Flip type horizontal electroplating equipment

Abstract

The utility model discloses flip type horizontal electroplating equipment. The electroplating equipment comprises an electroplating rack, an electroplating tank body, a flip cover plate, a roller conveying device, an anode electroplating device and a spray cleaning device, the roller conveying device comprises a lower roller conveying mechanism and an upper roller conveying mechanism; the anode electroplating device comprises a lower anode plate mechanism and an upper anode plate mechanism; the spray cleaning device comprises a lower spray mechanism and an upper spray mechanism; the overturning cover plate is used for overturning, opening and closing relative to the electroplating bath body by taking the hinged position of the overturning cover plate and the electroplating rack as a rotating shaft, so that the roller conveying device, the anode electroplating device and the spray cleaning device are convenient to overhaul and operate; according to the electroplating equipment, the functions of automatic conveying, electroplating, cleaning and convenient overhauling of electroplated parts are achieved, electroplating and cleaning of the electroplated parts in the conveying process are more uniform, meanwhile, the electroplated parts can be rapidly turned over and disassembled during maintenance, the line stopping time is shortened, and the overall operation and maintenance efficiency of the equipment is improved.

Description

Technical Field

[0001] This application relates to the field of horizontal electroplating equipment technology, and in particular to a flip-top type horizontal electroplating equipment. Background Technology

[0002] Traditional horizontal electroplating equipment in the PCB industry is typically used for surface treatment of metal parts. Existing equipment uses a horizontal electroplating flip-top tank design with a glass cover on the tank. However, the small opening area of ​​the glass cover makes it inconvenient to inspect and replace the anode plate and the spray cleaning device. In actual operation, the existing horizontal electroplating flip-top tank is not only complex to maintain and cumbersome to disassemble and assemble, but also time-consuming to maintain, resulting in extended production line downtime and increased maintenance costs. Utility Model Content

[0003] In order to improve the shortcomings of existing horizontal electroplating equipment, such as small opening area of ​​the electroplating flip-top tank and inconvenience for inspection and maintenance, this application provides a flip-top type horizontal electroplating equipment.

[0004] The flip-type horizontal electroplating equipment provided in this application adopts the following technical solution:

[0005] A flip-top type horizontal electroplating equipment includes an electroplating frame, an electroplating tank connected to the electroplating frame, a flip-top cover plate disposed at the opening end of the electroplating tank and hinged to the electroplating frame, a roller conveying device inserted into the electroplating tank and used for conveying electroplated parts, an anode electroplating device located on the upper and lower sides of the roller conveying device, and a spray cleaning device arranged alternately with the roller conveying device.

[0006] The roller conveying device includes a lower roller conveying mechanism rotatably connected to the electroplating tank and an upper roller conveying mechanism rotatably connected to the flip-over cover plate; the anodic electroplating device includes a lower anode plate mechanism fixedly connected to the electroplating tank and located below the lower roller conveying mechanism, and an upper anode plate mechanism fixedly connected to the flip-over cover plate and located above the upper roller conveying mechanism; the spray cleaning device includes a lower spray mechanism connected to the electroplating tank and staggered with the lower roller conveying mechanism, and an upper spray mechanism connected to the flip-over cover plate and staggered with the upper roller conveying mechanism.

[0007] By adopting the above technical solution, a flip-top cover is located at the opening end of the electroplating tank and hinged to the electroplating frame. The flip-top cover is used to flip and open relative to the electroplating tank with the hinge position to the electroplating frame as the rotation axis, so as to facilitate the maintenance and operation of the roller conveyor, the anode electroplating device, and the spray cleaning device. The lower roller conveyor mechanism is rotatably connected to the electroplating tank, and the upper roller conveyor mechanism is rotatably connected to the flip-top cover. When the flip-top cover is flipped, it is convenient to take out and put in the electroplated parts, reducing the impact on the operation of the electroplated parts. The lower anode plate mechanism is located below the lower roller conveyor mechanism, and the upper anode plate mechanism is located above the upper roller conveyor mechanism, ensuring uniform coverage and electroplating of the surface of the electroplated parts during the conveying of the electroplated parts. The lower spray mechanism is connected to the electroplating tank for spray cleaning of the lower surface of the electroplated parts, and the upper spray mechanism is connected to the flip-top cover for spray cleaning of the upper surface of the electroplated parts, ensuring uniform cleaning of the electroplated parts on the conveying path.

[0008] This application realizes the functions of automatic conveying, electroplating, cleaning and convenient maintenance of electroplated parts, which makes the electroplating and cleaning of electroplated parts more uniform during the conveying process. At the same time, it can quickly flip and disassemble during maintenance, reducing downtime and improving the overall operation and maintenance efficiency of the equipment.

[0009] Preferably, both the lower roller conveying mechanism and the upper roller conveying mechanism include rotating shafts arranged in an array along the direction of movement of the electroplated part, and rotating rollers sleeved on the outer wall of the rotating shaft and arranged in an array along the length direction of the rotating shaft.

[0010] By adopting the above technical solution, the rotating roller can rotate with the rotating shaft, thereby supporting and transporting the electroplated parts; the lower roller conveying mechanism is connected to the electroplating tank, and the upper roller conveying mechanism is connected to the flip cover plate, so that when the flip cover plate is opened or closed, the conveying path of the electroplated parts remains stable and unaffected; under the support and drive of the rotating roller, the electroplated parts can move smoothly in a predetermined direction, ensuring that the electroplated parts are evenly contacted with the electroplating solution in the electroplating tank, achieving a continuous and uniform electroplating effect; this application achieves stable and efficient electroplated part conveying, simplifies the equipment structure, reduces friction and wear, and at the same time improves the service life of the overall equipment, and enhances electroplating quality and production efficiency.

