Isolation device
By designing a paper-absorbing mechanism in the isolation device to adsorb the isolation paper and cover the silicon wafer, the problem of contact or collision of silicon wafers during automation system failures was solved, thereby reducing the defect rate and production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (CHENGDU) CO LID
- Filing Date
- 2025-04-29
- Publication Date
- 2026-05-05
AI Technical Summary
In existing technologies, silicon wafers are prone to contact or collision when the automation system malfunctions, leading to surface scratches, microcracks, and fragmentation risks, which increases the defect rate and production costs.
An isolation device was designed, including a paper feeding box for placing isolation paper, a wafer receiving box, a wafer rejection mechanism, and a paper suction mechanism. The paper suction mechanism uses a moving module and an adsorption component to adsorb the isolation paper to cover the silicon wafers, thereby preventing contact or collision between the silicon wafers.
It effectively reduced the defect rate and production cost of silicon wafers, and improved the safety and stability of silicon wafers.
Smart Images
Figure CN224205574U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of solar cell technology, and specifically relates to an isolation device. Background Technology
[0002] With the continuous development of photovoltaic technology and the intensification of market competition, enterprises are increasingly eager to reduce costs and increase efficiency. As the core component of photovoltaic cells, the quality and production cost of silicon wafers directly affect the economic benefits of enterprises.
[0003] In existing technology, silicon wafers in the THL wet process are transferred from the main machine to the receiving box via a rejection roller of an automated system. When the automated system malfunctions and cannot operate normally, if there are still unprocessed silicon wafers in the main machine, the rejection roller is activated to remove the unprocessed silicon wafers from the main machine and collect them into the receiving box located below the rejection roller. However, direct contact or collision between silicon wafers is likely to occur, which increases the risk of scratches, microcracks and fragments on the surface of the silicon wafers. This not only increases the defect rate of silicon wafers but also increases production costs.
[0004] Therefore, it is necessary to provide a new technical solution to solve the above-mentioned technical problems. Utility Model Content
[0005] The technical problem to be solved by this utility model is the high defect rate and high production cost.
[0006] To solve the above-mentioned technical problems, this utility model provides an isolation device, which includes a paper feeding box for placing release paper, a wafer receiving box with a placing space, a wafer rejection mechanism, and a paper suction mechanism. The placing space is used to place silicon wafers, the wafer rejection mechanism is used to transport silicon wafers to the placing space, and the paper suction mechanism includes a moving module and an adsorption component connected to the moving module. The moving module drives the adsorption component to move back and forth between the paper feeding box and the placing space, and the adsorption component is used to adsorb the release paper.
[0007] Optionally, the isolation device further includes a plurality of baffles disposed in the placement space, the plurality of baffles being arranged at intervals.
[0008] Optionally, the wafer rejection mechanism includes a lifting assembly and a transmission assembly with a conveying channel. The transmission assembly is connected to the lifting assembly, and the lifting assembly drives the transmission assembly to move up and down. The conveying channel is connected to the placement space, and the silicon wafer is conveyed to the placement space through the conveying channel.
[0009] Optionally, the transmission component includes a first driver connected to the lifting component and a roller assembly connected to the first driver and located in the transmission channel. The first driver drives the roller assembly to rotate so as to move the silicon wafer located on the roller assembly through the transmission channel to the placement space.
[0010] Optionally, the roller assembly includes a plurality of rollers and a rotating shaft connected to the plurality of rollers. The plurality of rollers are located in the conveying channel. The first driver is connected to the rotating shaft, and the first driver drives the rotating shaft to rotate the plurality of rollers along the conveying direction of the conveying channel.
[0011] Optionally, the moving module includes a lateral moving component and a vertical moving component connected to the lateral moving component. The lateral moving component includes a support frame and a sliding component disposed on the support frame. The vertical moving component is connected to the sliding component and moves along the length extension direction of the sliding component. The paper feeding box and the placement space are located within the length extension direction.
[0012] Optionally, the sliding component includes a slide rail and a second driver disposed on the support frame and connected to the vertical moving component. The vertical moving component is slidably connected to the slide rail, and the second driver drives the vertical moving component to move along the length extension direction.
[0013] Optionally, the adsorption assembly includes a support base and a suction cup disposed on the support base. The support base is connected to the vertical moving assembly, which drives the support base to move vertically. The suction cup is used to adsorb the release paper.
