCB board. The ball nut of the lead screw module is connected to one of the buffer compartment support frames.

[0017] As a further improvement to the above technical solution, the PCB board Y-axis transverse module includes a Y-axis beam, a Y-axis connecting frame, and a belt conveyor. The Y-axis beam is mounted on the frame, and the Y-axis connecting frame is slidably connected to the Y-axis beam along the X-axis direction. The belt conveyor includes multiple pulleys mounted on the Y-axis beam, a synchronous belt connected to the pulleys, and a third drive device for driving one of the pulleys to rotate. A fixing block is fixedly connected to the belt, and the fixing block is fixedly connected to the Y-axis connecting frame.

[0018] The beneficial effects of this utility model are as follows: The transfer machine of this utility model is mainly used to connect PCB boards that have been connected to reflow soldering equipment. After the reflow soldering equipment releases the PCB board, the transfer machine converts the dual channels into a single channel, forming a reasonable connection and transfer function with the dual-track reflow soldering equipment. The PCB board is also buffered by a buffer mechanism, which can reasonably match the efficiency of upstream and downstream equipment. In addition, the cooling mechanism realizes the cooling and temperature reduction of the PCB board during the reflow soldering process, thereby improving production efficiency. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a front view of a reflow oven post-transfer machine according to an embodiment of this utility model;

[0021] Figure 2 This is a schematic diagram of the cooling mechanism in an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of a hidden cover for a reflow oven transplanter according to an embodiment of this utility model;

[0023] Figure 4 yes Figure 3 Side view;

[0024] Figure 5 This is a schematic diagram of the dual-track mechanism in an embodiment of this utility model;

[0025] Figure 6 This is a schematic diagram of the conveyor rail structure of the dual-track mechanism in this utility model embodiment;

[0026] Figure 7This is a schematic diagram of the translation buffer mechanism in an embodiment of this utility model;

[0027] Figure 8 yes Figure 7 The main view;

[0028] Figure 9 This is a side view of the cache spacing adjustment mechanism in an embodiment of this utility model;

[0029] Figure 10 This is an isometric view of the buffer spacing adjustment mechanism in this embodiment of the utility model;

[0030] Figure 11 This is a schematic diagram of the structure of the boost cache component in an embodiment of this utility model.

[0031] Reference numerals: 110, base; 120, column; 130, cover; 140, first fan; 150, second fan; 200, double guide rail mechanism; 210, first track; 211, first conveyor rail; 2111, conveyor profile beam; 2112, roller conveyor chain; 2113, chain idler wheel; 2114, sprocket; 212, second conveyor rail; 213, conveyor rail spacing adjustment mechanism; 2131, first support block; 2132, fixing clamp; 2133, linear guide rod; 2134, linear bearing; 2315, second support block; 214 220. First motor; 221. First lifting mechanism; 222. Lifting cylinder; 223. Fixture support bar; 230. Second track; 240. Second lifting mechanism; 300. Translation buffer mechanism; 310. First buffer mechanism; 311. Buffer bin support beam; 312. Buffer bin support plate; 313. Lifting buffer assembly; 3131. Support plate; 3132. Bending plate chain; 3133. Lifting support plate; 314. Second drive device; 315. Hopper drive shaft; 316. First fixed guide rod; 317. Second linear guide rod; 320. Second buffer mechanism;

[0032] 330. Buffer spacing adjustment mechanism; 331. Lead screw; 332. Ball nut; 333. Bearing seat; 334. Handwheel; 335. Adapter plate; 336. Second linear guide; 400. PCB board Y-axis transverse movement module; 410. Y-axis beam; 420. Y-axis connecting frame; 430. First linear guide; 440. Third motor; 450. Drive shaft; 460. Pulley; 470. Synchronous belt; 480. Fixing block; 490. Transverse movement fixing plate; 500. PCB board. Detailed Implementation

[0033] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / connections involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. For detachable connections, screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., can be used as needed. The various technical features in this utility model can be combined interactively without contradicting each other.