[0011] Preferably, the electroplating frame includes a frame body, a flip support frame fixedly connected to the frame body, and a flip shaft connected to the flip support frame; the flip cover includes a cover body and a flip connector connected to the upper side of the cover body and rotatably connected to the flip shaft.

[0012] By adopting the above technical solution, the frame body is fixedly connected to the flipping support frame to form a stable support structure; the upper side of the cover plate body is rotatably connected to the flipping shaft through the flipping connector, so that the cover plate body can rotate around the flipping shaft to realize the opening and closing of the cover plate body; the opening and closing operation of the flipping cover plate of this application is more convenient, which facilitates the quick inspection and replacement of the roller conveyor device, the anodizing device and the spray cleaning device, reduces the disassembly and assembly time, and improves the maintenance efficiency of the equipment.

[0013] Preferably, both the lower anode plate mechanism and the upper anode plate mechanism include an anode connecting frame and an anode electroplating plate connected to the anode connecting frame.

[0014] By adopting the above technical solution, the anode connecting frame is connected to the electroplating tank, placing the anode electroplating plate below the lower roller conveyor mechanism. Another anode connecting frame is connected to the flip cover plate, placing the anode electroplating plate above the upper roller conveyor mechanism, ensuring uniform double-sided electroplating of the electroplated parts during movement. During electroplating, the anode electroplating plate remains stable through the anode connecting frame, forming an optimal electroplating distance with the electroplated parts, effectively improving electroplating efficiency and coating uniformity. This application ensures uniform electroplating environment for the electroplated parts throughout the entire conveying path, simplifies the installation and disassembly process of the anode electroplating plate, facilitates daily maintenance, and further improves the electroplating quality and overall production efficiency of the equipment.

[0015] Preferably, both the lower spray mechanism and the upper spray mechanism include a spray pipe and a spray pipe assembly that communicates with the spray pipe and is inserted laterally into the electroplating tank. The spray pipe assembly is provided with spray holes that open at the midpoint between the lower roller conveyor mechanism and the upper roller conveyor mechanism. The spray holes are arranged in an array along the length of the spray pipe assembly.

[0016] By adopting the above technical solution, the spray pipe is connected to an external cleaning liquid source, which delivers the cleaning liquid to the spray pipe assembly. The spray pipe assembly is inserted laterally into the electroplating tank and is connected to the spray pipe. The spray holes on the spray pipe assembly are used to spray the cleaning liquid onto the upper and lower sides of the electroplated parts, thereby ensuring that the cleaning liquid can cover the entire surface of the electroplated parts and achieve a uniform rinsing effect. This effectively removes residues from the surface of the electroplated parts, maintains the stability of the electroplating quality, and facilitates the cleaning treatment of the electroplated parts before and after electroplating. This application not only improves the cleaning efficiency but also improves the uniformity of cleaning through the array setting of the spray holes.

[0017] Preferably, the lower spray mechanism and the upper spray mechanism further include a quick-connect pipe assembly located between the spray nozzle assembly and the spray pipe and used to connect the spray pipe and the spray nozzle assembly.

[0018] By adopting the above technical solution, the quick-connect pipe assembly is located between the spray pipe assembly and the spray pipe, and is used to connect and fix the spray pipe and the spray pipe assembly, so that the cleaning fluid can be smoothly transported from the spray pipe to the spray hole of the spray pipe assembly. The design of the quick-connect pipe assembly of this application makes the connection between the spray pipe assembly and the spray pipe faster, facilitates the quick disassembly and maintenance of the cleaning fluid delivery system, facilitates the opening and closing of the flip cover, effectively shortens the equipment downtime, and further improves the operating efficiency and maintenance convenience of the equipment.

[0019] Preferably, the electroplating tank includes an electroplating tank bottom plate fixedly connected to the electroplating frame, an inner connecting plate connected to the inner side of the electroplating tank bottom plate, an outer connecting plate connected to the outer side of the electroplating tank bottom plate, a feed head plate connected to one end of the electroplating tank bottom plate, and a discharge tail plate connected to the other end of the electroplating tank bottom plate; both the feed head plate and the discharge tail plate are provided with electroplating through holes for electroplating parts to pass through, and the electroplating through holes are aligned with the roller conveying device.

[0020] By adopting the above technical solution, the inner connecting plate is connected along the inner side of the bottom plate of the electroplating tank, and the outer connecting plate is connected along the outer side of the bottom plate of the electroplating tank. The feed head plate and the discharge tail plate are located at both ends of the electroplating tank, which enhances the structural stability of the tank and forms a closed electroplating area. Electroplating through holes are provided on both the feed head plate and the discharge tail plate, so that the electroplated parts can pass smoothly through the electroplating tank under the drive of the roller conveyor device.

[0021] The electroplating tank of this application not only provides a stable electroplating environment, but also facilitates the transfer of electroplated parts within the tank, improving the efficiency and consistency of the electroplating process, enhancing the operational stability of the equipment, and reducing the resistance and wear that may occur during the entry and exit of electroplated parts, thereby improving the electroplating quality and extending the service life of the equipment.

