High-power PCB heat dissipation structure

Abstract

The utility model provides a high-power PCB heat dissipation structure, which comprises a heat dissipation frame arranged in a polygonal structure, the inner side wall of the heat dissipation frame is provided with a plurality of heat dissipation fins, the outer side wall of the heat dissipation frame is provided with a heat dissipation plane which can be attached to a PCB, and the heat dissipation structure can increase the heat dissipation effect and save the installation space at the same time.

Description

Technical Field

[0001] This utility model relates to the field of PCB board heat dissipation technology, specifically to a heat dissipation structure for a high-power PCB board. Background Technology

[0002] The function of a router is to distribute network signals to multiple devices and enable interconnection. Multiple PCBs need to be placed inside the router, and heat sinks are required to ensure that the components on the PCBs can operate normally. In the prior art, the invention patent with patent publication number CN1503989A discloses a heat sink, which includes a substrate and fins disposed on the substrate. However, this structure requires a lot of space. Since the space inside the router is limited, multiple PCBs and heat sinks will occupy a lot of space. Moreover, some high-power PCBs generate more heat, and ordinary heat sinks are not effective in heat dissipation. Utility Model Content

[0003] Therefore, the technical problem to be solved by this utility model is to overcome the shortcomings of the limited space inside the router in the prior art, where multiple PCB boards and heat sinks occupy a lot of space, thereby providing a multi-faceted heat sink that can improve the heat dissipation effect while saving the space occupied by the heat sink.

[0004] Therefore, this utility model provides a high-power PCB board heat dissipation structure, including a heat dissipation frame with a polygonal structure, a plurality of heat dissipation fins on the inner side wall of the heat dissipation frame, and a heat dissipation plane that can be attached to the PCB board on the outer side wall of the heat dissipation frame.

[0005] Furthermore: multiple positioning posts are fixed on the heat dissipation plane, and positioning holes are provided in the positioning posts. The PCB board can be inserted into the positioning posts, and external screws can be screwed into the positioning holes for fixation.

[0006] Furthermore, a heat dissipation plate is also provided on the heat dissipation plane, and the PCB board is disposed between the heat dissipation plate and the heat dissipation plane.

[0007] Furthermore: the heat sink is provided with an extension ear, the extension ear is provided with a round hole, a connecting post is inserted into the round hole, the positioning post is provided with a first extension ring, the connecting post is provided with a second extension ring, the PCB board is provided with a through hole, and a positioning cavity is formed between the first extension ring and the second extension ring for the through hole of the PCB board to be inserted.

[0008] Furthermore, the outer wall of the positioning post is provided with connecting teeth that abut against the inner wall of the extension ear.

[0009] Furthermore: the heat sink is a stamped heat sink or an extruded aluminum heat sink.

[0010] Furthermore, the lower end face of the heat sink is provided with an extension piece that can fit with the PCB board chip.

[0011] The technical solution of this utility model has the following advantages:

[0012] 1. This utility model provides a high-power PCB board heat dissipation structure. The heat dissipation frame has a quadrilateral structure, which can be better adapted for installation in a wireless router. During installation, the PCB board is glued to the outer side of the heat dissipation frame with special double-sided adhesive to fix the PCB board. Through the setting of the heat dissipation frame and the heat dissipation plane, the position of the PCB board can be more reasonably distributed, which can improve the heat dissipation effect while saving space. The heat dissipation frame is set as a quadrilateral structure, which has good support strength and can effectively prevent deformation during use. Attached Figure Description

[0013] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation structure;

[0015] Figure 2 This is another overall structural diagram of the heat dissipation structure;

[0016] Figure 3 This is another overall structural diagram of the heat dissipation structure;

[0017] Figure 4 This is another overall structural diagram of the heat dissipation structure;

[0018] Figure 5 This is a cross-sectional schematic diagram of the heat dissipation structure.

[0019] Figure 6 for Figure 5 Enlarged view of section A in the middle;

[0020] Figure 7 A schematic diagram of a heat dissipation structure with part of the heat sink removed;

[0021] Figure 8 This is a schematic diagram of the back structure of the heat sink.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Heat dissipation frame; 11. Heat dissipation plane; 2. Heat sink; 3. Positioning post; 31. Positioning hole; 32. First extension ring; 4. Heat sink plate; 41. Extension ear; 42. Round hole; 5. Connecting post; 51. Second extension ring; 52. Connecting tooth; 6. Positioning cavity; 7. Extension piece. Detailed Implementation

[0024] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0028] Example

[0029] This embodiment provides a high-power PCB board heat dissipation structure, including a heat dissipation frame 1 with a polygonal structure, a plurality of heat dissipation fins 2 on the inner sidewall of the heat dissipation frame 1, and a heat dissipation plane 11 that can be attached to the PCB board on the outer sidewall of the heat dissipation frame 1.

[0030] The specific improvements mentioned above are as follows: Figures 1-3As shown, compared to existing technologies, the heat dissipation frame 1 has a quadrilateral structure, which can better fit and be installed inside a wireless router. During installation, the PCB board is glued to the outer surface of the heat dissipation frame 1 with special double-sided adhesive to fix the PCB board. Through the setting of the heat dissipation frame 1 and the heat dissipation plane 11, the position of the PCB board can be more reasonably distributed, which can improve the heat dissipation effect while saving space. The heat dissipation frame 1 is set as a quadrilateral structure, which has good support strength and can effectively prevent deformation during use. The heat dissipation frame 1 in this embodiment can be used in Huawei Router Q6 and similar products.