[0034] Reference Figures 1-4 This utility model provides a reflow oven transfer machine, including a frame, a dual-track mechanism, a translation buffer mechanism, and a cooling mechanism. The frame includes a base, a column mounted on the base, and a cover mounted on the base. The dual-track mechanism is mounted on the base, and the translation buffer mechanism is mounted on the column and covered by the cover to improve the safety and stability of the equipment. The cover has two PCB conveying ports corresponding to the inlet and outlet ends of the dual-track mechanism.

[0035] Reference Figure 2 The cooling mechanism includes multiple first fans and multiple second fans. The multiple first fans are disposed on the top of the base and arranged in a multi-row array. At least two rows of first fans are disposed below the first track and the second track. The multiple second fans are disposed on the top of the cover. The first fans are used for blowing air and the second fans are used for drawing air, thereby forming convective air inside the cover, carrying away the heat on the PCB board, and realizing the cooling of the PCB board.

[0036] In this embodiment, refer to Figure 5 The dual-track mechanism includes a first track, a first lifting mechanism, a second track, and a second lifting mechanism. The first track and the second track are used to transport PCB boards, and the first lifting mechanism and the second lifting mechanism are used to lift the PCB boards so that the robotic arm of the translation buffer mechanism can pick up and place the PCB boards.

[0037] Furthermore, the first track and the second track have the same structure. Taking the first track as an example, the first track includes a first conveying rail and a second conveying rail with the same structure. Taking the first conveying rail as an example, refer to... Figure 6 The first conveying rail includes a conveying profile beam, a roller conveying chain, sprockets, chain idlers, and chain support rails. The roller conveying chain is mounted on the conveying profile beam via sprockets, chain idlers, and chain support rails. The first rail also includes a first driving device, which includes a first motor. The sprockets of both the first and second conveying rails are connected to the output shaft of the first motor. In this way, the first motor simultaneously drives the two sprockets to rotate, thereby driving the first and second conveying rails to move synchronously, realizing the conveying of PCBs on the first rail.

[0038] Furthermore, refer to Figure 5 The first lifting mechanism and the second lifting mechanism have the same structure. Taking the first lifting mechanism as an example, the first lifting mechanism includes multiple lifting cylinders installed on the base and a fixture support bar set at the movable end of the lifting cylinder. The lifting cylinder drives the fixture support bar to rise and fall, thereby lifting the PCB board.

[0039] In this embodiment, refer to Figure 7 and Figure 8 The translational buffer mechanism includes a PCB board Y-axis transverse module and a buffer robot. The PCB board Y-axis transverse module is mounted on a column, and the buffer robot is mounted on the movable end of the PCB board Y-axis transverse module. The buffer robot is used to pick up and place PCB boards. Thus, the PCB board Y-axis transverse module drives the buffer robot to translate along the Y-axis direction (i.e., the direction of the line connecting the first and second tracks), allowing the buffer robot to move back and forth between the first and second tracks. This allows PCB boards to be removed from the first track and placed on the second track, thereby transforming single-track conveying into dual-track conveying to accommodate the transfer and docking between pick-and-place machines and reflow soldering equipment.

[0040] Reference Figure 7 The buffer robot includes a first buffer mechanism and a second buffer mechanism arranged opposite to each other. The first buffer mechanism and the second buffer mechanism have the same structure. Taking the first buffer mechanism as an example, refer to... Figure 11 The first buffer mechanism includes a buffer bin support frame, a hopper drive shaft, a fixed guide rod, a second drive device, and multiple lifting buffer components. The buffer bin support frame includes a buffer bin support beam and buffer bin support plates fixed at both ends of the buffer bin support beam. The buffer bin support beam is connected to the movable end of the Y-axis transverse module of the PCB board. The second drive device includes a second motor and a planetary reducer. The second motor, the hopper drive shaft, and the fixed guide rod are all connected to the buffer bin support plate. The lifting buffer components are mounted on the fixed guide rods. There are two fixed guide rods to increase the stability of the lifting buffer components. The second motor drives the hopper drive shaft to rotate through the planetary reducer, thereby driving the lifting buffer components to move.

