Intelligent sound equipment mainboard structure based on circuit layered layout

Abstract

The utility model discloses an intelligent sound equipment mainboard structure based on circuit layered layout, comprising a sound equipment mainboard structure comprising a high-frequency board, a low-frequency board and a composite shielding board, the high-frequency board is arranged at the upper end of the low-frequency board, and the composite shielding board is arranged between the high-frequency board and the low-frequency board; the assembling assemblies are arranged on the two sides of the high-frequency board and the low-frequency board and comprise clamping grooves formed in the two sides of the high-frequency board, moving grooves are formed in the two sides of the low-frequency board, auxiliary grooves are formed in the moving grooves, connecting rods are connected to the interiors of the moving grooves in a matched mode, and supporting plates are connected to the ends of the connecting rods; the other end of the connecting rod is connected with a connecting elbow rod, and the end part of the connecting elbow rod is connected with a clamping block, so that the mainboard can be subjected to vertical layered design, the transverse size of the mainboard is reduced, signal shielding between a high-frequency board and a low-frequency board is carried out through a composite shielding board, high-frequency radiation is absorbed, and a plane space is compressed; therefore, the problem of signal crosstalk is reduced.

Description

Technical Field

[0001] This utility model relates to the field of audio motherboard technology, and in particular to a smart audio motherboard structure based on a layered circuit layout. Background Technology

[0002] The motherboard of a smart speaker is the core control module, typically integrating a high-performance processor (such as an ARM architecture chip), memory, storage units, and wireless communication modules (Wi-Fi / Bluetooth), supporting voice interaction, network connectivity, and smart home control functions. It has a built-in microphone array, and some motherboards are also equipped with an AI acceleration unit to enhance localized semantic processing capabilities.

[0003] As smart speaker devices become increasingly integrated and multifunctional, their motherboard designs face multiple challenges, including electromagnetic compatibility (EMC), space utilization, and maintainability. In traditional PCB layouts, the motherboard structure is large, occupies a large area, and cannot be layered. At the same time, coplanar routing of high-frequency and low-frequency modules can easily cause signal crosstalk, leading to audio distortion or communication interruption. Utility Model Content

[0004] This invention provides a smart speaker motherboard structure based on a layered circuit layout. It can vertically layer the motherboard, reduce its horizontal volume, and shield the high-frequency board and low-frequency board through a composite shielding plate to absorb high-frequency radiation and compress the planar space, thereby reducing signal crosstalk.

[0005] This utility model provides a smart speaker motherboard structure based on a layered circuit layout, including:

[0006] The speaker mainboard structure includes a high-frequency board, a low-frequency board, and a composite shielding board. The high-frequency board is located at the upper part of the low-frequency board, and the composite shielding board is located in the middle of the high-frequency board and the low-frequency board.

[0007] The assembly components are arranged on both sides of the high-frequency board and the low-frequency board, including slots on both sides of the high-frequency board, and movable slots on both sides of the low-frequency board. An auxiliary slot is provided inside the movable slot. A connecting rod is adapted to be connected inside the movable slot, and a support plate is connected to the end of the connecting rod. A connecting elbow rod is connected to the other end of the connecting rod, and a locking block is connected to the end of the connecting elbow rod.

[0008] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, the bottom of the high-frequency board is provided with four sets of positioning grooves, and the positioning grooves are cylindrical structures.

[0009] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, a number of neodymium iron boron magnet blocks are arranged in the middle of the high frequency board, and the neodymium iron boron magnet blocks are arranged in an array. The middle of the high frequency board is provided with mounting grooves that are adapted to the neodymium iron boron magnet blocks.

[0010] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, a number of spring pins are arranged at the bottom of the high-frequency board near the inner ring of the neodymium iron boron magnet block, and the spring pins are distributed in an array.

[0011] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, the length of the spring pin is 2mm, and the spring pin retracts by 0.8mm when pressed, and the outer side of the spring pin is coated with a gold plating layer.

[0012] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, the upper end of the low frequency board is connected to a soft iron magnetic sheet corresponding to the neodymium iron boron magnet block, and the diameter of the soft iron magnetic sheet is larger than the diameter of the neodymium iron boron magnet block.

[0013] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, the upper end of the low frequency board is provided with gold-plated pads that are in contact with the spring pins, and the diameter of the gold-plated pads is 1.2mm.

