LED intelligent card convenient to manufacture

Abstract

The utility model belongs to the technical field of intelligent cards, in particular to a light-emitting diode (LED) intelligent card convenient to manufacture, which comprises an integrated circuit (IC) module and realizes high-precision positioning in the manufacturing process. By means of the design, errors and the defective product rate in the manufacturing process are reduced, and the production efficiency is remarkably improved. Meanwhile, the FPC board with the double-face circuit board design is adopted, the compact LED light-emitting module with the bonding pad spacing smaller than or equal to 0.5 mm and the flip chip structure is combined, the integration level of the circuit and the manufacturing fineness are further improved, different circle numbers and spacing are elaborately set through the FPC board LED antenna according to the capacitance condition so as to be matched with the working frequency of the IC module, interference on the IC module circuit is avoided, and the reliability of the IC module circuit is improved. The electromagnetic compatibility of the product is further improved through the frequency separation design. Besides, the FPC board with the four-layer structure and the LED intelligent card INLAY are bonded in a hot-pressing mode, so that stable installation of each component in the plastic base material is ensured, and the overall flatness and durability of the product are improved.

Description

Technical Field

[0001] This utility model relates to the field of smart card technology, and in particular to an LED smart card that is easy to manufacture. Background Technology

[0002] In the field of smart card technology, the rapid development of applications such as the Internet of Things and mobile payment has placed higher demands on the functionality, integration, and manufacturing efficiency of smart cards. LED smart cards, as a type of smart card integrating light-emitting display functions, not only need to possess the data storage and interaction capabilities of traditional smart cards, but also need to provide visual feedback or status indications through LED illumination in specific scenarios, thereby enhancing the user experience. However, existing LED smart cards face numerous technical challenges in their design and manufacturing processes. These issues directly affect product performance, stability, and manufacturing costs. In the manufacturing process of traditional LED smart cards, inaccurate positioning often leads to component placement deviations, which in turn affect circuit connection performance and overall product quality. Furthermore, with the increasing integration of circuits and the continuous reduction in component spacing, more stringent requirements are placed on precision control during the manufacturing process. Existing manufacturing processes cannot simultaneously meet the demands of high-precision positioning and efficient production, resulting in low production efficiency, increased defect rates, and increased manufacturing costs. During operation, LED smart cards must ensure a stable power supply to the LED light-emitting module while avoiding interference with the IC module circuitry to maintain the overall performance of the smart card. However, existing designs have shortcomings in power management, electromagnetic compatibility, and component mounting, leading to problems such as unstable LED lighting, interference with the IC module, or easy component detachment, affecting product reliability and lifespan. Especially in complex electromagnetic environments, existing LED smart cards are more prone to performance fluctuations, making it difficult to meet users' demands for high-quality products. Utility Model Content

[0003] To address the aforementioned problems, this invention proposes an easy-to-manufacture LED smart card, which more precisely solves the problems mentioned in the background section.

[0004] This utility model is achieved through the following technical solution:

[0005] This utility model proposes an easy-to-manufacture LED smart card, comprising: an IC module including an IC chip and an IC antenna; an FPC board LED module including an FPC board, multiple LEDs, diodes, and an FPC board LED antenna; and a material distribution structure including an upper printed layer, a lower printed layer, and a lower printed layer of the FPC board LED smart card.

[0006] Preferably, the FPC board is a double-sided circuit board with clearance holes processed on it according to the product requirements for fixing and wiring needs, and the FPC board carries LEDs, diodes and FPC board LED antennas.

[0007] Preferably, an easy-to-manufacture LED smart card is characterized in that the LED light-emitting module is a flip-chip structure, directly mounted on the conductive pads of the FPC board, with a pad spacing of ≤0.5mm.

[0008] Preferably, the diode has a rectifier function, which converts the AC power generated by the FPC board LED antenna into DC power to power the LED. The FPC board LED antenna is configured with different numbers of turns and spacing according to the capacitance to match the operating frequency of the IC module and avoid interfering with the IC module circuit.

[0009] Preferably, the FPC board LED smart card INLAY structure includes: an FPC board fixing layer with a material thickness of 0.1±0.02mm; an IC antenna layer with different thicknesses selected according to the product process for void clearance treatment; an upper cover film and a lower cover film for INLAY, which are compensated according to the product thickness requirements; the above four layers are bonded by hot pressing to ensure that each component is fully bonded in the plastic substrate and to maintain the flatness of the product.