[0014] Optionally, the isolation device further includes a host end conveying assembly, which includes multiple conveying wheels and a conveying driver. The rotating rod of the conveying driver is connected to the multiple conveying wheels, and the rotating rod drives the multiple conveying wheels to rotate so as to convey the silicon wafers located on the conveying wheels to the rejection mechanism.
[0015] Optionally, the rejection mechanism further includes a sensor assembly disposed on the rejection mechanism, the sensor assembly being used to detect whether the silicon wafer is present on the rejection mechanism.
[0016] Beneficial effects:
[0017] This invention provides an isolation device. A wafer rejection mechanism transports silicon wafers to the placement space of a receiving cassette. A moving module of a paper suction mechanism drives an adsorption component back and forth between the paper feeding cassette and the placement space within the receiving cassette. The adsorption component adsorbs the release paper. After the wafer rejection mechanism transports the silicon wafers to the placement space, the moving module moves the adsorption component above the paper feeding cassette, bringing it close to the release paper. The adsorption component adsorbs the release paper, and the adsorption component, carrying the release paper, moves towards the placement space within the receiving cassette, driven by the moving module. The moving module then moves the adsorption component and the release paper onto the silicon wafer placed in the placement space. After releasing the release paper, the adsorption component covers the silicon wafer, achieving mutual isolation between the wafers and preventing contact or collision. This achieves the technical effect of reducing defect rates and production costs. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of an isolation device provided in an embodiment of the present utility model.
[0020] Figure 2 This is a schematic diagram of the structure of an isolation device after removing the receiving box, provided in an embodiment of the present utility model.
[0021] Figure 3 This is a schematic diagram of the structure of a receiving box in an isolation device provided in an embodiment of the present utility model.
[0022] Figure 4 This is a schematic diagram of the structure of a transmission component in an isolation device provided in an embodiment of the present invention.
[0023] Figure 5 This is a schematic diagram of the paper suction mechanism in an isolation device provided in an embodiment of the present utility model.
[0024] The meanings of the labels in the attached diagram are as follows:
[0025] 1—Paper feeding box, 2—Sheet receiving box, 21—Placement space, 3—Sheet rejection mechanism, 31—Lifting assembly, 32—Transmission assembly, 321—First driver, 322—Roller assembly, 3221—Roller, 3222—Rotating shaft, 4—Paper suction mechanism, 41—Horizontal movement assembly, 411—Support frame, 412—Sliding component, 4121—Slide rail, 4122—Second driver, 42—Vertical movement assembly, 43—Adsorption assembly, 431—Support base, 432—Suction cup, 44—Moving module, 5—Baffle, 6—Main unit end conveying assembly, 7—Sensor assembly, 8—Separation paper. Detailed Implementation
[0026] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0027] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0028] In the embodiments of this application, "at least one" refers to one or more; "multiple" refers to two or more. In the description of this application, the terms "first," "second," "third," etc., are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.
[0029] In this specification, references such as "one embodiment" or "some embodiments" mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, the terms "comprising," "including," "having," and variations thereof in this specification all mean "including but not limited to," unless otherwise specifically emphasized. It should be noted that in the embodiments of this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.
[0030] It should be noted that, in the embodiments of this utility model, when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is considered to be "set on" another component, it can be directly set on the other component or there may be an intervening component. Furthermore, in the embodiments of this application, "connection" can also be understood as an electrical connection; the connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components. The terms "vertical," "horizontal," "left," "right," and similar expressions used in the embodiments of this utility model are for illustrative purposes only and are not intended to limit the utility model.
[0031] An isolation device provided in this embodiment of the utility model, please refer to... Figures 1 to 5 As shown, Figure 1 This is a schematic diagram of the structure of an isolation device provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of an isolation device after removing the receiving box, according to an embodiment of this utility model. Figure 3 This is a schematic diagram of the structure of the receiving box in an isolation device provided by an embodiment of the present invention.
[0032] Figure 4 This is a schematic diagram of the structure of a transmission component in an isolation device provided by an embodiment of the present invention. Figure 5 This is a schematic diagram of the paper suction mechanism in an isolation device provided by an embodiment of the present invention. The isolation device provided by this embodiment of the present invention includes a paper feeding box 1, a wafer receiving box 2, a wafer rejection mechanism 3, and a paper suction mechanism 4. The paper feeding box 1 is used to hold the isolation paper. Silicon wafers can be placed in the placement space 21 of the wafer receiving box 2. The wafer rejection mechanism 3 is used to transport the silicon wafers to the placement space 21. The paper suction mechanism 4 includes a moving module 44 and an adsorption component 43. The moving module 44 is connected to the adsorption component 43, and the moving module 44 drives the adsorption component 43 to move back and forth between the paper feeding box 1 and the placement space 21. The adsorption component 43 is used to adsorb the isolation paper.
