Rapid detection equipment for BGA (Ball Grid Array) chip

Abstract

The utility model provides a BGA chip rapid detection device comprising a test block with a top end face provided with a test groove, a probe plate which is arranged on the bottom wall of the test groove and is provided with a plurality of probes on the top end face, and a dismounting mechanism which is arranged on the test block and is used for dismounting a BGA chip in the test groove. The BGA chip is arranged in the test groove in a penetrating mode, the multiple probes are sleeved with test holes in the bottom end of the BGA chip, the dismounting mechanism comprises a jacking frame arranged on the probe plate and located between the multiple probes and a pressing assembly arranged above the jacking frame in parallel through a telescopic assembly, and when the BGA chip is placed on the top end face of the jacking frame, the BGA chip is dismounted from the jacking frame through the telescopic assembly. The pressing assembly drives the jacking frame and the BGA chip to move into the test groove, and the test hole sleeves the probe; when the pressing assembly drives the jacking frame to move upwards, the jacking frame and the BGA chip are driven to move upwards; the telescopic length distance of the telescopic assembly is greater than the thickness of the BGA chip; according to the utility model, the BGA chip can be conveniently detected, and the detection efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of BGA chip testing equipment, specifically a rapid testing device for BGA chips. Background Technology

[0002] As chip manufacturing processes become increasingly sophisticated, the requirements for chip size, integration density, and frequency are all rising. Meanwhile, semiconductor production and testing processes are also advancing rapidly. However, highly complex chip designs are facing numerous challenges, including reliability and high quality. In existing technologies, BGA chip testing fixtures use probes within a needle cavity to test the chip. To ensure the probes accurately align with the chip's position, the needle cavity or positioning slot that defines the chip's location is typically set to match the chip's size. This ensures that each chip aligns with the probe position during testing, improving accuracy. However, this method makes it difficult to manually remove chips when they become stuck in the positioning slot or needle cavity due to the tight fit, causing difficulties in chip disassembly and reducing BGA chip testing efficiency. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model provides a rapid testing device for BGA chips, which can conveniently test BGA chips and improve testing efficiency.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a rapid testing device for BGA chips, comprising a test block with a test slot on its top end face, a probe plate disposed on the bottom wall of the test slot and having multiple probes on its top end face, and a disassembly mechanism disposed on the test block for disassembling the BGA chip located in the test slot. The BGA chip passes through the test slot and its bottom test hole is fitted onto the multiple probes. The disassembly mechanism includes a lifting frame disposed on the probe plate and located between the multiple probes, and a pressing component disposed parallel to the lifting frame via a telescopic assembly. When the BGA chip is placed on the top end face of the lifting frame, the pressing component moves the lifting frame and the BGA chip into the test slot, and the test hole is fitted onto the probe. When the pressing component moves the lifting frame upward, it moves the lifting frame and the BGA chip upward. The telescopic length of the telescopic assembly is greater than the thickness of the BGA chip.

[0005] Preferably, the bottom end of the test block is fixedly mounted on the top end face of the base. The pressing component includes a lifting component mounted on the base and arranged vertically via an installation component, a connecting rod mounted on the lifting frame and arranged horizontally via a telescopic component, and a fixing plate fixedly mounted on the bottom side of the connecting rod and parallel to the top end face of the lifting frame. The lifting component drives the fixing plate to move up and down in the vertical direction.

[0006] Preferably, the lifting component includes two vertical rods fixedly mounted on the top end face of the base in a vertical direction, a horizontal rod mounted on the top ends of the two vertical rods and located directly above the test block, and a telescopic cylinder fixedly mounted on the top side of the horizontal rod in a vertical direction, with its output end passing through the horizontal rod and fixedly connected to the middle position of the top side of the connecting rod.

[0007] Preferably, the top end face of the test block has two lifting slots symmetrically opened about the test slot and communicating with the inside of the test slot. The telescopic component includes two telescopic arms that are movably inserted into the two different lifting slots and whose bottom sides are fixedly connected to the two sides of the lifting frame; two telescopic columns whose bottom ends are movably inserted into the top of the telescopic arms and have limiting slots opened inside; and a limiting block that is slidably disposed in the limiting slot and whose top end is fixedly connected to the bottom end of the telescopic column. The sliding distance of the limiting block in the limiting slot is greater than the thickness of the BGA chip. The top end of the telescopic column is fixedly connected to the bottom side of the connecting rod.

[0008] Preferably, the test groove wall has multiple through holes for the test block, with one end of the through hole opening inside the test groove and the other end opening on the side of the test block.