[0022] Preferably, the electroplating tank includes an in-tank support frame connected to the bottom plate of the electroplating tank; the anode connecting frame of the lower anode plate mechanism is connected to the in-tank support frame; the quick-connect pipe assembly of the lower spray mechanism is inserted into the outer connecting plate; one end of the lower roller conveying mechanism is rotatably connected to the in-tank support frame, and the other end is rotatably connected to the outer connecting plate; one end of the lower spray mechanism is connected to the in-tank support frame, and the other end is connected to the outer connecting plate.

[0023] By adopting the above technical solutions, the tank support frame provides stable support for the lower anode plate mechanism, the lower roller conveying mechanism, and the lower spraying mechanism; the anode connecting frame of the lower anode plate mechanism is fixed on the tank support frame to ensure the stability of the position of the anode electroplating plate during the electroplating process, thereby improving the uniformity of electroplating; the quick-connect assembly of the pipe of the lower spraying mechanism is inserted into the outer connecting plate, realizing convenient connection and maintenance; the rotational connection of the lower roller conveying mechanism makes the conveying path of the electroplated parts in the tank stable and smooth;

[0024] This application, through the connection of the internal support frame, forms a compact and orderly arrangement of the components within the electroplating tank, effectively enhancing the stability and uniformity of the electroplating process, ensuring the simultaneous execution of cleaning and electroplating operations, while simplifying the equipment installation and maintenance process, and improving equipment operating efficiency and overall service life.

[0025] Preferably, the flip cover further includes a connecting support side plate connected to the cover body and located near the inner connecting plate, and a shielding support side plate connected to the cover body and located near the outer connecting plate; the shielding support side plate is aligned with the outer connecting plate.

[0026] The anode connecting frame of the upper anode plate mechanism is connected to the connecting support side plate; the quick-connect pipe assembly of the upper spray mechanism is inserted into the shielding support side plate; one end of the upper roller conveying mechanism is rotatably connected to the connecting support side plate, and the other end is rotatably connected to the shielding support side plate; one end of the upper spray mechanism is connected to the connecting support side plate, and the other end is connected to the shielding support side plate.

[0027] By adopting the above technical solution, the anode connecting frame of the upper anode plate mechanism is fixed on the connecting support side plate, which stabilizes the position of the anode electroplating plate during the electroplating process and ensures a uniform electroplating effect on the electroplated parts; the quick-connect assembly of the pipe of the upper spray mechanism is inserted into the shielding support side plate, realizing convenient disassembly and maintenance of the cleaning system and further optimizing the cleaning process; the rotating connection of the upper roller conveyor mechanism enables the electroplated parts to be stably conveyed through the upper roller conveyor mechanism, ensuring the smoothness of the conveying path; this application makes the flip cover easy to open and close, which not only facilitates the maintenance of the roller conveyor device, the anode electroplating device and the spray cleaning device, but also ensures the synchronization of electroplating and cleaning operations, improves the operating efficiency, cleaning effect and electroplating quality of the equipment, further extends the service life of the equipment and reduces downtime.

[0028] Preferably, the electroplating tank further includes a pipe fixing plate connected to the side edge of the bottom plate of the electroplating tank; the flip cover plate further includes a flip-shifting baffle connected to the side edge of the cover plate body; the spray pipe is connected to the pipe fixing plate; the pipe fixing plate, the flip-shifting baffle, the feed head plate and the discharge tail plate are arranged to form a pipe receiving cavity for the spray pipe to be inserted.

[0029] By adopting the above technical solution, the pipe fixing plate is used to fix the spray pipe and ensure the stability of the spray system during the electroplating process. The spray pipe is connected to the pipe fixing plate, so that the cleaning solution is stably delivered from the spray pipe to the target area in the electroplating tank. The flip-up baffle is set opposite to the pipe fixing plate when the flip cover is closed, and cooperates with the feed head plate and the discharge tail plate to form a pipe receiving cavity to protect the spray pipe and avoid accidental damage. This application enables the electroplating equipment to maintain the stability of the cleaning system and the continuity of the electroplating effect during operation, improves the cleaning efficiency and the overall ease of operation and maintenance of the equipment, extends the service life of the pipes, and further improves the overall economic benefits and operational stability of the equipment.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. A flip-top cover is located at the opening end of the electroplating tank and hinged to the electroplating frame. The flip-top cover is used to rotate relative to the electroplating tank with the hinged position as the axis of rotation, facilitating the maintenance and operation of the roller conveyor, anodizing device, and spray cleaning device. The lower roller conveyor mechanism is rotatably connected to the electroplating tank, and the upper roller conveyor mechanism is rotatably connected to the flip-top cover. When the flip-top cover is flipped, it facilitates the removal and placement of electroplated parts, reducing the impact on the operation of the electroplated parts. The lower anode plate mechanism is located below the lower roller conveyor mechanism, and the upper anode plate mechanism is located above the upper roller conveyor mechanism, ensuring uniform coverage and electroplating of the surface of the electroplated parts during transport. The lower spray mechanism is connected to the electroplating tank for spray cleaning of the lower surface of the electroplated parts, and the upper spray mechanism is connected to the flip-top cover for spray cleaning of the upper surface of the electroplated parts, ensuring uniform cleaning of the electroplated parts along the transport path.

[0032] This application realizes the functions of automatic conveying, electroplating, cleaning and convenient maintenance of electroplated parts, making the electroplating and cleaning of electroplated parts more uniform during the conveying process, and enabling quick flipping and disassembly during maintenance, reducing downtime and improving the overall operation and maintenance efficiency of the equipment.

