Special-shaped aluminum oxide ceramic lining piece

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a special-shaped aluminum oxide ceramic lining piece which comprises an aluminum oxide ceramic main body, and the shape of the aluminum oxide ceramic main body is customized according to the layout and space limitation of a heating element in the electronic equipment; the flexible heat dissipation layer is arranged on the surface, making contact with a heating element, of the aluminum oxide ceramic body, and the flexible heat dissipation layer is made of a high-heat-conduction silica gel material and can be automatically deformed and attached according to the surface shape of the heating element. According to the layout and the space customization shape of the electronic equipment heating element, the flexible heat dissipation layer capable of being automatically attached to the surface of the element is matched, the micro-channel structure is optimally designed, the heat conduction efficiency is effectively improved, the heat dissipation problem under the limited space is solved, the high-heat-conduction liquid in the micro-channel is driven to circulate through the micro-circulating pump, and the heat dissipation efficiency is improved. The high-temperature-resistant and corrosion-resistant fluororubber O-shaped sealing rings and the sealing glue layers at the inlet and the outlet are subjected to double sealing, so that stable and reliable heat dissipation circulation is ensured.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to an irregularly shaped alumina ceramic support. Background Technology

[0002] Alumina ceramics possess high insulation properties, providing reliable insulating support for integrated circuit chips, preventing short circuits, and ensuring normal chip operation. For example, in semiconductor packaging, alumina ceramic substrates isolate the chip from external circuits, ensuring stable signal transmission. Alumina ceramics also exhibit excellent mechanical properties and dimensional stability, making them suitable as mounting substrates for electronic components. Multilayer ceramic substrates, for instance, can integrate multiple electronic components, enabling miniaturization and high performance in electronic devices.

[0003] In the field of electronic devices, with the continuous increase in chip integration and power density, the large amount of heat generated by internal heat-generating components, if not dissipated in time, will seriously affect the performance and lifespan of electronic devices. Traditional heat dissipation structures typically employ standardized designs, making it difficult to closely fit the complex layout of heat-generating components within electronic devices, resulting in low heat dissipation efficiency. For example, there is a large air gap between conventional heat sinks and heat-generating components, and the low thermal conductivity of air greatly hinders effective heat conduction. Furthermore, existing heat dissipation materials and structures lack sufficient adaptability when dealing with irregularly shaped heat-generating components. While some flexible heat dissipation materials can fit the surface of heat-generating components to a certain extent, their own thermal conductivity is limited and cannot meet the heat dissipation requirements of high-power electronic devices. Utility Model Content

[0004] The purpose of this invention is to provide an irregularly shaped alumina ceramic support, which solves the problems of heat dissipation of heating elements in electronic devices and stable operation of the heat dissipation system.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An irregularly shaped alumina ceramic support, comprising an alumina ceramic body, wherein the shape of the alumina ceramic body is customized according to the layout and space constraints of the internal heating elements of the electronic device;

[0007] A flexible heat dissipation layer is disposed on the surface of the alumina ceramic body that contacts the heating element. The flexible heat dissipation layer is made of high thermal conductivity silicone material and can automatically deform and fit according to the surface shape of the heating element.

[0008] A microchannel structure is provided inside the alumina ceramic body. The microchannel structure is reserved during the forming of the ceramic body and the channel is filled with a highly thermally conductive liquid.

[0009] A circulation interface is provided on the alumina ceramic body and connected to the microchannel structure, used to connect an external driving device to drive the circulation of a high thermal conductivity liquid.

[0010] A sealing structure is provided at the inlet and outlet of the microchannel structure to prevent leakage of highly thermally conductive liquid.

[0011] Preferably, the alumina ceramic body is formed by 3D printing, and the shape, size and distribution of the microchannel structure are optimized according to the shape of the alumina ceramic body and the heat dissipation requirements.

[0012] Preferably, the high thermal conductivity liquid is a low melting point molten metal.

[0013] Preferably, the flexible heat dissipation layer is fixedly connected to the alumina ceramic body through a composite process.

[0014] Preferably, the driving device is a micro-circulating pump.