[0041] Specifically, refer to Figure 11 The lifting buffer assembly includes a support plate, a drive sprocket, a driven sprocket, a curved plate chain, and lifting trays. The support plate is fixedly connected to a fixed guide rod. The drive sprocket is mounted on the hopper drive shaft. The driven sprocket is mounted on the support plate via a driven shaft. The curved plate chain connects the drive sprocket and the driven sprocket. Multiple lifting trays are spaced apart on the curved plate chain. Thus, when the second motor drives the hopper drive shaft to rotate, it drives the curved plate chain to rotate, thereby moving the lifting trays.

[0042] It can be understood that when retrieving a PCB board from the first track, the first lifting mechanism lifts the PCB board, and the second motors of the first and second buffer mechanisms operate synchronously, driving the two hopper drive shafts to rotate synchronously and in opposite directions. As the bending chain rotates, it moves the lifting tray upwards. The lifting trays of the first and second buffer mechanisms respectively support the two sides of the PCB board, thus removing the PCB board from the fixture support. Then, the PCB board Y-axis transverse module moves the buffer robot and the PCB board above the second track. The lifting cylinder of the first lifting mechanism moves the fixture support upwards, and the second motor reverses direction. When the bending chain rotates in the opposite direction, it moves the lifting tray downwards, placing the PCB board on the fixture support. Then, the lifting cylinder moves the fixture support downwards, placing the PCB board on the second track. This achieves the lateral movement of the PCB board. Since the lifting trays are multiple and spaced apart on the bending chain, the buffer robot continues to repeatedly retrieve the PCB board at the first track, thus buffering the PCB board on lifting trays at different heights.

[0043] In some embodiments, refer to Figure 7 and Figure 8 The PCB board Y-axis transverse module includes a Y-axis connecting frame, two Y-axis beams mounted on columns, belt conveyors mounted on the two Y-axis beams, and a third drive device. The two ends of the Y-axis connecting frame are slidably connected to the Y-axis beams along the X-axis direction via a first linear guide rail. The belt conveyor includes two pulleys mounted on the Y-axis beams and a synchronous belt connected to the pulleys. A fixing block is fixedly connected to the belt, and the fixing block is fixedly connected to the Y-axis connecting frame. A transverse fixed plate is connected to the bottom of the Y-axis connecting frame, and a buffer robot is mounted on the transverse fixed plate. The third drive device includes a third motor and a transmission shaft. The output shaft of the third motor is connected to the pulleys of the two belt conveyors via the transmission shaft. Thus, when the third motor runs, it drives the two belt conveyors to move synchronously, thereby driving the Y-axis connecting frame and the buffer robot to move laterally along the Y-axis direction.

[0044] In a preferred embodiment, refer to Figure 5Each end of the first and second tracks is provided with a conveyor rail spacing adjustment mechanism. The conveyor rail spacing adjustment mechanism is used to adjust the spacing between the two conveyor rails of the first and second tracks. The conveyor rail spacing adjustment mechanism includes a first support block, a second support block, a linear guide rod, and a linear bearing. The two ends of the linear guide rod are respectively connected to the first and second support blocks. The linear bearing is mounted on the linear guide rod and fixedly connected to the conveyor profile beam of the first conveyor rail. The conveyor profile beam of the second conveyor rail is fixedly connected to the linear guide rod through a fixing clamp. In this way, adjusting the position of the linear bearing on the linear guide rod can adjust the spacing between the first and second conveyor rails to accommodate PCB boards of different sizes.

[0045] Correspondingly, the transplanter also includes a buffer spacing adjustment mechanism, see reference. Figure 9 and Figure 10 The buffer spacing adjustment mechanism includes a second linear guide rail and a lead screw module. Adapter plates are provided on the buffer chamber support beams of both the first and second buffer mechanisms. The adapter plates are slidably connected to the transverse fixed plate via the second linear guide rail. The lead screw module includes a bearing seat, a lead screw, a ball nut, and a handwheel. One end of the lead screw is connected to the buffer chamber support frame of the second buffer mechanism via the bearing seat. The ball nut is connected to the buffer chamber support frame of the first buffer mechanism. The handwheel is connected to the lead screw. Thus, rotating the handwheel drives the lead screw to rotate, which in turn moves the buffer chamber support frame of the first buffer mechanism via the ball nut, thereby adjusting the spacing between the first and second buffer mechanisms to accommodate PCBs of different sizes.

