Semiconductor chip dispensing device

Abstract

The utility model belongs to the field of adhesive dispensing devices, and particularly relates to a semiconductor chip adhesive dispensing device which comprises a rack, and a pair of first sliding rails are mounted on the inner wall of the rack; a second sliding rail is mounted between the first sliding rails; a third sliding rail is slidably connected to the middle of the second sliding rail. The middle of the third sliding rail is slidably connected with a mounting base. A nozzle is mounted at the bottom of the mounting seat; a box body is fixedly connected to the middle part of the mounting seat; the end part of the box body is communicated with an air pipe; the other end of the box body is communicated with a plurality of spray heads; a plurality of filter plates are arranged in the box body; through the cooperation of the air pipe and the nozzle, the hot air flow can pass through the air pipe and is sprayed to the surface of the colloid from the nozzle, heating of the device during chip dispensing is achieved, and the curing speed of the colloid on the surface of the chip is increased.

Description

Technical Field

[0001] This utility model relates to the field of dispensing devices, specifically a semiconductor chip dispensing device. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. According to internationally accepted semiconductor product standards, semiconductors can be divided into four categories: integrated circuits, discrete devices, sensors, and optoelectronic devices. These can be collectively referred to as semiconductor devices. Semiconductors are widely used in electronics, communications, computers, energy, medical, automotive and other fields.

[0003] In the semiconductor chip manufacturing process, dispensing is a crucial step. Glue is filled into the gap between the chip and the substrate to strengthen the connection between the chip and the substrate, improve mechanical reliability, and prevent moisture and contaminants from entering.

[0004] In the current semiconductor chip dispensing process, the adhesive is usually applied to the chip surface in an indoor environment. However, during use and observation, it has been found that this dispensing method requires the adhesive to set naturally, which increases the time required for the adhesive to cure.

[0005] Therefore, a semiconductor chip dispensing device is proposed to address the above problems. Utility Model Content

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by this utility model to solve its technical problem is as follows: A semiconductor chip dispensing device of this utility model includes a frame, a pair of first slide rails installed on the inner wall of the frame; a second slide rail installed between the first slide rails; a third slide rail slidably connected to the middle of the second slide rail; a mounting base slidably connected to the middle of the third slide rail; a nozzle installed at the bottom of the mounting base; a box body fixedly connected to the middle of the mounting base; an air pipe connected to one end of the box body; multiple nozzles connected to the other end of the box body; and multiple filter plates provided inside the box body. Through the cooperation of the air pipe and the nozzles, hot air can pass through the air pipe and be sprayed from the nozzles to the surface of the adhesive, thereby heating the chip during dispensing and accelerating the curing speed of the adhesive on the chip surface.

[0008] Preferably, a pair of connecting rods are symmetrically rotatably connected to the middle of the box body; the connecting rods and the box body are connected by a torsion spring; a clamping plate is fixedly connected to the end of the adjacent connecting rods; a handle is fixedly connected to the middle of the clamping plate; through the cooperation of the connecting rods and the clamping plate, rotating the connecting rods can drive the clamping plate away from the filter plate, realizing the quick installation and removal of the filter plate by the device, and improving the convenience of filter plate replacement and cleaning.

[0009] Preferably, the mounting base is symmetrically fixed with spring telescopic rods at its bottom; a pressure plate is fixedly fixed to the bottom of the spring telescopic rods; when the nozzle dispenses adhesive to the chip, the mounting base moves toward the chip along with the nozzle. During this process, the pressure plate first contacts the chip, and then the pressure plate transmits pressure to the spring telescopic rods, causing the spring telescopic rods to be in a compressed state. The spring telescopic rods apply elastic force to the pressure plate, causing the pressure plate to squeeze the chip, so that the chip will be subjected to additional squeezing during dispensing. At the same time, the nozzle moves along the edge of the chip's surface when dispensing adhesive, so the surface of the pressure plate can be sprayed with a wear-resistant coating to reduce wear caused by friction between the pressure plate and the chip.

[0010] Preferably, the bottom of the pressure plate is rotatably connected with multiple ball bearings; the ball bearings are arranged in an array; by setting the ball bearings, when the pressure plate and the chip come into contact, the ball bearings will also come into contact with the chip, and the ball bearings will rotate under the contact action with the chip, so as to reduce the friction between the pressure plate and the chip, and further reduce the wear between the pressure plate and the chip.