[0015] Preferably, the alumina content in the alumina ceramic body is not less than 95%, and the surface roughness Ra of the alumina ceramic body is ≤0.8μm, so as to improve the heat conduction efficiency and the bonding strength with the flexible heat dissipation layer.

[0016] Preferably, the sealing structure includes an O-ring and a sealing layer disposed at the inlet and outlet of the microchannel. The O-ring is made of fluororubber material that is resistant to high temperature and high thermal conductivity liquid corrosion. The sealing layer is coated on the outside of the O-ring to further enhance the sealing effect.

[0017] This utility model has at least the following beneficial effects:

[0018] This support component is shaped according to the layout and space of the heat-generating components in electronic devices. It features a flexible heat dissipation layer that can automatically conform to the surface of the components and an optimized microchannel structure, which effectively improves heat conduction efficiency and solves the heat dissipation problem under limited space. The highly thermally conductive liquid in the microchannel is driven to circulate by a micro circulation pump. The inlet and outlet are double-sealed by high-temperature and corrosion-resistant fluororubber O-rings and sealing adhesive layers to ensure stable and reliable heat dissipation circulation. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This utility model Figure 1 Sectional view;

[0022] Figure 3 This is a schematic diagram of the microchannel structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the O-ring seal structure of this utility model.

[0024] In the diagram: 1. Alumina ceramic body; 2. Flexible heat dissipation layer; 3. Microchannel structure; 4. Circulation interface; 5. Sealing structure; 6. O-ring; 7. Sealing adhesive layer. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] Reference Figure 1-4 An irregularly shaped alumina ceramic support, comprising an alumina ceramic body 1, wherein the shape of the alumina ceramic body 1 is customized according to the layout and space constraints of the internal heating elements of the electronic device;

[0028] A flexible heat dissipation layer 2 is disposed on the surface of the alumina ceramic body 1 that contacts the heating element. The flexible heat dissipation layer 2 is made of a high thermal conductivity silicone material, which can automatically deform and fit according to the surface shape of the heating element. The flexible heat dissipation layer 2 is fixed to the surface of the alumina ceramic body 1 that contacts the CPU through a composite process. The high thermal conductivity silicone material has a thermal conductivity of 5 W / (m·K), and can automatically deform and fit according to the slight undulations of the CPU surface during installation, eliminating air gaps and improving heat transfer efficiency. The composite process uses hot pressing to tightly bond the silicone to the alumina ceramic body 1 under certain temperature and pressure conditions.

[0029] Microchannel structure 3 is provided inside the alumina ceramic body 1. The microchannel structure 3 is reserved during the forming of the ceramic blank. The channel is filled with a high thermal conductivity liquid. During the 3D printing forming process of the ceramic blank, the microchannel structure 3 is reserved. The microchannel is distributed in a serpentine shape and the channel diameter is 1mm to increase the contact area between the high thermal conductivity liquid and the ceramic body and improve the heat dissipation effect.

[0030] The circulation interface 4 is disposed on the alumina ceramic body 1 and connected to the microchannel structure 3. It is used to connect an external driving device to drive the circulation of the high thermal conductivity liquid. The interface adopts a threaded connection.

[0031] The sealing structure 5 is located at the inlet and outlet of the microchannel structure 3 to prevent leakage of highly thermally conductive liquid.

[0032] To address the irregular shape of the server CPU and the layout of its surrounding circuit boards, an alumina ceramic body 1 was formed using 3D printing. A ceramic raw material with an alumina content of 99.5% was selected to ensure the body possesses high thermal conductivity and mechanical strength. During the printing process, computer-aided design (CAD) software was used to optimize the shape, size, and distribution of the microchannel structure 3 based on the CPU's external shape and heat dissipation requirements. The final surface roughness Ra of the formed alumina ceramic body 1 was controlled at 0.6 μm, which improves heat conduction efficiency and enhances the bonding strength with the flexible heat dissipation layer 2.

[0033] Furthermore, the alumina ceramic body 1 is formed using 3D printing technology, and the shape, size, and distribution of the microchannel structure 3 are optimized according to the shape of the alumina ceramic body 1 and the heat dissipation requirements.