[0010] Preferably, the FPC board has FPC clearance holes on its edge for precise alignment with the manufacturing equipment, and the diameter of the FPC clearance holes is 1.0-2.0mm.

[0011] Compared with the prior art, this utility model provides an LED smart card that is easy to manufacture and has the following advantages:

[0012] This easily manufactured LED smart card achieves high-precision positioning during manufacturing by setting specific diameter 1.0-2.0mm FPC clearance holes on the edge of the FPC board and precisely aligning them with the manufacturing equipment. This design not only reduces manufacturing errors and defect rates but also significantly improves production efficiency. Furthermore, the double-sided circuit board design of the FPC board, combined with a compact pad spacing of ≤0.5mm and a flip-chip LED light-emitting module, further enhances circuit integration and manufacturing precision.

[0013] This easy-to-manufacture LED smart card utilizes an FPC board LED antenna with carefully designed turns and spacing based on capacitance to match the IC module's operating frequency and avoid interference with the IC module circuitry. This frequency separation design further enhances the product's electromagnetic compatibility. Furthermore, the four-layer FPC board LED smart card inlay is bonded using a thermoforming method, ensuring stable mounting of all components within the plastic substrate and improving the product's overall flatness and durability. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of an LED smart card IC module that is easy to manufacture, as proposed in this utility model.

[0015] Figure 2 This is a schematic diagram of an LED module on an FPC board for an LED smart card that is easy to manufacture, as proposed in this utility model.

[0016] Figure 3 This is a schematic diagram of an FPC board for an LED smart card that is easy to manufacture, as proposed in this utility model.

[0017] Figure 4 This utility model presents an FPC board for an LED smart card that is easy to manufacture, and an LED smart card INLAY structural diagram.

[0018] Figure 5 This utility model presents an FPC board structure diagram for an LED smart card that is easy to manufacture.

[0019] In the diagram: 001, IC chip; 002, IC antenna; 003, FPC board; 004, FPC board LED antenna; 005, multiple LEDs; 006, diode; 007, FPC clearance hole; 008, FPC board filler; 009, FPC board filler; 010, IC antenna layer; 011, upper cover film of INLAY; 012, lower cover film of INLAY; 013, upper printed layer of FPC board LED smart card; 014, lower printed layer of FPC board LED smart card; 015, adhesive film of FPC board LED smart card. Detailed Implementation

[0020] To more clearly and completely illustrate the technical solution of this utility model, the following description, in conjunction with the accompanying drawings, will further explain this utility model.

[0021] Example

[0022] like Figures 1-5As shown in the figure, one embodiment of this utility model proposes an easy-to-manufacture LED smart card. The smart card includes an IC module, an FPC board LED module, and a component assembly structure. The IC module consists of an IC chip 001 and an IC antenna 002, responsible for the data interaction function of the smart card. The FPC board LED module includes an FPC board 003, multiple LEDs 005, diodes 006, and an FPC board LED antenna 004. The FPC board serves as the circuit carrier, the LEDs are used for light emission and display, the diodes perform rectification, and the FPC board LED antenna receives energy to illuminate the LEDs. The component assembly structure includes an upper printed layer 013, a lower printed layer 014, and a lower printed layer 014 on the FPC board LED smart card, which guide the smart card manufacturing process. Through the above structural combination, this utility model achieves integrated design of the LED smart card, simplifies the production process, and improves product adaptability.

[0023] In this invention, the FPC board 003 in the FPC board LED smart card adopts a double-sided circuit board design. According to actual product requirements, clearance holes 007 are machined on the FPC board. These clearance holes not only fix the position of the FPC board during manufacturing but also facilitate wiring, ensuring the accuracy of circuit connections. As the circuit carrier, the FPC board 003 supports key components such as LED 005, diode 006, and FPC board LED antenna 004. By adopting a double-sided circuit board design and machining clearance holes, the FPC board meets circuit connection requirements while also improving manufacturing precision and efficiency, ensuring the stable installation of components.

[0024] In this invention, the LED light-emitting module adopts a flip-chip structure, with the chip directly mounted on the conductive pads of the FPC board 003. The pad spacing is designed to be ≤0.5mm to meet the requirements of high-density integration while ensuring signal transmission stability. The flip-chip structure reduces wire bonding steps, lowers thermal resistance, and improves heat dissipation. By employing the flip-chip structure and compact pad spacing design, the LED light-emitting module achieves efficient and stable light emission, while also enhancing the integration and reliability of the smart card.

