Semiconductor chip high-temperature test fixture with heat dissipation structure

Abstract

The utility model discloses a semiconductor chip high-temperature test fixture with a heat dissipation structure, which belongs to the field of semiconductor chips and comprises a base, a turntable is rotatably connected to the middle of the upper portion of the base, four arc-shaped grooves are formed in the surface of the turntable at equal intervals, and fixing blocks are slidably connected to the interiors of the four arc-shaped grooves. When the two mounting plates slide under the cooperation of arc-shaped grooves and sliding blocks, the middle parts of the bilateral telescopic rods extrude the moving blocks to promote the moving blocks to slide above the base, and the linkage mechanism realizes the synchronous displacement of the air outlet cover and the mounting plates, so that the two air coolers in the base transmit cold air through the telescopic pipes and the connecting pipes; according to the chip heat dissipation device, the chip area can be aligned all the time, an additional control device is not needed, heat dissipation can be conducted on a chip in a high-temperature state after testing through linkage between mechanical structures, meanwhile, the heat dissipation position can be automatically adjusted according to the size of the chip, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chips, and more specifically, to a high-temperature test fixture for semiconductor chips with a heat dissipation structure. Background Technology

[0002] In the research and development and production of semiconductor chips, high-temperature testing is a key step in ensuring chip performance reliability. With the rapid development of semiconductor technology, the integration of chips is constantly increasing and their size is becoming smaller and smaller. This places more stringent requirements on high-temperature testing fixtures. Chips generate a lot of heat during high-temperature testing. If heat is not dissipated in time, prolonged exposure to high temperatures may cause changes in the internal structure of the chip, such as changes in transistor performance and migration of metal interconnect layers. This can affect the electrical performance and stability of the chip and shorten its lifespan. Utility Model Content

[0003] 1. Technical problems to be solved

[0004] To address the problems existing in the prior art, the purpose of this utility model is to provide a high-temperature test fixture for semiconductor chips with a heat dissipation structure, which can dissipate heat from semiconductor chips that are in a high-temperature state after testing.

[0005] 2. Technical Solution

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] A high-temperature testing fixture for semiconductor chips with a heat dissipation structure includes a base. A turntable is rotatably connected to the center of the upper part of the base. Four arc-shaped grooves are equidistantly formed on the surface of the turntable. Fixed blocks are slidably connected inside each of the four arc-shaped grooves. Mounting plates are fixedly connected above each of the four fixed blocks. Slider blocks are fixedly connected below each of the four mounting plates. The four slider blocks are slidably connected above the base. Movable blocks are slidably connected to both sides of the upper part of the base. Air vents are fixedly connected above two of the movable blocks. The two movable blocks are respectively located in the middle of the two mounting plates.

[0008] Furthermore, a double-sided telescopic rod is provided in the middle of the two mounting plates, and the two output ends of the double-sided telescopic rod are rotatably connected to one side of the two mounting plates respectively.

[0009] Furthermore, the middle of the two bilateral telescopic rods is slidably connected to the interior of the moving block, and two air coolers are installed inside the base, with telescopic pipes fixedly connected to the output ends of the two air coolers.

[0010] Furthermore, each of the two telescopic tubes has a connecting pipe fixedly connected to its end away from the air cooler, and the ends of the two connecting pipes away from the telescopic tubes are respectively fixedly connected to the bottom of the two air outlet hoods.

[0011] Furthermore, each of the four mounting plates is rotatably connected to a bolt at its top end, and a clamping block is threaded onto the outer wall of the bolt, with the clamping block and the mounting plate being slidably connected.

[0012] Furthermore, a knob is fixedly connected to one end of the bolt located above the mounting plate.

[0013] Furthermore, a motor is fixedly connected to the bottom of the base, and bevel gears are fixedly connected to both the output end of the motor and the rotating shaft below the turntable, with the two bevel gears meshing.

[0014] 3. Beneficial effects

[0015] Compared with existing technologies, the advantages of this utility model are:

[0016] (1) In this solution, the turntable connected to the center of the base has four arc-shaped grooves equidistantly opened on its surface that are slidably connected to the fixing block, so that the mounting plate can be flexibly adjusted. This design can adapt to the installation requirements of semiconductor chips of different sizes and specifications. The sliders under the four mounting plates slide with the base, further enhancing the stability and adjustability of the mounting plate, enabling more accurate positioning of the chip, and improving the accuracy and reliability of the test.