[0014] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, the composite shielding plate is a double layer, with an inner layer being an aluminum substrate and an outer layer being an iron oxide layer. The upper end of the composite shielding plate is fixedly connected with a positioning post that is compatible with the positioning groove, and the positioning post is a cylindrical structure. The middle part of the composite shielding plate is provided with honeycomb holes for holding spring pins, and the number of honeycomb holes is equal to the number of spring pins.

[0015] In the intelligent speaker motherboard structure based on circuit layer layout according to one embodiment of the present invention, a compression spring is connected between the support plate and the auxiliary slot, and the compression spring wraps around the outside of the connecting rod, and a rounded corner is provided on one side edge of the card block.

[0016] The technical solution provided in this application embodiment may include the following beneficial effects: This application designs a smart speaker motherboard structure based on circuit layer layout, which can vertically layer the motherboard and divide the speaker motherboard structure into a high-frequency board and a low-frequency board. The positioning is achieved by assembling components, which facilitates later disassembly and maintenance. At the same time, the high-frequency board and the low-frequency board are shielded by a composite shielding plate to absorb high-frequency radiation and compress the planar space, thereby reducing the problem of signal crosstalk.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a smart speaker motherboard structure based on a circuit layered layout provided in one embodiment of this application;

[0020] Figure 2 yes Figure 1 A partial structural diagram of the motherboard structure of a smart speaker based on a layered circuit layout;

[0021] Figure 3 yes Figure 2 Another perspective view;

[0022] Figure 4 yes Figure 1 A front view of the motherboard structure of a smart speaker based on a circuit-layered layout;

[0023] Figure 5 yes Figure 4 A partial side sectional view of AA in the motherboard structure of a smart speaker based on a circuit-layered layout.

[0024] Figure 6 yes Figure 1 A partial structural diagram of the components assembled in the motherboard structure of a smart speaker based on a layered circuit layout. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0028] like Figures 1 to 6 As shown, this application provides a smart speaker motherboard structure based on a circuit layered layout, including: a speaker motherboard structure 100, including a high-frequency board 10, a low-frequency board 20, a composite shielding board 30, and an assembly component 40. The high-frequency board 10 is located at the upper end of the low-frequency board 20, and the composite shielding board 30 is located in the middle of the high-frequency board 10 and the low-frequency board 20; the assembly component 40 is disposed on both sides of the high-frequency board 10 and the low-frequency board 20, including slots 41 formed on both sides of the high-frequency board 10, moving slots 42 formed on both sides of the low-frequency board 20, and auxiliary slots 43 formed inside the moving slots 42. A connecting rod 44 is adapted to be connected inside the moving slots 42, and a support plate 45 is connected to the end of the connecting rod 44. A connecting elbow rod 47 is connected to the other end of the connecting rod 44, and a locking block 48 is connected to the end of the connecting elbow rod 47.

[0029] After adopting the above technical solution, since the composite shielding plate 30 is located in the middle of the high-frequency plate 10 and the low-frequency plate 20, during the assembly process of the high-frequency plate 10 and the low-frequency plate 20, the composite shielding plate 30 needs to be connected to the high-frequency plate 10 first, then the low-frequency plate 20 needs to be connected to the composite shielding plate 30, and finally the high-frequency plate 10 and the low-frequency plate 20 are positioned by the assembly component 40.

[0030] It should be noted that by vertically distributing the speaker motherboard into a high-frequency board 10 and a low-frequency board 20, space utilization can be optimized, making it suitable for small smart speakers. At the same time, the high-frequency board 10 and the low-frequency board 20 are positioned by the assembly component 40, allowing for subsequent disassembly and maintenance of the high-frequency board 10 and the low-frequency board 20, saving time and effort. Then, a composite shielding plate 30 is placed in the middle of the high-frequency board 10 and the low-frequency board 20, which can reflect high-frequency electromagnetic waves and suppress radio frequency module radiation leakage. Meanwhile, the ferrite layer absorbs low-frequency magnetic field interference, reducing audio signal crosstalk to <0.1%.