[0034] Furthermore, the high thermal conductivity liquid is a low melting point metal liquid, such as gallium indium tin alloy, which has a melting point of 15°C and a boiling point as high as 1300°C, and can efficiently transfer heat within the normal operating temperature range of the CPU.

[0035] Furthermore, the flexible heat dissipation layer 2 is fixedly connected to the alumina ceramic body 1 through a composite process.

[0036] Furthermore, the driving device is a micro-circulation pump with a flow rate of 50 mL / min, which can stably drive the low-melting-point molten metal in the microchannel to circulate and quickly remove the heat generated by the CPU.

[0037] Furthermore, the alumina content in the alumina ceramic body 1 is not less than 95%, and the surface roughness Ra of the alumina ceramic body 1 is ≤0.8μm, so as to improve the heat conduction efficiency and the bonding strength with the flexible heat dissipation layer 2.

[0038] Furthermore, the sealing structure 5 includes an O-ring 6 and a sealing layer 7 disposed at the inlet and outlet of the microchannel. The O-ring 6 is made of fluororubber material that is resistant to high temperature and high thermal conductivity liquid corrosion. The sealing layer 7 is coated on the outside of the O-ring 6 to further enhance the sealing effect.

[0039] In summary, for high-performance server CPUs, an irregularly shaped alumina ceramic support component is designed and manufactured. The alumina ceramic body 1 is formed using 3D printing technology with high-purity raw materials. The microchannels are optimized by CAD to control surface roughness and improve performance. The flexible heat dissipation layer 2 is made of high thermal conductivity silicone and is achieved by hot-pressing composite to achieve a tight fit. The microchannels are filled with low-melting-point molten metal. The circulation interface 4 is connected to a micro circulation pump to drive liquid circulation. The O-rings 6 and the sealing adhesive layer 7 at the inlet and outlet constitute a sealing structure 5, which effectively improves the stability and service life of the server.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A shaped alumina ceramic support, characterized in that, include: The shape of the alumina ceramic body (1) is customized according to the layout and space constraints of the internal heating elements of the electronic device; A flexible heat dissipation layer (2) is disposed on the surface of the alumina ceramic body (1) in contact with the heating element. The flexible heat dissipation layer (2) is made of high thermal conductivity silicone material and can automatically deform and fit according to the surface shape of the heating element. Microchannel structure (3) is provided inside the alumina ceramic body (1). The microchannel structure (3) is reserved during the forming of the ceramic body and the channel is filled with a highly thermally conductive liquid. The circulation interface (4) is set on the alumina ceramic body (1) and connected to the microchannel structure (3) for connecting an external driving device to drive the circulation of high thermal conductivity liquid; A sealing structure (5) is provided at the inlet and outlet of the microchannel structure (3) to prevent leakage of highly thermally conductive liquid.

2. The irregularly shaped alumina ceramic support according to claim 1, characterized in that, The alumina ceramic body (1) is formed by 3D printing process, and the shape, size and distribution of the microchannel structure (3) are optimized according to the shape of the alumina ceramic body (1) and heat dissipation requirements.

3. The irregularly shaped alumina ceramic support according to claim 1, characterized in that, The high thermal conductivity liquid is a low melting point molten metal.

4. The irregularly shaped alumina ceramic support according to claim 1, characterized in that, The flexible heat dissipation layer (2) is fixedly connected to the alumina ceramic body (1) through a composite process.

5. The irregularly shaped alumina ceramic support according to claim 1, characterized in that, The driving device is a miniature circulating pump.

6. The irregularly shaped alumina ceramic support according to claim 1, characterized in that, The surface roughness Ra of the alumina ceramic body (1) is ≤0.8μm to improve the heat conduction efficiency and the bonding strength with the flexible heat dissipation layer (2).

7. The irregularly shaped alumina ceramic support according to claim 1, characterized in that, The sealing structure (5) includes an O-ring (6) and a sealing layer (7) disposed at the inlet and outlet of the microchannel. The O-ring (6) is made of fluororubber material that is resistant to high temperature and high thermal conductivity liquid corrosion. The sealing layer (7) is coated on the outside of the O-ring (6) to further enhance the sealing effect.

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