[0033] 2. The pipe fixing plate is used to fix the spray pipe and ensure the stability of the spray system during the electroplating process. The spray pipe is connected to the pipe fixing plate, so that the cleaning solution is stably delivered from the spray pipe to the target area in the electroplating tank. The flip-up baffle is set opposite to the pipe fixing plate when the flip cover is closed, and cooperates with the feed head plate and the discharge tail plate to form a pipe receiving cavity to protect the spray pipe and avoid accidental damage. This application enables the electroplating equipment to maintain the stability of the cleaning system and the continuity of the electroplating effect during operation, improves the cleaning efficiency and the overall ease of operation and maintenance of the equipment, extends the service life of the pipes, and further improves the overall economic benefits and operational stability of the equipment. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the exploded structure of an embodiment of this application. Figure 1 .

[0035] Figure 2 This is a schematic diagram of the exploded structure of an embodiment of this application. Figure 2 .

[0036] Figure 3 This is a cross-sectional structural diagram of an embodiment of this application.

[0037] Figure 4 This is a schematic diagram of the exploded structure of an embodiment of this application. Figure 3 .

[0038] Figure 5 for Figure 4 Enlarged view of part A in the middle.

[0039] Figure 6 This is a three-dimensional structural diagram of an embodiment of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1. Electroplating frame; 11. Frame body; 12. Tilting support frame; 13. Tilting shaft; 2. Electroplating tank; 21. Electroplating tank bottom plate; 22. Inner connecting plate; 23. Outer connecting plate; 24. Feed head plate; 25. Discharge tail plate; 26. Electroplating through hole; 27. Tank support frame; 28. Pipe fixing plate; 29. ​​Pipe receiving cavity; 3. Tilting cover plate; 31. Cover plate body; 32. Tilting connector; 33. Connecting support side plate; 34. Blocking support side plate; 35. Tilting actuation baffle;

[0042] 4. Roller conveyor device; 41. Lower roller conveyor mechanism; 42. Upper roller conveyor mechanism; 411. Rotating shaft; 412. Rotating roller; 5. Anode electroplating device; 51. Lower anode plate mechanism; 52. Upper anode plate mechanism; 511. Anode connecting frame; 512. Anode electroplating plate; 6. Spray cleaning device; 61. Lower spray mechanism; 62. Upper spray mechanism; 611. Spray pipe; 612. Spray pipe assembly; 613. Spray hole; 614. Pipe quick-connect assembly. Detailed Implementation

[0043] The following is in conjunction with the appendix Figures 1 to 6 This application will be described in further detail.

[0044] This application discloses a flip-top type horizontal electroplating apparatus. (Refer to...) Figure 1 A flip-top type horizontal electroplating equipment includes an electroplating frame 1, an electroplating tank 2 connected to the electroplating frame 1, a flip-top cover 3 located at the opening end of the electroplating tank 2 and hinged to the electroplating frame 1, a roller conveying device 4 inserted into the electroplating tank 2 for conveying electroplated parts, an anode electroplating device 5 located on the upper and lower sides of the roller conveying device 4, and a spray cleaning device 6 arranged alternately with the roller conveying device 4.

[0045] The roller conveying device 4 includes a lower roller conveying mechanism 41 rotatably connected to the electroplating tank 2, and an upper roller conveying mechanism 42 rotatably connected to the flip cover plate 3; the anodizing device 5 includes a lower anode plate mechanism 51 fixedly connected to the electroplating tank 2 and located below the lower roller conveying mechanism 41, and an upper anode plate mechanism 52 fixedly connected to the flip cover plate 3 and located above the upper roller conveying mechanism 42; the spray cleaning device 6 includes a lower spray mechanism 61 connected to the electroplating tank 2 and staggered with the lower roller conveying mechanism 41, and an upper spray mechanism 62 connected to the flip cover plate 3 and staggered with the upper roller conveying mechanism 42.

[0046] The flip cover 3 of this application is located at the opening end of the electroplating tank 2 and is hinged to the electroplating frame 1. The flip cover 3 is used to flip and open relative to the electroplating tank 2 with the hinge position with the electroplating frame 1 as the rotation axis, so as to facilitate the maintenance and operation of the roller conveyor 4, the anodic electroplating device 5 and the spray cleaning device 6. The lower roller conveyor mechanism 41 is rotatably connected to the electroplating tank 2, and the upper roller conveyor mechanism 42 is rotatably connected to the flip cover 3. When the flip cover 3 is flipped, it is convenient to take out and put in the electroplated parts, reducing the impact on the electroplating process. The impact of the plated parts operation: The lower anode plate mechanism 51 is located below the lower roller conveyor mechanism 41, and the upper anode plate mechanism 52 is located above the upper roller conveyor mechanism 42. During the transport of the electroplated parts, it ensures uniform coverage and electroplating of the surface of the electroplated parts; The lower spray mechanism 61 is connected to the electroplating tank 2 to spray and clean the lower surface of the electroplated parts, and the upper spray mechanism 62 is connected to the flip cover plate 3 to spray and clean the upper surface of the electroplated parts, ensuring uniform cleaning of the electroplated parts on the transport path;

[0047] This application realizes the functions of automatic conveying, electroplating, cleaning and convenient maintenance of electroplated parts, which makes the electroplating and cleaning of electroplated parts more uniform during the conveying process. At the same time, it can quickly flip and disassemble during maintenance, reducing downtime and improving the overall operation and maintenance efficiency of the equipment.

