Heating structure applied to immunohistochemical staining instrument

Abstract

The utility model discloses a heating structure applied to an immunohistochemical staining instrument. The heating structure comprises an aluminum substrate, a heating film, a fuse and a temperature sensor, the heating film is connected to the bottom of the aluminum substrate, and the fuse and the temperature sensor are connected to the heating film; wherein epoxy resin glue is coated outside a welding spot of the fuse and the heating film, and epoxy resin glue is coated outside a welding spot of the temperature sensor and the heating film. According to the heating structure applied to the immunohistochemical staining instrument, the fuse and the temperature sensor are arranged in the mounting groove in the aluminum substrate in the sinking manner, the silica gel is filled in the mounting groove, and the epoxy resin adhesive is coated outside the fuse, the temperature sensor and the heating film connecting welding spot, so that the sealing performance is improved, and the heating structure is prevented from being corroded by an overflowing reagent; the service life is prolonged and the temperature fluctuation is reduced.

Description

Technical Field

[0001] This utility model relates to the field of immunohistochemistry equipment technology, and in particular to a heating structure used in immunohistochemistry staining instruments. Background Technology

[0002] In immunohistochemical staining equipment, a heating structure is typically required to heat the glass slide. This heating structure generally includes a substrate and a heating film connected to the substrate. The heating film heats the substrate, which then transfers the heat to the glass slide. However, the slide contains the detection liquid and reagents. During the immunohistochemical reaction, reagents may leak out. This leaked reagent can corrode the fuse or temperature sensor connected to the heating film, causing device damage and resulting in poor corrosion resistance of the heating structure, large temperature fluctuations, and other adverse effects. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heating structure for use in immunohistochemical staining instruments, so as to solve the technical problem of easy corrosion of existing slide heating mechanisms.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] An embodiment of this utility model provides a heating structure for use in an immunohistochemical staining instrument, which includes: an aluminum substrate, a heating film, a fuse, and a temperature sensor;

[0006] The heating film is connected to the bottom of the aluminum substrate, and the fuse and the temperature sensor are connected to the heating film;

[0007] The solder joints between the fuse and the heating film are coated with epoxy resin, and the solder joints between the temperature sensor and the heating film are also coated with epoxy resin.

[0008] The aluminum substrate has a groove at its bottom, and a first mounting groove and a second mounting groove are recessed at the bottom of the groove. The heating film is disposed in the groove, the fuse is recessed in the first mounting groove, and the temperature sensor is recessed in the second mounting groove.

[0009] The solder joint between the fuse and the heating film is located on the film surface of the heating film on the side away from the aluminum substrate.

[0010] The first and second mounting slots are also filled with silicone.

[0011] The first mounting groove is located near the end of the aluminum substrate, and the second mounting groove is located in the middle of the aluminum substrate.

[0012] The epoxy resin adhesive is DP460NS epoxy structural adhesive.

[0013] The silicone is 1530C silicone and Mishima SD916R organic thermally conductive silicone.

[0014] The aluminum substrate is made of aluminum alloy.

[0015] The width of the first mounting groove is 1-3 mm wider than the fuse, and the depth of the first mounting groove is 0.5-2 mm greater than the height of the fuse.

[0016] The heating film is a thick-film printed heating resistor, and the operating temperature range of the thick-film printed heating resistor is room temperature - 150℃.

[0017] The present invention relates to a heating structure for an immunohistochemical staining instrument. It features a fuse and a temperature sensor embedded in a mounting groove within an aluminum substrate, with the groove filled with silicone. Epoxy resin is then applied to the solder joints connecting the fuse, temperature sensor, and heating film to improve sealing, thereby preventing corrosion from spilled reagents, extending service life, and reducing temperature fluctuations.

[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0019] Figures 1 to 3 These are schematic diagrams of the overall structure of the heating structure applied to an immunohistochemical staining instrument from different perspectives, representing embodiments of this utility model.

[0020] Figure 4 This is an exploded view of the heating structure of an immunohistochemical staining instrument according to an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the aluminum substrate portion of the heating structure applied to an immunohistochemical staining instrument according to an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram of the planar structure of the heating structure applied to an immunohistochemical staining instrument according to an embodiment of the present invention.

[0023] Figure 7 for Figure 6 The sectional view shown is along line AA.

[0024] Figure 8 for Figure 6 The BB-directed sectional view is shown.

[0025] Figure 9 for Figure 6 The cross-sectional view shown is along the CC direction.

