Die bonding mechanism and die bonding equipment

Abstract

The utility model relates to the technical field of die bonders, in particular to a die bonding mechanism, which comprises an adjusting assembly, a ZR motor fixed on the adjusting assembly, a die bonding arm fixed at the position of the output end of the ZR motor, an adsorption assembly rotatably mounted on the die bonding arm, and a fixing assembly fixed at the position of the output end of the ZR motor, the output end of the ZR motor drives the adsorption assembly to rotate on the die bonding arm, and the ZR motor can drive the vertical movement of the die bonding arm and the rotation of the adsorption assembly at the same time, thereby simplifying the overall structure of the die bonding mechanism, reducing the mechanical inertia, and more accurately controlling the vertical position of the die bonding arm and the rotation angle of the adsorption assembly. Therefore, the positioning of the wafer in the adsorption, transfer and placement process is more accurate, the die bonding quality and the product yield are improved, the position of the adsorption assembly connected with the adjusting assembly can be finely adjusted by the adjusting assembly, different die bonding process requirements and working scenes are adapted, and the die bonding mechanism has higher universality and flexibility.

Description

Technical Field

[0001] This utility model relates to the field of die bonding machine technology, and in particular to a die bonding mechanism and die bonding equipment. Background Technology

[0002] Die bonding, also known as die bonding, involves using an adhesive to bond a wafer to a designated area on a support, creating a thermal or electrical path to facilitate subsequent wire bonding. It is mainly used in lead frame plates of various gold wire ultrasonic welding equipment, as well as various nozzles, ejector pins, dispensing heads, ceramic nozzles, through-hole needles, motors, carbon brushes, encoders, drive belts, and various spare parts, instruments, etc. of various chip mounting equipment and automated robotic arms.

[0003] Die bonding, a crucial process for precisely fixing wafers to specific positions on a substrate, places extremely high demands on the performance of the die bonding mechanism. Currently, most die bonding equipment on the market exhibits numerous problems that urgently need to be addressed in achieving the wafer adsorption and transfer function. Regarding motion implementation, traditional designs rely on the coordinated operation of multiple independent mechanisms to achieve the necessary vertical and rotational movements of the die bonding mechanism. A common approach is to equip separate motors and then use mechanical conversion devices such as lead screws and gears to transmit and convert power. This complex structural design not only significantly increases the number of components in the die bonding mechanism but also makes the assembly and debugging of each component extremely cumbersome; any deviation in any link can affect the overall performance of the mechanism. In terms of operating efficiency and accuracy, too many mechanical components mean greater mechanical inertia and motion errors. During the die bonding process, each start, stop, or change of direction of movement causes the response speed of the die bonding mechanism to slow down, making it difficult to achieve fast and accurate adsorption and transfer operations. Moreover, the gaps between multiple mechanical components and the accumulation of processing accuracy errors severely affect the positioning accuracy of the die bonding mechanism. This slow speed and low precision directly restricts the overall capacity and product quality of die bonders, making it difficult to meet the current semiconductor industry's urgent need for high-efficiency, high-precision die bonding processes.

[0004] In summary, the shortcomings of existing die bonding mechanisms in terms of structural design, cost control, operating speed, and accuracy have become bottlenecks hindering the improvement of die bonding machine performance and industry development. An innovative die bonding mechanism design is urgently needed to break through this predicament. Utility Model Content

[0005] The purpose of this utility model is to provide a die bonding mechanism and die bonding equipment, which aims to solve the defects in structural design, cost control, operating speed and accuracy in the above-mentioned problems, so as to improve the integration and accuracy of the die bonding mechanism and ensure the accuracy of die bonding.

[0006] The technical solution adopted in this utility model is as follows:

[0007] A die bonding mechanism, comprising:

[0008] Adjust components;

[0009] ZR motor, the ZR motor being fixed to the adjustment assembly;

[0010] A die-bonding arm is fixed at the output end of the ZR motor, and the output end of the ZR motor drives the die-bonding arm to move vertically.

[0011] An adsorption assembly is rotatably mounted on the die-bonding arm, and the output of the ZR motor drives the adsorption assembly to rotate on the die-bonding arm.

[0012] This utility model also has the following technical features:

[0013] In one embodiment of this utility model, a cross roller guide is provided on the die bonding arm. The cross roller guide is arranged vertically and forms a sliding fit with the adjustment component.