[0011] Preferably, an airbag is fixedly connected to the middle of the pressure plate; a plug is threadedly connected to the middle of the airbag; by setting the airbag, the plug can be unscrewed from the surface of the airbag and inflated into the airbag, so that the airbag is in an inflated state. When the pressure plate moves and comes into contact with the chip surface components, the airbag will come into contact with them before the pressure plate. Because the air pressure inside the airbag makes the surface of the airbag elastic, it can reduce the impact when the components and the spring telescopic rod come into contact.

[0012] Preferably, a plurality of reinforcing plates are fixedly connected to the middle of the airbag; the reinforcing plates are arranged in a circumferential array; by setting the reinforcing plates, the reinforcing plates can provide additional tension to the outer wall of the airbag, improve the rigidity of the airbag surface, and reduce the damage caused by pulling when the airbag and components come into contact.

[0013] The advantages of this utility model are:

[0014] 1. The semiconductor chip dispensing device of this utility model, through the cooperation of the air pipe and the nozzle, allows hot air to pass through the air pipe and be sprayed from the nozzle onto the surface of the adhesive, thereby heating the chip during dispensing and accelerating the curing speed of the adhesive on the chip surface.

[0015] 2. The semiconductor chip dispensing device of this utility model, through the cooperation of the connecting rod and the pressure plate, allows the pressure plate to be driven away from the filter plate by rotating the connecting rod, thereby realizing the quick installation and removal of the filter plate and improving the convenience of filter plate replacement and cleaning. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the main body of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the second slide rail in this utility model;

[0019] Figure 3 This is a schematic diagram of the box body in this utility model;

[0020] Figure 4 This is a schematic diagram of the filter plate in this utility model;

[0021] Figure 5 This is a schematic diagram of the structure of the airbag in this utility model.

[0022] In the diagram: 1. Frame; 12. First slide rail; 13. Second slide rail; 14. Mounting base; 15. Nozzle; 16. Box body; 17. Air pipe; 18. Filter plate; 19. Nozzle; 110. Vacuum suction cup; 111. Third slide rail; 2. Connecting rod; 22. Clamping plate; 23. Handle; 3. Spring telescopic rod; 32. Pressure plate; 4. Ball bearing; 5. Airbag; 52. Plug; 6. Reinforcing plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] Specific implementation examples are given below.

[0025] Please see Figures 1 to 5As shown in the embodiment of this utility model, a semiconductor chip dispensing device includes a frame 1. A pair of first slide rails 12 are installed on the inner wall of the frame 1. A second slide rail 13 is installed between the first slide rails 12. A third slide rail 111 is slidably connected to the middle of the second slide rail 13. A mounting base 14 is slidably connected to the middle of the third slide rail 111. A nozzle 15 is installed at the bottom of the mounting base 14. A box 16 is fixedly connected to the middle of the mounting base 14. An air pipe 17 is connected to one end of the box 16. Multiple nozzles 19 are connected to the other end of the box 16. Multiple filter plates 18 are provided inside the box 16. A vacuum suction cup 110 is installed on the inner wall of the frame 1. During operation, the chip can be placed on top of the vacuum suction cup 110 and the vacuum suction cup 110 can be connected to a vacuum pump, so that the vacuum suction cup 110 can suction the chip under negative pressure. The device is fixed in place, and then can be activated to make the nozzle 15 move vertically along the third slide rail 111 with the mounting base 14. With the second slide rail 13 and the first slide rail 12 moving horizontally, the nozzle 15 can apply the adhesive to the chip surface through the delivery pump. The above driving methods are all electric and are common existing technologies. When the nozzle 15 dispenses adhesive to the chip surface, the air pipe 17 can be connected to a hot air blower so that the hot airflow enters the box 16 through the air pipe 17. The airflow will pass through the filter plate 18 and be filtered and impurities removed by the filter plate 18. Then the purified airflow will be sprayed out from the nozzle 19 and reach the adhesive that has just been applied to the chip surface to accelerate the curing speed of the adhesive on the chip surface. Through the cooperation of the air pipe 17 and the nozzle 19, the hot airflow can pass through the air pipe 17 and be sprayed from the nozzle 19 to the adhesive surface, realizing the heating of the device when dispensing adhesive to the chip and accelerating the curing speed of the adhesive on the chip surface.