[0009] Preferably, four locking blocks are fixedly provided at the four corners of the top end face of the lifting frame to limit the position of the BGA chip on the top end face of the lifting frame; the four locking blocks are L-shaped and the opening direction of each block points to the middle of the top end face of the lifting frame.

[0010] The beneficial effects of this utility model are as follows: The BGA chip is placed directly on the top end face of the lifting frame. At this time, the BGA chip is located between the lifting frame and the pressing component. With the pressing component moving downward, the telescopic component is compressed. At this time, the bottom end of the pressing component contacts the top end face of the BGA chip on the lifting frame, which facilitates the relative fixation of the position of the BGA chip on the lifting frame. As the pressing component continues to move downward, the lifting frame passes through the top end face of the probe plate and is arranged between multiple probes. The test hole opened on the bottom end face of the BGA chip on the lifting frame is fitted onto the multiple probes. After the pressing component drives the lifting frame and the BGA chip to move completely into the test slot, the probes are completely inserted into the test holes opened in the BGA chip, which facilitates the testing of the BGA chip. After the test is completed, the pressing component drives the lifting frame to move upward, lifting and removing the BGA chip that is fitted onto the multiple probes through the test holes. This allows for convenient testing of BGA chips and improves testing efficiency. Attached Figure Description

[0011] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0012] Figure 1This is a schematic diagram of the BGA chip structure tested by the rapid testing device for BGA chips proposed in this utility model.

[0013] Figure 2 This is a schematic diagram of the unfolded structure of the BGA chip rapid testing device proposed in this utility model.

[0014] Figure 3 This is a schematic diagram of the BGA chip placement structure in the BGA chip rapid testing device proposed in this utility model.

[0015] Figure 4 This is a schematic diagram of the cross-sectional structure of the BGA chip under test state in the BGA chip rapid testing device proposed in this utility model.

[0016] Figure 5 This is an enlarged structural diagram of point A of this utility model.

[0017] In the diagram: 1. Base; 2. Test block; 3. Test slot; 4. Through hole; 5. Fixing plate; 6. Connecting rod; 7. Vertical rod; 8. Horizontal rod; 9. Telescopic cylinder; 10. Lifting frame; 11. Locking block; 12. Telescopic arm; 13. Telescopic column; 14. BGA chip; 15. Probe board; 16. Probe; 17. Lifting slot; 18. Limiting slot; 19. Limiting block. Detailed Implementation

[0018] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are only preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the embodiments without creative effort are all within the protection scope of this utility model.

[0019] Please see Figures 1-5 A rapid testing device for BGA chips includes a test block 2 with a test groove 3 on its top end face, a probe plate 15 disposed on the bottom wall of the test groove 3 and having multiple probes 16 on its top end face, and a disassembly mechanism disposed on the test block 2 for disassembling BGA chips 14 located in the test groove 3. The BGA chips 14 pass through the test groove 3 and have test holes at their bottom ends fitted onto the multiple probes 16. The disassembly mechanism includes a lifting frame 10 disposed on the probe plate 15 and located between the multiple probes 16, and a pressing component disposed parallel to the lifting frame 10 via a telescopic assembly. When the BGA chips 14 are placed on the top end face of the lifting frame 10, the pressing component moves the lifting frame 10 and the BGA chips 14 into the test groove 3, with the test holes fitted onto the probes 16. When the pressing component moves the lifting frame 10 upward, it moves the lifting frame 10 and the BGA chips 14 upward. The telescopic length of the telescopic assembly is greater than the thickness of the BGA chips 14.

[0020] like Figures 1-5 As shown, the testing of BGA chip 14 involves the following steps:

[0021] The first step is to control the placement of the BGA chip 14 on the top end face of the lifting frame 10 (e.g., by using a suction cup to pick up the BGA chip 14 and controlling its movement, or by manually picking up the BGA chip 14 and controlling its movement).

[0022] The second step involves pressing the component downwards to compress the telescopic component. The bottom of the pressing component first contacts the top of the BGA chip 14 placed on the top of the lifting frame 10. When the pressing component contacts the bottom of the BGA chip 14, the pressing component and the lifting frame 10 facilitate the fixation of the position of the BGA chip 14 on the top end face of the lifting frame 10. After the BGA chip 14 is fixed, the pressing component moves the BGA chip 14 and the lifting frame 10 synchronously into the test slot 3. (During the process of the lifting frame 10 passing through the test slot 3, the lifting frame 10 passes between multiple probes 16, and the BGA chip 14 is fitted onto the multiple probes 16 through the test hole opened at the bottom, thereby facilitating the detection and testing of the BGA chip 14 through the multiple probes 16 set on the probe plate 15).

