Packaging structure of high-stability laser

Abstract

The utility model discloses a packaging structure of a high-stability laser, and relates to the technical field of lasers, and the packaging structure of the high-stability laser comprises a housing which is provided with an accommodating cavity with an opening; the chip assembly is arranged in the accommodating cavity; the cover body is fixed at the opening to seal the accommodating cavity; the first heat dissipation piece is fixed to the cover body, one end of the first heat dissipation piece abuts against the top of the chip assembly, and the other end of the first heat dissipation piece penetrates through the cover body and extends out of the containing cavity. According to the technical scheme provided by the utility model, the stability of the laser is improved.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a packaging structure for a high-stability laser. Background Technology

[0002] Lasers are widely used in fields such as fiber optic communication, laser processing, and medical equipment.

[0003] Currently, common lasers mainly consist of a housing, a chip assembly, and a cover. The housing forms a cavity to house the chip assembly, while the cover seals the cavity and protects the chip assembly from external environmental influences.

[0004] However, after a period of use, the temperature changes during the operation of existing lasers can cause thermal stress between various components. Under the action of thermal stress, the chip components inside the laser are prone to loosening, resulting in a decrease in the stability of the laser. Utility Model Content

[0005] The main purpose of this invention is to propose a packaging structure for a high-stability laser, which aims to improve the stability of the laser.

[0006] To achieve the above objectives, the present invention proposes a packaging structure for a high-stability laser, comprising:

[0007] The housing has a receiving cavity with an opening;

[0008] The chip assembly is disposed inside the receiving cavity;

[0009] A cover, fixed to the opening to close the receiving cavity; and

[0010] A first heat sink is fixed to the cover. One end of the first heat sink is provided with a first clearance groove corresponding to the top of the chip assembly, and the inner wall of the first clearance groove abuts against the top of the chip assembly. The other end of the first heat sink extends through the cover to the outside of the receiving cavity.

[0011] In one embodiment, the first heat sink includes:

[0012] The first substrate is attached to the side of the cover facing the chip assembly;

[0013] First fins, one end of which is fixed to the first substrate, and the other end of which extends toward the chip assembly and abuts against the top of the chip assembly. Multiple first fins are provided, and each first fin has a first notch at its end near the chip assembly. The first notches of the multiple first fins together form the first clearance groove.

[0014] A first heat-conducting part, one end of which is connected to the first substrate, and the other end of which extends through the cover to the outside of the receiving cavity.

[0015] In one embodiment, the cover has a first receiving groove on the side opposite to the receiving cavity, and the end of the first heat-conducting part located outside the receiving cavity is bent and fixed in the first receiving groove.

[0016] In one embodiment, the first heat-conducting portion is provided on both sides of the first substrate in the width direction.

[0017] In one embodiment, a second heat sink is further included, one end of which abuts against the side of the chip assembly, and the other end of which extends through the bottom wall of the housing to the outside of the receiving cavity.

[0018] In one embodiment, the second heat sink is provided on both sides of the chip assembly in the width direction.

[0019] In one embodiment, the second heat sink is provided with a second clearance groove corresponding to the side of the chip assembly, and the inner wall of the second clearance groove abuts against the side of the chip assembly.

[0020] In one embodiment, the second heat sink includes:

[0021] The second substrate is disposed inside the receiving cavity;

[0022] The second fin has one end fixed to the second substrate and the other end extending towards the chip assembly and abutting against the side of the chip assembly. Multiple second fins are provided, and each second fin has a second notch at its end near the chip assembly. The second notches of the multiple second fins together form the second clearance groove.

[0023] The second heat-conducting part has one end connected to the second substrate and the other end extending through the bottom wall of the housing to the outside of the receiving cavity.

[0024] In one embodiment, the first fin is perpendicular to the second fin.

[0025] In one embodiment, a second receiving groove is provided on the outer side of the bottom of the housing, and one end of the second heat-conducting part located outside the receiving cavity is bent and fixed in the second receiving groove.