[0014] In one embodiment of the present invention, the adsorption component includes a suction nozzle, the upper end of which is connected to the adsorption port of the negative pressure adsorption unit via a pipeline.

[0015] In one embodiment of this utility model, the die bonding arm is generally in the form of a right-angled folded plate, the cross roller guide is fixed on the vertical section of the die bonding arm, and the adsorption component is rotatably installed on the horizontal section of the die bonding arm.

[0016] In one embodiment of this utility model, the suction nozzle is tubular and vertically arranged. The tube body of the suction nozzle is rotatably mounted on the die bonding arm via a first bearing. A sealing ring is provided at the upper end of the suction nozzle. A top cover is provided on the die bonding arm. An air passage is provided on the top cover. The sealing ring abuts against one end of the air passage. An air nozzle is provided at the other end of the air passage. The air nozzle is connected to the adsorption port of the negative pressure adsorption unit.

[0017] In one embodiment of this utility model, a first synchronous pulley is provided on the output end of the ZR motor, and a second synchronous pulley is provided on the tube of the suction nozzle. The first synchronous pulley and the second synchronous pulley are connected by a synchronous belt.

[0018] In one embodiment of this utility model, a second bearing is provided at the output end of the ZR motor, and the second bearing is rotatably mounted on the die bond arm.

[0019] In one embodiment of the present invention, the second bearing is rotatably mounted on a bearing seat, and the bearing seat is fixed on the die bond arm.

[0020] In one embodiment of this utility model, the adjustment assembly includes a base fixing plate, a front and rear adjustment plate is provided on the base fixing plate, a motor fixing plate is provided on the front and rear adjustment plate, a mounting plate is provided on the motor fixing plate, the ZR motor is mounted on the motor fixing plate, and the vertical section of the die bonding arm is fixed on the mounting plate.

[0021] Another objective of this invention is to provide a die bonding device, including the aforementioned die bonding mechanism.

[0022] Compared with existing technologies, the beneficial effects of this utility model are as follows: This die bonding mechanism can simultaneously drive the vertical movement of the die bonding arm and the rotation of the adsorption component with only one ZR motor, which simplifies the overall structure of the die bonding mechanism, reduces the number of required parts, reduces intermediate transmission links, and reduces mechanical inertia. This allows the vertical movement of the die bonding arm and the rotation of the adsorption component to respond to control signals more quickly, significantly improving the operating speed of the die bonding mechanism. Furthermore, the pressure during die bonding can be precisely controlled through the force control program of the ZR motor, ensuring that the wafer meets the process requirements of die bonding. In the actual die bonding production process, a faster operating speed means that more die bonding operations can be completed per unit time, thereby effectively improving the production capacity of the die bonding machine.

[0023] This die-bonding mechanism uses a single ZR motor to directly drive the die-bonding arm and the adsorption assembly, reducing sources of error. Simultaneously, the single-motor drive method makes motion control more precise and stable, enabling more accurate control of the vertical position of the die-bonding arm and the rotation angle of the adsorption assembly. This results in more precise positioning of the wafer during adsorption, transfer, and placement, improving die-bonding quality and product yield.

[0024] The adjustment components provide additional adjustability to the die bonding mechanism. By adjusting the components, the positions of the ZR motor and the connected die bonding arm and adsorption components can be finely adjusted to adapt to different die bonding process requirements and working scenarios. This adjustability makes the die bonding mechanism more versatile and flexible, and can meet diverse production needs. Attached Figure Description

[0025] Figure 1 and Figure 2 These are schematic diagrams of the die-bonding mechanism from two different perspectives in one embodiment of this utility model;

[0026] Figure 3 This is a cross-sectional structural diagram of the die-bonding mechanism in one embodiment of the present invention;

[0027] Figure 4 This is an exploded view of the die-bonding arm adsorption assembly in one embodiment of the present invention;

[0028] Explanation of icon numbers:

[0029] 10. Adjustment components; 11. Fixing plate; 12. Front and rear adjustment plate; 13. Motor fixing plate; 14. Mounting plate;

[0030] 20. ZR motor; 21. First synchronous pulley; 22. Second bearing; 23. Bearing housing;

[0031] 30. Die-bonding arm; 31. Cross roller guide; 32. Top cover; 321. Air nozzle;