[0017] (2) In this solution, when the two mounting plates slide in the cooperation of the arc groove and the slider, the middle part of the double telescopic rod will squeeze the moving block, causing the moving block to slide above the base. This linkage mechanism realizes the synchronous displacement of the air hood and the mounting plate, so that the cold air transmitted by the two cold air blowers inside the base through the telescopic pipe and the connecting pipe can always be aimed at the chip area. No additional control device is needed. Relying only on the linkage between the mechanical structures, the chip in the high temperature state after the test can be cooled down. At the same time, the heat dissipation position can be automatically adjusted according to the size of the chip, which improves the heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 This is a first three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a schematic diagram of the second three-dimensional structure of the present invention;

[0020] Figure 3 for Figure 1 Enlarged structural diagram of region A in the middle;

[0021] Figure 4 for Figure 2A magnified structural diagram of region B in the middle;

[0022] Figure 5 This is a schematic diagram showing the connection between the turntable and the mounting plate in this utility model.

[0023] Explanation of the labels in the diagram:

[0024] 1. Base; 11. Turntable; 12. Arc groove; 13. Fixing block; 14. Mounting plate; 15. Slider; 16. Bolt; 17. Clamping block; 18. Knob; 19. Air cooler; 2. Telescopic tube; 21. Connecting tube; 22. Air outlet cover; 23. Moving block; 24. Double-sided telescopic rod; 25. Motor; 26. Bevel gear. Detailed Implementation

[0025] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] Example 1:

[0029] Please see Figure 1-5A high-temperature testing fixture for semiconductor chips with a heat dissipation structure includes a base 1. A turntable 11 is rotatably connected to the center of the upper part of the base 1. Four arc-shaped grooves 12 are equidistantly formed on the surface of the turntable 11. Fixing blocks 13 are slidably connected inside each of the four arc-shaped grooves 12. Mounting plates 14 are fixedly connected above each of the four fixing blocks 13. Slider blocks 15 are fixedly connected below each of the four mounting plates 14. The four sliders 15 are slidably connected above the base 1. The turntable 11, rotatably connected to the center of the upper part of the base 1, has four arc-shaped grooves 12 equidistantly formed on its surface that are slidably connected to the fixing blocks 13, allowing the mounting plates 14 to be flexibly adjusted in position. This design can adapt to the installation requirements of semiconductor chips of different sizes and specifications. The sliders 15 below the four mounting plates 14 slide in cooperation with the base 1, further enhancing the stability and adjustability of the mounting plates 14, enabling more accurate chip positioning, and improving the accuracy and reliability of the test.

[0030] Movable blocks 23 are slidably connected to both sides of the base 1. An air hood 22 is fixedly connected above each of the two movable blocks 23. The two movable blocks 23 are located in the middle of the two mounting plates 14. A double-sided telescopic rod 24 is provided in the middle of the two mounting plates 14. The two output ends of the double-sided telescopic rod 24 are rotatably connected to one side of the two mounting plates 14. The middle part of the two double-sided telescopic rod 24 is slidably connected to the inside of the movable blocks 23. When the two mounting plates 14 slide under the cooperation of the arc groove 12 and the slider 15, the middle part of the double-sided telescopic rod 24 will squeeze the movable blocks 23, causing the movable blocks 23 to slide above the base 1. This linkage mechanism realizes the synchronous displacement of the air hood 22 and the mounting plate 14, so that the cold air transmitted by the two cold air blowers 19 inside the base 1 through the telescopic pipe 2 and the connecting pipe 21 can always accurately cover the chip area. Without additional control devices, the heat dissipation position can be automatically adjusted according to the size of the chip by relying solely on the ingenious design of the mechanical structure, thereby improving the heat dissipation efficiency.

[0031] Two air coolers 19 are installed inside the base 1. The output ends of the two air coolers 19 are fixedly connected to telescopic pipes 2. The ends of the two telescopic pipes 2 away from the air coolers 19 are fixedly connected to connecting pipes 21. The ends of the two connecting pipes 21 away from the telescopic pipes 2 are fixedly connected to the bottom of the two air outlet covers 22 respectively.

[0032] Example 2:

[0033] Please see Figure 1-5A high-temperature test fixture for semiconductor chips with a heat dissipation structure is disclosed. Each of the four mounting plates 14 has a bolt 16 rotatably connected to its top. A clamping block 17 is threaded onto the outer wall of each bolt 16. The clamping block 17 and the mounting plate 14 are slidably connected. A knob 18 is fixedly connected to one end of each bolt 16 located above the mounting plate 14. The bolts 16 rotatably connected to the top of the four mounting plates 14, in conjunction with the threaded clamping blocks 17, allow for secure clamping of the chip by rotating the knob 18. This structure is not only easy to operate but also allows for adjustment according to the different thicknesses of the chip, ensuring that the chip does not shift during testing.

