Wafer box heating and air injection drying device

Abstract

The utility model provides a wafer box heating jet drying device, which relates to the technical field of wafer box heating drying and comprises a jet drying machine body, a nozzle is obliquely mounted on the inner wall of the left side of the jet drying machine body, and the left side of the nozzle is connected with a jet atomizer through an atomizing pipe. An IPA mixed solution cylinder is connected to the jet atomizer through a liquid conveying pipe, a rotating column is connected to the inner wall of the lower end of the jet drying machine body through a bearing seat, a storage frame plate is welded to the outer side of the rotating column, an L-shaped pressing plate is connected into a groove in the upper end of the storage frame plate in a limiting mode, and a wafer box is pressed between the storage frame plate and the L-shaped pressing plate; and clamping plates are symmetrically clamped on the two side faces of the L-shaped pressing plate, external thread blocks are welded to the clamping plates through fixing columns, and the external thread blocks are in threaded connection with adjusting groove blocks through internal thread grooves. According to the utility model, the problem in the prior art that residual moisture in grooves of wafer boxes placed on a grid plate is difficult to discharge, so that the heating and drying time is prolonged and the drying efficiency is influenced is solved.

Description

Technical Field

[0001] This utility model relates to the field of wafer box heating and drying technology, specifically to a wafer box heating and jet drying device. Background Technology

[0002] In semiconductor manufacturing, wafer cassettes primarily serve to place and transport wafers. To simplify transportation and minimize the risk of contamination, chip manufacturers utilize wafer cassettes for handling and storing wafers. To ensure cleanliness within the wafer cassette, it requires heated air-jet drying. A search revealed an existing technology (publication number: CN202421111228.3) for a drying device for semiconductor wafer cassettes. The device describes a process where "a drive motor rotates a support, causing a movable gear to rotate. Simultaneously, the movable gear rotates along a fixed gear, rotating the semiconductor wafer cassette above the movable gear. The wafer cassette is then dried by heated nitrogen gas and heating elements within the drying chamber, facilitating drying. A support column is inserted into the movable gear, and the semiconductor wafer cassette is placed on a grid plate. A rubber rod is moved according to the size of the wafer cassette, causing a rubber ring inside a sleeve to rotate along a circular ring, squeezing the wafer cassette and adapting to different sizes." However, in this existing technology, residual moisture in the grooves of the wafer cassette placed on the grid plate is difficult to drain, leading to prolonged heating and drying times and reduced drying efficiency. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, a wafer box heating and jet drying device is provided to solve the problem that residual moisture in the grooves of the wafer box placed on the grid plate is difficult to remove, resulting in prolonged heating and drying time and affecting drying efficiency.

[0004] To achieve the above objectives, a wafer cassette heating and jet drying apparatus is provided, comprising: a jet drying body, wherein an electric heater is installed on the inner wall of the upper end of the jet drying body.

[0005] A nozzle is obliquely installed on the inner left side of the jet dryer body. A jet atomizer is connected to the left side of the nozzle via an atomizing tube. The jet atomizer is connected to an IPA mixing solution cylinder via a liquid delivery tube. A rotating column is connected to the inner lower end of the jet dryer body via a bearing seat. A storage frame plate is welded to the outside of the rotating column. An L-shaped pressure plate is limited and connected to the upper groove of the storage frame plate. A wafer cassette is held between the storage frame plate and the L-shaped pressure plate. Clamping plates are symmetrically clamped on both sides of the L-shaped pressure plate. An external threaded block is welded to the clamping plate via a fixing column. An adjusting slot block is screwed to the external threaded block via an internal threaded groove.

[0006] Furthermore, a cabinet door is installed on the front surface of the jet dryer body, and a receiver is fixed on the inner left side of the jet dryer body; and the receiver is located at the top of the nozzle.

[0007] Furthermore, a rubber plug is sealed at the slot on the left side of the jet dryer body, and a motor is fixed on the upper surface of the jet dryer body. The lower end of the motor is connected to the rotating column through a coupling.

[0008] Furthermore, a jet atomizer is provided on the left side of the motor; and an IPA mixing solution cylinder is provided on the right side, with a laser positioner embedded in the cylindrical surface of the rotating column.

[0009] Furthermore, an elastic pad is bonded to the lower end face of the L-shaped pressure plate; and the elastic pad is tightly attached to the upper surface of the wafer box, and an adjustment slot block is screwed to the upper surface of the storage frame plate.

[0010] Furthermore, the inner side of the adjusting groove block is provided with an internal thread groove, and a column head is welded to the other end face of the external thread block.

[0011] Furthermore, the side of the clamping plate is attached to the L-shaped pressure plate by an anti-slip pad, and a sealing ring is provided on the surface of the groove of the adjusting block; and a column head and a fixing column pass through the sealing ring respectively.