[0033] The release liner covers the silicon wafers. The placement space 21 of the receiving cassette 2 has space to accommodate multiple silicon wafers. The opening of the receiving cassette 2 faces the rejecting mechanism 3. The rejecting mechanism 3 transports the silicon wafers from the opening of the receiving cassette 2 into the placement space 21. If the opening of the receiving cassette 2 is placed below the rejecting mechanism 3, the silicon wafers will enter the placement space 21 of the receiving cassette 2 under the push of the rejecting mechanism 3 when it transports them. The direction in which the rejecting mechanism 3 transports the silicon wafers can be as follows: Figure 1 The Y-axis direction in the diagram.
[0034] The adsorption component 43 is mounted on the moving module 44. The adsorption component 43 can be powered by a vacuum pump, and the moving module 44 can drive the adsorption component 43 to move vertically. Vertical movement refers to... Figure 1 The vertical direction, i.e., vertical movement, refers to... Figure 1 In the Z-axis direction. When the adsorption component 43 is moved above the paper feeding box 1, the moving module 44 will continue to drive the adsorption component 43 to approach the isolation paper located in the paper feeding box 1. After the adsorption component 43 adsorbs the isolation paper, the moving module 44 can drive the adsorption component 43 with the adsorbed isolation paper to rise continuously.
[0035] The moving module 44 may include a universal arm or a 6-axis robotic arm. For example, after the adsorption component 43 is connected to the 6-axis robotic arm, a moving path is pre-planned between the placement space 21 of the receiving cassette 2 and the paper placement cassette 1. The 6-axis robotic arm can move the isolation paper adsorbed by the adsorption component 43 to the silicon wafer located in the placement space 21 of the receiving cassette 2 according to the pre-planned moving path.
[0036] In this embodiment, the wafer rejection mechanism 3 transports silicon wafers to the placement space 21 of the receiving cassette 2. The moving module 44 of the paper suction mechanism 4 drives the adsorption component 43 to move back and forth between the paper feeding cassette 1 and the placement space 21 of the receiving cassette 2. The adsorption component 43 is used to adsorb the release paper. After the wafer rejection mechanism 3 transports the silicon wafers to the placement space 21, the moving module 44 drives the adsorption component 43 to move above the paper feeding cassette 1, and then moves the adsorption component 43 close to the release paper in the paper feeding cassette 1. The adsorption component 43 adsorbs the release paper. The adsorption component 43 with the release paper adsorbed moves towards the placement space 21 of the receiving cassette 2 under the drive of the moving module 44. Then, the moving module 44 moves the adsorption component 43 and the release paper on the adsorption component 43 to the silicon wafer placed in the placement space 21. After the adsorption component 43 releases the release paper, it covers the silicon wafer, realizing mutual isolation between the silicon wafers to avoid mutual contact or collision between the silicon wafers. This achieves the technical effect of reducing defect rates and production costs.
[0037] As one implementation method, please refer to Figure 1 and Figure 3 The isolation device provided in this embodiment of the present invention also includes a plurality of baffles 5, which are disposed within the placement space 21 and are spaced apart. The plurality of baffles 5 can move along the space as shown in the figure. Figure 1The X-axis direction is arranged sequentially. Multiple baffles 5 can be arranged parallel to each other, with space left between adjacent baffles 5 for placing silicon wafers. That is, the placement space 21 is divided into multiple spaces for placing silicon wafers by multiple baffles 5. For example, silicon wafers and the aforementioned release paper are alternately placed in this space, so that a release paper is placed between two adjacent silicon wafers. At the same time, the adjacent baffles 5 limit the silicon wafers and release paper alternately placed in this space to prevent the silicon wafers from colliding or stacking with each other in the placement space 21. Alternatively, after the silicon wafers and the aforementioned release paper are alternately placed in this space, multiple silicon wafers are placed on both sides of a release paper to reduce the number of release papers and increase the space for accommodating silicon wafers. At the same time, the adjacent baffles 5 limit the multiple silicon wafers and release paper placed in this space. By setting multiple baffles 5 in the placement space 21, the stability and safety of silicon wafers in the placement space 21 can be improved, which helps to reduce the defect rate.