[0048] Furthermore, such as Figure 2 As shown, both the lower roller conveying mechanism 41 and the upper roller conveying mechanism 42 include a rotating shaft 411 arranged in an array along the direction of movement of the electroplated part, and rotating rollers 412 sleeved on the outer wall of the rotating shaft 411 and arranged in an array along the length direction of the rotating shaft 411.

[0049] The rotating roller 412 of this application can rotate with the rotating shaft 411, thereby supporting and transporting the electroplated parts; the lower roller conveying mechanism 41 is connected to the electroplating tank 2, and the upper roller conveying mechanism 42 is connected to the flip cover 3, so that when the flip cover 3 is opened or closed, the conveying path of the electroplated parts remains stable and unaffected; under the support and drive of the rotating roller 412, the electroplated parts can move smoothly in a predetermined direction, ensuring that the electroplated parts are evenly contacted with the electroplating solution in the electroplating tank 2, and achieving a continuous and uniform electroplating effect; this application achieves stable and efficient electroplated part conveying, simplifies the equipment structure, reduces friction and wear, and at the same time improves the service life of the overall equipment, and enhances the electroplating quality and production efficiency;

[0050] In this application, the rotating shaft 411 of the lower roller conveying mechanism 41 is rotatably connected to the electroplating tank 2 via bearings, and the rotating shaft 411 of the upper roller conveying mechanism 42 is rotatably connected to the flip cover plate 3 via bearings; this application also discloses a motor (not shown in the figure) connected to the rotating shaft 411 and used to drive the rotating shaft 411 to rotate.

[0051] Furthermore, such as Figure 1 and Figure 2 As shown, the electroplating frame 1 includes a frame body 11, a flip support frame 12 fixedly connected to the frame body 11, and a flip shaft 13 connected to the flip support frame 12; the flip cover plate 3 includes a cover plate body 31, and a flip connector 32 connected to the upper side of the cover plate body 31 and rotatably connected to the flip shaft 13.

[0052] The frame body 11 of this application serves as the main frame of the equipment and is fixedly connected to the flipping support frame 12 to form a stable support structure. The upper side of the cover plate body 31 is rotatably connected to the flipping shaft 13 through the flipping connector 32, so that the cover plate body 31 can rotate around the flipping shaft 13 to realize the opening and closing of the cover plate body 31. The opening and closing operation of the flipping cover plate 3 of this application is more convenient, which facilitates the quick inspection and replacement of the roller conveyor device 4, the anodizing device 5 and the spray cleaning device 6, reduces the disassembly and assembly time, and improves the maintenance efficiency of the equipment.

[0053] Specifically, such as Figure 3 and Figure 4 As shown, both the lower anode plate mechanism 51 and the upper anode plate mechanism 52 include an anode connecting frame 511 and an anode electroplating plate 512 connected to the anode connecting frame 511.

[0054] The anode connecting frame 511 of this application is used to support and fix the anode electroplating plate 512. The anode connecting frame 511 is connected to the electroplating tank 2, so that the anode electroplating plate 512 is located on the lower roller conveying mechanism 41. The other anode connecting frame 511 is connected to the flip cover plate 3, so that the anode electroplating plate 512 is located on the upper roller conveying mechanism 42, ensuring that the electroplated parts achieve a uniform double-sided electroplating effect during movement. During the electroplating process, the anode electroplating plate 512 can be kept stable by the anode connecting frame 511, forming an optimal electroplating distance with the electroplated parts, effectively improving electroplating efficiency and coating uniformity. This application makes the electroplated parts maintain a uniform electroplating environment throughout the entire conveying path, while simplifying the installation and disassembly process of the anode electroplating plate 512, facilitating daily maintenance, and further improving the electroplating quality and overall production efficiency of the equipment.

[0055] Both the lower anode plate mechanism 51 and the upper anode plate mechanism 52 are arranged in an array along the movement direction of the electroplated part.

[0056] More specifically, such as Figure 4 and Figure 5As shown, both the lower spray mechanism 61 and the upper spray mechanism 62 include a spray pipe 611 and a spray pipe assembly 612 that communicates with the spray pipe 611 and is inserted laterally into the electroplating tank 2. The spray pipe assembly 612 is provided with spray holes 613 that open at the middle position facing the lower roller conveyor mechanism 41 and the upper roller conveyor mechanism 42. The spray holes 613 are arranged in an array along the length direction of the spray pipe assembly 612.

[0057] The spray pipe 611 of this application is connected to an external cleaning liquid source to deliver the cleaning liquid to the spray pipe assembly 612. The spray pipe assembly 612 is inserted laterally into the electroplating tank 2 and is connected to the spray pipe 611. The spray holes 613 on the spray pipe assembly 612 are used to spray the cleaning liquid onto the upper and lower sides of the electroplated parts, thereby ensuring that the cleaning liquid can cover the entire surface of the electroplated parts and achieve a uniform rinsing effect, so as to effectively remove the residues on the surface of the electroplated parts, maintain the stability of the electroplating quality, and facilitate the cleaning treatment of the electroplated parts before and after electroplating. This application not only improves the cleaning efficiency, but also improves the cleaning uniformity through the array setting of the spray holes 613.

[0058] This application also discloses the connection between the sprinkler pipe 611 and an external water pump (not shown in the figure).

