Tin spraying device based on gold removing and tin coating of middle-lower part of gold-plated connector pin

Abstract

The utility model discloses a tin spraying device based on gold removing and tin coating of the middle lower portion of a gold-plated connector pin, and belongs to the technical field of gold removing and tin coating. The tin spraying device comprises a base and a spray head, the base comprises a substrate, and a through tin spraying hole is formed in the substrate; the spray head is fixed to the base, a through tin spraying channel is formed in the spray head and communicates with the tin spraying hole, and tin guiding grooves are formed in the two sides of the end of the tin spraying channel. According to the utility model, the problem that the final requirement of a product is not met due to the inevitable gold-removing and tin-coating treatment on the upper part of the contact pin when the gold-removing and tin-coating treatment is carried out on the connector can be solved.

Description

Technical Field

[0001] This application relates to the field of gold plating removal technology, and more particularly to a tin spraying device for removing gold plating from the lower part of the gold-plated connector pins. Background Technology

[0002] According to industry standards and product quality reliability requirements, double-row gold-plated connectors should undergo a gold-removal and tinning process on the gold-plated pin soldering areas before soldering. However, because board-level interconnection is required after soldering (the upper 5mm of the pins is protected and not gold-removed or tinned, as this part needs to be mated with the corresponding connector), the connector pins in the interconnection area cannot be tinned and must maintain their original gold plating state, according to design requirements. Therefore, the product connector requires that only the lower part of the pins be gold-removed and tinned, so as to protect the upper part of the pins (interconnection area) that does not need tinning, while ensuring that the lower part (soldering area) can be gold-removed and tinned effectively.

[0003] Based on traditional methods, when removing gold and tinning connectors, the pin leads are usually inserted directly into the solder with the pins perpendicular to the solder surface. This method inevitably removes gold and tins the upper part of the pins as well, which does not meet the final requirements of the product. Utility Model Content

[0004] The main purpose of this application is to provide a solder spraying device for removing gold and tinning the lower part of the gold-plated connector pins, which aims to solve the problem that when removing gold and tinning the connector, the upper part of the pins is inevitably also removed and tinned, resulting in non-compliance with the final product requirements.

[0005] To achieve the above objectives, this application provides a solder spraying device for removing gold plating and soldering the lower part of a gold-plated connector pin, comprising: a base and a nozzle, wherein the base includes a substrate with a through solder spraying hole; the nozzle is fixed to the base and has a through solder spraying channel communicating with the solder spraying hole, and solder guide grooves are provided on both sides of the end of the solder spraying channel.

[0006] Optionally, the base has a mating plate on the edge opposite to the nozzle.

[0007] Optionally, the tin-spraying device based on removing gold plating and tinning the lower part of the gold-plated connector pin further includes a left ear and a right ear, wherein the left ear is disposed on one side of the mating plate and the extending direction of the left ear is perpendicular to the extending direction of the nozzle; the right ear is disposed on one side of the mating plate opposite to the left ear and the extending direction of the right ear is perpendicular to the extending direction of the nozzle.

[0008] Optionally, the base, the nozzle, the left ear, and the right ear are all made of stainless steel.

[0009] Optionally, the thickness of the base, the nozzle, the left ear, and the right ear is 1mm to 2mm.

[0010] Optionally, the length of the end of the nozzle away from the base is greater than the length of the end of the nozzle connected to the base.

[0011] Optionally, the base, the nozzle, the left ear, and the right ear are connected together by welding.

[0012] This application discloses a solder spraying device for removing gold plating and soldering the lower part of gold-plated connector pins. During the gold plating process, the base is mounted on a solder spraying furnace, and the nozzle is aimed at the soldering part of the gold-plated connector pins. The solder sprayed from the nozzle adheres to the soldering part of the gold-plated connector pins. In this process, the solder enters the solder spraying channel from the solder spraying holes on the substrate and is then sprayed onto the soldering part of the gold-plated connector pins, thus completing the gold plating and solder removal process and ensuring the product meets the final requirements. Solder guide grooves are provided on both sides of the end of the solder spraying channel. When the solder is sprayed out and exceeds the height of the solder spraying nozzle, it flows away through the solder guide grooves on both sides, ensuring that the solder does not overflow the long side of the solder spraying nozzle. Furthermore, the solder guide grooves also change the surface tension of the solder itself, effectively solving the problem of solder flowability during the solder spraying process. Ultimately, the shape, size, height, and flowability of the solder sprayed from the solder spraying nozzle are effectively controlled. In summary, the tin-plating device involved in this application has a simple structure and is easy to operate. It can accurately remove gold and tin from the soldered part of the lower part of the gold-plated connector pins, while protecting the upper part of the pins from tinning, thus meeting the final requirements of the product. Attached Figure Description

[0013] Figure 1 A schematic diagram of a solder spraying device for removing gold plating and soldering the lower part of a gold-plated connector pin, provided in this application embodiment;

[0014] Figure 2 for Figure 1 A structural diagram from another perspective.

[0015] In the diagram, 1 is the base; 101 is the substrate; 102 is the solder spray hole; 103 is the mating board; 2 is the nozzle; 201 is the solder spray channel; 202 is the solder guide groove; 3 is the left ear; and 4 is the right ear.