[0032] 40. Adsorption assembly; 41. Suction nozzle; 411. Sealing ring; 412. Second synchronous pulley; 42. First bearing. Detailed Implementation

[0033] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0034] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0035] Most die-bonding equipment on the market employs die-bonding mechanisms that reveal numerous problems that urgently need to be addressed in achieving the adsorption and transfer function of wafers. Regarding motion implementation, traditional designs rely on the coordinated operation of multiple independent mechanisms to achieve the necessary vertical and rotational movements of the die-bonding mechanism. A common approach is to equip separate motors and then use mechanical conversion devices such as lead screws and gears to transmit and convert power. This complex structural design not only significantly increases the number of components in the die-bonding mechanism, but also makes the assembly and debugging of each component extremely cumbersome; any deviation in any link can affect the overall performance of the mechanism. In terms of operating efficiency and accuracy, too many mechanical components mean greater mechanical inertia and motion errors. During the die-bonding process, each start, stop, or change of direction of movement causes the response speed of the die-bonding mechanism to slow down, making it difficult to achieve fast and accurate adsorption and transfer operations. Moreover, the gaps between multiple mechanical components and the accumulation of processing accuracy errors severely affect the positioning accuracy of the die-bonding mechanism. This slow speed and low precision directly restricts the overall capacity and product quality of die bonders, making it difficult to meet the urgent needs of the current semiconductor industry for high-efficiency and high-precision die bonding processes. To address this, this utility model proposes a die bonding mechanism, comprising: an adjustment component 10; a ZR motor 20 fixed to the adjustment component 10; a die bonder arm 30 fixed to the output end of the ZR motor 20, the output end of which drives the die bonder arm 30 to move vertically; and an adsorption component 40 rotatably mounted on the die bonder arm 30, the output end of which drives the adsorption component 40 to rotate on the die bonder arm 30.

[0036] In one embodiment, the ZR motor 20 can be of model GAS-LRS1635-01-48. This model of ZR motor 20 is used as a power drive. The ZR motor 20 has advantages such as smoother movement, faster response speed, high integration, and easy installation and maintenance. In addition, this motor has a compact structure and high integration, integrating linear (Z-axis) and rotary (R-axis) motion functions into a single unit, eliminating the need for separate motors and mechanical conversion devices (such as lead screws and gears) in traditional systems, and significantly reducing the size of the equipment.

[0037] In one embodiment, the adjustment component 10 can be adjusted in the vertical direction and in the horizontal plane. The adjustment component 10 can be used to make coarse adjustments to the adsorption component 40 in space, and the ZR motor 20 can be used to make precise adjustments to the angle of the adsorption component 40 in the vertical direction and in the horizontal plane.

[0038] In one embodiment, the die bonding arm 30 is provided with a cross roller guide 31, which is arranged vertically and has a sliding fit with the adjustment assembly 10.

[0039] In the above embodiment, the Z-axis motion is supported by a cross roller guide 31. The ZR motor 20 adjusts the angle of the adsorption component 40 in the horizontal plane to adjust the die bonding angle, ensuring the accuracy of die bonding. Furthermore, the force control program of the ZR motor 20 can precisely control the pressure during die bonding, so that the wafer meets the process requirements of die bonding.

[0040] In one embodiment, to perform adsorption transfer of the wafer, the adsorption assembly 40 includes a suction nozzle 41, the upper end of which is connected to the adsorption port of the negative pressure adsorption unit via a pipeline.

[0041] In one embodiment, the upper end of the suction nozzle 41 can be connected to the suction port of the negative pressure adsorption unit through an air nozzle, thereby enabling the adsorption of the wafer. By starting the ZR motor 20, the suction nozzle 41 is rotated, thereby adjusting the angle of the wafer in the horizontal plane.

[0042] In one embodiment, in order to enable the fixed arm 30 to connect the adsorption component 40 and the adjustment component 10, the die-bonding arm 30 is generally in the form of a right-angled folded plate, the cross roller guide rail 31 is fixed on the vertical section of the die-bonding arm 30, and the adsorption component 40 is rotatably mounted on the horizontal section of the die-bonding arm 30.