[0038] As one implementation method, please refer to Figure 1 , Figure 2 and Figure 4 The wafer rejection mechanism 3 includes a lifting assembly 31 and a conveying assembly 32. The conveying assembly 32 has a conveying channel and is connected to the lifting assembly 31. The lifting assembly 31 drives the conveying assembly 32 to move up and down. The height of the conveying assembly 32 can be adjusted as needed to connect the conveying channel with the placement space 21, allowing the silicon wafers to be conveyed to the placement space 21. The conveying channel has a space to accommodate the silicon wafers. After the conveying channel connects with the placement space 21, the silicon wafers can enter the placement space 21 from the conveying channel. The lifting assembly 31 can drive the conveying assembly 32 to move up and down, aligning the conveying assembly 32 with the receiving cassette 2 and the main unit end conveying assembly 6, respectively. The conveying assembly 32 receives the silicon wafers from the main unit end conveying assembly 6 and then conveys the silicon wafers into the receiving cassette 2.
[0039] As one implementation method, please continue to see Figure 1 , Figure 2 and Figure 4The transmission component 32 includes a first driver 321 and a roller assembly 322. The first driver 321 is connected to the lifting component 31, and the roller assembly 322 is connected to the first driver 321. The roller assembly 322 is located within the transmission channel. The first driver 321 drives the roller assembly 322 to rotate, thereby moving the silicon wafers on the roller assembly 322 through the transmission channel into the placement space 21. Simultaneously, the rolling action of the roller assembly 322 reduces friction and resistance on the silicon wafers, lowering the risk of damage during transmission. The first driver 321 may include a motor or a cylinder. Multiple silicon wafers are placed on the roller assembly 322, and the first driver 321 drives the roller assembly 322 to push the silicon wafers into the receiving cassette 2. Alternatively, the roller assembly 322 may also include a conveyor belt, which transports the silicon wafers into the receiving cassette 2.
[0040] As one implementation method, please continue to see Figure 1 , Figure 2 and Figure 4 The roller assembly 322 includes multiple rollers 3221 and a rotating shaft 3222. The rotating shaft 3222 is connected to the multiple rollers 3221. The multiple rollers 3221 are located within the conveying channel. A first driver 321 is connected to the rotating shaft 3222 and drives the rotating shaft 3222 to rotate the multiple rollers 3221 along the conveying direction of the conveying channel. After the multiple rollers 3221 are connected to the rotating shaft 3222, during the rotation of the rotating shaft 3222 driven by the first driver 321, the multiple rollers 3221 will rotate along with the rotating shaft 3222. The rotation direction of the multiple rollers 3221 is consistent with the conveying direction of the conveying channel, which refers to the direction closer to the receiving cassette 2. When a silicon wafer is placed on the multiple rollers 3221, activating the first driver 321 will cause the multiple rollers 3221 to convey the silicon wafer into the receiving cassette 2 along the conveying direction. Meanwhile, multiple rollers 3221 distribute the weight and pressure of the silicon wafer during transport, reducing the load on each individual roller 3221 and extending its service life. The rotating shaft 3222 connects the multiple rollers 3221 into a single unit, enabling them to rotate synchronously and in a coordinated manner. This not only improves the smoothness and continuity of silicon wafer transport but also makes the entire transport assembly 32 more compact and stable.
[0041] As one implementation method, please refer to Figure 1 , Figure 2 and Figure 5 The moving module 44 includes a horizontal moving component 41 and a vertical moving component 42. The vertical moving component 42 is connected to the horizontal moving component 41. The direction in which the horizontal moving component 41 drives the vertical moving component 42 to move back and forth can refer to, for example, Figure 1In the Y-axis direction, the adsorption component 43 is connected to the vertical moving component 42. The vertical moving component 42 drives the adsorption component 43 to move vertically. Vertical movement can refer to... Figure 1 In the Z-axis direction, the lateral moving component 41 includes a support frame 411 and a sliding component 412. The sliding component 412 is disposed on the support frame 411. The vertical moving component 42 is connected to the sliding component 412 and moves along the length extension direction of the sliding component 412. The length extension direction of the sliding component 412 refers to... Figure 1 The direction of the Y-axis. The paper tray 1 and the placement space 21 being within the length extension direction means that during the movement of the vertical moving component 42 along the length extension direction of the sliding component 412, the vertical moving component 42 can reach above the paper tray 1 and also above the placement space 21. The support frame 411 provides support for the sliding component 412, which drives the vertical moving component 42 to move along the length extension direction of the sliding component 412, that is, to reciprocate between the paper tray 1 and the placement space 21.