[0016] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0019] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0020] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0021] Please see Figure 1 , Figure 2This application provides a solder spraying device for removing gold plating and soldering the lower part of a gold-plated connector pin. The solder spraying device may include a base 1 and a nozzle 2. The base 1 includes a substrate 101, on which a through solder spraying hole 102 is formed. The nozzle 2 is fixed on the base 1 and has a through solder spraying channel 201. The solder spraying channel 201 communicates with the solder spraying hole 102, and solder guide grooves 202 are provided on both sides of the end of the solder spraying channel 201.

[0022] In this embodiment, during the gold removal and soldering process, the base 1 is installed on the soldering furnace, and the nozzle 2 is aligned with the gold-plated pin soldering part of the connector. The solder sprayed from the nozzle 2 adheres to the gold-plated pin soldering part of the connector. During this process, the solder enters the soldering channel 201 from the soldering hole 102 on the substrate 101, and then the solder is sprayed onto the gold-plated pin soldering part of the connector, thereby completing the gold removal and soldering process and ensuring that the product meets the final requirements. Solder guide grooves 202 are provided on both sides of the end of the soldering channel 201. When the solder is sprayed out and exceeds the soldering nozzle, the solder will flow away through the solder guide grooves 202 on both sides, ensuring that the solder does not overflow the long side of the soldering nozzle. Moreover, the solder guide grooves 202 also change the surface tension of the solder itself, effectively solving the problem of solder flow during the soldering process. Ultimately, the shape, size, height, and flow of the solder sprayed from the soldering nozzle are effectively controlled. In summary, the tin-plating device involved in this application has a simple structure and is easy to operate. It can accurately remove gold and tin from the soldered part of the lower part of the gold-plated connector pins, while protecting the upper part of the pins from tinning, thus meeting the final requirements of the product.

[0023] It should be noted that the solder spraying channel 201 of the nozzle 2 ensures that the molten solder can be sprayed evenly and accurately onto the lower middle part of the pin. The solder guide trough 202 helps to guide excess molten solder out and prevents molten solder from accumulating on the pin, thereby ensuring the effectiveness of the gold removal and soldering process.

[0024] Please see Figure 2 In one possible implementation, the edge of the base 1 facing away from the nozzle 2 may be provided with a mating plate 103.

[0025] Specifically, the mating plate 103 facilitates the stable installation of the base 1 onto the soldering furnace, and also facilitates its mating and fixation with other components. The size and shape of the mating plate 103 can be designed according to actual needs to ensure a firm and reliable connection between the base 1 and the soldering furnace or other components. For example, the mating plate 103 can be configured as a rectangular frame structure, a columnar structure, etc.

[0026] Please see Figure 1 , Figure 2In one possible implementation, the tin-spraying device for removing gold plating from the lower part of the gold-plated connector pins may further include: a left ear 3 and a right ear 4, wherein the left ear 3 is disposed on one side of the mating plate 103 and the extension direction of the left ear 3 is perpendicular to the extension direction of the nozzle 2; the right ear 4 is disposed on one side of the mating plate 103 opposite to the left ear 3 and the extension direction of the right ear 4 is perpendicular to the extension direction of the nozzle 2.

[0027] In this embodiment, the placement of the left ear 3 and right ear 4 further enhances the structural stability and ease of installation of the base 1. The left ear 3 and right ear 4 are located on opposite sides of the mating plate 103, and their extension direction is perpendicular to the extension direction of the nozzle 2. This design makes the solder spraying device easier to install and disassemble, while also improving the overall stability of the device. The left ear 3 and right ear 4 allow the solder spraying device to be securely fixed to the solder spraying furnace or other related equipment, ensuring that there is no shaking or displacement during the solder spraying process, thereby further improving the accuracy and stability of the solder spraying.

[0028] Furthermore, the left ear 3 and right ear 4 can also serve as leverage points for carrying and moving the soldering device, allowing operators to easily move or adjust the device's position as needed. This design not only improves the ease of use of the soldering device but also reduces the difficulties and risks that operators may encounter during handling.

[0029] It should be noted that both the left ear (3) and the right ear (4) can be "L" shaped structures.

[0030] Furthermore, in one possible implementation, the base 1, nozzle 2, left ear 3, and right ear 4 can all be made of stainless steel.

[0031] The base 1, nozzle 2, left ear 3, and right ear 4 are all made of stainless steel, primarily due to stainless steel's excellent corrosion resistance and high-temperature resistance. During tin plating, the device needs to withstand high temperatures as the molten solder requires high temperatures. Stainless steel effectively resists high temperatures and corrosion from molten solder, ensuring stable performance and a long service life even after prolonged use. Furthermore, stainless steel possesses good mechanical strength and toughness, capable of withstanding certain external forces and impacts, further enhancing the overall stability and durability of the device. This material selection makes the tin plating device more reliable and durable, meeting the requirements for long-term continuous operation.

[0032] In some embodiments, the base 1, nozzle 2, left ear 3, and right ear 4 can be austenitic stainless steel, martensitic stainless steel, ferritic stainless steel, etc.