[0034] A motor 25 is fixedly connected to the bottom of the base 1. Both the output end of the motor 25 and the rotating shaft below the turntable 11 are fixedly connected to bevel gears 26. The two bevel gears 26 mesh. The motor 25 fixedly connected to the bottom of the base 1 achieves automatic rotation of the turntable 11 by meshing the bevel gear 26 at the output end with the bevel gear 26 at the rotating shaft below the turntable 11.

[0035] Working principle: The distance between the four mounting plates 14 changes when the motor 25 is started, so that the clamping block 17 above the mounting plate 14 can clamp chips of different sizes. During the sliding of the mounting plate 14 above the base 1, when two mounting plates 14 slide in cooperation with the arc groove 12 and the slider 15, the middle part of the double telescopic rod 24 will squeeze the moving block 23, causing the moving block 23 to slide above the base 1. This linkage mechanism realizes the synchronous displacement of the air hood 22 and the mounting plate 14, so that the cold air transmitted by the two cold air blowers 19 inside the base 1 through the telescopic pipe 2 and the connecting pipe 21 can always accurately cover the chip area. Without the need for additional control devices, the heat dissipation position can be automatically adjusted according to the size of the chip by relying solely on the ingenious design of the mechanical structure, which improves the heat dissipation efficiency and targeting. Then, the lower part of the chip external heating plate is attached and the heating plate is started to heat the chip, and various performance parameters of the chip, such as current, voltage, resistance, and operating frequency, are recorded in real time.

[0036] After heating is complete, turn on the air cooler 19 to dissipate heat from the high-temperature chip. Once the chip temperature drops to the preset safe temperature, turn off the air cooler 19. At this point, the chip can be disassembled, or its position can be readjusted or replaced according to subsequent testing requirements.

[0037] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A high-temperature test fixture for semiconductor chips with a heat dissipation structure, comprising a base (1), characterized in that: A turntable (11) is rotatably connected to the center of the upper part of the base (1). Four arc-shaped grooves (12) are equidistantly opened on the surface of the turntable (11). A fixing block (13) is slidably connected inside each of the four arc-shaped grooves (12). An mounting plate (14) is fixedly connected above each of the four fixing blocks (13). A slider (15) is fixedly connected below each of the four mounting plates (14). The four sliders (15) are slidably connected above the base (1). Moving blocks (23) are slidably connected to both sides of the upper part of the base (1). An air hood (22) is fixedly connected above each of the two moving blocks (23). The two moving blocks (23) are respectively located in the middle of the two mounting plates (14).

2. The high-temperature test fixture for semiconductor chips with a heat dissipation structure according to claim 1, characterized in that: A double-sided telescopic rod (24) is provided in the middle of the two mounting plates (14), and the two output ends of the double-sided telescopic rod (24) are rotatably connected to one side of the two mounting plates (14).

3. A high-temperature test fixture for semiconductor chips with a heat dissipation structure according to claim 2, characterized in that: The middle of the two bilateral telescopic rods (24) is slidably connected to the interior of the moving block (23), and two air coolers (19) are installed inside the base (1). The output ends of the two air coolers (19) are fixedly connected to telescopic pipes (2).

4. A high-temperature test fixture for semiconductor chips with a heat dissipation structure according to claim 3, characterized in that: Each of the two telescopic tubes (2) has a connecting tube (21) fixedly connected to one end away from the air cooler (19), and the two connecting tubes (21) have one end away from the telescopic tube (2) fixedly connected to the bottom of the two air outlet hoods (22).

5. A high-temperature test fixture for semiconductor chips with a heat dissipation structure according to claim 1, characterized in that: Each of the four mounting plates (14) is rotatably connected to a bolt (16), and the outer wall of the bolt (16) is threaded with a clamping block (17), which is slidably connected to the mounting plate (14).

6. A high-temperature test fixture for semiconductor chips with a heat dissipation structure according to claim 5, characterized in that: A knob (18) is fixedly connected to one end of the bolt (16) located above the mounting plate (14).

7. A high-temperature test fixture for semiconductor chips with a heat dissipation structure according to claim 6, characterized in that: A motor (25) is fixedly connected to the bottom of the base (1). A bevel gear (26) is fixedly connected to the output end of the motor (25) and the shaft below the turntable (11). The two bevel gears (26) mesh.

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