[0026] Figure 10 and Figure 11 for Figure 9 The diagram shows a partially enlarged structural schematic.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100 Heating structure for immunohistochemical staining instrument, 1 Aluminum substrate, 2 Heating film, 3 Fuse, 4 Temperature sensor, 5 Silicone, 6 Epoxy resin, 7 Silicone, 8 Epoxy resin, 10 Groove, 11 Top surface, 12 Liquid collection structure, 13 Drain hole, 14 Manifold, 21 Plug interface, 101 First mounting slot, 102 Second mounting slot. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] In immunohistochemical staining equipment, a heating mechanism is typically required to heat the glass slide. This heating mechanism generally includes a substrate and a heating film connected to the substrate. The heating film heats the substrate, which then transfers the heat to the glass slide. However, the glass slide contains detection liquids and reagents. During the immunohistochemical reaction, reagents may leak out. This leaked reagent can corrode the fuse or temperature sensor connected to the heating film, causing damage to the device and resulting in poor corrosion resistance and large temperature fluctuations in the heating mechanism. Therefore, based on the above requirements, this embodiment provides a heating structure 100 for use in an immunohistochemical staining instrument.

[0037] Please see Figures 1 to 11 This embodiment discloses a heating structure 100 for use in an immunohistochemical staining instrument, which includes: an aluminum substrate 1, a heating film 2, a fuse 3, and a temperature sensor 4.

[0038] The heating film 2 is connected to the bottom of the aluminum substrate 1, and the fuse 3 and the temperature sensor 4 are connected to the heating film 2;

[0039] The solder joints between the fuse 3 and the heating film 2 are coated with epoxy resin, and the solder joints between the temperature sensor 4 and the heating film 2 are also coated with epoxy resin.

[0040] The heating structure 100 of this embodiment, applied to an immunohistochemical staining instrument, uses epoxy resin to encapsulate the solder joints between the fuse 3, temperature sensor 4, and heating film 2. The epoxy resin effectively seals the solder joints, preventing external corrosive liquids from intruding and causing corrosion and oxidation, which could lead to power outages or poor contact. Simultaneously, the epoxy resin also helps to fix the solder joints, further improving the reliability of the connection.

[0041] Please refer to it again. Figure 5 The aluminum substrate 1 has a groove 10 at its bottom. A first mounting groove 101 and a second mounting groove 102 are recessed at the bottom of the groove 10. The heating film 2 is disposed within the groove 10, the fuse 3 is recessed within the first mounting groove 101, and the temperature sensor 4 is recessed within the second mounting groove 102. In this embodiment, the size of the heating film 2 is approximately equal to that of the groove 10. When the heating film 2 is disposed within the groove 10, it covers the entire bottom surface of the groove 10. The fuse 3 and the temperature sensor 4, connected to solder points on the surface of the heating film 2, are disposed within the first mounting groove 101 and the second mounting groove 102, allowing the surface of the heating film 2 to completely adhere to the bottom surface of the groove 10, thereby improving its heat conduction efficiency.

[0042] The first mounting groove 101 and the second mounting groove 102 are further filled with silicone. A fuse 3 is placed in the first mounting groove 101, and a temperature sensor 4 is placed in the second mounting groove 102. The silicone filling of both grooves allows the fuse 3 and temperature sensor 4 to be stably and reliably seated within the grooves, while also improving the sealing of the grooves and preventing external liquids from damaging them. In this embodiment, the epoxy resin is a high-temperature and corrosion-resistant epoxy resin, and the silicone is a chemically resistant silicone.

[0043] Please refer to it again. Figure 4The solder joint between the fuse 3 and the heating film 2 is located on the film surface of the heating film 2 on the side away from the aluminum substrate 1. The solder joint between the fuse 3 and the heating film 2 is located on the side of the heating film 2 away from the aluminum substrate 1, that is, on the side opposite to the top surface 11 of the aluminum substrate 1, rather than on the side of the heating film 2 that is attached to the aluminum substrate 1. This solder joint arrangement can minimize the risk of liquids such as reagents spilling from the slide and damaging the fuse 3.

[0044] The first mounting groove 101 is located near the end of the aluminum substrate 1, and the second mounting groove 102 is located in the middle of the aluminum substrate 1. The fuse 3 is positioned away from the center of the heating film 2 to reduce the adverse effects of the heating film 2 on the fuse 3, while the temperature sensor 4 is positioned in the center to more accurately detect the temperature of the aluminum substrate 1.

[0045] In this embodiment, the epoxy resin adhesive is DP460NS epoxy structural adhesive. The silicone adhesive is 1530C adhesive and Mishima SD916R organic thermally conductive silicone adhesive. The aluminum substrate 1 is made of aluminum alloy.