[0043] In the above embodiment, the die-bonding arm 30 has a right-angled folded plate structure, which cleverly utilizes space. The vertical section is used to install the cross roller guide 31, and the horizontal section is used to rotate and install the adsorption assembly 40. This layout allows the components to be rationally placed in a limited space, avoiding mutual interference between components and improving the space utilization of the die-bonding mechanism. Compared with some compact but poorly laid-out designs, this right-angled folded plate die-bonding arm can better adapt to wafers of different sizes and other components inside the die-bonding equipment, providing possibilities for the miniaturization and integration of the overall equipment. The cross roller guide 31 is fixed on the vertical section of the die-bonding arm 30, providing stable linear motion guidance for the connected components. As the mounting base for the guide, the right-angled folded plate structure of the vertical section provides sufficient strength and rigidity to support the weight of the guide and the moving parts on the guide, reducing swaying or deviation caused by structural deformation during movement. For the adsorption assembly 40, which is installed on the horizontal section, the structural design of the horizontal section ensures that the adsorption assembly remains stable during rotation. Because the horizontal and vertical segments form right angles, they provide stable support in space, making the rotation of the adsorption component more precise and stable during wafer adsorption and transfer, which helps to improve the accuracy of wafer positioning during the die bonding process.

[0044] In one embodiment, see Figure 3The suction nozzle 41 is tubular and vertically arranged. The tube body of the suction nozzle 41 is rotatably mounted on the die bonding arm 30 through the first bearing 42. A sealing ring 411 is provided at the upper end of the suction nozzle 41. A top cover 32 is provided on the die bonding arm 30. An air passage is provided on the top cover 32. The sealing ring 411 abuts against one end of the air passage. An air nozzle 321 is provided at the other end of the air passage. The air nozzle 321 is connected to the adsorption port of the negative pressure adsorption unit.

[0045] In the above embodiment, the suction nozzle 41 is tubular and vertically arranged, and is rotatably mounted on the die-bonding arm 30 via the first bearing 42. This design gives the suction nozzle 41 excellent rotational flexibility. During the die-bonding process, the suction nozzle 41 can easily adjust its angle according to actual needs, accurately aligning with wafers in different positions and directions. Compared to a suction nozzle with a fixed angle, this rotatable design greatly improves the nozzle's adaptability to wafers with various complex layouts, effectively improving the adsorption success rate and die-bonding efficiency. For example, when facing wafers with irregular arrangements or special angle requirements, the rotatable suction nozzle can quickly adjust its posture and accurately adsorb the wafer, avoiding adsorption failure or wafer damage caused by angle deviation. Furthermore, the sealing ring 411 provided at the upper end of the suction nozzle 41 abuts against one end of the gas passage of the die-bonding arm 30 cover 32, forming a highly efficient sealing structure. This sealing design can effectively prevent gas leakage and ensure that the negative pressure in the gas passage is stably transmitted to the suction nozzle 41. When the air nozzle 321 is connected to the adsorption port of the negative pressure adsorption unit, the stable negative pressure environment enables the nozzle 41 to generate a continuous and stable adsorption force, firmly adsorbing the wafer. Stable adsorption force is crucial for ensuring the stability of the wafer during transport, reducing the risk of the wafer falling off during adsorption and movement, thereby improving the reliability of the die bonding process and product quality.

[0046] In one embodiment, see Figure 4 The ZR motor 20 has a first synchronous pulley 21 at its output end and a second synchronous pulley 412 on its tube body. The first synchronous pulley 21 and the second synchronous pulley 412 are connected by a synchronous belt. The ZR motor 20 has a second bearing 22 at its output end. The second bearing 22 is rotatably mounted on the die bonding arm 30 and is also rotatably mounted on a bearing seat 23. The bearing seat 23 is fixed on the die bonding arm 30.

[0047] In one embodiment, the adjustment assembly 10 includes a base fixing plate 11, a front and rear adjustment plate 12 is provided on the base fixing plate 11, a motor fixing plate 13 is provided on the front and rear adjustment plate 12, a mounting plate 14 is provided on the motor fixing plate 13, the ZR motor 20 is mounted on the motor fixing plate 13, and the vertical section of the die bonding arm 30 is fixed on the mounting plate 14.