[0026] The high-stability laser packaging structure of this utility model includes a housing, a chip assembly, a cover, and a first heat sink. The housing houses the internal components of the laser, and the cover seals the opening of the housing, completely enclosing the chip assembly within the cavity and protecting it from external environmental influences. The first heat sink has a first clearance groove at one end inside the cavity. The inner wall of the first clearance groove abuts against the top of the chip assembly, providing support and holding the chip assembly between the bottom wall of the cavity and the first heat sink, reducing the possibility of vertical movement. Furthermore, by providing the first clearance groove, the area of ​​the first heat sink is increased while preventing interference between the heat sink and the chip assembly. The other end of the first heat sink extends through the cover to the external environment, conducting heat generated by the chip assembly to the surrounding environment, reducing the temperature rise of the chip assembly, preventing performance degradation or damage due to overheating, and reducing thermal stress caused by temperature changes. The first heat sink improves both the thermal and structural stability of the laser, thereby enhancing its reliability and extending its lifespan. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 A cross-sectional view of an embodiment of the packaging structure for a high-stability laser provided by this utility model. Figure 1 ;

[0029] Figure 2 A cross-sectional view of an embodiment of the packaging structure for a high-stability laser provided by this utility model. Figure 2 ;

[0030] Figure 3 A cross-sectional view of an embodiment of the packaging structure for a high-stability laser provided by this utility model. Figure 3 ;

[0031] Figure 4 A schematic diagram of an embodiment of the packaging structure for the high-stability laser provided by this utility model;

[0032] Figure 5 An exploded view of an embodiment of the packaging structure for the high-stability laser provided by this utility model;

[0033] Figure 6A schematic diagram of the first heat sink component in the packaging structure of the high-stability laser provided by this utility model;

[0034] Figure 7 A partial structural schematic diagram of the packaging structure for the high-stability laser provided by this utility model;

[0035] Figure 8 A schematic diagram of the second heat sink component in the packaging structure of the high-stability laser provided by this utility model;

[0036] Figure 9 A schematic diagram of the housing structure of the high-stability laser provided by this utility model.

[0037] Explanation of icon numbers:

[0038] 100. Shell; 101. Second receiving slot;

[0039] 200. Cover; 201. First receiving slot;

[0040] 300. Chip components;

[0041] 400, First heat sink; 401, First clearance groove; 410, First substrate; 420, First fin; 421, First notch; 430, First heat-conducting part;

[0042] 500, Second heat sink; 501, Second clearance groove; 510, Second substrate; 520, Second fin; 521, Second notch; 530, Second heat-conducting part.

[0043] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0044] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0045] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0046] In this utility model, unless otherwise explicitly specified and limited, the terms "connection" and "fixation" should be interpreted broadly. For example, "fixation" can mean a fixed connection, a detachable connection, or an integral part; "connection" can mean a mechanical connection or an electrical connection, a direct connection or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0048] This invention proposes a packaging structure for a high-stability laser.

[0049] Please see Figures 1 to 4 , Figure 1 A cross-sectional view of an embodiment of the packaging structure for a high-stability laser provided by this utility model. Figure 1 , Figure 2 A cross-sectional view of an embodiment of the packaging structure for a high-stability laser provided by this utility model. Figure 2 , Figure 3 A cross-sectional view of an embodiment of the packaging structure for a high-stability laser provided by this utility model. Figure 3 , Figure 4 A schematic diagram of an embodiment of the packaging structure for the high-stability laser provided by this utility model.

[0050] In one embodiment of this utility model, the packaging structure of the high-stability laser includes:

[0051] The housing 100 has a receiving cavity with an opening;

[0052] Chip assembly 300 is located inside the receiving cavity;

[0053] Cover 200, fixed to the opening to close the receiving cavity; and

[0054] The first heat sink 400 is fixed to the cover 200. One end of the first heat sink 400 is provided with a first relief groove 401 corresponding to the top of the chip assembly 300, and the inner wall of the first relief groove 401 abuts against the top of the chip assembly 300. The other end of the first heat sink 400 extends through the cover 200 to the outside of the receiving cavity.

[0055] The high-stability laser packaging structure of this utility model includes a housing 100, a chip assembly 300, a cover 200, and a first heat sink 400. The housing 100 is used to accommodate the internal components of the laser, and the cover 200 is used to close the opening of the housing 100, completely enclosing the chip assembly 300 within the receiving cavity and protecting the chip assembly 300 from external environmental influences. The first heat sink 400 has a first clearance groove 401 at one end inside the receiving cavity. The inner wall of the first clearance groove 401 abuts against the top of the chip assembly 300, providing support for the chip assembly 300 and holding it between the bottom wall of the receiving cavity and the first heat sink 400, reducing the possibility of vertical movement of the chip assembly 300. Furthermore, by providing the first clearance groove 401, the area of ​​the first heat sink 400 is increased, while avoiding interference between the first heat sink 400 and the chip assembly 300. The other end of the first heat sink 400 extends through the cover 200 to the external environment, conducting the heat generated by the chip assembly 300 to the external environment, reducing the temperature rise of the chip assembly 300, preventing performance degradation or damage due to overheating, and also reducing thermal stress caused by temperature changes. The first heat sink 400 improves both the thermal stability and structural stability of the laser, thereby enhancing its reliability and extending its lifespan.