[0046] Please refer to it again. Figure 4 , Figure 6 , Figure 7 , Figure 9 and Figure 10 The fuse 3 is externally filled with epoxy resin 6, and one end of the heating film 2 is wrapped in the groove 10 by silicone 5, which is located in the first mounting groove 101.

[0047] The temperature sensor 4 is disposed within the second mounting groove 102, which is pre-filled with silicone 7. Epoxy resin adhesive 8 is used to cover the solder joints between the pins of the temperature sensor 4 and the heating film 2, thus forming a double seal on the outside of the temperature sensor 4. This structurally minimizes the risk of corrosion damage to the temperature sensor 4. Similarly, the solder joints between the temperature sensor 4 and the heating film 2 are located on the opposite side of the heating film 2, away from the top surface 11 of the aluminum substrate 1. The pins of the temperature sensor 4 pass through the heating film 2 and are soldered to the solder joints.

[0048] The width of the first mounting groove 101 is 1-3 mm wider than the fuse 3, and the depth of the first mounting groove 101 is 0.5-2 mm greater than the height of the fuse 3.

[0049] In this embodiment, the heating film 2 is a thick-film printed heating resistor, and the operating temperature range of the thick-film printed heating resistor is room temperature (e.g., 25°C) to 150°C. The heating film 2 is led out of the heating film through flexible conductive wires and signal lines, and is electrically connected to an external power supply and signal processing unit through the plug-in 21 at its end.

[0050] One end of the aluminum substrate 2 is also provided with a liquid collection structure 12, which is used to collect and directionally discharge liquid overflowing from the glass slide. The glass slide is the object heated by the heating structure 100 of the immunohistochemical staining instrument in this embodiment. The glass slide is placed on the top surface 11 and contains detection liquid and immunohistochemical reaction reagents. The liquid collection structure 12 is provided with a drain hole 13, and a confluence channel 14 is also provided between the liquid collection structure 12 and the main body of the aluminum substrate 1. Part of the liquid overflowing from the glass slide is discharged from the drain hole 13, and part is first collected and guided by the confluence channel 14 before being discharged outside the aluminum substrate 1.

[0051] The present invention relates to a heating structure for an immunohistochemical staining instrument. It features a fuse and a temperature sensor embedded in a mounting groove within an aluminum substrate, with the groove filled with silicone. Epoxy resin is then applied to the solder joints connecting the fuse, temperature sensor, and heating film to improve sealing, thereby preventing corrosion from spilled reagents, extending service life, and reducing temperature fluctuations.

[0052] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heating structure for use in an immunohistochemical staining instrument, characterized in that, include: Aluminum substrate, heating film, fuse, and temperature sensor; The heating film is connected to the bottom of the aluminum substrate, and the fuse and the temperature sensor are connected to the heating film; The solder joints between the fuse and the heating film are coated with epoxy resin, and the solder joints between the temperature sensor and the heating film are also coated with epoxy resin.

2. The heating structure for use in an immunohistochemical staining instrument according to claim 1, characterized in that, The bottom of the aluminum substrate is provided with a groove, and a first mounting groove and a second mounting groove are recessed at the bottom of the groove. The heating film is disposed in the groove, the fuse is recessed in the first mounting groove, and the temperature sensor is recessed in the second mounting groove.

3. The heating structure for use in an immunohistochemical staining instrument according to claim 2, characterized in that, The solder joint between the fuse and the heating film is located on the film surface of the heating film on the side away from the aluminum substrate.

4. The heating structure for use in an immunohistochemical staining instrument according to claim 2, characterized in that, The first and second mounting slots are also filled with silicone.

5. The heating structure for use in an immunohistochemical staining instrument according to claim 4, characterized in that, The first mounting groove is located near the end of the aluminum substrate, and the second mounting groove is located in the middle of the aluminum substrate.

6. The heating structure for use in an immunohistochemical staining instrument according to claim 3, characterized in that, The epoxy resin adhesive is DP460NS epoxy structural adhesive.

7. The heating structure for use in an immunohistochemical staining instrument according to claim 4, characterized in that, The silicone is 1530C silicone and Mishima SD916R organic thermally conductive silicone.

8. The heating structure for use in an immunohistochemical staining instrument according to claim 7, characterized in that, The aluminum substrate is made of aluminum alloy.

9. The heating structure for use in an immunohistochemical staining instrument according to claim 3, characterized in that, The width of the first mounting groove is 1-3 mm wider than the fuse, and the depth of the first mounting groove is 0.5-2 mm greater than the height of the fuse.

10. The heating structure for use in an immunohistochemical staining instrument according to claim 1, characterized in that, The heating film is a thick-film printed heating resistor, and the operating temperature range of the thick-film printed heating resistor is room temperature - 150℃.

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