[0042] In one embodiment, the sliding component 412 may also include a motor and an annular belt. The motor is connected to the support frame 411, and the annular belt is rotatably mounted on the support frame 411. The annular belt is connected to the vertical moving component 42. The motor drives the annular belt to rotate, thereby moving the vertical moving component 42 located on the annular belt.
[0043] As one implementation method, please continue to see Figure 1 , Figure 2 and Figure 5The sliding component 412 includes a slide rail 4121 and a second driver 4122. The second driver 4122 is disposed on the support frame 411 and is connected to the vertical moving component 42. The vertical moving component 42 is slidably connected to the slide rail 4121. The second driver 4122 drives the vertical moving component 42 to move along the aforementioned length extension direction. The second actuator 4122 includes a motor or cylinder. The slide rail 4121 is arranged along the aforementioned length extension direction. The slide rail 4121 is slidably connected to the vertical moving component 42. For example, the vertical moving component 42 includes a slider sleeved on the slide rail 4121 and a telescopic motor connected to the slider. The slider is connected to the push rod of the second actuator 4122. The push rod of the second actuator 4122 drives the slider and the telescopic motor connected to the slider to move. Alternatively, the push rod of the second actuator 4122 is connected to a lead screw, and the vertical moving component 42 is threadedly connected to the lead screw. The second actuator 4122 drives the lead screw connected to the push rod to rotate, causing the vertical moving component 42 to move along the length extension direction of the lead screw. Simultaneously, the slide rail 4121 in the sliding component 412 can improve the stability and accuracy of the vertical moving component 42's movement in the horizontal direction, enabling the vertical moving component 42 to accurately reach above the paper tray 1 and the placement space 21. After the adsorption component 43 adsorbs the release paper, it can cover the silicon wafer in the placement space 21, effectively preventing the silicon wafers from contacting or colliding with each other.
[0044] As one implementation method, please continue to see Figure 1 , Figure 2 and Figure 5 The adsorption component 43 includes a support base 431 and a suction cup 432. The suction cup 432 is mounted on the support base 431, which is connected to a vertical moving component 42. The vertical moving component 42 drives the support base 431 to move vertically, and the suction cup 432 is used to adsorb the release paper. The support base 431, mounted on the telescopic rod of the aforementioned telescopic motor, provides support for the suction cup 432. Simultaneously, the telescopic rod of the telescopic motor can drive the support base 431 and the suction cup 432 to move up and down.
[0045] As one implementation method, please continue to see Figure 1 , Figure 2 and Figure 5 The suction cup 432 can be a vacuum suction cup 432. When air is drawn out of the suction cup 432, making the suction cup 432 in a vacuum suction state, the suction cup 432 can adsorb the release paper. When air is supplied to the suction cup 432, the suction cup 432 can release the adsorbed release paper.
[0046] As one implementation method, please refer to Figure 1 , Figure 2 and Figure 4The isolation device provided in this embodiment of the utility model also includes a main unit end conveying assembly 6. The main unit end conveying assembly 6 includes multiple conveying wheels and a conveying driver. The rotating rod of the conveying driver is connected to the multiple conveying wheels. The rotating rod drives the multiple conveying wheels to rotate, so as to convey the silicon wafers located on the conveying wheels to the rejection mechanism 3. Since the conveying wheels have the same structure and principle as the rollers 3221 mentioned above, the conveying wheels will not be described in detail here. Since the conveying driver has the same structure and principle as the first driver 321 mentioned above, the conveying wheels will not be described in detail here. The main unit end conveying assembly 6 can efficiently and stably convey the silicon wafers to the rejection mechanism 3, avoiding possible bumps or jams during the conveying process. At the same time, the conveying driver, as a power source, can precisely control the rotation speed and direction of the conveying wheels, realizing precise control of the silicon wafer conveying process. This not only improves the working efficiency of the entire isolation device, but also ensures that the silicon wafers are accurately conveyed to the rejection mechanism 3 for subsequent processing.