[0023] Third, after the BGA chip 14 is tested, the pressing component drives the telescopic component and the lifting frame 10 and the BGA chip 14 to move upward from the test slot 3, which facilitates the opening and disassembly of the BGA chip 14, makes it convenient to test the BGA chip 14, and improves the testing efficiency.

[0024] The bottom of the test block 2 is fixedly set on the top end face of the base 1. The pressing component includes a lifting component set on the base 1 and arranged vertically via an installation component, a connecting rod 6 set on the top of the lifting frame 10 and arranged horizontally via a telescopic component, and a fixing plate 5 fixedly set on the bottom side of the connecting rod 6 and parallel to the top end face of the lifting frame 10. The lifting component drives the fixing plate 5 to move up and down in the vertical direction.

[0025] The lifting component includes two vertical rods 7 fixedly mounted on the top end face of the base 1 in a vertical direction, a horizontal rod 8 mounted on the top end of the two vertical rods 7 and located directly above the test block 2, and a telescopic cylinder 9 fixedly mounted on the top side of the horizontal rod 8 in a vertical direction, with its output end passing through the horizontal rod 8 and fixedly connected to the middle position of the top side of the connecting rod 6.

[0026] like Figures 1-4As shown, when the BGA chip 14 is placed on the top end face of the lifting frame 10, the output end of the telescopic cylinder 9 drives the fixing plate 5 to move downward. At this time, the telescopic component is compressed. When the fixing plate 5 contacts the BGA chip 14 placed on the top of the lifting frame 10, it is convenient to fix the position of the BGA chip 14 through the fixing plate 5 and the lifting frame 10. The telescopic cylinder 9 drives the fixing plate 5 to continue to move downward, which pushes the lifting frame 10 and the BGA chip 14 into the test slot 3. At this time, multiple probes 16 set on the top of the probe plate 15 pass through multiple test holes opened at the bottom of the BGA chip 14. The multiple probes 16 facilitate the detection and testing of the BGA chip 14. After the test is completed, the output end of the telescopic cylinder 9 drives the telescopic component to move upward. At this time, the telescopic component is stretched. When it is stretched to its maximum length, the lifting frame 10 is moved upward, and the BGA chip 14 located on the multiple probes 16 is removed, which improves the detection and testing efficiency of the BGA chip 14.

[0027] The top end face of the test block 2 is symmetrically provided with two lifting slots 17 that are connected to the inside of the test slot 3. The telescopic assembly includes two telescopic arms 12 that are respectively movably inserted into the two different lifting slots 17 and are fixedly connected to the two sides of the lifting frame 10 at their bottom ends; two telescopic columns 13 that are respectively movably inserted into the top end of the telescopic arms 12 and are provided with limiting slots 18 inside; and a limiting block 19 that is slidably disposed in the limiting slots 18 and is fixedly connected to the bottom end of the telescopic column 13 at its top end. The sliding distance of the limiting block 19 in the limiting slots 18 is greater than the thickness of the BGA chip 14. The top end of the telescopic column 13 is fixedly connected to the bottom side of the connecting rod 6.

[0028] like Figures 4-5 As shown, a limiting block 19 is connected to the bottom end of the telescopic column 13. The limiting block 19 passes through the limiting groove 18, limiting the distance the telescopic column 13 passes through the telescopic arm 12. When the output end of the telescopic cylinder 9 drives the connecting rod 6 to move upward, it drives the connecting rod 6 to move downward. At this time, the limiting block 19 at the bottom end of the telescopic column 13 connected to the connecting rod 6 slides downward in the limiting groove 18. When the bottom end face of the fixing plate 5 contacts the top end of the BGA chip 14 placed on the top end face of the lifting frame 10, it is convenient to adjust the position of the BGA chip 14 through the fixing plate 5 and the lifting frame 10. When the BGA chip 14 located in the test slot 3 is disassembled, the output end of the telescopic cylinder 9 drives the connecting rod 6 to move upward, which in turn drives the telescopic column 13 connected to the connecting rod 6 to move upward. The limiting block 19 set on the bottom end of the telescopic column 13 slides to the top of the limiting slot 18, which drives the telescopic arm 12 to move upward synchronously. This causes the BGA chip 14 located on the top of the lifting frame 10 to move upward through the lifting frame 10, which facilitates the disassembly of the BGA chip 14, makes it easy to test the BGA chip 14, and improves the testing efficiency.

[0029] Multiple through holes 4 are opened in the wall of the test groove 3 to pass through the test block 2. One end of the through hole 4 is located inside the test groove 3, and the other end of the through hole 4 is located on the side of the test block 2.