[0026] Please see Figure 3 and Figure 4 As shown, a pair of connecting rods 2 are symmetrically rotatably connected to the middle of the box 16; the connecting rods 2 and the box 16 are connected by a torsion spring; a clamping plate 22 is fixedly connected to the end of the adjacent connecting rods 2; a handle 23 is fixedly connected to the middle of the clamping plate 22; when the filter plate 18 has been working for a long time, powder and other substances will adhere to its surface. The handle 23 can be pulled to rotate the clamping plate 22 and the connecting rods 2. During the process, the torsion spring will be in a bent state. At this time, the filter plate 18 will be in a movable state and can be easily removed from the box 16, which is convenient for the replacement or cleaning of the filter plate 18. At the same time, because the airflow temperature is limited, it will not affect the performance of the torsion spring; through the cooperation of the connecting rods 2 and the clamping plate 22, rotating the connecting rods 2 can drive the clamping plate 22 away from the filter plate 18, realizing the quick installation and removal of the filter plate 18 and improving the convenience of filter plate 18 replacement and cleaning.

[0027] Please see Figure 3 and Figure 5As shown, the mounting base 14 is symmetrically fixed to the bottom of a spring telescopic rod 3; the bottom of the spring telescopic rod 3 is fixed to a pressure plate 32; when the nozzle 15 dispenses adhesive to the chip, the mounting base 14 moves toward the chip along with the nozzle 15. During the process, the pressure plate 32 first contacts the chip, and then the pressure plate 32 transmits pressure to the spring telescopic rod 3, causing the spring telescopic rod 3 to be in a compressed state. The spring telescopic rod 3 applies elastic force to the pressure plate 32, causing the pressure plate 32 to squeeze the chip, so that the chip will be subjected to additional squeezing during dispensing. At the same time, the nozzle 15 moves along the edge of the chip surface when dispensing adhesive. Therefore, the surface of the pressure plate 32 can be sprayed with a wear-resistant coating to reduce wear caused by friction between the pressure plate 32 and the chip.

[0028] Please see Figure 5 As shown, a plurality of balls 4 are rotatably connected to the bottom of the pressure plate 32; the balls 4 are arranged in an array; by setting the balls 4, when the pressure plate 32 contacts the chip, the balls 4 will also contact the chip, and the balls 4 will rotate under the contact action with the chip, so as to reduce the friction between the pressure plate 32 and the chip, and further reduce the wear between the pressure plate 32 and the chip.

[0029] Please see Figure 5 As shown, an airbag 5 is fixedly connected to the middle of the pressure plate 32; a plug 52 is threadedly connected to the middle of the airbag 5; by setting the airbag 5, the plug 52 can be unscrewed from the surface of the airbag 5 and inflated into the airbag 5, so that the airbag 5 is in an inflated state. When the pressure plate 32 moves and comes into contact with the chip surface component, the airbag 5 will come into contact with it before the pressure plate 32. Because the air pressure inside the airbag 5 makes the surface of the airbag 5 elastic, it can reduce the impact when the component and the spring telescopic rod 3 come into contact.

[0030] Please see Figure 5 As shown, a plurality of reinforcing plates 6 are fixedly connected to the middle of the airbag 5; the reinforcing plates 6 are arranged in a circumferential array; by setting the reinforcing plates 6, the reinforcing plates 6 can provide additional tension to the outer wall of the airbag 5, improve the rigidity of the surface of the airbag 5, and reduce the damage caused by pulling when the airbag 5 and the components come into contact.