[0046] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A reflow oven post-transfer machine, characterized in that, include: The frame includes a base, columns mounted on the base, and a cover; A dual-track mechanism, mounted on the base, includes a first track, a first lifting mechanism, a second track, and a second lifting mechanism. The first track and the second track are used to transport PCB boards. The first lifting mechanism is used to lift the PCB board on the first track, and the second lifting mechanism is used to lift the PCB board on the second track. The translation buffer mechanism includes a PCB board Y-axis transverse module and a buffer robot. The PCB board Y-axis transverse module is mounted on the column, and the buffer robot is mounted on the movable end of the PCB board Y-axis transverse module. The buffer robot is used to pick up and place PCB boards. The cooling mechanism includes a first fan and a second fan. The first fan is disposed on the top of the base, and the second fan is disposed on the top of the cover. The first fan is used for blowing air, and the second fan is used for exhausting air.

2. The reflow oven transfer machine according to claim 1, characterized in that: There are multiple first fans and multiple second fans, and the multiple first fans are arranged in a multi-row array. There are at least two rows of first fans below each of the first and second tracks.

3. The reflow oven transfer machine according to claim 1, characterized in that: The first track and the second track each include two conveying rails and a first driving device. The conveying rails include a conveying profile beam, a roller conveying chain, sprockets, chain idlers, and chain support rails. The roller conveying chain is mounted on the conveying profile beam via sprockets, chain idlers, and chain support rails. The first driving device is used to drive the sprockets of the two conveying rails to rotate so as to drive the roller conveying chain.

4. A reflow oven transfer machine according to claim 3, characterized in that: The first track and the second track are each connected to a conveyor track spacing adjustment mechanism, which is used to adjust the spacing between the two conveyor tracks of the first track and the second track.

5. A reflow oven transfer machine according to claim 1, characterized in that: Both the first lifting mechanism and the second lifting mechanism include a lifting cylinder and a fixture support bar disposed at the movable end of the lifting cylinder, wherein the lifting cylinder is mounted on the machine base.

6. A reflow oven transfer machine according to claim 1, characterized in that: The buffer robot includes two buffer mechanisms arranged opposite each other. Each buffer mechanism includes a buffer bin support frame, a hopper drive shaft, a fixed guide rod, a second drive device, and multiple lifting buffer components. The buffer bin support frame is connected to the movable end of the Y-axis transverse module of the PCB board. The second drive device, the hopper drive shaft, and the fixed guide rod are all connected to the buffer bin support frame. The lifting buffer components are mounted on the fixed guide rod. The second drive device is used to drive the hopper drive shaft to rotate, thereby driving the lifting buffer components to move.

7. A reflow oven transfer machine according to claim 6, characterized in that: The lifting buffer assembly includes a support plate, a drive sprocket, a driven sprocket, a curved plate chain, and a lifting tray. The support plate is fixedly connected to a fixed guide rod. The drive sprocket is mounted on the hopper drive shaft. The driven sprocket is mounted on the support plate via a driven shaft. The curved plate chain connects the drive sprocket and the driven sprocket. The lifting tray includes multiple trays spaced apart on the curved plate chain.

8. A reflow oven transfer machine according to claim 6, characterized in that: It also includes a buffer spacing adjustment mechanism, which includes an adapter plate, a linear guide rail and a lead screw module. The buffer compartment support frames of the two buffer mechanisms are both connected to the adapter plate, and the adapter plate is slidably connected to the movable end of the Y-axis transverse module of the PCB board. The ball nut of the lead screw module is connected to one of the buffer compartment support frames.

9. A reflow oven transfer machine according to claim 1, characterized in that: The PCB board Y-axis transverse module includes a Y-axis beam, a Y-axis connecting frame, and a belt conveyor. The Y-axis beam is mounted on the frame, and the Y-axis connecting frame is slidably connected to the Y-axis beam along the X-axis direction. The belt conveyor includes multiple pulleys mounted on the Y-axis beam, a synchronous belt connected to the pulleys, and a third drive device for driving one of the pulleys to rotate. A fixing block is fixedly connected to the belt, and the fixing block is fixedly connected to the Y-axis connecting frame.

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