[0012] The beneficial effects of this utility model are as follows: the wafer box heating and jet drying device of this utility model uses a placement frame plate and an L-shaped pressure plate to hold the wafer box at an angle. By rotating and adjusting the clamping plates on both sides of the L-shaped pressure plate, the downward pressing position of the L-shaped pressure plate is fixed, so that the inner groove of the wafer box is pressed tightly with the groove facing outward. This facilitates the discharge of the atomized IPA mixed solution sprayed from the groove of the wafer box to the outside, avoids excess IPA spray moisture remaining in the box, which would prolong the drying time, accelerates the drying speed of the heating and jet drying device, and improves the processing efficiency of the wafer box heating and jet drying. Attached Figure Description

[0013] Figure 1 This is a front view of the wafer box heating and jet drying device according to an embodiment of the present invention.

[0014] Figure 2 This is a front view cross-sectional structural diagram of the wafer box heating and jet drying device according to an embodiment of the present invention.

[0015] Figure 3 This is a top view of the wafer box and storage frame according to an embodiment of the present invention.

[0016] Figure 4 This is a top view cross-sectional diagram of the connection structure of the clamping plate in an embodiment of the present invention.

[0017] In the diagram: 1. Jet dryer body; 11. Cabinet door; 12. Receiver; 13. Rubber stopper; 14. Electric heater; 2. Jet atomizer; 21. Atomizing tube; 22. IPA mixing solution cylinder; 23. Infusion tube; 24. Nozzle; 3. Storage frame plate; 31. L-shaped pressure plate; 32. Rotating column; 33. Bearing seat; 34. Motor; 35. Coupling; 36. Laser positioner; 37. Elastic pad; 4. Wafer box; 5. Clamping plate; 51. Adjusting slot block; 52. Column head; 53. Internal threaded groove; 54. External threaded block; 55. Anti-slip pad; 56. Fixed column; 57. Sealing ring. Detailed Implementation

[0018] Reference Figures 1 to 4 As shown, this utility model provides a wafer cassette heating and jet drying device, including: a jet drying body 1, and an electric heater 14 installed on the inner wall of the upper end of the jet drying body 1.

[0019] A nozzle 24 is installed at an angle on the inner wall of the left side of the jet dryer body 1. A jet atomizer 2 is connected to the left side of the nozzle 24 through an atomizing tube 21. The jet atomizer 2 is connected to an IPA mixed solution cylinder 22 through an infusion tube 23. A rotating column 32 is connected to the inner wall of the lower end of the jet dryer body 1 through a bearing seat 33. A storage frame plate 3 is welded to the outside of the rotating column 32. An L-shaped pressure plate 31 is connected to the upper end of the storage frame plate 3 in a groove. A wafer box 4 is held between the storage frame plate 3 and the L-shaped pressure plate 31. The two sides of the L-shaped pressure plate 31 symmetrically hold a clamping plate 5. An external threaded block 54 is welded to the clamping plate 5 through a fixing column 56. An adjusting groove block 51 is screwed to the external threaded block 54 through an internal threaded groove 53.

[0020] First, place the wafer cassette 4, which needs to be dried, onto the inclined surface of the storage frame plate 3 inside the jet dryer 1, with the grooves of the wafer cassette 4 facing outwards. Press the L-shaped pressure plate 31 down onto the upper surface of the wafer cassette 4. By rotating the column head 52, move the clamping plates 5 on both sides of the L-shaped pressure plate 31 to clamp the L-shaped pressure plate 31 in the current pressing state, so that the L-shaped pressure plate 31 is in the current pressing position and the pressed wafer cassette 4 will fall off during rotation drying. Close the cabinet door of the wafer cassette 4, and the electric heater 14 will heat it, so that the nozzle 24 will spray the atomized IPA mixed solution into the inside of the wafer cassette 4. Excess spray liquid will flow out of the wafer cassette 4 along the inclined surface. Control the motor 34 to drive the storage frame plate 3 to rotate through the rotating column 32, so that the heated air inside the jet dryer 1 will quickly contact and evaporate the atomized liquid inside the wafer cassette 4. After the heating and jet drying process of the wafer cassette 4 is completed, it can be taken out.

[0021] In this embodiment, a cabinet door 11 is installed on the front surface of the jet dryer body 1, and a receiver 12 is fixed on the inner left side wall of the jet dryer body 1; the receiver 12 is located directly above the nozzle 24. A rubber plug 13 is sealed at the slot on the left side of the jet dryer body 1, and a motor 34 is fixed on the upper surface of the jet dryer body 1. The lower end of the motor 34 is connected to the rotating column 32 through a coupling 35. A jet atomizer 2 is provided on the left side of the motor 34; and an IPA mixing solution cylinder 22 is provided on the right side. A laser positioner 36 is embedded in the cylindrical surface of the rotating column 32.

[0022] In a preferred embodiment, receiver 12 receives positioning signals emitted by laser locator 36, causing each set of storage frame plates 3 to move and pause at nozzle 24. Nozzle 24 then sprays the atomized IPA mixture solution onto the inside of wafer housing 4, facilitating the removal of moisture and residues from the inside of the wafer housing 4 through evaporation of the mixture, ensuring the cleanliness of the wafer housing 4. Motor 34 rotates the storage frame plates 3 via rotating column 32, accelerating the contact between the wafer housing 4 held on the storage frame plates 3 and the hot air, thereby speeding up the drying process.