[0056] The first heat sink 400 can be fixed to the cover 200 by welding, bonding or other methods. The chip assembly 300 can be fixed inside the receiving cavity by welding, screw fastening or other methods.

[0057] In one embodiment, the first heat sink 400 includes:

[0058] The first substrate 410 is attached to the side of the cover 200 facing the chip assembly 300;

[0059] First fins 420, one end of which is fixed to the first substrate 410, and the other end of which extends toward the chip assembly 300 and abuts against the top of the chip assembly 300. Multiple first fins 420 are provided, and each first fin 420 has a first notch 421 at its end near the chip assembly 300. The first notches 421 of the multiple first fins 420 together form a first clearance groove 401; and

[0060] The first heat-conducting part 430 has one end connected to the first substrate 410 and the other end extending through the cover 200 to the outside of the receiving cavity.

[0061] Reference Figure 2 , Figure 3 as well as Figure 6 In an embodiment of this utility model, the first heat sink 400 includes a first substrate 410, a first fin 420, and a first heat-conducting portion 430. The first substrate 410 is attached to the side of the cover 200 facing the chip assembly 300, i.e., the inner side of the cover 200, providing stable support for the first fin 420 and improving the structural stability of the first heat sink 400. On the other hand, the first substrate 410 can conduct heat from the first fin 420 to the first heat-conducting portion 430 and also transfer heat from the first fin 420 to the cover 200, increasing the heat transfer area and thus improving the heat dissipation efficiency of the first heat sink 400. Multiple first fins 420 are arranged in an array. Each first fin 420 has a first notch 421 at one end near the chip assembly 300. The multiple first notches 421 of the multiple first fins 420 together form a first clearance groove 401, which increases the heat conduction area of ​​each first fin 420 and avoids interference between the first fin 420 and the chip assembly 300. The first heat conduction part 430 conducts heat from the first substrate 410 to the external environment, realizing the final dissipation of heat from the chip assembly 300.

[0062] In one embodiment, the cover 200 has a first receiving groove 201 on the side away from the receiving cavity, and the end of the first heat-conducting part 430 located outside the receiving cavity is bent and fixed in the first receiving groove 201.

[0063] Reference Figure 2 , Figure 4 and Figure 5 In this embodiment of the present invention, a first receiving groove 201 is provided on the side of the cover 200 away from the receiving cavity (i.e., the outer side of the cover 200). The end of the first heat-conducting part 430 located outside the receiving cavity is bent and fixed in the first receiving groove 201, so that the first substrate 410 and the first heat-conducting part 430 clamp the two sides of the cover 200, which improves the firmness and stability of the first heat sink 400 fixed on the cover 200 and reduces the possibility of the first heat sink 400 loosening. In addition, bending the first heat-conducting part 430 and hiding it in the first receiving groove 201 avoids the first heat-conducting part 430 protruding from the surface of the cover 200, reduces the possibility of the first heat-conducting part 430 being damaged by impact, and helps to improve the structural compactness of the laser.

[0064] In one embodiment, a first heat-conducting portion 430 is provided on both sides of the first substrate 410 in the width direction.

[0065] Reference Figure 4 and Figure 5 In the embodiment of this utility model, the first substrate 410 is provided with a first heat-conducting part 430 on both sides in the width direction. Specifically, three first heat-conducting parts 430 are provided on each side. The first heat-conducting parts 430 on both sides are opposite to each other and extend towards each other, which further improves the firmness and stability of the first heat sink 400 fixed on the cover 200 and avoids the first heat sink 400 from loosening.

[0066] In one embodiment, a second heat sink 500 is also included. One end of the second heat sink 500 abuts against the side of the chip assembly 300, and the other end of the second heat sink 500 extends through the bottom wall of the housing 100 to the outside of the receiving cavity.