[0031] Based on the above embodiments: a plurality of positioning posts 3 are fixed on the heat dissipation plane 11, and positioning holes 31 are provided in the positioning posts 3. The PCB board can be inserted into the positioning posts 3, and external screws can be screwed into the positioning holes 31 for fixation.

[0032] Based on the above embodiments: a heat dissipation plate 4 is further provided on the heat dissipation plane 11, and the PCB board is disposed between the heat dissipation plate 4 and the heat dissipation plane 11.

[0033] Based on the above embodiments: the heat sink 4 is provided with an extension ear 41, the extension ear 41 is provided with a round hole 42, the connecting post 5 is inserted into the round hole 42, the positioning post 3 is provided with a first extension ring 32, the connecting post 5 is provided with a second extension ring 51, the PCB board is provided with a through hole, and the first extension ring and the second extension ring 51 form a positioning cavity 6 for the through hole of the PCB board to be inserted.

[0034] The specific improvements mentioned above are as follows: Figures 4-6 As shown, multiple positioning posts 3 are provided on the heat dissipation plane 11, and positioning holes 31 are provided in the positioning posts 3. During the installation process, the positioning posts 3 are inserted into the round holes 42 on the PCB board, and then the screws are screwed into the positioning holes 31 to fix the PCB board.

[0035] For some high-power PCBs, the heat sink 2 on the heat dissipation frame 1 cannot meet the heat dissipation requirements. Therefore, a heat sink 4 can be added to the side of the PCB facing away from the heat dissipation plane 11. During the installation process, the first step is to rivet the positioning post 3 to the heat dissipation plane 11. The second step is to rivet the connecting post 5 to the heat sink 4. The third step is to install the PCB between the heat sink 4 and the heat dissipation plane 11, that is, to install the PCB between the positioning cavity 6 of the second extension ring 51 of the first extension ring 32. Finally, the entire fixing nail is inserted into the positioning post 3 and the connecting post 5 to complete the fixing of the heat sink 4 and the heat dissipation frame 1.

[0036] Based on the above embodiments: the outer wall of the positioning post 3 is provided with connecting teeth 52 that abut against the inner wall of the extension ear 41.

[0037] The specific improvements mentioned above are as follows: Figure 7 and Figure 8 As shown, in order to ensure that the positioning post 3 can be fixedly connected to the heat sink 4, the positioning post 3 is provided with a connecting tooth 52. The connecting tooth 52 is set along the circumference of the positioning post 3. During installation, the connecting tooth 52 is driven into the circular hole of the extension ear 41 and is interference-fitted with the inner sidewall of the circular hole, so that the positioning post 3 and the heat sink 4 can be effectively connected.

[0038] Based on the above embodiments: the heat sink 4 is a stamped heat sink or an extruded aluminum heat sink.

[0039] The specific improvements mentioned above are as follows: Figure 2 and Figure 4 As shown, the heat sink 4 can be selected to be either a stamped heat sink 4 or an aluminum extruded heat sink 4 depending on the power of the PCB board being installed. For some PCB boards with lower power, a stamped heat sink 4 can be selected, while for some PCB boards with higher power, an aluminum extruded heat sink 4 can be selected.

[0040] Based on the above embodiments: the lower end face of the heat sink 4 is provided with an extension piece 7 that can be attached to the PCB board chip.

[0041] The specific improvements mentioned above are as follows: Figure 8 As shown, by setting the extension piece 7, the contact area between the heat sink 4 and the PCB board can be increased, effectively improving the heat dissipation capacity.

[0042] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A high-power PCB board heat dissipation structure, characterized in that: It includes a heat dissipation frame (1) with a polygonal structure, the inner wall of the heat dissipation frame (1) is provided with a plurality of heat dissipation fins (2), and the outer wall of the heat dissipation frame (1) is provided with a heat dissipation plane (11) that can be attached to the PCB board.

2. The high-power PCB board heat dissipation structure according to claim 1, characterized in that: Multiple positioning posts (3) are fixed on the heat dissipation plane (11). Positioning holes (31) are provided in the positioning posts (3). The PCB board can be inserted into the positioning posts (3). External screws can be screwed into the positioning holes (31) for fixation.

3. The high-power PCB board heat dissipation structure according to claim 2, characterized in that: A heat dissipation plate (4) is also provided on the heat dissipation plane (11), and the PCB board is disposed between the heat dissipation plate (4) and the heat dissipation plane (11).

4. The high-power PCB board heat dissipation structure according to claim 3, characterized in that: The heat sink (4) is provided with an extension ear (41), and a round hole (42) is provided at the extension ear (41). A connecting post (5) is inserted into the round hole (42). A first extension ring (32) is provided on the positioning post (3), and a second extension ring (51) is provided on the connecting post (5). A through hole is provided on the PCB board. A positioning cavity (6) for the through hole of the PCB board is formed between the first extension ring and the second extension ring (51).

5. The high-power PCB board heat dissipation structure according to claim 3, characterized in that: The outer side wall of the positioning post (3) is provided with connecting teeth (52) that abut against the inner side wall of the extension ear (41).

6. A high-power PCB board heat dissipation structure according to any one of claims 3-5, characterized in that: The heat sink (4) is a stamped heat sink or an aluminum extrusion heat sink.

7. A high-power PCB board heat dissipation structure according to claim 6, characterized in that: The lower end face of the heat sink (4) is provided with an extension piece (7) that can be attached to the PCB chip.

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