[0059] In addition, such as Figure 4 and Figure 5 As shown, the lower spray mechanism 61 and the upper spray mechanism 62 also include a quick-connect pipe assembly 614 located between the spray pipe assembly 612 and the spray pipe 611 and used to connect the spray pipe 611 and the spray pipe assembly 612.

[0060] The quick-connect pipe assembly 614 of this application is located between the spray pipe assembly 612 and the spray pipe 611, and is used to connect and fix the spray pipe 611 and the spray pipe assembly 612, so that the cleaning fluid can be smoothly delivered from the spray pipe 611 to the spray hole 613 of the spray pipe assembly 612. The design of the quick-connect pipe assembly 614 of this application makes the connection between the spray pipe assembly 612 and the spray pipe 611 faster, which facilitates the quick disassembly and maintenance of the cleaning fluid delivery system, facilitates the opening and closing of the flip cover 3, effectively shortens the equipment downtime, and further improves the operating efficiency and maintenance convenience of the equipment.

[0061] The lower spray mechanism 61 and the upper spray mechanism 62 are arranged alternately along the movement direction of the electroplated part.

[0062] And, as Figure 3 and Figure 4As shown, the electroplating tank 2 includes an electroplating tank bottom plate 21 fixedly connected to the electroplating frame 1, an inner connecting plate 22 connected to the inner side of the electroplating tank bottom plate 21, an outer connecting plate 23 connected to the outer side of the electroplating tank bottom plate 21, a feed head plate 24 connected to one end of the electroplating tank bottom plate 21, and a discharge tail plate 25 connected to the other end of the electroplating tank bottom plate 21. Both the feed head plate 24 and the discharge tail plate 25 are provided with electroplating through holes 26 for electroplating parts to pass through, and the electroplating through holes 26 are aligned with the roller conveyor device 4.

[0063] The electroplating tank bottom plate 21 is fixedly connected to the electroplating frame 1 to form a stable support foundation. The inner connecting plate 22 is connected along the inner side of the electroplating tank bottom plate 21, and the outer connecting plate 23 is connected along the outer side of the electroplating tank bottom plate 21. The feed head plate 24 and the discharge tail plate 25 are located at both ends of the electroplating tank 2, which enhances the structural stability of the tank and forms a closed electroplating area. Both the feed head plate 24 and the discharge tail plate 25 are provided with electroplating through holes 26, so that the electroplated parts can pass smoothly through the electroplating tank 2 under the drive of the roller conveyor device 4.

[0064] The electroplating tank 2 of this application not only provides a stable electroplating environment, but also facilitates the transfer of electroplated parts within the tank, improving the efficiency and consistency of the electroplating process, enhancing the operational stability of the equipment, and reducing the resistance and wear that may occur during the entry and exit of electroplated parts, thereby improving the electroplating quality and extending the service life of the equipment.

[0065] The feed head plate 24 of this application is also connected to one end of the inner connecting plate 22 and the outer connecting plate 23 respectively, and the discharge tail plate 25 is also connected to the other end of the inner connecting plate 22 and the outer connecting plate 23 respectively.

[0066] Furthermore, such as Figure 3 and Figure 4 As shown, the electroplating tank 2 includes an in-tank support frame 27 connected to the bottom plate 21 of the electroplating tank; the anode connecting frame 511 of the lower anode plate mechanism 51 is connected to the in-tank support frame 27; the quick-connect pipe assembly 614 of the lower spray mechanism 61 is inserted into the outer connecting plate 23; one end of the lower roller conveying mechanism 41 is rotatably connected to the in-tank support frame 27, and the other end is rotatably connected to the outer connecting plate 23; one end of the lower spray mechanism 61 is connected to the in-tank support frame 27, and the other end is connected to the outer connecting plate 23.

[0067] The electroplating tank 2 of this application is equipped with an internal support frame 27 connected to the bottom plate 21 of the electroplating tank. The internal support frame 27 provides stable support for the lower anode plate mechanism 51, the lower roller conveying mechanism 41, and the lower spraying mechanisms 61 and 62. The anode connecting frame 511 of the lower anode plate mechanism 51 is fixed on the internal support frame 27 to ensure that the position of the anode electroplating plate 512 is stable during the electroplating process, thereby improving the uniformity of electroplating. The quick-connect pipe assembly 614 of the lower spraying mechanism 61 is inserted into the outer connecting plate 23, realizing convenient connection and maintenance. The rotational connection of the lower roller conveying mechanism 41 makes the conveying path of the electroplated parts in the tank stable and smooth.

[0068] Through the connection of the internal support frame 27, the components in this application form a compact and orderly arrangement within the electroplating tank 2, which effectively enhances the stability and uniformity of the electroplating process, ensures the synchronous operation of cleaning and electroplating, simplifies the installation and maintenance process of the equipment, and improves the operating efficiency and overall service life of the equipment.

[0069] Furthermore, such as Figure 4 and Figure 6 As shown, the flip cover 3 also includes a connecting support side plate 33 connected to the cover body 31 and located near the inner connecting plate 22, and a shielding support side plate 34 connected to the cover body 31 and located near the outer connecting plate 23; the shielding support side plate 34 is aligned with the outer connecting plate 23.

[0070] The anode connecting frame 511 of the upper anode plate mechanism 52 is connected to the connecting support side plate 33; the pipe quick-connect assembly 614 of the upper spray mechanism 62 is inserted into the shielding support side plate 34; one end of the upper roller conveying mechanism 42 is rotatably connected to the connecting support side plate 33, and the other end is rotatably connected to the shielding support side plate 34; one end of the upper spray mechanism 62 is connected to the connecting support side plate 33, and the other end is connected to the shielding support side plate 34.