[0067] Reference Figure 1 , Figure 2 and Figure 7 In this embodiment of the invention, the laser's packaging structure further includes a second heat sink 500. The second heat sink 500 absorbs heat from the side of the chip assembly 300 and conducts the heat to the external environment through the bottom wall of the housing 100, further improving the laser's heat dissipation efficiency. The first heat sink 400 dissipates heat from the top, while the second heat sink 500 dissipates heat from the side, avoiding heat dissipation in one direction and ensuring the uniformity of temperature rise in different directions for the chip assembly 300, thereby improving the laser's stability and reliability. Furthermore, the second heat sink 500 abuts against the side of the chip assembly 300, limiting the movement of the chip assembly 300 along its width, further reducing the possibility of the chip assembly 300 becoming loose, and further improving the laser's stability.

[0068] Specifically, the chip assembly 300 mainly includes a laser diode, an optical waveguide, and a driving module. The laser diode generates laser light, the optical waveguide guides the laser beam, and the driving module controls the operation of the laser diode. The tops of the laser diode, the optical waveguide, and the driving module can all abut against the first heat sink 400, and the second heat sink 500 is disposed on both sides of the driving module.

[0069] In one embodiment, a second heat sink 500 is provided on both sides of the chip assembly 300 in the width direction.

[0070] Reference Figure 1 , Figure 2 and Figure 7In this embodiment of the present invention, two second heat sinks 500 are provided. The two second heat sinks 500 are arranged on both sides of the chip assembly 300 in the width direction, which improves the uniformity of heat dissipation on both sides of the chip assembly 300. Furthermore, the two second heat sinks 500 clamp the chip assembly 300 in the middle, which further reduces the possibility of the chip assembly 300 moving left and right in the width direction, thereby further improving the stability of the laser.

[0071] In one embodiment, the second heat sink 500 is provided with a second clearance groove 501 corresponding to the side of the chip assembly 300, and the inner wall of the second clearance groove 501 abuts against the side of the chip assembly 300.

[0072] Reference Figure 1 , Figure 2 , Figure 7 and Figure 8 In an embodiment of this utility model, the second heat sink 500 is provided with a second clearance groove 501 at one end inside the receiving cavity. The inner wall of the second clearance groove 501 abuts against the side of the chip assembly 300, so that the chip assembly 300 is clamped between the two second clearance grooves 501 on both sides, reducing the possibility of the chip assembly 300 becoming loose. On the other hand, by providing the second clearance groove 501, the area of ​​the second heat sink 500 is increased, and interference between the second heat sink 500 and the chip assembly 300 is avoided.

[0073] In one embodiment, the second heat sink 500 includes:

[0074] The second substrate 510 is disposed inside the receiving cavity;

[0075] Second fins 520, one end of which is fixed to the second substrate 510, and the other end of which extends toward the chip assembly 300 and abuts against the side of the chip assembly 300. Multiple second fins 520 are provided, and each second fin 520 has a second notch 521 at its end near the chip assembly 300. The second notches 521 of the multiple second fins 520 together form a second clearance groove 501; and

[0076] The second heat-conducting part 530 has one end connected to the second substrate 510 and the other end extending through the bottom wall of the housing 100 to the outside of the receiving cavity.

[0077] Reference Figure 8In an embodiment of this invention, the second heat sink 500 includes a second substrate 510, second fins 520, and a second heat-conducting portion 530. The second substrate 510 conducts heat from the second fins 520 to the second heat-conducting portion 530, extending vertically within the receiving cavity to provide stable support for the second fins 520 and improve the structural stability of the second heat sink 500. Multiple second fins 520 are arranged in an array. Each second fin 520 has a second notch 521 at one end near the chip assembly 300. The multiple second notches 521 of the multiple second fins 520 together form a second clearance groove 501, which increases the heat-conducting area of ​​each second fin 520 and avoids interference between the second fins 520 and the chip assembly 300. The second heat-conducting portion 530 conducts heat from the second substrate 510 to the external environment, achieving the final dissipation of heat from the chip assembly 300.

[0078] In one embodiment, the first fin 420 is perpendicular to the second fin 520.

[0079] Reference Figure 1 In the embodiments of this utility model, the first fin 420 on the first heat sink 400 is perpendicular to the second fin 520 on the second heat sink 500, which can make more effective use of the space in the receiving cavity. Furthermore, the first fin 420 and the second fin 520 provide support forces in different directions for the chip assembly 300, thereby improving the stability of the chip assembly 300 fixed in the receiving cavity.