[0048] In the above embodiments, see Figure 2 The adjustment assembly 10, through the combined design of the base fixing plate 11, the front and rear adjustment plate 12, the motor fixing plate 13, and the mounting plate 14, provides flexible and precise adjustment capabilities for the die bonding mechanism. The base fixing plate 11 serves as a basic support, providing a stable platform for the subsequent installation of various components. The front and rear adjustment plate 12, mounted on the base fixing plate 11, enables position adjustment in the front and rear directions. This is crucial in actual die bonding operations. When different die bonding process requirements or substrates of different sizes need to be adapted, the position of the die bonding arm 30 in the front and rear directions can be precisely adjusted by adjusting the front and rear adjustment plate 12, ensuring that the nozzle 41 can accurately pick up and place the wafer. The motor fixing plate 13, mounted on the front and rear adjustment plate 12, allows the ZR motor 20 and the connected die bonding arm 30 to not only be adjusted in the front and rear directions, but also to further optimize the positional accuracy of the die bonding mechanism through fine-tuning of the motor fixing plate 13 on the front and rear adjustment plate 12. Mounting plate 14 is used to fix the vertical section of die bonding arm 30. Its cooperation with motor mounting plate 13 ensures the stability of die bonding arm 30 during installation and adjustment. It also provides a structural basis for other possible fine-tuning operations, realizes multi-dimensional fine adjustment, and greatly improves the versatility and adaptability of die bonding mechanism.

[0049] This utility model also proposes a crystal bonding device, including the crystal bonding mechanism described above. The specific structure of the crystal bonding mechanism is as described in the above embodiments. Since this eyeglass frame adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The fastening connecting member connects the eyeglass frame and the eyeglass stand.

[0050] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0051] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A die-bonding mechanism, characterized in that, include: Adjustment components (10); ZR motor (20), the ZR motor (20) being fixed to the adjustment assembly (10); A die-bonding arm (30) is fixed at the output end of the ZR motor (20), and the output end of the ZR motor (20) drives the die-bonding arm (30) to move vertically. The adsorption component (40) is rotatably mounted on the die bonding arm (30), and the output end of the ZR motor (20) drives the adsorption component (40) to rotate on the die bonding arm (30).

2. The die-bonding mechanism according to claim 1, characterized in that, The die-bonding arm (30) is provided with a cross roller guide (31), which is arranged vertically and has a sliding fit with the adjustment component (10).

3. The die-bonding mechanism according to claim 2, characterized in that, The adsorption component (40) includes a suction nozzle (41), the upper end of which is connected to the adsorption port of the negative pressure adsorption unit through a pipeline.

4. The die-bonding mechanism according to claim 3, characterized in that, The die-bonding arm (30) has a right-angled folded plate structure. The cross roller guide (31) is fixed on the vertical section of the die-bonding arm (30). The adsorption component (40) is rotatably installed on the horizontal section of the die-bonding arm (30).

5. The die-bonding mechanism according to claim 4, characterized in that, The suction nozzle (41) is tubular and vertically arranged. The tube body of the suction nozzle (41) is rotatably mounted on the die bonding arm (30) via the first bearing (42). A sealing ring (411) is provided at the upper end of the suction nozzle (41). A top cover (32) is provided on the die bonding arm (30). An air passage is provided on the top cover (32). The sealing ring (411) abuts against one end of the air passage. An air nozzle (321) is provided at the other end of the air passage. The air nozzle (321) is connected to the adsorption port of the negative pressure adsorption unit.

6. The die-bonding mechanism according to claim 5, characterized in that, The output end of the ZR motor (20) is provided with a first synchronous pulley (21), and the tube of the suction nozzle (41) is provided with a second synchronous pulley (412). The first synchronous pulley (21) and the second synchronous pulley (412) are connected by a synchronous belt.

7. The die-bonding mechanism according to claim 5, characterized in that, The output end of the ZR motor (20) is provided with a second bearing (22), which is rotatably mounted on the die bond arm (30).

8. The die-bonding mechanism according to claim 7, characterized in that, The second bearing (22) is rotatably mounted on the bearing seat (23), which is fixed on the die bond arm (30).

9. The die-bonding mechanism according to claim 4, characterized in that, The adjustment assembly (10) includes a base fixing plate (11), a front and rear adjustment plate (12) is provided on the base fixing plate (11), a motor fixing plate (13) is provided on the front and rear adjustment plate (12), a mounting plate (14) is provided on the motor fixing plate (13), the ZR motor (20) is mounted on the motor fixing plate (13), and the vertical section of the die bonding arm (30) is fixed on the mounting plate (14).

10. A die bonding apparatus, characterized in that, Includes the die-bonding mechanism described in any one of claims 1 to 9.

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