[0033] Furthermore, in one possible implementation, the thickness of the base 1, nozzle 2, left ear 3, and right ear 4 can all be 1mm to 2mm.

[0034] In an exemplary embodiment, the thickness of the base 1, nozzle 2, left ear 3, and right ear 4 can all be 1mm, 1.5mm, 2mm, etc. This thickness design ensures the structural strength of the device while reducing its weight, making it lighter and easier to operate. Simultaneously, the appropriate thickness also helps improve the thermal conductivity of the device, allowing the molten solder to reach the required temperature more quickly, thereby improving soldering efficiency.

[0035] Furthermore, in one possible implementation, the length of the end of the nozzle 2 away from the base 1 can be greater than the length of the end of the nozzle 2 connected to the base 1.

[0036] In practice, the length of the end of the nozzle 2 furthest from the base 1 is greater than the length of the end of the nozzle 2 connected to the base 1. This design of the nozzle 2 helps reduce the waste of molten solder and improves the accuracy and economy of soldering.

[0037] Furthermore, in one possible implementation, the base 1, nozzle 2, left ear 3, and right ear 4 can be connected together by welding.

[0038] Specifically, the base 1, nozzle 2, left ear 3, and right ear 4 are connected together by welding. Welding offers advantages such as high strength and stable, reliable connection, ensuring the device will not loosen or detach during use. Furthermore, welding improves the overall aesthetics of the device, making it neater and easier to maintain.

[0039] The process of applying soldering using the soldering apparatus described in this application is as follows:

[0040] 1) Turn on the tin spray furnace to melt the tin-lead solder in the furnace.

[0041] 2) High-temperature resistant tape is used to protect the socket body and its base.

[0042] 3) Use flat-tipped tweezers to hold the socket body in the center and apply flux and tin directly. Ensure the grip is stable during the process to prevent the socket from shifting or falling.

[0043] 4) Apply flux. Hold the socket with tweezers in one hand, and use a small flux brush to apply flux along one row of the bottom of the socket body with the other hand. Make sure the application is even and note that the brushing height should not exceed 6mm (the width of the small brush is 5mm).

[0044] 5) Install the dedicated tin spraying device and adjust the tin spraying height. After installing the tin spraying device, turn on the tin spraying switch of the tin spraying furnace and adjust the tin spraying height knob so that the solder can flow out from the tin guide tanks 202 on both sides of the tin spraying device, which meets the width, height and solder flow requirements for gold plating.

[0045] 6) Soldering. Hold the socket with tweezers using one or both hands and place it horizontally on the dedicated soldering device with the soldering height adjusted. The soldering height should be approximately 6mm from the base of the socket to the bottom of the solder baffle, and the soldering time should be 2-3 seconds.

[0046] 7) Cleaning. Soak the socket in anhydrous ethanol for 15-20 minutes, then scrub it by hand.

[0047] 8) Inspection. Check whether the tinning height meets the requirements and whether there are any excess materials.

[0048] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A solder spraying device for removing gold plating and soldering the lower part of gold-plated connector pins, characterized in that, include: The base (1) includes a substrate (101) on which through solder spray holes (102) are formed. The nozzle (2) is fixed on the base (1), and the nozzle (2) has a through solder spraying channel (201). The solder spraying channel (201) is connected to the solder spraying hole (102), and solder guide grooves (202) are provided on both sides of the end of the solder spraying channel (201).

2. The tin-spraying device for removing gold plating and tinning the lower part of the gold-plated connector pins according to claim 1, characterized in that, The base (1) has a mating plate (103) on the edge opposite to the nozzle (2).

3. The tin-spraying device for removing gold plating and tinning the lower part of the gold-plated connector pins according to claim 2, characterized in that, The solder spraying device based on removing gold plating and soldering from the lower part of the gold-plated connector pins further includes: The left ear (3) is located on one side of the mating plate (103), and the extension direction of the left ear (3) is perpendicular to the extension direction of the nozzle (2); The right ear (4) is located on one side of the mating plate (103) opposite to the left ear (3), and the extension direction of the right ear (4) is perpendicular to the extension direction of the nozzle (2).

4. The tin-spraying device for removing gold plating and tinning the lower part of the gold-plated connector pins according to claim 3, characterized in that, The base (1), the nozzle (2), the left ear (3), and the right ear (4) are all made of stainless steel.

5. The tin-spraying device for removing gold plating and tinning the lower part of the gold-plated connector pins according to claim 3, characterized in that, The thickness of the base (1), the nozzle (2), the left ear (3), and the right ear (4) is 1mm to 2mm.

6. The tin-spraying device for removing gold plating and tinning the lower part of the gold-plated connector pins according to claim 1, characterized in that, The length of the nozzle (2) at the end away from the base (1) is greater than the length of the end where the nozzle (2) is connected to the base (1).

7. The tin-spraying device for removing gold plating and tinning the lower part of the gold-plated connector pins according to claim 3, characterized in that, The base (1), the nozzle (2), the left ear (3), and the right ear (4) are connected together by welding.

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