[0080] In one embodiment, a second receiving groove 101 is provided on the outer side of the bottom of the housing 100, and the end of the second heat-conducting part 530 located outside the receiving cavity is bent and fixed in the second receiving groove 101.

[0081] Reference Figure 2 , Figure 8 and Figure 9 In this embodiment of the present invention, a second receiving groove 101 is provided on the outer side of the bottom of the housing 100. The end of the second heat-conducting part 530 located outside the receiving cavity is bent and fixed in the second receiving groove 101, which improves the firmness and stability of the second heat sink 500 fixed on the cover 200 and reduces the possibility of the second heat sink 500 loosening. In addition, bending the second heat-conducting part 530 and hiding it in the second receiving groove 101 avoids the second heat-conducting part 530 protruding from the surface of the housing 100, reduces the possibility of the second heat-conducting part 530 being damaged by impact, and helps to improve the structural compactness of the laser.

[0082] In summary, by setting the first heat sink 400, the vertical movement of the chip assembly 300 is prevented, and the heat of the chip assembly 300 is conducted from the top of the laser to the external environment. By setting the second heat sink 500, the horizontal movement of the chip assembly 300 is prevented, and the heat of the chip assembly 300 is conducted from the bottom of the laser to the external environment. This improves the thermal stability and structural stability of the laser and extends its service life.

[0083] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A packaging structure for a high-stability laser, characterized in that, include: The housing has a receiving cavity with an opening; The chip assembly is disposed inside the receiving cavity; A cover is fixed to the opening to close the receiving cavity; as well as A first heat sink is fixed to the cover. One end of the first heat sink is provided with a first clearance groove corresponding to the top of the chip assembly, and the inner wall of the first clearance groove abuts against the top of the chip assembly. The other end of the first heat sink extends through the cover to the outside of the receiving cavity.

2. The packaging structure of the high-stability laser as described in claim 1, characterized in that, The first heat sink includes: The first substrate is attached to the side of the cover facing the chip assembly; First fins, one end of which is fixed to the first substrate, and the other end of which extends toward the chip assembly and abuts against the top of the chip assembly. Multiple first fins are provided, and each first fin has a first notch at its end near the chip assembly. The first notches of the multiple first fins together form the first clearance groove. A first heat-conducting part, one end of which is connected to the first substrate, and the other end of which extends through the cover to the outside of the receiving cavity.

3. The packaging structure of the high-stability laser as described in claim 2, characterized in that, The cover has a first receiving groove on the side opposite to the receiving cavity, and the end of the first heat-conducting part located outside the receiving cavity is bent and fixed in the first receiving groove.

4. The packaging structure of the high-stability laser as described in claim 2, characterized in that, The first heat-conducting portion is provided on both sides of the first substrate in the width direction.

5. The packaging structure of the high-stability laser as described in claim 2, characterized in that, It also includes a second heat sink, one end of which abuts against the side of the chip assembly, and the other end of which extends through the bottom wall of the housing to the outside of the receiving cavity.

6. The packaging structure of the high-stability laser as described in claim 5, characterized in that, The chip assembly has the second heat sink on both sides in the width direction.

7. The packaging structure of the high-stability laser as described in claim 5, characterized in that, The second heat sink is provided with a second clearance groove corresponding to the side of the chip assembly, and the inner wall of the second clearance groove abuts against the side of the chip assembly.

8. The packaging structure of the high-stability laser as described in claim 7, characterized in that, The second heat sink includes: The second substrate is disposed inside the receiving cavity; The second fin has one end fixed to the second substrate and the other end extending towards the chip assembly and abutting against the side of the chip assembly. Multiple second fins are provided, and each second fin has a second notch at its end near the chip assembly. The second notches of the multiple second fins together form the second clearance groove. The second heat-conducting part has one end connected to the second substrate and the other end extending through the bottom wall of the housing to the outside of the receiving cavity.

9. The packaging structure of the high-stability laser as described in claim 8, characterized in that, The first fin is perpendicular to the second fin.

10. The packaging structure of the high-stability laser as described in claim 8, characterized in that, The bottom outer side of the housing is provided with a second receiving groove, and the end of the second heat-conducting part located outside the receiving cavity is bent and fixed in the second receiving groove.

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