[0047] As one implementation method, please refer to Figure 1 and Figure 4 The rejection mechanism 3 also includes a sensor assembly 7, which is disposed in the rejection mechanism 3 and is used to detect whether there is a silicon wafer on the rejection mechanism 3. The sensor assembly 7 can be a reflective photoelectric sensor, which is mounted on the first driver 321 of the transmission assembly 32 in the rejection mechanism 3, and the detection direction of the reflective photoelectric sensor is facing the upper surface of the roller assembly 322. The reflective photoelectric sensor can detect whether there is a silicon wafer on the upper surface of the roller assembly 322.
[0048] As one implementation method, please continue to see Figure 1 and Figure 4 The sensor assembly 7 may include a controller, which is connected to the reflective photoelectric sensor and the lateral movement assembly 41, vertical movement assembly 42, and suction assembly 43 of the paper suction mechanism 4. This connection can be wired or wireless. When the reflective photoelectric sensor detects a silicon wafer on the upper surface of the roller assembly 322, the controller can control the lateral movement assembly 41, vertical movement assembly 42, and suction assembly 43 to suction the release paper and move it onto the silicon wafer in the placement space 21. When the reflective photoelectric sensor does not detect a silicon wafer, the process can be paused or stopped to avoid unnecessary waste and errors, ensuring the silicon wafer is accurately and promptly delivered to the placement space 21 for subsequent processing.
[0049] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although this utility model has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the claims of this utility model.
Claims
1. An isolation device, characterized in that, The isolation device includes a paper feeding box for placing release paper, a wafer receiving box with a placement space, a wafer rejection mechanism, and a paper suction mechanism. The placement space is used to place silicon wafers, the wafer rejection mechanism is used to transport silicon wafers to the placement space, and the paper suction mechanism includes a moving module and an adsorption component connected to the moving module. The moving module drives the adsorption component to move back and forth between the paper feeding box and the placement space, and the adsorption component is used to adsorb the release paper.
2. The isolation device according to claim 1, characterized in that, The isolation device also includes a plurality of baffles disposed in the placement space, the plurality of baffles being arranged at intervals.
3. The isolation device according to claim 1, characterized in that, The wafer rejection mechanism includes a lifting assembly and a transmission assembly with a conveying channel. The transmission assembly is connected to the lifting assembly, and the lifting assembly drives the transmission assembly to move up and down. The conveying channel is connected to the placement space, and the silicon wafer is conveyed to the placement space through the conveying channel.
4. The isolation device according to claim 3, characterized in that, The transmission component includes a first driver connected to the lifting component and a roller assembly connected to the first driver and located in the conveying channel. The first driver drives the roller assembly to rotate so as to move the silicon wafer located on the roller assembly through the conveying channel to the placement space.
5. The isolation device according to claim 4, characterized in that, The roller assembly includes multiple rollers and a rotating shaft connected to the multiple rollers. The multiple rollers are located in the conveying channel. The first driver is connected to the rotating shaft and drives the rotating shaft to rotate the multiple rollers along the conveying direction of the conveying channel.
6. The isolation device according to claim 1, characterized in that, The moving module includes a horizontal moving component and a vertical moving component connected to the horizontal moving component. The horizontal moving component includes a support frame and a sliding component disposed on the support frame. The vertical moving component is connected to the sliding component and moves along the length extension direction of the sliding component. The paper feeding box and the placement space are located within the range of the length extension direction.
7. The isolation device according to claim 6, characterized in that, The sliding component includes a slide rail and a second driver disposed on the support frame and connected to the vertical moving component. The vertical moving component is slidably connected to the slide rail, and the second driver drives the vertical moving component to move along the length extension direction.
8. The isolation device according to claim 6, characterized in that, The adsorption assembly includes a support base and a suction cup disposed on the support base. The support base is connected to the vertical moving assembly, which drives the support base to move vertically. The suction cup is used to adsorb the release paper.
9. The isolation device according to claim 1, characterized in that, The isolation device further includes a main unit end conveying assembly, which includes multiple conveying wheels and a conveying driver. The rotating rod of the conveying driver is connected to the multiple conveying wheels, and the rotating rod drives the multiple conveying wheels to rotate so as to convey the silicon wafers located on the conveying wheels to the wafer rejection mechanism.
10. The isolation device according to claim 1, characterized in that, The rejection mechanism also includes a sensor assembly disposed on the rejection mechanism, the sensor assembly being used to detect whether there is a silicon wafer on the rejection mechanism.