[0071] In this application, the anode connecting frame 511 of the upper anode plate mechanism 52 is fixed on the connecting support side plate 33, which stabilizes the position of the anode electroplating plate 512 during the electroplating process and ensures a uniform electroplating effect on the electroplated parts. The quick-connect pipe assembly 614 of the upper spray mechanism 62 is inserted into the shielding support side plate 34, realizing convenient disassembly and maintenance of the cleaning system and further optimizing the cleaning process. The rotating connection of the upper roller conveyor mechanism 42 enables the electroplated parts to be stably conveyed through the upper roller conveyor mechanism 42, ensuring the smoothness of the conveying path. This application makes the flip cover 3 easy to open and close, which facilitates the maintenance of the roller conveyor device 4, the anode electroplating device 5 and the spray cleaning device 6, and ensures the synchronization of electroplating and cleaning operations, improving the operating efficiency, cleaning effect and electroplating quality of the equipment, further extending the service life of the equipment and reducing downtime.

[0072] Specifically, such as Figure 4 and Figure 6 As shown, the electroplating tank 2 also includes a pipe fixing plate 28 connected to the side edge of the electroplating tank bottom plate 21; the flip cover plate 3 also includes a flip-toggle baffle 35 connected to the side edge of the cover plate body 31; the spray pipe 611 is connected to the pipe fixing plate 28; the pipe fixing plate 28, the flip-toggle baffle 35, the feed head plate 24 and the discharge tail plate 25 are arranged to form a pipe receiving cavity 29 for the spray pipe 611 to be inserted.

[0073] The pipe fixing plate 28 of this application is used to fix the spray pipe 611 and ensure the stability of the spray system during the electroplating process. The spray pipe 611 is connected to the pipe fixing plate 28 so that the cleaning liquid is stably delivered from the spray pipe 611 to the target area in the electroplating tank. The flip-up baffle 35 is set opposite to the pipe fixing plate 28 when the flip cover plate 3 is closed, and cooperates with the feed head plate 24 and the discharge tail plate 25 to form a pipe receiving cavity 29 to protect the spray pipe 611 and avoid accidental damage.

[0074] This application enables the electroplating equipment to maintain the stability of the cleaning system and the continuity of the electroplating effect during operation, improves cleaning efficiency and the overall ease of operation and maintenance of the equipment, extends the service life of the pipe fittings, and further enhances the overall economic benefits and operational stability of the equipment.

[0075] The implementation principle of a flip-type horizontal electroplating device according to an embodiment of this application is as follows:

[0076] A flip cover 3 is located at the opening end of the electroplating tank 2 and hinged to the electroplating frame 1. The flip cover 3 is used to flip and open relative to the electroplating tank 2 with the hinge position with the electroplating frame 1 as the rotation axis, so as to facilitate the maintenance and operation of the roller conveyor 4, the anodizing device 5, and the spray cleaning device 6. The lower roller conveyor mechanism 41 is rotatably connected to the electroplating tank 2, and the upper roller conveyor mechanism 42 is rotatably connected to the flip cover 3. When the flip cover 3 is flipped, it is convenient to take out and put in the electroplated parts, reducing the impact on the electroplating process. The impact of component operation; the lower anode plate mechanism 51 is located below the lower roller conveyor mechanism 41, and the upper anode plate mechanism 52 is located above the upper roller conveyor mechanism 42, ensuring uniform coverage and electroplating of the electroplated parts during the conveying of the electroplated parts; the lower spray mechanism 61 is connected to the electroplating tank 2 to spray and clean the lower surface of the electroplated parts, and the upper spray mechanism 62 is connected to the flip cover plate 3 to spray and clean the upper surface of the electroplated parts, ensuring uniform cleaning of the electroplated parts along the conveying path;

[0077] This application realizes the functions of automatic conveying, electroplating, cleaning and convenient maintenance of electroplated parts, making the electroplating and cleaning of electroplated parts more uniform during the conveying process, and enabling quick flipping and disassembly during maintenance, reducing downtime and improving the overall operation and maintenance efficiency of the equipment.

[0078] The pipe fixing plate 28 is used to fix the spray pipe 611 and ensure the stability of the spray system during the electroplating process. The spray pipe 611 is connected to the pipe fixing plate 28, so that the cleaning solution is stably delivered from the spray pipe 611 to the target area in the electroplating tank. The flip-up baffle 35 is set opposite to the pipe fixing plate 28 when the flip cover plate 3 is closed, and cooperates with the feed head plate 24 and the discharge tail plate 25 to form a pipe receiving cavity 29 to protect the spray pipe 611 and avoid accidental damage. This application enables the electroplating equipment to maintain the stability of the cleaning system and the continuity of the electroplating effect during operation, improves the cleaning efficiency and the overall ease of operation and maintenance of the equipment, extends the service life of the pipes, and further improves the overall economic benefits and operational stability of the equipment.