[0023] In this embodiment, an elastic pad 37 is bonded to the lower end face of the L-shaped pressure plate 31; and the elastic pad 37 is tightly attached to the upper surface of the wafer box 4, and an adjustment slot block 51 is screwed to the upper surface of the storage frame plate 3.

[0024] As a preferred embodiment, the elastic pad 37 has high elasticity, which makes it easy for the elastic pad 37 to be pressed tightly against the upper surface of the tilted wafer cassette 4. The tilted wafer cassette 4 facilitates the discharge of the atomized IPA mixed solution sprayed in the groove of the cassette.

[0025] In this embodiment, an internal threaded groove 53 is provided on the inner side of the adjusting groove block 51, and a column head 52 is welded to the other end face of the external threaded block 54. The side of the clamping plate 5 is attached to the L-shaped pressure plate 31 by an anti-slip pad 55, and a sealing ring 57 is provided on the groove surface of the adjusting groove block 51; and the column head 52 and the fixing column 56 pass through the sealing ring 57 respectively.

[0026] As a preferred implementation, the adjusting groove block 51 prevents moisture from entering the internal thread groove 53 through the sealing ring 57, thereby reducing corrosion and wear of the internal thread groove 53 and the external thread block 54, and making it easier for the clamping plate 5 to be used for a longer period of time in high temperature and steam environments.

[0027] This invention provides a wafer box heating and jet drying device that effectively solves the problem in the prior art where residual moisture in the grooves of the wafer box placed on the grid plate is difficult to drain, leading to prolonged heating and drying time and affecting drying efficiency. It facilitates the discharge of the atomized IPA mixed solution from the grooves of the wafer box, avoiding excess IPA jet moisture remaining in the box and causing prolonged drying time, thus accelerating the drying speed of the heating and jet drying device and improving the processing efficiency of the wafer box heating and jet drying. It is applicable to wafer box heating and jet drying devices.

Claims

1. A wafer cassette heating and jet drying apparatus, comprising: A jet dryer body (1), wherein an electric heater (14) is installed on the inner wall of the upper end of the jet dryer body (1), characterized in that: A nozzle (24) is installed obliquely on the inner wall of the left side of the jet dryer body (1). A jet atomizer (2) is connected to the left side of the nozzle (24) through an atomizing tube (21). The jet atomizer (2) is connected to an IPA mixed solution cylinder (22) through an infusion tube (23). A rotating column (32) is connected to the inner wall of the lower end of the jet dryer body (1) through a bearing seat (33). A storage frame plate (3) is welded to the outside of the rotating column (32). An L-shaped pressure plate (31) is connected to the upper groove of the storage frame plate (3). A wafer box (4) is held between the storage frame plate (3) and the L-shaped pressure plate (31). A clamping plate (5) is symmetrically clamped on both sides of the L-shaped pressure plate (31). An external thread block (54) is welded to the clamping plate (5) through a fixing column (56). An adjusting groove block (51) is screwed to the external thread block (54) through an internal thread groove (53).

2. The wafer cassette heating and jet drying apparatus according to claim 1, characterized in that, The front surface of the jet dryer body (1) is equipped with a cabinet door (11), and a receiver (12) is fixed on the inner left side of the jet dryer body (1); and the receiver (12) is located at the top of the nozzle (24).

3. The wafer cassette heating and jet drying apparatus according to claim 1, characterized in that, A rubber plug (13) is sealed at the slot on the left side of the jet dryer body (1). A motor (34) is fixed on the upper surface of the jet dryer body (1). The lower end of the motor (34) is connected to the rotating column (32) through a coupling (35).

4. The wafer cassette heating and jet drying apparatus according to claim 3, characterized in that, The motor (34) is provided with a jet atomizer (2) on the left side and an IPA mixing solution cylinder (22) on the right side. A laser positioner (36) is embedded in the cylindrical surface of the rotating column (32).

5. The wafer cassette heating and jet drying apparatus according to claim 1, characterized in that, The lower end face of the L-shaped pressure plate (31) is bonded with an elastic pad (37); and the elastic pad (37) is in close contact with the upper surface of the wafer box (4), and the upper surface of the storage frame plate (3) is screwed with an adjustment slot block (51).

6. The wafer cassette heating and jet drying apparatus according to claim 1, characterized in that, The inner side of the adjusting groove block (51) is provided with an internal thread groove (53), and the other end face of the external thread block (54) is welded with a column head (52).

7. A wafer cassette heating and jet drying apparatus according to claim 1, characterized in that, The side of the clamp (5) is attached to the L-shaped pressure plate (31) by the anti-slip pad (55), and the surface of the groove of the adjusting block (51) is provided with a sealing ring (57); and the sealing ring (57) is respectively connected to a column head (52) and a fixing column (56).

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