[0031] For example, when the high-frequency board 10 and the low-frequency board 20 need to be assembled, the composite shielding plate 30 is first connected to the high-frequency board 10. The positioning post 301 on the top of the composite shielding plate 30 is inserted into the middle of the positioning groove 101 at the bottom of the high-frequency board 10, while the honeycomb hole 302 slides along the outside of the spring pin 103, thereby connecting the high-frequency board 10 and the composite shielding plate 30. Then, the low-frequency board 20 is clipped to the bottom of the composite shielding plate 30. The soft iron magnetic sheet 201 and the neodymium iron boron magnet block 102 are attracted to each other, so that the low-frequency board 20 is attracted to the bottom of the composite shielding plate 30 for quick positioning. When the low-frequency board 20 is close to the composite shielding plate 30, the magnetic force automatically attracts and aligns it, and the spring pin 103 is then engaged. 3. After compression, it contacts the gold-plated solder pad 202. Then, pull the connecting rods 44 on both sides of the low-frequency board 20, so that the connecting rods 44 slide along the inside of the moving groove 42. At the same time, it drives the support plate 45 to move along the inside of the auxiliary groove 43, further compressing the compression spring 46. Under the connecting action of the connecting elbow rod 47, it moves outward, making the slot 41 and the block 48 horizontally aligned. Release the connecting rod 44. Under the elastic potential energy of the compression spring 46, the block 48 automatically engages with the inside of the slot 41, thereby positioning the high-frequency board 10 and the low-frequency board 20. Disassembly can be performed by reversing the above steps to disassemble the high-frequency board 10 and the low-frequency board 20, which is convenient for later maintenance and repair.

[0032] In one optional embodiment, the bottom of the high-frequency board 10 is provided with four sets of positioning grooves 101, and the positioning grooves 101 are cylindrical structures, which facilitates the rapid positioning of the subsequent composite shielding plate 30. The positioning pins 301 can be quickly inserted into the interior of the positioning grooves 101 to position the composite shielding plate 30 and the high-frequency board 10.

[0033] In one optional embodiment, a plurality of neodymium iron boron magnet blocks 102 are provided in the middle of the high-frequency plate 10, and the neodymium iron boron magnet blocks 102 are arranged in an array. The middle of the high-frequency plate 10 is provided with mounting grooves that are compatible with the neodymium iron boron magnet blocks 102, so as to facilitate the installation and fixing of the neodymium iron boron magnet blocks 102. The circular array of neodymium iron boron magnet blocks 102 can provide an adsorption base for the subsequent low-frequency plate 20, so that the high-frequency plate 10 and the low-frequency plate 20 can be stably adsorbed without misalignment.

[0034] In an optional embodiment, a number of spring pins 103 are provided on the bottom of the high-frequency board 10 near the inner ring of the neodymium iron boron magnet block 102, and the spring pins 103 are arranged in an array to facilitate the conduction between the high-frequency board 10 and the low-frequency board 20 for the transmission of electrical signals.

[0035] In one optional embodiment, the spring pin 103 is 2mm long and retracts 0.8mm when pressed. The outer side of the spring pin 103 is coated with a gold-plated layer. The 0.8mm retraction during the pressing process is just enough to fit the composite shielding plate 30 and the low-frequency board 20 together, while facilitating the connection and positioning of the subsequent locking block 48. The gold-plated layer of the spring pin 103 can effectively prevent rust. It is energized when in contact with the gold-plated pad 202 and disconnected when separated.

[0036] In an optional embodiment, the upper end of the low-frequency plate 20 is connected to a soft iron magnetic sheet 201 corresponding to the neodymium iron boron magnet block 102, and the diameter of the soft iron magnetic sheet 201 is larger than the diameter of the neodymium iron boron magnet block 102, which facilitates the low-frequency plate 20 to quickly adsorb and position with the high-frequency plate 10, thereby increasing the adsorption area.

[0037] In an optional embodiment, the upper end of the low-frequency board 20 is provided with gold-plated pads 202 that contact the spring pins 103, and the diameter of the gold-plated pads 202 is 1.2mm to facilitate contact with the spring pins 103. When the spring pins 103 contact the gold-plated pads 202, the bottom of the spring pins 103 is retracted, so that the electrical signal is conducted between the spring pins 103 and the gold-plated pads 202.

[0038] In one optional embodiment, the composite shielding plate 30 has two layers, with the inner layer being an aluminum substrate and the outer layer being an iron oxide layer. The composite shielding plate 30 can reflect high-frequency electromagnetic waves, suppress radiation leakage from the radio frequency module, and absorb low-frequency magnetic field interference to reduce audio signal crosstalk. The upper end of the composite shielding plate 30 is fixedly connected to a positioning post 301 that is compatible with the positioning groove 101. The positioning post 301 is a cylindrical structure made of nylon, which is used to limit the composite shielding plate 30 from offset in the XY direction. The middle part of the composite shielding plate 30 has a honeycomb hole 302 for holding the spring pin 103, and the number of honeycomb holes 302 is equal to the number of spring pins 103, so that the spring pin 103 can be inserted along the inside of the honeycomb hole 302, which will facilitate the contact between the spring pin 103 and the gold-plated pad 202 at the lower end.