[0030] This allows air in the test slot 3 to be discharged through the through hole 4 when the BGA chip 14 is inserted into the test slot 3, facilitating the testing of the BGA chip 14 inside the test slot 3.

[0031] Four BGA chip 14 is fixedly installed at the four corners of the top end face of the lifting frame 10, with four locking blocks 11 that limit the position of the BGA chip 14 on the top end face of the lifting frame 10; the four locking blocks 11 are L-shaped and the opening direction of each block points to the middle of the top end face of the lifting frame 10.

[0032] like Figures 2-3 As shown, when the BGA chip 14 is placed on the top end face of the lifting frame 10, the BGA chip 14 is placed directly between the four locking blocks 11 provided on the top end face of the lifting frame 10. This allows the locking blocks 11 to limit the position of the BGA chip 14 on the lifting frame 10, preventing the BGA chip 14 from sliding on the lifting frame 10 and causing the probe 16 to be unable to pass through the test hole when the BGA chip 14 passes through the test slot 3.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A rapid testing device for BGA chips, comprising a test block (2) with a test groove (3) on its top end face, a probe plate (15) disposed on the bottom wall of the test groove (3) and having a plurality of probes (16) disposed on its top end face, and a disassembly mechanism disposed on the test block (2) for disassembling a BGA chip (14) located in the test groove (3), wherein the BGA chip (14) passes through the test groove (3) and the bottom test hole is fitted onto the plurality of probes (16), characterized in that, The disassembly mechanism includes a lifting frame (10) set on the probe plate (15) and located between multiple probes (16), and a pressing component set parallel above the lifting frame (10) via a telescopic assembly. When the BGA chip (14) is placed on the top end face of the lifting frame (10), the pressing component drives the lifting frame (10) and the BGA chip (14) to move into the test slot (3), and the test hole is fitted onto the probe (16). When the pressing component drives the lifting frame (10) to move upward, it drives the lifting frame (10) and the BGA chip (14) to move upward. The telescopic length of the telescopic assembly is greater than the thickness of the BGA chip (14).

2. The BGA chip rapid testing device according to claim 1, characterized in that: The bottom of the test block (2) is fixedly set on the top end face of the base (1). The pressing component includes a lifting component set above the base (1) and arranged vertically by means of an installation component, a connecting rod (6) set above the lifting frame (10) and arranged horizontally by means of a telescopic component, and a fixing plate (5) fixedly set on the bottom side of the connecting rod (6) and parallel to the top end face of the lifting frame (10). The lifting component drives the fixing plate (5) to move up and down in the vertical direction.

3. The BGA chip rapid testing device according to claim 2, characterized in that: The lifting component includes two vertical rods (7) fixedly mounted on the top end face of the base (1) in the vertical direction, a horizontal rod (8) mounted on the top end of the two vertical rods (7) and located directly above the test block (2), and a telescopic cylinder (9) fixedly mounted on the top side of the horizontal rod (8) in the vertical direction, with its output end passing through the horizontal rod (8) and fixedly connected to the middle position of the top side of the connecting rod (6).

4. The BGA chip rapid testing device according to claim 3, characterized in that: The test block (2) has two lifting slots (17) symmetrically opened on the top end face of the test slot (3) and communicating with the inside of the test slot (3). The telescopic assembly includes two telescopic arms (12) that are respectively movably inserted into the two different lifting slots (17) and fixedly connected to the sides of the lifting frame (10) at the bottom end, two telescopic columns (13) that are respectively movably inserted into the top end of the telescopic arms (12) and have a limiting slot (18) opened inside, and a limiting block (19) that is slidably set in the limiting slot (18) and fixedly connected to the bottom end of the telescopic column (13) at the top end. The sliding distance of the limiting block (19) in the limiting slot (18) is greater than the thickness of the BGA chip (14). The bottom side of the connecting rod (6) is fixedly connected to the top end of the telescopic column (13).

5. A rapid testing device for BGA chips according to any one of claims 1 to 4, characterized in that: The test groove (3) has multiple through holes (4) that penetrate the test block (2) on its wall. One end of the through hole (4) is located inside the test groove (3), and the other end of the through hole (4) is located on the side of the test block (2).

6. The BGA chip rapid testing device according to claim 5, characterized in that: Four BGA chips (14) are fixedly installed at the four corners of the top end face of the lifting frame (10), with four locking blocks (11) positioned on the top end face of the lifting frame (10); the four locking blocks (11) are L-shaped and their openings all point to the middle of the top end face of the lifting frame (10).

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