[0079] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A flip-top type horizontal electroplating equipment, characterized in that, The device includes an electroplating frame (1), an electroplating tank (2) connected to the electroplating frame (1), a flip cover plate (3) located at the opening end of the electroplating tank (2) and hinged to the electroplating frame (1), a roller conveyor (4) inserted into the electroplating tank (2) for conveying electroplated parts, an anode electroplating device (5) located on the upper and lower sides of the roller conveyor (4), and a spray cleaning device (6) arranged alternately with the roller conveyor (4). The roller conveying device (4) includes a lower roller conveying mechanism (41) rotatably connected to the electroplating tank (2) and an upper roller conveying mechanism (42) rotatably connected to the flip cover plate (3); the anode electroplating device (5) includes a lower anode plate mechanism (51) fixedly connected to the electroplating tank (2) and located below the lower roller conveying mechanism (41), and an upper anode plate mechanism (52) fixedly connected to the flip cover plate (3) and located above the upper roller conveying mechanism (42); the spray cleaning device (6) includes a lower spray mechanism (61) connected to the electroplating tank (2) and staggered with the lower roller conveying mechanism (41), and an upper spray mechanism (62) connected to the flip cover plate (3) and staggered with the upper roller conveying mechanism (42).

2. The flip-top type horizontal electroplating equipment according to claim 1, characterized in that, Both the lower roller conveying mechanism (41) and the upper roller conveying mechanism (42) include a rotating shaft (411) arranged in an array along the direction of movement of the electroplated part, and rotating rollers (412) sleeved on the outer wall of the rotating shaft (411) and arranged in an array along the length direction of the rotating shaft (411).

3. The flip-top type horizontal electroplating equipment according to claim 1, characterized in that, The electroplating frame (1) includes a frame body (11), a flip support frame (12) fixedly connected to the frame body (11), and a flip shaft (13) connected to the flip support frame (12); the flip cover plate (3) includes a cover plate body (31), and a flip connector (32) connected to the upper side of the cover plate body (31) and rotatably connected to the flip shaft (13).

4. The flip-top type horizontal electroplating equipment according to claim 3, characterized in that, Both the lower anode plate mechanism (51) and the upper anode plate mechanism (52) include an anode connecting frame (511) and an anode electroplating plate (512) connected to the anode connecting frame (511).

5. A flip-top type horizontal electroplating equipment according to claim 4, characterized in that, Both the lower spray mechanism (61) and the upper spray mechanism (62) include a spray pipe (611) and a spray pipe assembly (612) that communicates with the spray pipe (611) and is inserted laterally into the electroplating tank (2). The spray pipe assembly (612) is provided with spray holes (613) that open at the midpoint between the lower roller conveying mechanism (41) and the upper roller conveying mechanism (42). The spray holes (613) are arranged in an array along the length of the spray pipe assembly (612).

6. A flip-top type horizontal electroplating equipment according to claim 5, characterized in that, The lower spray mechanism (61) and the upper spray mechanism (62) further include a quick-connect pipe assembly (614) located between the spray pipe assembly (612) and the spray pipe (611) for connecting the spray pipe (611) and the spray pipe assembly (612).

7. A flip-top type horizontal electroplating equipment according to claim 6, characterized in that, The electroplating tank body (2) includes an electroplating tank bottom plate (21) fixedly connected to the electroplating frame (1), an inner connecting plate (22) connected to the inner side of the electroplating tank bottom plate (21), an outer connecting plate (23) connected to the outer side of the electroplating tank bottom plate (21), a feed head plate (24) connected to the end of the electroplating tank bottom plate (21), and a discharge tail plate (25) connected to the other end of the electroplating tank bottom plate (21); the feed head plate (24) and the discharge tail plate (25) are both provided with electroplating through holes (26) for electroplating parts to pass through, and the electroplating through holes (26) are aligned with the roller conveying device (4).

8. A flip-type horizontal electroplating equipment according to claim 7, characterized in that, The electroplating tank (2) includes an in-tank support frame (27) connected to the bottom plate (21) of the electroplating tank; the anode connecting frame (511) of the lower anode plate mechanism (51) is connected to the in-tank support frame (27); the quick-connect pipe assembly (614) of the lower spray mechanism (61) is inserted on the outer connecting plate (23); one end of the lower roller conveying mechanism (41) is rotatably connected to the in-tank support frame (27), and the other end is rotatably connected to the outer connecting plate (23); one end of the lower spray mechanism (61) is connected to the in-tank support frame (27), and the other end is connected to the outer connecting plate (23).

9. A flip-top type horizontal electroplating equipment according to claim 7, characterized in that, The flip cover (3) also includes a connecting support side plate (33) connected to the cover body (31) and located near the inner connecting plate (22), and a shielding support side plate (34) connected to the cover body (31) and located near the outer connecting plate (23); the shielding support side plate (34) is aligned with the outer connecting plate (23); The anode connecting frame (511) of the upper anode plate mechanism (52) is connected to the connecting support side plate (33); the pipe quick-connect assembly (614) of the upper spray mechanism (62) is inserted into the shielding support side plate (34); one end of the upper roller conveying mechanism (42) is rotatably connected to the connecting support side plate (33), and the other end is rotatably connected to the shielding support side plate (34); one end of the upper spray mechanism (62) is connected to the connecting support side plate (33), and the other end is connected to the shielding support side plate (34).

10. A flip-top type horizontal electroplating equipment according to claim 9, characterized in that, The electroplating tank (2) also includes a pipe fixing plate (28) connected to the side edge of the bottom plate (21) of the electroplating tank; the flip cover plate (3) also includes a flip-tog baffle (35) connected to the side edge of the cover plate body (31); the spray pipe (611) is connected to the pipe fixing plate (28); the pipe fixing plate (28), the flip-tog baffle (35), the feed head plate (24) and the discharge tail plate (25) are arranged to form a pipe receiving cavity (29) for the spray pipe (611) to be inserted.

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