[0039] In an optional embodiment, a compression spring 46 is connected between the support plate 45 and the auxiliary groove 43, and the compression spring 46 wraps around the outside of the connecting rod 44. The connecting rod 44 has an "L" shaped structure, and the connecting rod 44 and the connecting elbow rod 47 are an integral structure. A rounded corner is provided on one side edge of the locking block 48.

[0040] It should be noted that, through the setting of the compression spring 46, when the connecting rod 44 moves out along the inside of the moving groove 42, the support plate 45 drives the compression spring 46 to compress. When the connecting rod 44 is released, the elastic potential energy of the compression spring 46 causes the compression spring 46 to reset, thereby driving the support plate 45 and the connecting rod 44 to perform a reset operation, which further facilitates the reset of the locking block 48, so that the locking block 48 can be inserted into the corresponding locking slot 41, thereby fixing the high frequency board 10 and the low frequency board 20. The structure is simple, the operation is convenient, and the installation is time-saving and labor-saving.

[0041] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0044] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0045] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A smart speaker motherboard structure based on a layered circuit layout, characterized in that, include: The speaker mainboard structure includes a high-frequency board, a low-frequency board, and a composite shielding board. The high-frequency board is located at the upper part of the low-frequency board, and the composite shielding board is located in the middle of the high-frequency board and the low-frequency board. The assembly components are arranged on both sides of the high-frequency board and the low-frequency board, including slots on both sides of the high-frequency board, and movable slots on both sides of the low-frequency board. An auxiliary slot is provided inside the movable slot. A connecting rod is adapted to be connected inside the movable slot, and a support plate is connected to the end of the connecting rod. A connecting elbow rod is connected to the other end of the connecting rod, and a locking block is connected to the end of the connecting elbow rod.

2. The intelligent speaker motherboard structure based on circuit layered layout according to claim 1, characterized in that, The bottom of the high-frequency board has four sets of positioning grooves, and the positioning grooves are cylindrical.

3. The intelligent speaker motherboard structure based on circuit layered layout according to claim 2, characterized in that, The high-frequency board has several sets of neodymium iron boron magnets arranged in an array in the middle, and the high-frequency board has mounting grooves in the middle that are adapted to the neodymium iron boron magnets.

4. The intelligent speaker motherboard structure based on circuit layered layout according to claim 3, characterized in that, The bottom of the high-frequency board is provided with several sets of spring pins near the inner ring of the neodymium iron boron magnet block, and the spring pins are distributed in an array.

5. The intelligent speaker motherboard structure based on circuit layered layout according to claim 4, characterized in that, The spring needle is 2mm long and retracts 0.8mm when pressed. The outer side of the spring needle is coated with a gold plating layer.

6. The intelligent speaker motherboard structure based on circuit layer layout according to claim 1, characterized in that, The upper end of the low-frequency board is connected to a soft iron magnetic sheet corresponding to the neodymium iron boron magnet block, and the diameter of the soft iron magnetic sheet is larger than the diameter of the neodymium iron boron magnet block.

7. The intelligent speaker motherboard structure based on circuit layered layout according to claim 1, characterized in that, The upper end of the low-frequency board has gold-plated pads that contact the spring pins, and the diameter of the gold-plated pads is 1.2 mm.

8. The intelligent speaker motherboard structure based on circuit layer layout according to claim 4, characterized in that, The composite shielding plate has two layers, an inner layer of aluminum substrate and an outer layer of iron oxide layer. The upper end of the composite shielding plate is fixedly connected with a positioning post that matches the positioning groove. The positioning post has a cylindrical structure. The middle part of the composite shielding plate has honeycomb holes for holding spring needles, and the number of honeycomb holes is equal to the number of spring needles.

9. The intelligent speaker motherboard structure based on circuit layer layout according to claim 1, characterized in that, A compression spring is connected between the support plate and the auxiliary groove, and the compression spring wraps around the outside of the connecting rod. A rounded corner is provided on one side edge of the locking block.

Images