[0025] In this invention, in the FPC board LED smart card, diode 006 acts as a rectifier, converting the AC power received by the FPC board LED antenna 004 into DC power to provide a stable power supply for LED 005. The FPC board LED antenna 004 is carefully configured with different numbers of turns and spacing based on capacitance to match the IC module's operating frequency of 13.56-18MHz, while avoiding interference with the IC module circuitry. Through the rectification effect of the diode and the optimized design of the FPC board LED antenna, the LED smart card achieves a stable light emission effect, while ensuring frequency separation between the IC module and the LED module, avoiding mutual interference.

[0026] In this invention, the FPC board LED smart card INLAY structure comprises four layers: an FPC board fixing layer 009, an IC antenna layer 010, an upper INLAY cover film 011, and a lower INLAY cover film 012. The FPC board fixing layer has a material thickness of 0.1±0.02mm and is provided with clearance holes to fix the FPC board position. The IC antenna layer uses different thicknesses depending on the product process and is designed with clearance to reduce pressure on components. The upper and lower INLAY cover films are compensated according to the product thickness requirements. These four layers are bonded together by hot pressing to ensure that each component is fully bonded to the plastic substrate, maintaining product flatness. Through the hot pressing bonding process of the four-layer structure, the FPC board LED smart card INLAY achieves high-precision interlayer bonding, ensuring stable installation of components and overall product flatness.

[0027] In this invention, FPC clearance holes 007 are provided on the edge of the FPC board 003. These clearance holes are used for precise alignment with manufacturing equipment, ensuring accurate positioning of the FPC board during the manufacturing process. The diameter of the FPC clearance holes 007 is designed to be 1.0-2.0mm to accommodate the alignment requirements of different manufacturing equipment. By setting FPC clearance holes of a specific diameter, the FPC board achieves precise alignment with the equipment during the manufacturing process, improving manufacturing accuracy and efficiency, and ensuring product quality and consistency.

[0028] Finally, it should be noted that the basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification, and therefore remain within the spirit and scope of the exemplary embodiments of this specification. Furthermore, this specification uses specific terms to describe embodiments of this specification. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined. Moreover, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this specification are not intended to limit the order of the processes and methods of this specification.

[0029] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An easy-to-manufacture LED smart card, characterized in that, include: The IC module includes an IC chip (001) and an IC antenna (002); The FPC board LED module includes an FPC board (003), multiple LEDs (005), diodes (006), and an FPC board LED antenna (004); the component structure includes an upper printed layer (013) of the FPC board LED smart card, a lower printed layer (014) of the FPC board LED smart card, and a lower printed layer (014) of the FPC board LED smart card.

2. The LED smart card that is easy to manufacture according to claim 1, characterized in that, The FPC board (003) is a double-sided circuit board with clearance holes (007) processed on it according to the product requirements for fixing and wiring needs. The FPC board (003) carries LED (005), diode (006) and FPC board LED antenna (004).

3. The LED smart card that is easy to manufacture according to claim 1, characterized in that, The LED light-emitting module is a flip-chip structure, which is directly mounted on the conductive pads of the FPC board (003), with a pad spacing of ≤0.5mm.

4. The LED smart card that is easy to manufacture according to claim 1, characterized in that, The diode (006) has a rectifier function, which is used to convert the AC power generated by the FPC board LED antenna (004) into DC power to supply the LED (005) for lighting. The FPC board LED antenna (004) is set with different number of turns and spacing according to the capacitance to match the working frequency of the IC module, while avoiding interference with the IC module circuit.

5. The LED smart card that is easy to manufacture according to claim 1, characterized in that, The FPC board LED smart card INLAY structure includes: an FPC board fixing layer (009) with a material thickness of 0.1±0.02mm; an IC antenna layer (010) with different thicknesses selected according to the product process for void clearance treatment; an upper INLAY cover film (011) and a lower INLAY cover film (012) for compensation according to the product thickness requirements; the above four layers are bonded by hot pressing to ensure that each component is fully bonded in the plastic substrate and to maintain the flatness of the product.

6. The LED smart card that is easy to manufacture according to claim 1, characterized in that, The FPC board (003) has FPC clearance holes (007) on its edge for precise alignment with the manufacturing equipment. The diameter of the FPC clearance holes (007) is 1.0-2.0 mm.

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