[0031] Working principle: The chip is placed on top of the vacuum suction cup 110 and connected to the vacuum pump, allowing the vacuum suction cup 110 to adsorb and fix the chip under negative pressure. Then, the device can be activated, causing the nozzle 15 to move vertically along the third slide rail 111 with the mounting base 14. As the second slide rail 13 and the first slide rail 12 move horizontally, the nozzle 15 can apply the adhesive to the chip surface through the delivery pump. The above driving methods are all electric and are common existing technologies. When the nozzle 15 is dispensing adhesive to the chip surface, a hot air blower can be connected to the air pipe 17 to allow hot air to enter the box 16 through the air pipe 17. The airflow will be filtered. The filter plate 18 filters and removes impurities. The purified airflow is then sprayed from the nozzle 19 and reaches the newly applied adhesive on the chip surface to accelerate the curing speed of the adhesive. When the filter plate 18 has been in operation for a long time, powder or other deposits may accumulate on its surface. Pulling the handle 23 rotates the clamping plate 22 and connecting rod 2. During this process, the torsion spring is in a bent state, allowing the filter plate 18 to be easily removed from the housing 16 for replacement or cleaning. Since the airflow temperature is limited, it does not affect the performance of the torsion spring. When the nozzle 15 dispenses adhesive onto the chip, the mounting base 14 moves the nozzle 15 towards the chip. During the process, the pressure plate 32 first contacts the chip, then transmits pressure to the spring telescopic rod 3, compressing it. The spring telescopic rod 3 applies elastic force to the pressure plate 32, causing it to squeeze the chip. This results in additional pressure on the chip during dispensing. Simultaneously, the nozzle 15 moves along the chip's surface edge during dispensing. Therefore, the surface of the pressure plate 32 can be coated with a wear-resistant coating to reduce wear caused by friction between the pressure plate 32 and the chip. By incorporating ball bearings 4, when the pressure plate 32 contacts the chip, the ball bearings also contact the chip, contributing to the chip's contact performance. The pressure plate 32 rotates downwards to reduce friction between it and the chip. By providing an airbag 5, the plug 52 can be unscrewed from the surface of the airbag 5 and inflated into it, so that the airbag 5 is in an inflated state. When the pressure plate 32 moves and comes into contact with the chip surface component, the airbag 5 will make contact with it before the pressure plate 32. This is because the air pressure inside the airbag 5 makes its surface elastic, which can reduce the impact when the component and the spring telescopic rod 3 come into contact. By providing a reinforcing plate 6, the reinforcing plate 6 can provide additional tension to the outer wall of the airbag 5, improve the rigidity of the airbag 5 surface, and reduce the damage caused by pulling when the airbag 5 comes into contact with the component.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A semiconductor chip dispensing apparatus, comprising a frame (1), characterized in that: The inner wall of the frame (1) is equipped with a pair of first slide rails (12); a second slide rail (13) is installed between the first slide rails (12); a third slide rail (111) is slidably connected in the middle of the second slide rail (13); a mounting base (14) is slidably connected in the middle of the third slide rail (111); a nozzle (15) is installed at the bottom of the mounting base (14); a box (16) is fixedly connected in the middle of the mounting base (14); an air pipe (17) is connected to one end of the box (16); multiple nozzles (19) are connected to the other end of the box (16); multiple filter plates (18) are provided inside the box (16); a vacuum suction cup (110) is installed on the inner wall of the frame (1).

2. The semiconductor chip dispensing device according to claim 1, characterized in that: A pair of connecting rods (2) are symmetrically rotatably connected in the middle of the box (16); the connecting rods (2) and the box (16) are connected by a torsion spring; a clamp (22) is fixedly connected to the end of the adjacent connecting rods (2); a handle (23) is fixedly connected to the middle of the clamp (22).

3. The semiconductor chip dispensing apparatus according to claim 2, characterized in that: The mounting base (14) is symmetrically fixed to the bottom of a spring telescopic rod (3); the bottom of the spring telescopic rod (3) is fixed to a pressure plate (32).

4. The semiconductor chip dispensing device according to claim 3, characterized in that: The bottom of the pressure plate (32) is rotatably connected to multiple balls (4); the balls (4) are arranged in an array.

5. A semiconductor chip dispensing device according to claim 4, characterized in that: An airbag (5) is fixedly connected to the middle of the pressure plate (32); a plug (52) is threadedly connected to the middle of the airbag (5).

6. The semiconductor chip dispensing apparatus according to claim 5, characterized in that: Multiple reinforcing plates (6) are fixedly attached to the middle of the airbag (5); the reinforcing plates (6) are arranged in a circumferential array.

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